TWI395121B - Pressure detectable touch device - Google Patents

Pressure detectable touch device Download PDF

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TWI395121B
TWI395121B TW098108168A TW98108168A TWI395121B TW I395121 B TWI395121 B TW I395121B TW 098108168 A TW098108168 A TW 098108168A TW 98108168 A TW98108168 A TW 98108168A TW I395121 B TWI395121 B TW I395121B
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electrode pattern
touch
conductive layer
touch device
electrode
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TW098108168A
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TW201033868A (en
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Tpk Touch Solutions Inc
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416Control or interface arrangements specially adapted for digitisers
    • G06F3/04166Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Description

感壓式觸控裝置Pressure sensitive touch device

本發明係關於一種觸控裝置之設計,特別是關於一種結合電容式及電阻式觸控操作方式之感壓式觸控裝置。The present invention relates to a touch device design, and more particularly to a pressure sensitive touch device that combines a capacitive and resistive touch operation mode.

電阻式觸控面板係由一ITO(氧化銦錫)薄膜和一導電玻璃(ITO Glass)所組成,中間由複數個絕緣隔點所隔開,在ITO薄膜和ITO玻璃之間施加一預定之驅動電壓,藉由一觸控物件(例如觸控筆)去觸壓ITO薄膜形成下壓凹陷,使其與下層的ITO玻璃接觸而產生電壓的變化,經由將類比訊號轉為數位訊號,再由微處理器之運算處理取得受觸壓點之座標位置。The resistive touch panel is composed of an ITO (Indium Tin Oxide) film and a conductive glass (ITO Glass) separated by a plurality of insulating spacers, and a predetermined driving force is applied between the ITO film and the ITO glass. Voltage, by a touch object (such as a stylus) to touch the ITO film to form a depression, so that it contacts the underlying ITO glass to produce a voltage change, by converting the analog signal into a digital signal, and then by micro The arithmetic processing of the processor obtains the coordinate position of the touched point.

電容式觸控面板基本上是利用排列之透明電極與導電體之間的電容耦合變化,從所產生之誘導電流來檢測其受觸壓點之座標位置。在電容式觸控面板之結構中,最外層為一薄的二氧化矽硬化處理層透明基材,第二層為ITO層,在玻璃表面建立一均勻電場,當一觸控物件(例如手指)接觸到螢幕透明基材之表面時,觸控物件就會與外側導電層上的電場產生電容耦合,而產生微小的電流的變化。各電極負責測量來自各個角落的電流,再由微處理器計算出觸控物件觸控之座標位置。The capacitive touch panel basically uses the capacitive coupling change between the arranged transparent electrodes and the electrical conductor to detect the coordinate position of the touched point from the induced current generated. In the structure of the capacitive touch panel, the outermost layer is a thin ceria hardened layer transparent substrate, and the second layer is an ITO layer to establish a uniform electric field on the surface of the glass, when a touch object (such as a finger) Upon contact with the surface of the transparent substrate of the screen, the touch object is capacitively coupled to the electric field on the outer conductive layer to produce a slight change in current. Each electrode is responsible for measuring the current from each corner, and then the microprocessor calculates the coordinates of the touch object touch.

然而,電阻式觸控板與電容式觸控板在操作上有其限制條件及缺點。其中電阻式觸控板雖具有價格較低之優點,但在觸控時需使驅動導電層及感測導電層接觸,故需施加一定程度之觸壓力,較容易使導電層損壞,且其敏感度也較低。而電容式觸控板雖敏感度較高,但因其作用原理的關係,在觸控物件之選用上必須是一導電體,例如手指或是接有地線的觸頭,以便傳導電流,若是以絕緣體作為觸控物件則觸控板無法進行感測。However, the resistive touch panel and the capacitive touch panel have limitations and disadvantages in operation. Among them, the resistive touch panel has the advantages of lower price, but needs to make the driving conductive layer and the sensing conductive layer contact when touching, so it is necessary to apply a certain degree of contact pressure, which is easy to damage the conductive layer, and is sensitive. The degree is also low. The capacitive touch panel has high sensitivity, but due to its action principle, the touch object must be selected as a conductor, such as a finger or a grounded contact, to conduct current. With the insulator as the touch object, the touch panel cannot be sensed.

再者,在目前具有觸控輸入功能之電子裝置中,已廣泛使用到筆寫輸入的功能。在使用者進行筆寫輸入時,一般是由使用者手持觸控筆以一預定的觸壓壓力及一般書寫文字的方式,在電子裝置之觸控操作面上產生連續座標位置,微處理器即依據感測到之數個連續座標位置而計算出觸控物件在觸控操作面上之手寫軌跡。電容式觸控板應用在此一筆寫輸入的應用方面,存在了書寫操作不順暢、感應不良之問題。Furthermore, in the electronic devices having the touch input function, the function of the pen write input has been widely used. When the user performs the pen input input, the user generally holds the stylus pen to generate a continuous coordinate position on the touch operation surface of the electronic device by a predetermined touch pressure and general writing text, and the microprocessor is The handwritten trajectory of the touch object on the touch operation surface is calculated according to the sensed number of consecutive coordinate positions. The application of the capacitive touch panel in this application of writing input has the problem that the writing operation is not smooth and the sensing is poor.

本發明之目的是提供一種可依據使用者觸控操作方式而對應不同觸控位置感測模式之觸控裝置,當使用者輕觸該觸控裝置之觸控操作面時,觸控裝置會操作於電容式觸控位置感測模式,而當使用者觸壓該觸控裝置之觸控操作面、或以筆寫輸入操作該觸控裝置之觸控操作面時,觸控裝置會操作於電阻式觸控位置感測模式。An object of the present invention is to provide a touch device that can respond to different touch position sensing modes according to a user's touch operation mode. When the user touches the touch operation surface of the touch device, the touch device operates. In the capacitive touch position sensing mode, when the user touches the touch operation surface of the touch device or operates the touch operation surface of the touch device with the pen input input, the touch device operates on the resistance Touch position sensing mode.

本發明為解決習知技術之問題所採用之技術手段係設計一種結合電容式及電阻式觸控操作模式之觸控裝置,用以感測一觸控物件在該觸控裝置上之觸控操作動作。該觸控裝置主要包括一導電層、一第一電極圖型、一第二電極圖型、一微處理器。導電層形成於一第一基材上並施加一驅動電壓。第一電極圖型與導電層之間形成一第一電容,第二電極圖型與導電層之間形成一第二電容。The technical means for solving the problems of the prior art is to design a touch device combining a capacitive and resistive touch operation mode for sensing a touch operation of a touch object on the touch device. action. The touch device mainly comprises a conductive layer, a first electrode pattern, a second electrode pattern, and a microprocessor. The conductive layer is formed on a first substrate and a driving voltage is applied. A first capacitor is formed between the first electrode pattern and the conductive layer, and a second capacitor is formed between the second electrode pattern and the conductive layer.

