TW201033868A - Pressure-sensing type touch device - Google Patents
Pressure-sensing type touch device Download PDFInfo
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- TW201033868A TW201033868A TW098108168A TW98108168A TW201033868A TW 201033868 A TW201033868 A TW 201033868A TW 098108168 A TW098108168 A TW 098108168A TW 98108168 A TW98108168 A TW 98108168A TW 201033868 A TW201033868 A TW 201033868A
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- 239000000758 substrate Substances 0.000 claims abstract description 48
- 230000008859 change Effects 0.000 claims description 13
- 125000006850 spacer group Chemical group 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
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- 239000002689 soil Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000009858 dingxin Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000012905 input function Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04166—Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
Description
201033868 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種觸控裝置之設計,特別是關於一種 結合電容式及電阻式觸控操作方式之感壓式觸控裝置p 【先前技術】 電阻式觸控面板係由一 ITO(氧化銦錫)薄膜和一導電201033868 VI. Description of the Invention: [Technical Field] The present invention relates to a touch device design, and more particularly to a pressure sensitive touch device that combines a capacitive and resistive touch operation mode. The resistive touch panel is made of an ITO (Indium Tin Oxide) film and a conductive
玻璃(ITO Glass)所組成,中間由複數個絕緣隔點所隔開,在 ITO薄膜和ITO玻璃之間施加一預定之驅動電壓,藉由一觸 控物件(例如觸控筆)去觸壓IT0薄膜形成下壓凹陷,使其與 下層的ΙΤΟ玻璃接觸而產生電壓的變化,經由將類比訊號 轉為數位訊號,再由微處理器之運算處理取得受觸壓點之座 標位置。 電容式觸控面板基本上是利用排狀透明電極與導 體之間的電容轉合變化,從所產生之誘導電流來檢測盆受 壓點之座標位置。在電容式觸控面板之結構中,最外層 薄的二氧切硬化處理層透縣材,第二層為ΙΤ0 玻璃表面建立一均句電場,當一觸控 勞幕透明隸之表科,觸㈣件財料辦電層)3: =生電雜合,而產生微小的電流的變化。各電極負責、、 里來自各個角洛的電流,再由微處 生 之座標位置。 Μ异出物件觸幸 【發明内容】 201033868 本發明所欲解決之技術問題The glass (ITO Glass) is separated by a plurality of insulating spacers, and a predetermined driving voltage is applied between the ITO film and the ITO glass to touch the IT0 by a touch object (for example, a stylus). The film is formed into a depression, which is brought into contact with the lower layer of the bismuth glass to generate a voltage change. The analog signal is converted into a digital signal, and then processed by the microprocessor to obtain the coordinate position of the contact point. The capacitive touch panel basically uses the capacitance switching change between the transparent electrode and the conductor to detect the coordinate position of the basin pressure point from the induced current generated. In the structure of the capacitive touch panel, the outermost layer of the thin dioxo-hardened layer passes through the county material, and the second layer establishes a uniform electric field on the surface of the ΙΤ0 glass surface, when a touch screen is transparently attached to the watch, touch (4) Piece of materials and electricity management layer) 3: = Hybrid electricity generation, and a slight change in current. Each electrode is responsible for the current from each corner, and then the position of the coordinates. Μ 出 物 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【
然而,電阻式觸控板與電容式觸控板在操作上有其& 制條件及缺點。其中電阻式觸控板雖具有價袼較低之優點限 但在觸控時需使驅動導電層及感測導電層接觸,故需施加— 定程度之觸壓力,較容易使導電層損壞,且其敏感度也較 低。而電容式觸控板雖敏感度較高,但因其作用原理的關 係,在觸控物件之選用上必須是一導電體,例如手指或是接 有地線的觸頭’以便傳導電流,若是以絕緣體作為二: 則觸控板無法進行感測。 再者,在目前具有觸控輸入功能之電子裝置中,已廣 ,使用到筆寫輸人的功能。在使用者進行筆寫輸人時,一般 ,由使用者手持-控筆以—預定的觸壓塵力及—般書寫= :的方式纟電子裝置之觸控操作面上產生連續座標位置, 微處理器即依據感測到之數個連續座標位置而計算出觸控 物件在觸控操作面上之手寫軌跡。電容式觸控板應用在此二 筆寫輸入的應用方面’存在了書寫操作不順暢、感應不良之 本發明之目的是提供一種可依據使用者觸控操作方式 而對應不_控位置感測模式之觸控裂置,當使用者輕觸該 觸& #置之觸控操作面時,觸控裝置會操作於電容式觸控位 置感測极式,而當使用者觸壓該觸控裝置之觸控操作面、或 以筆寫輸人操作該觸控裝置之觸控操作 作於電阻摘独__式。 ^However, resistive touch panels and capacitive touch panels have their operating conditions and disadvantages in operation. Among them, the resistive touch panel has the advantage of lower price, but it needs to make the driving conductive layer and the sensing conductive layer contact when touching, so it is necessary to apply a certain degree of contact pressure, which is easy to damage the conductive layer, and Its sensitivity is also low. The capacitive touch panel has high sensitivity, but due to its principle of action, the touch object must be selected as a conductor, such as a finger or a grounded contact to conduct current. The insulator is used as two: The touchpad cannot be sensed. Furthermore, in the electronic devices having the touch input function, the functions of writing and inputting are widely used. When the user writes the pen to input, generally, the user holds the hand-control pen to generate a continuous coordinate position on the touch operation surface of the electronic device by using the predetermined touch dust force and the general writing =: The processor calculates the handwritten trajectory of the touch object on the touch operation surface according to the sensed number of consecutive coordinate positions. The application of the capacitive touch panel in the application of the two-stroke input input has the problem that the writing operation is not smooth and the sensing is poor. The purpose of the invention is to provide a corresponding position sensing mode according to the user's touch operation mode. When the user touches the touch control surface, the touch device operates on the capacitive touch position sensing pole type, and when the user touches the touch device The touch operation surface, or the touch operation of the touch device by the pen writing input operation is performed on the resistor __ type. ^
201033868 本發明解決問題之技術手段 本發明為解決習知技術之問題所採用之技術手段係設 °十種結合電容式及電阻式觸控操作模式之觸控裝置,用以 感踯一觸控物件在該觸控裝置上之觸控操作動作。該觸控裝 置主要包括-導電層、—第—電極圖型、—第二電極圖型、 一微處理器。導電層形成於—第—基材上並施加一驅動電 壓。第-電極圖型與導電層之間形成一第一電容,第二電極 圖型與導電層之間形成一第二電容。 當使用者輕觸該觸控裝置之觸控操作面時,位在該操 作位置處之導電層因錢,而使導電層與第—電極圖型間之 距離、及導電層與第二電極圖型間之距離改變,故使導電層 與第-電_型間之電容、及導電層與第二電極圖型間之; 容轉合變化,使觸控裝置操作於電容式觸控位置感測模式:, 微處理器依據該導電層與該第—電極圖型之電容輕合變 化以及e亥導電層與第二電極圖型之電容輕合變化,叶曾 一觸控物件位在該導電層上之操作位置。 〜 當使用者㈣該觸控裝置之_控操作面、或以筆 =操作該觸控裝置之觸控操作面時,位在該操作位置處之; 層因受壓,而使導電層與第—電極圖型之條狀電極接觸 此時兩者間之間距為零,使觸_ _ , 文蜩控4置彳呆作於電阻式觸控位罢 感測模式,該導電層受觸壓而與守第 3 土叩興。哀弟—電極圖型接觸,料冷 理器依據該受觸壓之第一電極円夂處 觸控物件位在該導電層上之至少—操作位置。 201033868 本發明對照先前技術之功效 經由本發明所採用之技術手段,僅需搭配本發明之感 壓式觸控裝置配合簡易的掃描感測流程,即可兼具電容式及 電阻式觸控板之觸控操作模式。不需受限於習知電阻式觸控 板或電容式觸控板之觸控物件限制,可使得使用者之觸控操 作更為簡便’在腿之操作方式下應⑽佳之觸控感應模 式。本發明之設計,可使增加觸控裝置之應用範圍,並兼具 兩種觸控操作模式之觸控板之優點。 本發明之設計,可因應不同使用者在使用觸控裝置時 之不同操作習慣’而自動操作於適當的觸控位置感測模式。 本發明之設計也制適合應用在需要作筆寫輸人的觸控應 用領域中’可有效解決-般電容式觸控板所存在之書寫操作 不順暢、感應不良之問題。 : 本發明所採用的具體實施例,將藉由以下之實施例及 附呈圖式作進一步之說明。 【實施方式】 參閱第丨圖’其係顯示本發明第—實施例之系統方塊 m圖係顯示第!圖中主要構件之立體分解圖,圖所 二,明之觸控裝置100主要包括—第一基材1〇、一第 一基材20及一微處理器3〇。 第^基係為-透明絕緣薄層,其具有—導電層結 :面u及一觸控操作面12(同時參閱第 201033868 13主要為導電材料所組成,當該導電材料為ιτ〇(氧化鋼錫) 時,可組成一層透明的導電層。 一驅動電壓供應電路4〇可在微處理器3〇之控制之下 產车-驅動電壓V施加於該導電層13,以使該導電層η 作為電阻式觸控時之驅動導電層。 