當使用者輕觸該觸控裝置之觸控操作面時,位在該操作位置處之導電層因受壓,而使導電層與第一電極圖型間之距離、及導電層與第二電極圖型間之距離改變,故使導電層與第一電極圖型間之電容、及導電層與第二電極圖型間之電容耦合變化,使觸控裝置操作於電容式觸控位置感測模式,微處理器依據該導電層與該第一電極圖型之電容耦合變化、以及該導電層與第二電極圖型之電容耦合變化,計算出一觸控物件位在該導電層上之操作位置。When the user touches the touch operation surface of the touch device, the conductive layer located at the operation position is pressed, and the distance between the conductive layer and the first electrode pattern, and the conductive layer and the second electrode are The distance between the patterns changes, so that the capacitance between the conductive layer and the first electrode pattern and the capacitive coupling between the conductive layer and the second electrode pattern change, so that the touch device operates in the capacitive touch position sensing mode. The microprocessor calculates a capacitive position of the touch object on the conductive layer according to the capacitive coupling change of the conductive layer and the first electrode pattern and the capacitive coupling change between the conductive layer and the second electrode pattern. .

當使用者觸壓該觸控裝置之觸控操作面、或以筆寫輸入操作該觸控裝置之觸控操作面時,位在該操作位置處之導電層因受壓,而使導電層與第一電極圖型之條狀電極接觸,此時兩者間之間距為零,使觸控裝置操作於電阻式觸控位置感測模式,該導電層受觸壓而與該第一電極圖型接觸,微處理器依據該受觸壓之第一電極圖型之電壓變化,而計算出該觸控物件位在該導電層上之至少一操作位置。When the user touches the touch operation surface of the touch device or operates the touch operation surface of the touch device with the pen input input, the conductive layer located at the operation position is pressed to make the conductive layer The strip electrodes of the first electrode pattern are in contact, and the distance between the two is zero, so that the touch device operates in the resistive touch position sensing mode, and the conductive layer is pressed and the first electrode pattern In contact, the microprocessor calculates at least one operating position of the touch object on the conductive layer according to the voltage change of the touched first electrode pattern.

經由本發明所採用之技術手段,僅需搭配本發明之感壓式觸控裝置配合簡易的掃描感測流程,即可兼具電容式及電阻式觸控板之觸控操作模式。不需受限於習知電阻式觸控板或電容式觸控板之觸控物件限制,可使得使用者之觸控操作更為簡便,在不同之操作方式下應用較佳之觸控感應模式。本發明之設計,可使增加觸控裝置之應用範圍,並兼具兩種觸控操作模式之觸控板之優點。Through the technical means adopted by the present invention, only the touch-sensitive touch device of the present invention and the simple scanning sensing process can be combined with the touch operation mode of the capacitive and resistive touch panels. There is no need to be limited by the touch object limitation of the conventional resistive touch panel or the capacitive touch panel, which makes the user's touch operation easier and applies the better touch sensing mode in different operation modes. The design of the invention can increase the application range of the touch device and has the advantages of the touch panel of the two touch operation modes.

本發明之設計,可因應不同使用者在使用觸控裝置時之不同操作習慣,而自動操作於適當的觸控位置感測模式。本發明之設計也特別適合應用在需要作筆寫輸入的觸控應用領域中,可有效解決一般電容式觸控板所存在之書寫操作不順暢、感應不良之問題。The design of the present invention can automatically operate in an appropriate touch position sensing mode in response to different operating habits of different users when using the touch device. The design of the invention is also particularly suitable for application in the field of touch applications requiring writing input, and can effectively solve the problem that the writing operation of the general capacitive touch panel is not smooth and the sensing is poor.

本發明所採用的具體實施例,將藉由以下之實施例及附呈圖式作進一步之說明。The specific embodiments of the present invention will be further described by the following examples and the accompanying drawings.

參閱第1圖,其係顯示本發明第一實施例之系統方塊圖。第2圖係顯示第1圖中主要構件之立體分解圖。如圖所示,本發明之觸控裝置100主要包括一第一基材10、一第二基材20及一微處理器30。Referring to Figure 1, there is shown a block diagram of a system in accordance with a first embodiment of the present invention. Fig. 2 is a perspective exploded view showing the main components in Fig. 1. As shown, the touch device 100 of the present invention mainly includes a first substrate 10, a second substrate 20, and a microprocessor 30.

第一基材10係為一透明絕緣薄層,其具有一導電層結合面11及一觸控操作面12(同時參閱第4圖所示)。第一基材10之導電層結合面11上形成有一導電層13,該導電層13主要為導電材料所組成,當該導電材料為ITO(氧化銦錫)時,可組成一層透明的導電層。The first substrate 10 is a transparent insulating layer having a conductive layer bonding surface 11 and a touch operation surface 12 (see also FIG. 4). A conductive layer 13 is formed on the conductive layer bonding surface 11 of the first substrate 10. The conductive layer 13 is mainly composed of a conductive material. When the conductive material is ITO (Indium Tin Oxide), a transparent conductive layer can be formed.

一驅動電壓供應電路40可在微處理器30之控制之下產生一驅動電壓V施加於該導電層13,以使該導電層13作為電阻式觸控時之驅動導電層。A driving voltage supply circuit 40 can generate a driving voltage V applied to the conductive layer 13 under the control of the microprocessor 30, so that the conductive layer 13 functions as a driving conductive layer for resistive touch.

第二基材20具有一相對應於第一基材10之導電層結合面11之電極圖型結合面21,在該電極圖型結合面21上方形成一第一電極圖型22及一第二電極圖型23。如第2圖及第4圖所示,第一電極圖型22及第二電極圖型23之間,利用一絕緣層24予以隔開。第一電極圖型22與第一基材10之導電層13之間之距離被定義為第一預定距離d1。第二電極圖型23與第一基材10之導電層13之間之距離被定義為第二預定距離d2。The second substrate 20 has an electrode pattern bonding surface 21 corresponding to the conductive layer bonding surface 11 of the first substrate 10, and a first electrode pattern 22 and a second surface are formed over the electrode pattern bonding surface 21. Electrode pattern 23. As shown in FIGS. 2 and 4, the first electrode pattern 22 and the second electrode pattern 23 are separated by an insulating layer 24. The distance between the first electrode pattern 22 and the conductive layer 13 of the first substrate 10 is defined as a first predetermined distance d1. The distance between the second electrode pattern 23 and the conductive layer 13 of the first substrate 10 is defined as a second predetermined distance d2.