第二基材2G具有—相對應於第—基材1()之導電層結 口面11之電極圖型結合面2卜在該電極圖型結合面U上 方开/成第一電極圖型22及一第二電極圖型…如第2圖 及第4圖所示,第一電極圖型22及第二電極圖型23之間, 利用-絕緣層24予以隔開。第—電極圖型22與第一基材 之導電層U之間之距離被定義為第一預定距離以。第二 ^圖型23與第—基材1〇之導電層13之間之距離被㈣ 马弟二預定距離<J2。 第電極圖型22具有複數個條狀電極s卜S2、s3、S4、 s5,s6’並可與第__基材1()之導電層13之間形成一第一 電谷Cx。第-電極圖型22之各個條狀電極………. 2S6係相互平似彼此_地形成在絕緣層24上。在絕 緣層24與第―其# ! Λ p ^ ''£ sl 土 之導電層13之間,未佈設條狀電極 60。夢由:/4、55及56之處,各別設置至少-絕緣隔點 鱼第電ΓΓ緣隔點6〇,可避免第一基材1〇之導電層。 與第一電極圖型22直接接觸。 第二電極圖型23具有複數個條狀電極Η,、η,、 :、二及S6’,並可與第一基材1〇之導電心之間形成一 第-電谷巧。各個條狀電極sl,、s2,、s3,、s4,、s5,h6, 201033868 :相互平行且彼此_地形録第二基材μ 合面21上。 口 土、,口 在本實施例中,第一電極圖型22及第二電極圖型幻 ^別以六個條狀電極為例,但條狀電極之數目大 此數目亦可實施。 久 以第一電極圖型22為例,其各個條狀電極Sl、s2、s3、 :75及“彼此間平行、保持-預定之間距,且沿著第— 軸向Y延伸。而第二電極圖型23之各個條狀電u,、s2,、 f :4’、35’及%’彼此間亦為平行、保持—狀之間距, 且沿著第二軸向X延伸。第一 、狎第電極圖型22之各個條狀電極 、S4、S5及S6係垂直或以其它角度對應於第-電極圖型23之各個條狀電極S1,、S2,、S3,、S4,、S5,^:: 第-電極圖型22之各個條狀電極sl、s2、^. =s6刀別經由-第—掃描電路5i連接至微處理器3〇 第二電極圖型23之各個條狀電極81,、〜3、4,、: 及s6刀別&由第—掃描電路52連接至微處理器。 參閱第3圖及第5圖,第3圖係顯示第一基材】 二基材20在結合後,篦―+托㈤乐 弟電極圖型22及第二電極圖型 之相對位置關係,而第5圖係顯示本發明第—實施例 基材之俯視圖。如圖戶斤结 ms3、s4'su “弟一型22之各個條狀電 及%係分別與第二電極圖'型23 =条狀電極S1,、S2’、〜、…,呈交疊之對應斷 各個父豎位置分別代表觸控裝置1〇〇上之一觸控位置。 參閱第6圖,其係顯示本發明第二實施例之第: 201033868 之俯視®。如圖所^,本實關第二基板2G之主要元件與 第-實施例大多相同,相同元件以相關號標示,在此不再 头,述要不同之處在於第―電極圖型22&之各個條狀電極 si” ' S2”、s3”、s4”、s5”、s6”與第二電極圖型幻 條狀電極si,、s2,、qV ., c, 個 庫之内凹U221 4、S5 S6,交疊處係分別具有對 二 4 221,以減少第—電極圖型22a對第二電極圓 =所產生之遮蔽作用,使導電層】3與第 圓 φ ❿ 間之電容耦合效應更好。 丄 同時參閱第7A、7B圖及第8圓,笛7Λ ^ 太狢昍雔以奸 固次弟δ圓,第7Α、7Β圖係顯示 务月觸控裝置在受到使用者手 8圖係顯示第7A、7R岡占々ώ 丁心料不忍圖’苐 首务 回中各觸控位置與對應之電容值表。 i无在本應用例中蔣當 鱼第1如刑” 圖型22之條狀電極S3 ”第一電極圖型23之條狀電極Θ,交 : 操作位置P卜而將第 呆作位置疋義為 電極圖型22之條壯雷拉c t 電極圖型23之條狀電極 :条狀電極S5與第二 E . 乂 $之刼作位置定義為操作位 U俯視位置可參閱第3圖) Μ立 作觸控裝置100之觸控物件 二J中用以觸控操 它操作物件。 糸了為例如手指、導電物或其 X T針本發%之實施原 (即未受操作時),導電層13 說明。當靜止狀態時 圖型23夕pq、. 電極圖型22、第-雷托 固生23之間分別存在了— 弟一電極 C卿1㈣之效應,使得導電層13/=合⑷伽e⑽hy 在了第一電容Cx,而導電層極圖型D之間存 在了第二電容Cy。但由於導電/ :電極圖型23之間存 g 13與第一電極圖型22、 201033868 第二電極圖型23之間並未受到觸壓,故並無距離變化,也 無電容耦合變化。 當以觸控物件7輕觸第一基材1〇之觸控操作面12之The technical means for solving the problem of the prior art is to provide a touch device for combining a capacitive and resistive touch operation mode for sensing a touch object. A touch operation action on the touch device. The touch device mainly comprises a conductive layer, a first electrode pattern, a second electrode pattern, and a microprocessor. A conductive layer is formed on the -first substrate and a driving voltage is applied. A first capacitor is formed between the first electrode pattern and the conductive layer, and a second capacitor is formed between the second electrode pattern and the conductive layer. When the user touches the touch operation surface of the touch device, the conductive layer located at the operation position causes the distance between the conductive layer and the first electrode pattern, and the conductive layer and the second electrode pattern due to money. The distance between the types is changed, so that the capacitance between the conductive layer and the first-electro-type, and between the conductive layer and the second electrode pattern are changed; the touch switching device is operated to perform capacitive touch position sensing. Mode: the microprocessor changes the capacitance of the conductive layer and the first electrode pattern and the capacitance of the e-electrode layer and the second electrode pattern, and the leaf touch object is located in the conductive layer. The operating position on it. ~ When the user (4) controls the operation surface of the touch device or operates the touch operation surface of the touch device with the pen=, the position is at the operation position; the layer is pressed to make the conductive layer - the strip electrode contact of the electrode pattern is zero at this time, so that the touch _ _ , the 蜩 蜩 4 is placed in the resistive touch position sensing mode, the conductive layer is subjected to pressure With the third 叩 叩. The sorrow-electrode pattern contact, the material cold device is based on at least the operating position of the touch object at the first electrode 受 of the contacted pressure on the conductive layer. 201033868 The present invention compares the effects of the prior art with the technical means adopted by the present invention, and only needs to be combined with the pressure sensitive touch device of the present invention and a simple scanning sensing process, which can be combined with a capacitive and resistive touch panel. Touch operation mode. There is no need to be limited by the touch object limitation of the conventional resistive touch panel or the capacitive touch panel, which makes the user's touch operation easier. In the leg operation mode, the (10) good touch sensing mode should be used. The design of the present invention can increase the application range of the touch device and has the advantages of the touch panel of the two touch operation modes. The design of the present invention can automatically operate in an appropriate touch position sensing mode in response to different operating habits of different users when using the touch device. The design of the present invention is also suitable for application in the field of touch applications requiring pen writing and inputting, which can effectively solve the problem that the writing operation of the capacitive touch panel is not smooth and the sensing is poor. The specific embodiments of the present invention will be further described by the following examples and accompanying drawings. [Embodiment] Referring to Figure ’, it shows a system block of the first embodiment of the present invention. In the figure, the touch device 100 mainly includes a first substrate 1 , a first substrate 20 and a microprocessor 3 . The second base is a transparent insulating thin layer having a conductive layer: a surface u and a touch operating surface 12 (see also 201033868 13 mainly composed of a conductive material, when the conductive material is ιτ〇 (oxidized steel) When tin), a transparent conductive layer can be formed. A driving voltage supply circuit 4 can be applied to the conductive layer 13 under the control of the microprocessor 3 to make the conductive layer η The conductive substrate is driven by the resistive touch. The second substrate 2G has an electrode pattern bonding surface 2 corresponding to the junction surface 11 of the conductive layer of the first substrate 1 (). The first electrode pattern 22 and the second electrode pattern are opened/formed as shown in FIGS. 2 and 4, and between the first electrode pattern 22 and the second electrode pattern 23, the insulating layer 24 is utilized. The distance between the first electrode pattern 22 and the conductive layer U of the first substrate is defined as a first predetermined distance. The second pattern 23 and the conductive layer 13 of the first substrate 1 The distance between the two is determined by (4) Ma Di two predetermined distance < J2. The second electrode pattern 22 has a plurality of strip electrodes S 2 , s3, S4, s5, s6 And forming a first electric valley Cx with the conductive layer 13 of the first substrate 1 (). The strip electrodes of the first electrode pattern 22 are ..... 