第一電極圖型22具有複數個條狀電極s1、s2、s3、s4、s5及s6,並可與第一基材10之導電層13之間形成一第一電容Cx。第一電極圖型22之各個條狀電極s1、s2、s3、s4、s5及s6係相互平行且彼此間隔地形成在絕緣層24上。在絕緣層24與第一基材10之導電層13之間,未佈設條狀電極s1、s2、s3、s4、s5及s6之處,各別設置至少一絕緣隔點60。藉由各個絕緣隔點60,可避免第一基材10之導電層13與第一電極圖型22直接接觸。The first electrode pattern 22 has a plurality of strip electrodes s1, s2, s3, s4, s5, and s6, and a first capacitor Cx is formed between the conductive layer 13 of the first substrate 10. The respective strip electrodes s1, s2, s3, s4, s5, and s6 of the first electrode pattern 22 are formed in parallel with each other and spaced apart from each other on the insulating layer 24. At least one insulating spacer 60 is provided between the insulating layer 24 and the conductive layer 13 of the first substrate 10 where the strip electrodes s1, s2, s3, s4, s5 and s6 are not disposed. By the respective insulating spacers 60, the conductive layer 13 of the first substrate 10 can be prevented from coming into direct contact with the first electrode pattern 22.

第二電極圖型23具有複數個條狀電極s1’、s2’、s3’、s4’、s5’及s6’,並可與第一基材10之導電層13之間形成一第二電容Cy。各個條狀電極s1’、s2’、s3’、s4’、s5’及s6’係相互平行且彼此間隔地形成在第二基材20之電極圖型結合面21上。The second electrode pattern 23 has a plurality of strip electrodes s1', s2', s3', s4', s5' and s6', and can form a second capacitance Cy with the conductive layer 13 of the first substrate 10. . The respective strip electrodes s1', s2', s3', s4', s5' and s6' are formed parallel to each other and spaced apart from each other on the electrode pattern-type bonding surface 21 of the second substrate 20.

在本實施例中,第一電極圖型22及第二電極圖型23係分別以六個條狀電極為例,但條狀電極之數目大於或小於此數目亦可實施。In the present embodiment, the first electrode pattern 22 and the second electrode pattern 23 are respectively exemplified by six strip electrodes, but the number of strip electrodes is larger or smaller than this number.

以第一電極圖型22為例,其各個條狀電極s1、s2、s3、s4、s5及s6彼此間平行、保持一預定之間距,且沿著第一軸向Y延伸。而第二電極圖型23之各個條狀電極s1’、s2’、s3’、s4’、s5’及s6’彼此間亦為平行、保持一預定之間距,且沿著第二軸向X延伸。第一電極圖型22之各個條狀電極s1、s2、s3、s4、s5及s6係垂直或以其它角度對應於第二電極圖型23之各個條狀電極s1’、s2’、s3’、s4’、s5’及s6’。Taking the first electrode pattern 22 as an example, the respective strip electrodes s1, s2, s3, s4, s5, and s6 are parallel to each other, maintained at a predetermined distance, and extend along the first axial direction Y. The strip electrodes s1', s2', s3', s4', s5', and s6' of the second electrode pattern 23 are also parallel to each other, maintain a predetermined distance, and extend along the second axis X. . Each of the strip electrodes s1, s2, s3, s4, s5, and s6 of the first electrode pattern 22 corresponds to the strip electrodes s1', s2', s3' of the second electrode pattern 23 vertically or at other angles. S4', s5' and s6'.

第一電極圖型22之各個條狀電極s1、s2、s3、s4、s5及s6分別經由一第一掃描電路51連接至微處理器30。而第二電極圖型23之各個條狀電極s1’、s2’、s3’、s4’、s5’及s6’分別經由一第二掃描電路52連接至微處理器30。The respective strip electrodes s1, s2, s3, s4, s5, and s6 of the first electrode pattern 22 are connected to the microprocessor 30 via a first scanning circuit 51, respectively. The strip electrodes s1', s2', s3', s4', s5', and s6' of the second electrode pattern 23 are connected to the microprocessor 30 via a second scanning circuit 52, respectively.

參閱第3圖及第5圖,第3圖係顯示第一基材10與第二基材20在結合後,第一電極圖型22及第二電極圖型23之相對位置關係,而第5圖係顯示本發明第一實施例之第二基材之俯視圖。如圖所示,第一電極圖型22之各個條狀電極s1、s2、s3、s4、s5及s6係分別與第二電極圖型23之各個條狀電極s1’、s2’、s3’、s4’、s5’及s6’呈交疊之對應關係,各個交疊位置分別代表觸控裝置100上之一觸控位置。Referring to FIG. 3 and FIG. 5 , FIG. 3 shows the relative positional relationship between the first electrode pattern 22 and the second electrode pattern 23 after the first substrate 10 and the second substrate 20 are bonded, and the fifth position is shown. The figure shows a plan view of a second substrate of the first embodiment of the present invention. As shown in the figure, each strip electrode s1, s2, s3, s4, s5, and s6 of the first electrode pattern 22 and each strip electrode s1', s2', s3' of the second electrode pattern 23, The s4', s5', and s6' are overlapped, and each of the overlapping positions represents a touch position on the touch device 100.

參閱第6圖,其係顯示本發明第二實施例之第二基材之俯視圖。如圖所示,本實施例第二基板20之主要元件與第一實施例大多相同,相同元件以相同圖號標示,在此不再贅述。主要不同之處在於第一電極圖型22a之各個條狀電極s1”、s2”、s3”、s4”、s5”、s6”與第二電極圖型23之各個條狀電極s1’、s2’、s3’、s4’、s5’、s6’交疊處係分別具有對應之內凹區段221,以減少第一電極圖型22a對第二電極圖型23所產生之遮蔽作用,使導電層13與第二電極圖型23間之電容耦合效應更好。Referring to Figure 6, there is shown a plan view of a second substrate of a second embodiment of the present invention. As shown in the figure, the main components of the second substrate 20 of the present embodiment are mostly the same as those of the first embodiment, and the same components are designated by the same reference numerals, and details are not described herein again. The main difference is that each strip electrode s1", s2", s3", s4", s5", s6" of the first electrode pattern 22a and the strip electrodes s1', s2' of the second electrode pattern 23 The overlapping portions of s3', s4', s5', and s6' respectively have corresponding concave sections 221 to reduce the shielding effect of the first electrode pattern 22a on the second electrode pattern 23, so that the conductive layer The capacitive coupling effect between 13 and the second electrode pattern 23 is better.