2S6 are formed in a manner similar to each other. On the insulating layer 24. Between the insulating layer 24 and the conductive layer 13 of the first layer, the strip electrode 60 is not disposed. The dream is: /4, 55 and 56, The conductive layer of the first substrate 1 可 can be avoided at least by the insulating edge of the insulating layer. The second electrode pattern 23 has a plurality of strips. The electrodes Η, η, , :, 2, and S6', and form a first electric grid with the conductive core of the first substrate 1 各个. Each strip electrode sl, s2, s3, S4, s5, h6, 201033868: parallel to each other and _ topographically recorded on the second substrate μ-combined surface 21. The earth, the mouth, in this embodiment, the first electrode pattern 22 and the second electrode pattern ^Do not take six strip electrodes as an example, but the number of strip electrodes can be implemented. The first electrode pattern 22 is taken as an example, and its strip electrodes S1, s2, s3, :75 and Parallel to each other - a predetermined distance and extending along the first axial direction Y. The respective strips of the second electrode pattern 23, u, s2, f: 4', 35' and %' are also parallel to each other a distance between the shapes and extending along the second axis X. The respective strip electrodes of the first, second electrode pattern 22, S4, S5 and S6 are perpendicular or at other angles corresponding to the first electrode pattern 23 Each strip electrode S1, S2, S3, S4, S5, ^:: each strip electrode sl, s2, ^. = s6 of the first electrode pattern 22 is connected via the - scan circuit 5i The respective strip electrodes 81, 〜3, 4, and s6 of the second electrode pattern 23 of the microprocessor 3 are connected to the microprocessor by the first scanning circuit 52. Referring to FIG. 3 and FIG. 5, FIG. 3 is a view showing the relative positional relationship between the first substrate and the second electrode pattern after the two substrates 20 are bonded, and the 篦-+ (5) music electrode pattern 22 and the second electrode pattern are Fig. 5 is a plan view showing the substrate of the first embodiment of the present invention. As shown in the figure, the ms3 and s4'su "different type and the % system of the second type 22 are overlapped with the second electrode pattern 'type 23 = strip electrodes S1, S2', ~, ..., respectively. Corresponding to each of the parent vertical positions respectively represents one touch position on the touch device 1 . Referring to FIG. 6 , which shows the second embodiment of the present invention: 201033868 is a top view®. The main components of the second substrate 2G are mostly the same as those of the first embodiment, and the same components are denoted by the relevant numbers, and are not referred to herein. The difference is that the strip electrodes of the first electrode pattern 22 & S2", s3", s4", s5", s6" and the second electrode pattern of the magic strip electrode si,, s2, qV., c, the concave U221 4, S5 S6 of the library, the overlap There are two pairs of 4 221, respectively, to reduce the shielding effect of the first electrode pattern 22a on the second electrode circle=, so that the capacitive coupling effect between the conductive layer 】3 and the first circle φ 更好 is better. 丄 See also 7A , 7B and 8th round, flute 7Λ ^ Too tempted to rape the younger brother δ circle, the 7th, 7th picture shows that the monthly touch device is subject to users 8 Figure shows the 7A, 7R Gang Zhan 々ώ Dingxin can not bear the picture '苐 务 回 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各Strip electrode S3 of the type 22" strip electrode of the first electrode pattern 23, intersection: operation position P and the position of the first position is defined as the electrode pattern 22, the strong zipper ct electrode pattern 23 The strip electrode: the strip electrode S5 and the second E. The position of the 乂$ is defined as the position of the operation position U can be seen in Fig. 3) The touch object of the touch device 100 is used for touch It is used to manipulate the object. For example, when the finger, the conductive material or the XT pin is used as the original (ie, when it is not operated), the conductive layer 13 is illustrated. When the state is at rest, the pattern 23 pq, the electrode pattern 22. The effect of the first electrode C C 1 (4) exists between the first and the first thunder, so that the conductive layer 13/= (4) gae (10) hy is in the first capacitance Cx, and the conductive layer pattern D is between There is a second capacitor Cy. However, since the conductive/:electrode pattern 23 stores g 13 and the first electrode pattern 22, 201033868, the second electrode pattern 23 There is no contact pressure, so there is no distance change, and there is no capacitive coupling change. When the touch object 7 is touched, the touch operation surface 12 of the first substrate 1 is touched.
❹ 一操作位置P1 (如第7A圊所示),但導電層丨3與該第—電 極圖型22之間並未接觸時,位在該操作位置ρι處之導電層 13因文壓,而使導電層13與該第一電極圖型22之間之第 一預定距離di改變為们’(其中0<dl,<dl),且導電層13與 該第二電極圖型23之間之第二預定距離汜改變為们,(其中 0<d2 <d2) ’故使導電層13與第一電極圖型22之間之第一 電容Cx變化為第-電容Cxl,同時導電層13與第二電極圖 51 23之間之第一電容Cy變化為第二電容cyl。 、此時觸控裝置⑽會操作於電容式觸控位置感測模 式,由第-掃描電路51掃描感測導電層j 3與第一電極圖-22之各個條狀電極“、s2、s3、s4、s5及%之電容耦合變 化,亚送出一掃描感測錢N1至微處理器,3〇。而第二掃描 電路52同樣經由掃描感測導電層13與第二電極圖型心 :個條,S1,、,之電容輕合變化 俊’达出一掃描感測信號N2至微處理器3〇。 觸控褒置⑽依據接收到之第—電容㈤與第 之電容輕合變化,而計算出該觸控物件?位在第—基材 10之觸控操作面12 、 土 觸批你^ 置決定_控物件7之 工’、位於第二軸向X之條狀電極 條狀電極心疊之操作位置P1。 轴向¥之 而當觸控物件7以—移動方向L由第—基材H)之觸控 • 11 - 201033868 操作面12之操作位置P1移動至操作位置p2時(如第7β圖 所示),位在該操作位置P2處之導電層13因錢,使導電 層13與第一電極圖型22之間之第-預定距離cU改變為 dl (其中0<dl’<dl) ’且導電層13與該第二電極圖型之 間之第二就距離d2改變為d2,(其中㈣,,,故使導電 層13與第一電極圖型22之間之第一電容Oc變化為第一電 容CX2,同時導電層13與第二電極圖·23之間之第二電容❹ an operation position P1 (as shown in FIG. 7A), but when the conductive layer 丨3 is not in contact with the first electrode pattern 22, the conductive layer 13 located at the operation position ρι is pressed by the text The first predetermined distance di between the conductive layer 13 and the first electrode pattern 22 is changed to be '(where 0 < dl, < dl), and between the conductive layer 13 and the second electrode pattern 23 The second predetermined distance 汜 is changed to (where 0 < d2 < d2) ', so that the first capacitance Cx between the conductive layer 13 and the first electrode pattern 22 is changed to the first capacitance Cxl, while the conductive layer 13 and The first capacitance Cy between the second electrode patterns 51 23 changes to the second capacitance cyl. At this time, the touch device (10) operates in the capacitive