同時參閱第7A、7B圖及第8圖,第7A、7B圖係顯示本發明觸控裝置在受到使用者手指操作時之操作示意圖,第8圖係顯示第7A、7B圖中各觸控位置與對應之電容值表。7A, 7B and 8B, 7A and 7B are diagrams showing the operation of the touch device of the present invention when being operated by a user's finger, and FIG. 8 is a view showing the touch positions of the 7A and 7B. And the corresponding capacitance value table.

首先在本應用例中將第一電極圖型22之條狀電極s3與第二電極圖型23之條狀電極s3’交疊之操作位置定義為操作位置P1,而將第一電極圖型22之條狀電極s5與第二電極圖型23之條狀電極s3’交疊之操作位置定義為操作位置P2(其俯視位置可參閱第3圖)。在本應用例中用以觸控操作觸控裝置100之觸控物件7係可為例如手指、導電物或其它操作物件。First, in this application example, the operation position at which the strip electrode s3 of the first electrode pattern 22 and the strip electrode s3' of the second electrode pattern 23 overlap is defined as the operation position P1, and the first electrode pattern 22 is The operation position at which the strip electrode s5 overlaps the strip electrode s3' of the second electrode pattern 23 is defined as the operation position P2 (the top view position can be referred to Fig. 3). In this application example, the touch object 7 for touch-operating the touch device 100 can be, for example, a finger, a conductive object, or other operating object.

以下針對本發明之實施原理作一說明。當靜止狀態時(即未受操作時),導電層13與第一電極圖型22、第二電極圖型23之間分別存在了一電容耦合(electric capacity coupling)之效應,使得導電層13與第一電極圖型22之間存在了第一電容Cx,而導電層13與第二電極圖型23之間存在了第二電容Cy。但由於導電層13與第一電極圖型22、第二電極圖型23之間並未受到觸壓,故並無距離變化,也無電容耦合變化。The implementation principle of the present invention will be described below. When in a stationary state (ie, when not in operation), there is an effect of an electrical capacity coupling between the conductive layer 13 and the first electrode pattern 22 and the second electrode pattern 23, such that the conductive layer 13 and A first capacitor Cx exists between the first electrode patterns 22, and a second capacitor Cy exists between the conductive layer 13 and the second electrode pattern 23. However, since the conductive layer 13 is not touched between the first electrode pattern 22 and the second electrode pattern 23, there is no distance change and no capacitive coupling change.

當以觸控物件7輕觸第一基材10之觸控操作面12之一操作位置P1(如第7A圖所示),但導電層13與該第一電極圖型22之間並未接觸時,位在該操作位置P1處之導電層13因受壓,而使導電層13與該第一電極圖型22之間之第一預定距離d1改變為d1’(其中0<d1’<d1),且導電層13與該第二電極圖型23之間之第二預定距離d2改變為d2’(其中0<d2’<d2),故使導電層13與第一電極圖型22之間之第一電容Cx變化為第一電容Cx1,同時導電層13與第二電極圖型23之間之第二電容Cy變化為第二電容Cy1。When the touch object 7 touches one of the touch operation surfaces 12 of the first substrate 10, the operation position P1 (as shown in FIG. 7A), but the conductive layer 13 is not in contact with the first electrode pattern 22. When the conductive layer 13 at the operating position P1 is pressed, the first predetermined distance d1 between the conductive layer 13 and the first electrode pattern 22 is changed to d1' (where 0<d1'<d1 And the second predetermined distance d2 between the conductive layer 13 and the second electrode pattern 23 is changed to d2' (where 0 < d2' < d2), so that the conductive layer 13 and the first electrode pattern 22 are The first capacitor Cx changes to the first capacitor Cx1, and the second capacitor Cy between the conductive layer 13 and the second electrode pattern 23 changes to the second capacitor Cy1.

此時觸控裝置100會操作於電容式觸控位置感測模式,由第一掃描電路51掃描感測導電層13與第一電極圖型22之各個條狀電極s1、s2、s3、s4、s5及s6之電容耦合變化,並送出一掃描感測信號N1至微處理器30。而第二掃描電路52同樣經由掃描感測導電層13與第二電極圖型23之各個條狀電極s1’、s2’、s3’、s4’、s5’及s6’之電容耦合變化後,送出一掃描感測信號N2至微處理器30。At this time, the touch device 100 operates in the capacitive touch position sensing mode, and the first scanning circuit 51 scans the strip electrodes s1, s2, s3, and s4 of the sensing conductive layer 13 and the first electrode pattern 22. The capacitive coupling of s5 and s6 changes, and a scan sensing signal N1 is sent to the microprocessor 30. The second scanning circuit 52 also sends out the capacitive coupling of the strip electrodes s1', s2', s3', s4', s5', and s6' of the second sensing pattern 13 and the second electrode pattern 23, and then sends out A sense signal N2 is scanned to the microprocessor 30.

觸控裝置100依據接收到之第一電容Cx1與第二電容Cy1之電容耦合變化,而計算出該觸控物件7位在第一基材10之觸控操作面12上之操作位置,以決定出觸控物件7之觸控位置係位於第二軸向X之條狀電極s3與第一軸向Y之條狀電極s3’交疊之操作位置P1。The touch device 100 calculates the operation position of the touch object 7 on the touch operation surface 12 of the first substrate 10 according to the capacitive coupling change of the received first capacitor Cx1 and the second capacitor Cy1. The touch position of the touch object 7 is located at the operation position P1 where the strip electrode s3 of the second axial direction X overlaps the strip electrode s3' of the first axial direction Y.

而當觸控物件7以一移動方向L由第一基材10之觸控操作面12之操作位置P1移動至操作位置P2時(如第7B圖所示),位在該操作位置P2處之導電層13因受壓,使導電層13與第一電極圖型22之間之第一預定距離d1改變為d1’(其中0<d1’<d1),且導電層13與該第二電極圖型23之間之第二預定距離d2改變為d2’(其中0<d2’<d2),故使導電層13與第一電極圖型22之間之第一電容Cx變化為第一電容Cx2,同時導電層13與第二電極圖型23之間之第二電容Cy變化為第二電容Cy2,再經由相同之掃描感測方式,以測得觸控位置移至操作位置P2,其相同之實施原理在此不再贅述。When the touch object 7 is moved from the operation position P1 of the touch operation surface 12 of the first substrate 10 to the operation position P2 in a moving direction L (as shown in FIG. 7B), it is located at the operation position P2. The conductive layer 13 is pressed to change the first predetermined distance d1 between the conductive layer 13 and the first electrode pattern 22 to d1' (where 0<d1'<d1), and the conductive layer 13 and the second electrode pattern The second predetermined distance d2 between the patterns 23 is changed to d2' (where 0 < d2' < d2), so that the first capacitance Cx between the conductive layer 13 and the first electrode pattern 22 is changed to the first capacitance Cx2, At the same time, the second capacitance Cy between the conductive layer 13 and the second electrode pattern 23 is changed to the second capacitance Cy2, and the touch position is moved to the operation position P2 through the same scanning sensing method, and the same implementation is performed. The principle is not described here.

參閱第9圖,其係顯示本發明之觸控裝置以觸控物件操作之示意圖。如圖所示,首先將本應用例中第一電極圖型22之條狀電極s4與第二電極圖型23之條狀電極s3’交疊之位置定義為操作位置P3。而本應用例中用以觸控操作觸控裝置100之觸控物件7a係可為導電或非導電觸控物件(例如觸控筆或其它任何物件)。Referring to FIG. 9, a schematic diagram showing the operation of the touch device of the present invention with a touch object is shown. As shown in the figure, the position where the strip electrode s4 of the first electrode pattern 22 and the strip electrode s3' of the second electrode pattern 23 overlap in this application example is first defined as the operation position P3. The touch object 7a used for touch-operating the touch device 100 in this application example can be a conductive or non-conductive touch object (such as a stylus or any other object).

同時參閱第10圖,其係顯示配合第9圖之觸控物件7a在進行觸控操作之系統方塊圖。當使用者以觸控物件7a以一預定觸壓方向I觸壓第一基材10之觸控操作面12之操作位置P3時,位在該操作位置P3處之導電層13與第一電極圖型22之條狀電極s4因受壓接觸,此時兩者間之第一預定間距d1=0(同時參閱第4圖)。Referring to FIG. 10, it is a system block diagram showing the touch operation of the touch object 7a in FIG. When the user touches the operation position P3 of the touch operation surface 12 of the first substrate 10 with the touch object 7a in a predetermined touch direction I, the conductive layer 13 and the first electrode pattern located at the operation position P3 The strip electrode s4 of the type 22 is contacted by pressure, and the first predetermined interval d1 between the two is 0 (see also Fig. 4).

此時,觸控裝置100會操作於電阻式觸控位置感測模式,經由驅動電壓供應電路40送出驅動電壓V至第一基材10之導電層13,並經由該導電層13將該驅動電壓V施加至第一電極圖型22之對應位置。故當第一基材10之導電層13與第一電極圖型22之條狀電極s4因受壓而在受觸壓位置接觸時,驅動電壓V會施加至第一電極圖型22之條狀電極s4上,並經由第一掃描電路51掃描感測第一電極圖型22之條狀電極s4之電壓變化,輸出一掃描感測信號N3至微處理器30。微處理器30依據第一電極圖型22之條狀電極s4之電壓變化,即可計算出觸控物件7a位在第一基材10之觸控操作面12上之操作位置P3。At this time, the touch device 100 operates in the resistive touch position sensing mode, and sends the driving voltage V to the conductive layer 13 of the first substrate 10 via the driving voltage supply circuit 40, and drives the driving voltage through the conductive layer 13 . V is applied to the corresponding position of the first electrode pattern 22. Therefore, when the conductive layer 13 of the first substrate 10 and the strip electrode s4 of the first electrode pattern 22 are pressed by the contact position due to the pressure, the driving voltage V is applied to the strip of the first electrode pattern 22. On the electrode s4, the voltage change of the strip electrode s4 sensing the first electrode pattern 22 is scanned via the first scanning circuit 51, and a scan sensing signal N3 is outputted to the microprocessor 30. The microprocessor 30 can calculate the operating position P3 of the touch object 7a on the touch operation surface 12 of the first substrate 10 according to the voltage change of the strip electrode s4 of the first electrode pattern 22.

參閱第11A、11B、11C圖所示,其係顯示本發明之觸控裝置以觸控物件進行手寫輸入之示意圖,而第12圖係顯示配合第11A、11B、11C圖觸控物件在進行手寫輸入操作之系統圖。Referring to FIGS. 11A, 11B, and 11C, which are schematic diagrams showing the handwriting input of the touch device of the present invention by using a touch object, and FIG. 12 shows that the touch object of FIG. 11A, 11B, and 11C is handwritten. Enter the system diagram for the operation.

當使用者經觸控物件7a觸壓第一基材10之觸控操作面12以筆寫輸入方式位移時,位在各個操作位置處之導電層13與第一電極圖型22因受壓接觸,會使觸控裝置100操作於電阻式觸控位置感測模式。使用者筆寫輸入之操作,會產生以移動方向L移位之數個操作位置P4、P5、P6所形成之手寫軌跡,在每一個操作位置P4、P5、P6時,驅動電壓供應電路40送出驅動電壓V至第一基材10之導電層13,並經由導電層13將該驅動電壓V施加至第一電極圖型22之各個對應操作位置。故當第一基材10之導電層13與第一電極圖型22之條狀電極s3接觸時,驅動電壓V會施加至第一電極圖型22之條狀電極s3上,並經由第一掃描電路51掃描感測第一電極圖型22之條狀電極s3之電壓變化,輸出一掃描感測信號N4至微處理器30。微處理器30依據第一電極圖型22之條狀電極s3之電壓變化,即可計算出觸控物件7a位在第一基材10之觸控操作面12上之操作位置P4。如此連續地順序感測各個操作位置P4、P5、P6,並由第一掃描電路51順序地輸出一序列掃描感測信號N4送至微處理器30。微處理器30依據感測到之數個操作位置P4、P5、P6而計算出觸控物件7a位在第一基材10之觸控操作面12上之手寫軌跡。When the touch object 11 of the first substrate 10 is touched by the touch object 7a in the pen input mode, the conductive layer 13 at each operation position is in contact with the first electrode pattern 22 by pressure. The touch device 100 is operated in the resistive touch position sensing mode. The operation of the user's pen input input generates a handwritten trajectory formed by a plurality of operation positions P4, P5, and P6 displaced in the moving direction L. At each of the operation positions P4, P5, and P6, the driving voltage supply circuit 40 sends out The driving voltage V is applied to the conductive layer 13 of the first substrate 10, and the driving voltage V is applied to each corresponding operating position of the first electrode pattern 22 via the conductive layer 13. Therefore, when the conductive layer 13 of the first substrate 10 is in contact with the strip electrode s3 of the first electrode pattern 22, the driving voltage V is applied to the strip electrode s3 of the first electrode pattern 22, and via the first scan. The circuit 51 scans the voltage change of the strip electrode s3 of the first electrode pattern 22, and outputs a scan sensing signal N4 to the microprocessor 30. The microprocessor 30 can calculate the operating position P4 of the touch object 7a on the touch operation surface 12 of the first substrate 10 according to the voltage change of the strip electrode s3 of the first electrode pattern 22. The respective operation positions P4, P5, P6 are sequentially sequentially sensed in this manner, and a sequence of scan sensing signals N4 are sequentially outputted from the first scanning circuit 51 to the microprocessor 30. The microprocessor 30 calculates the handwritten trajectory of the touch object 7a on the touch operation surface 12 of the first substrate 10 according to the sensed operation positions P4, P5, and P6.