touch position sensing mode, and the first scanning electrode 51 scans the strip electrodes "3, s2, s3, and the strip electrodes of the first electrode pattern -22". The capacitive coupling changes of s4, s5 and %, sub-send a scan sensing money N1 to the microprocessor, 3〇, and the second scanning circuit 52 also senses the conductive layer 13 and the second electrode pattern via scanning: , S1,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The touch object is located on the touch operation surface 12 of the first substrate 10, the soil touches the batch, the control object 7 is working, and the strip electrode electrode stack is located in the second axial direction X. Operation position P1. When the touch object 7 is touched by the first substrate H in the moving direction L, the operation position P1 of the operation surface 12 is moved to the operation position p2 (such as 7β shows that the conductive layer 13 at the operating position P2 is between the conductive layer 13 and the first electrode pattern 22 due to the money. The first-predetermined distance cU is changed to dl (where 0 < dl' < dl) ' and the second distance d2 between the conductive layer 13 and the second electrode pattern is changed to d2, (wherein (4), The first capacitance Oc between the conductive layer 13 and the first electrode pattern 22 changes to the first capacitance CX2, and the second capacitance between the conductive layer 13 and the second electrode pattern 23
Cy變化為第二電容Cy2,再經由相同之掃描感測方式,以 =觸控位置移至操作位置P2,其相同之實施原理在此不 再贅述。 參閱第9 ®,其係顯示本發明之觸控裝置以觸控物件 ^之不意圖。如圖所示’首先將本應用例中第—電極圖型 2之,狀電極“與第二電極圖型23之條狀電極s3,交疊之 位置定義為操作他署pq , 、 置3。而本應用例中用以觸控操作觸控 ==:::)係可為導電或非導電觸控物件(例如 7a在逸!參閱第1〇圖,其係顯示配合第9圖之觸控物件 丁控操作之系統方塊圖。當使用者以觸控物件 ==方向Z觸壓第一基材1。之觸控一 極圖型22之停位置P3處之導電層13與第一電 宏因受塵接觸,此時兩者間之第一預 疋間距dl,(同時參閱第4圖)。 式,經H叙觸控裳4 1 〇 〇會操作於電阻式觸控位置感測模 °電壓供應電路送出驅動電壓v至第一基材 -12 - 201033868 至H由料電層13將該驅動㈣V施加 電極圖型22之對應位置。故當第一基材⑺之導電声 與第-電極圖型22之條狀電極s4因 & s 置接觸時,驅動電壓V會施加 又壓位 ^ 王弟電極圖型22之條肤雷 〇 =Γ T電壓變化’輸出—掃描感難號N3至 錢理"3G。微處理器3G依據第—電極_22之條狀電 極S4之電壓變化’即可計算出觸控物件立在 10之觸控操作面12上之操作位置P3。 土 μΓΓ^11β、llc圖所示,其係顯示本發明之觸 ==物件進行手寫輸入之示意圖,而第12圖係顯 之系統圖。UB、llc圖觸控物件在進行手寫輸入操作 當使用者經觸控物件7a 第一基材10之觸控操作 戶13^筆寫輸人方式位移時,位在各個操作位置處之導電 ㈣於Γ—電極圖型22因受壓接觸,會使觸控裝置⑽ 會、’、阻式觸控位置感測模式。使用者筆寫輸人之操作, I ί以移動方向“多位之數個操作位置P4、P5、P6所形 懕:庙寫軌跡’在每—個操作位置P4、P5、P6時,驅動電 二、應電路4〇送出驅動電壓v至第一基材1〇之導電層 13,亚經由導雷屉 ^ a 22之各個對應摔曰作^該驅動電魔V施加至第一電極圖型 第-電極圖型22 J。故虽第一基材1〇之導電層13與 '^條狀電極S3接觸時,驅動電壓v會施 刀口主弟一電極圖型 之條狀電極s3上’並經由第一掃描電 -13 - 201033868 :::描感測第一電極圖型22之條狀電極 =出:掃描感測信號N4至微處理器3〇 ; —電極圖型22之條狀電極S3之電屋變化,即可,算 位在第-基材丨。之觸控操作面二= =Η。如此連續地順序感測各個操作位置料、p5、= :至微Z描電路51順序地輸出一序列掃描感測信號N4 迗至微處理器3〇。料# 。 ^ 处里态30依據感測到之數個操作位置 P4、P5、P6而計算出觸 ❿操作㈣上之手寫軌跡。位在第基材之觸控 A同時參閱第13、14圖’第13圖係顯示本發明第三者 之!統方塊圖,第14圖係顯示本發明第三實施例之二 =槿,所示,本實施例之觸控裝置1〇〇a和第-實施例 目以’其主要差異在於本實施例觸控t置10〇a之資 二材ST上:堇包括結合有第一電極圖型22之各個條狀電 s3、s4、S5、S6 ’且各條狀電極s卜s2、s3、^、 ❹ 和第—基材1〇之導電層13相距—第三預定距離d3, -刀H由第-掃描電路51連接至微處理器,其他 疋件之部份以相同之標號顯示,故不再贅述。〃 ° 本實施例之實施方式與前述實施例相似,同樣包括社 ^電谷式及電阻式觸控操作方式。當觸控裝置1〇如之觸栌 :作面12未受到觸壓操作時,第一電極圖型22之各_ 第广^心““和苐一基材⑺之導電層叫目距 —預疋距離d3 ’而在第一電極圖型22與導 形成第一電容Cx。 