同時參閱第13、14圖,第13圖係顯示本發明第三實施例之系統方塊圖,第14圖係顯示本發明第三實施例之剖視圖。如圖所示,本實施例之觸控裝置100a和第一實施例之結構相似,其主要差異在於本實施例觸控裝置100a之第二基材20上,僅包括結合有第一電極圖型22之各個條狀電極s1、s2、s3、s4、s5、s6,且各條狀電極s1、s2、s3、s4、s5、s6和第一基材10之導電層13相距一第三預定距離d3,且分別經由第一掃描電路51連接至微處理器30,其他相同元件之部份以相同之標號顯示,故不再贅述。Referring to Figures 13 and 14, Figure 13 is a block diagram showing a third embodiment of the present invention, and Figure 14 is a cross-sectional view showing a third embodiment of the present invention. As shown in the figure, the touch device 100a of the present embodiment is similar in structure to the first embodiment, and the main difference is that the second substrate 20 of the touch device 100a of the present embodiment includes only the first electrode pattern. Each of the strip electrodes s1, s2, s3, s4, s5, s6, and each strip electrode s1, s2, s3, s4, s5, s6 and the conductive layer 13 of the first substrate 10 are separated by a third predetermined distance D3, and is respectively connected to the microprocessor 30 via the first scanning circuit 51, and the same components are denoted by the same reference numerals and will not be described again.

本實施例之實施方式與前述實施例相似,同樣包括結合電容式及電阻式觸控操作方式。當觸控裝置100a之觸控操作面12未受到觸壓操作時,第一電極圖型22之各條狀電極s1、s2、s3、s4、s5、s6和第一基材10之導電層13相距第三預定距離d3,而在第一電極圖型22與導電層13之間形成第一電容Cx。The embodiment of the embodiment is similar to the previous embodiment, and also includes a combined capacitive and resistive touch operation mode. When the touch operation surface 12 of the touch device 100a is not subjected to a touch operation, the strip electrodes s1, s2, s3, s4, s5, s6 of the first electrode pattern 22 and the conductive layer 13 of the first substrate 10 are A first capacitance Cx is formed between the first electrode pattern 22 and the conductive layer 13 at a third predetermined distance d3.

當觸控物件輕觸第一基材10之觸控操作面12、但導電層13與第一電極圖型22之間並未接觸時,位在該操作位置處之導電層13因受壓,而使導電層13與第一電極圖型22之間之第三預定距離d3改變,故使導電層13與第一電極圖型22之間之電容耦合變化,使觸控裝置100a操作於電容式觸控位置感測模式。藉由第一掃描電路51掃描感測導電層13與第一電極圖型22間之電容耦合變化,送出掃描感測信號N1至微處理器30。微處理器30依據接收到之電容耦合變化,而計算出觸控之操作位置。When the touch object touches the touch operation surface 12 of the first substrate 10 but the conductive layer 13 is not in contact with the first electrode pattern 22, the conductive layer 13 located at the operation position is pressed. The third predetermined distance d3 between the conductive layer 13 and the first electrode pattern 22 is changed, so that the capacitive coupling between the conductive layer 13 and the first electrode pattern 22 is changed, so that the touch device 100a operates in a capacitive manner. Touch position sensing mode. The scanning sensing signal N1 is sent to the microprocessor 30 by the first scanning circuit 51 scanning the capacitive coupling change between the sensing conductive layer 13 and the first electrode pattern 22. The microprocessor 30 calculates the operating position of the touch based on the received capacitive coupling change.

與第一實施例相似,當觸控物件觸壓該觸控裝置100a之觸控操作面12或以筆寫輸入操作該觸控裝置100a之觸控操作面12時,位在該操作位置處之導電層13與第一電極圖型22間因受壓接觸,此時第一預定間距d3=0,使觸控裝置100a操作於電阻式觸控位置感測模式。此時,第一基材10之導電層13與第一電極圖型22之其中一條狀電極(例如條狀電極s4)接觸時,驅動電壓V會施加至該條狀電極上,並經由第一掃描電路51掃描感測第一電極圖型22之該條狀電極s4之電壓變化,使微處理器30依據其電壓變化,計算出觸控之操作位置。Similar to the first embodiment, when the touch object touches the touch operation surface 12 of the touch device 100a or touches the touch operation surface 12 of the touch device 100a with the pen input input, the touch object is located at the operation position. The conductive layer 13 and the first electrode pattern 22 are contacted by pressure. At this time, the first predetermined spacing d3=0, so that the touch device 100a operates in the resistive touch position sensing mode. At this time, when the conductive layer 13 of the first substrate 10 is in contact with one of the first electrode patterns 22 (for example, the strip electrode s4), the driving voltage V is applied to the strip electrodes, and the first The scanning circuit 51 scans the voltage change of the strip electrode s4 of the first electrode pattern 22, so that the microprocessor 30 calculates the operating position of the touch according to the voltage change.

由以上之實施例可知,本發明所提供之感壓式觸控裝置確具產業上之利用價值,故本發明業已符合於專利之要件。惟以上之敘述僅為本發明之較佳實施例說明,凡精於此項技藝者當可依據上述之說明而作其它種種之改良,惟這些改變仍屬於本發明之發明精神及以下所界定之專利範圍中。It can be seen from the above embodiments that the pressure sensitive touch device provided by the present invention has industrial utilization value, and thus the present invention has met the requirements of the patent. The above description is only for the preferred embodiment of the present invention, and those skilled in the art can make other various improvements according to the above description, but these changes still belong to the inventive spirit of the present invention and the following definitions. In the scope of patents.

100、100a...觸控裝置100, 100a. . . Touch device

10...第一基材10. . . First substrate

11...導電層結合面11. . . Conductive layer bonding surface

12...觸控操作面12. . . Touch operation surface

13...導電層13. . . Conductive layer

20...第二基材20. . . Second substrate

21...電極圖型結合面twenty one. . . Electrode pattern binding surface

22、22a...第一電極圖型22, 22a. . . First electrode pattern

221...內凹區段221. . . Concave section

23...第二電極圖型twenty three. . . Second electrode pattern

24...絕緣層twenty four. . . Insulation

30...微處理器30. . . microprocessor

40...驅動電壓供應電路40. . . Drive voltage supply circuit

51...第一掃描電路51. . . First scanning circuit

52...第二掃描電路52. . . Second scanning circuit

60...絕緣隔點60. . . Insulating spacer

7、7a...觸控物件7, 7a. . . Touch object

Cx、Cx1、Cx2...第一電容Cx, Cx1, Cx2. . . First capacitor

Cy、Cy1、Cy2...第二電容Cy, Cy1, Cy2. . . Second capacitor

d1...第一預定距離D1. . . First predetermined distance

d2...第二預定距離D2. . . Second predetermined distance

d3...第三預定距離D3. . . Third predetermined distance

P1、P2、P3、P4、P5、P6...操作位置P1, P2, P3, P4, P5, P6. . . Operating position

V...驅動電壓V. . . Driving voltage

N1...掃描感測信號N1. . . Scanning sensing signal

N2...掃描感測信號N2. . . Scanning sensing signal

N3...掃描感測信號N3. . . Scanning sensing signal

N4...掃描感測信號N4. . . Scanning sensing signal

s1、s2、s3、s4、、s5、s6...條狀電極S1, s2, s3, s4, s5, s6. . . Strip electrode

s1’、s2’、s3’、s4’、s5’、s6’...條狀電極S1', s2', s3', s4', s5', s6'. . . Strip electrode

s1”、s2”、s3”、s4”、s5”、s6”...條狀電極S1", s2", s3", s4", s5", s6". . . Strip electrode

X...第二軸向X. . . Second axial direction

Y...第一軸向Y. . . First axial direction

I...觸壓方向I. . . Contact direction

L...移動方向L. . . Direction of movement

第1圖係顯示本發明第一實施例之系統方塊圖;Figure 1 is a block diagram showing the system of the first embodiment of the present invention;

第2圖係顯示第1圖中主要構件之立體分解圖;Figure 2 is an exploded perspective view showing the main components of Figure 1;

第3圖係顯示第1圖中第一基材與第二基材在結合後,第一電極圖型及第二電極圖型之相對位置關係;3 is a view showing the relative positional relationship between the first electrode pattern and the second electrode pattern after the first substrate and the second substrate are bonded in FIG. 1;

第4圖係顯示第3圖之4-4斷面之剖視圖;Figure 4 is a cross-sectional view showing the section 4-4 of Figure 3;

第5圖係顯示本發明第一實施例之第二基材之俯視圖;Figure 5 is a plan view showing a second substrate of the first embodiment of the present invention;

第6圖係顯示本發明第二實施例之第二基材之俯視圖;Figure 6 is a plan view showing a second substrate of the second embodiment of the present invention;

第7A、7B圖係顯示本發明之觸控裝置在受到使用者手指操作時之操作示意圖;7A and 7B are schematic views showing the operation of the touch device of the present invention when being operated by a user's finger;

第8圖係顯示第7A、7B圖中各觸控位置與對應之電容值表;Figure 8 shows the touch positions and corresponding capacitance values in the 7A and 7B drawings;

第9圖係顯示本發明之觸控裝置以觸控物件操作之示意圖;Figure 9 is a schematic view showing the operation of the touch device of the present invention with a touch object;

第10圖係顯示配合第9圖觸控物件在進行觸控操作之系統方塊圖;Figure 10 is a block diagram showing the system in which the touch object is touched by the touch object of Figure 9;

第11A、11B、11C圖係顯示本發明之觸控裝置以觸控物件進行手寫輸入之示意圖;11A, 11B, and 11C are schematic diagrams showing the handwriting input of the touch device of the present invention by using a touch object;

第12圖係顯示配合第11A、11B、11C圖觸控物件在進行手寫輸入操作之系統圖;Figure 12 is a system diagram showing the handwriting input operation of the touch object in conjunction with the 11A, 11B, and 11C images;

第13圖係顯示本發明第三實施例之系統方塊圖;Figure 13 is a block diagram showing the system of the third embodiment of the present invention;

第14圖係顯示本發明第三實施例之剖視圖。Figure 14 is a cross-sectional view showing a third embodiment of the present invention.

100...觸控裝置100. . . Touch device

10...第一基材10. . . First substrate

11...導電層結合面11. . . Conductive layer bonding surface

13...導電層13. . . Conductive layer

20...第二基材20. . . Second substrate

21...電極圖型結合面twenty one. . . Electrode pattern binding surface

22...第一電極圖型twenty two. . . First electrode pattern

23...第二電極圖型twenty three. . . Second electrode pattern

24...絕緣層twenty four. . . Insulation

30...微處理器30. . . microprocessor

40...驅動電壓供應電路40. . . Drive voltage supply circuit

51...第一掃描電路51. . . First scanning circuit

52...第二掃描電路52. . . Second scanning circuit

N1...掃描感測信號N1. . . Scanning sensing signal

N2...掃描感測信號N2. . . Scanning sensing signal

V...驅動電壓V. . . Driving voltage

s1、s2、s3、s4、s5、s6...條狀電極S1, s2, s3, s4, s5, s6. . . Strip electrode

s1’、s2’、s3’、s4’、s5’、s6’...條狀電極S1', s2', s3', s4', s5', s6'. . . Strip electrode

X...第二軸向X. . . Second axial direction

Y...第一軸向Y. . . First axial direction

Claims (5)

一種感壓式觸控裝置,具有可供一觸控物件操作之觸控操作面,該裝置包括:一導電層,施加有一驅動電壓;一第一電極圖型,位在該導電層之下方位置,並與該導電層之間保持一第一預定距離;一第二電極圖型,位在該第一電極圖型之下方位置,並與該導電層之間保持一第二預定距離;一微處理器,電連接於該導電層、第一電極圖型與該第二電極圖型;當該觸控物件輕觸該觸控裝置之觸控操作面時,位在操作位置之導電層因受壓,該導電層與該第一電極圖型之間之距離改變,而使該導電層與該第一電極圖型間之電容耦合變化,且該導電層與該第二電極圖型之間之距離亦改變,而使該導電層與該第二電極圖型間之電容耦合變化,使該觸控裝置操作於電容式觸控位置感測模式,該微處理器依據該導電層與該第一電極圖型間之電容耦合變化、以及該導電層與該第二電極圖型間之電容耦合變化,計算出該觸控物件位在該觸控操作面上之操作位置;當該觸控物件觸壓該觸控裝置之觸控操作面或以筆寫輸入操作該觸控裝置之觸控操作面時,位在該操作位置之導電層因受壓,該導電層與該第一電極圖型之至少一相 對應之受觸壓位置接觸,使該觸控裝置操作於電阻式觸控位置感測模式,經由該導電層將該驅動電壓施加至該第一電極圖型之對應位置,該微處理器即依據該第一電極圖型之電壓變化,而計算出該觸控物件位在該觸控操作面上之至少一操作位置。 A touch-sensitive touch device having a touch operation surface operable by a touch object, the device comprising: a conductive layer to which a driving voltage is applied; and a first electrode pattern positioned below the conductive layer And maintaining a first predetermined distance from the conductive layer; a second electrode pattern positioned below the first electrode pattern and maintaining a second predetermined distance from the conductive layer; The processor is electrically connected to the conductive layer, the first electrode pattern and the second electrode pattern; when the touch object touches the touch operation surface of the touch device, the conductive layer located at the operating position is affected by Pressing, the distance between the conductive layer and the first electrode pattern is changed, and the capacitive coupling between the conductive layer and the first electrode pattern is changed, and the conductive layer and the second electrode pattern are The distance is also changed, and the capacitive coupling between the conductive layer and the second electrode pattern is changed, so that the touch device operates in a capacitive touch position sensing mode, and the microprocessor according to the conductive layer and the first Capacitive coupling change between electrode patterns, and the guide a capacitive coupling change between the layer and the second electrode pattern, and calculating an operation position of the touch object on the touch operation surface; when the touch object touches the touch operation surface of the touch device or When the input operation is performed on the touch operation surface of the touch device, the conductive layer located at the operation position is pressed, and the conductive layer and the first electrode pattern are at least one phase Corresponding to contact with the touched position, the touch device is operated in the resistive touch position sensing mode, and the driving voltage is applied to the corresponding position of the first electrode pattern via the conductive layer, and the microprocessor is based on The voltage of the first electrode pattern changes, and the touch object is calculated to be at least one operating position on the touch operation surface. 如申請專利範圍第1項所述之感壓式觸控裝置,其中該第一電極圖型與該第二電極圖型分別包括有複數個相互平行且彼此間隔之條狀電極。 The pressure sensitive touch device of claim 1, wherein the first electrode pattern and the second electrode pattern respectively comprise a plurality of strip electrodes parallel to each other and spaced apart from each other. 如申請專利範圍第2項所述之感壓式觸控裝置,其中該第一電極圖型之各個條狀電極分別經由一第一掃描電路連接至該微處理器,該第二電極圖型之各個條狀電極分別經由一第二掃描電路連接至該微處理器。 The pressure sensitive touch device of claim 2, wherein each strip electrode of the first electrode pattern is respectively connected to the microprocessor via a first scanning circuit, and the second electrode pattern is Each strip electrode is connected to the microprocessor via a second scan circuit. 如申請專利範圍第2項所述之感壓式觸控裝置,其中該微處理器經由一驅動電壓供應電路供應該驅動電壓至該導電層。 The pressure sensitive touch device of claim 2, wherein the microprocessor supplies the driving voltage to the conductive layer via a driving voltage supply circuit. 如申請專利範圍第1項所述之感壓式觸控裝置,其中該第一電極圖型經由一第一掃描電路連接至該微處理器,該第二電極圖型經由一第二掃描電路連接至該微處理器。 The pressure sensitive touch device of claim 1, wherein the first electrode pattern is connected to the microprocessor via a first scanning circuit, and the second electrode pattern is connected via a second scanning circuit. To the microprocessor.
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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5496851B2 (en) * 2010-10-22 2014-05-21 株式会社ジャパンディスプレイ Touch panel
TWI583003B (en) * 2015-04-29 2017-05-11 世界先進積體電路股份有限公司 Semiconductor devices
US9530732B1 (en) 2015-06-25 2016-12-27 Vanguard International Semiconductor Corporation Efficient layout placement of a diode
US11797119B2 (en) 2017-04-14 2023-10-24 Sensel, Inc. Selectively adhered resistive force sensor

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5777607A (en) * 1995-02-22 1998-07-07 U.S. Philips Corporation Low-cost resistive tablet with touch and stylus functionality
US20010013855A1 (en) * 1998-06-12 2001-08-16 Jean-Philippe Fricker Resistive and capacitive touchpad
US6492979B1 (en) * 1999-09-07 2002-12-10 Elo Touchsystems, Inc. Dual sensor touchscreen utilizing projective-capacitive and force touch sensors
TWM321553U (en) * 2007-02-16 2007-11-01 Young Fast Optoelectronics Co Touch control panel with dual sensing interfaces
TWM335736U (en) * 2007-11-02 2008-07-01 Young Fast Optoelectronics Co Improved structure of duplexing touch panel
TW200834391A (en) * 2007-02-12 2008-08-16 Young Fast Optoelectronics Co Complex touch sensing device
TW200909912A (en) * 2007-08-17 2009-03-01 Mildex Optical Inc Flat-plane resistive and capacitive integrated touch panel

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5777607A (en) * 1995-02-22 1998-07-07 U.S. Philips Corporation Low-cost resistive tablet with touch and stylus functionality
US20010013855A1 (en) * 1998-06-12 2001-08-16 Jean-Philippe Fricker Resistive and capacitive touchpad
US6492979B1 (en) * 1999-09-07 2002-12-10 Elo Touchsystems, Inc. Dual sensor touchscreen utilizing projective-capacitive and force touch sensors
TW200834391A (en) * 2007-02-12 2008-08-16 Young Fast Optoelectronics Co Complex touch sensing device
TWM321553U (en) * 2007-02-16 2007-11-01 Young Fast Optoelectronics Co Touch control panel with dual sensing interfaces
TW200909912A (en) * 2007-08-17 2009-03-01 Mildex Optical Inc Flat-plane resistive and capacitive integrated touch panel
TWM335736U (en) * 2007-11-02 2008-07-01 Young Fast Optoelectronics Co Improved structure of duplexing touch panel

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