曰13之間 -14 - 201033868Cy changes to the second capacitor Cy2, and then moves to the operating position P2 by the same scanning sensing mode, and the same implementation principle will not be repeated here. Referring to the ninth aspect, the display of the touch device of the present invention is not intended to be a touch object. As shown in the figure, 'the position of the electrode of the first electrode pattern 2 and the strip electrode s3 of the second electrode pattern 23 is first defined as the operation of the pq, and the third. In this application example, the touch operation touch ==:::) can be a conductive or non-conductive touch object (for example, 7a is in Yi! Refer to Figure 1 for displaying the touch with Figure 9). The system block diagram of the object control operation. When the user touches the first substrate 1 with the touch object== direction Z. The conductive layer 13 at the stop position P3 of the touch one-pole pattern 22 and the first electric macro Due to the dust contact, the first pre-twisting distance between the two is dl (see also Figure 4). The H-touch touch skirt 4 1 〇〇 will operate in the resistive touch position sensing mode. The voltage supply circuit sends the driving voltage v to the first substrate -12 - 201033868 to H, and the driving (four) V applies the corresponding position of the electrode pattern 22 by the material layer 13. Therefore, the conductive sound and the first electrode of the first substrate (7) When the strip electrode s4 of the pattern 22 is contacted by & s, the driving voltage V will be applied and pressed again. ^ Wang Di electrode pattern 22 skin thunder = Γ T voltage change 'transmission - Scanning difficulty number N3 to Qianli " 3G. The microprocessor 3G can calculate the touch object standing on the touch operation surface 12 of 10 according to the voltage change of the strip electrode S4 of the first electrode_22 The operation position P3 is shown in the figure of the soil μΓΓ^11β, which shows a schematic diagram of the handwriting input of the touch== object of the present invention, and the system diagram of the system shown in Fig. 12 is performed. The handwriting input operation is performed when the user is displaced by the touch operation method of the first substrate 10 of the touch object 7a, and the conductive (4) at each operation position is pressed by the Γ-electrode pattern 22 Contact, the touch device (10) will, ', resistive touch position sensing mode. The user writes the input operation, I ί in the moving direction "multiple positions of the operation position P4, P5, P6懕: Temple write track 'At every operation position P4, P5, P6, the drive circuit 2, the circuit 4 〇 sends the drive voltage v to the conductive layer 13 of the first substrate 1 亚, sub-via the guide drawer ^ a Each of the corresponding wrestlings of 22 is applied to the first electrode pattern type-electrode pattern 22 J. When a conductive layer 13 of a substrate is in contact with the strip electrode S3, the driving voltage v is applied to the strip electrode s3 of the electrode pattern of the master of the blade and is transmitted via the first scanning electron-13 - 201033868 :: The strip electrode of the first electrode pattern 22 is sensed: the scan sensing signal N4 is sent to the microprocessor 3〇; the electric strip of the strip electrode S3 of the electrode pattern 22 is changed, that is, the calculation is performed. The touch-operating surface of the first substrate 二 = = Η. Thus sequentially sequentially sensing the respective operating position materials, p5, =: to the micro-Z trace circuit 51 sequentially outputs a sequence of scanning sensing signals N4 迗 to micro Processor 3〇. Material #. ^ The state 30 calculates the handwritten trajectory on the touch operation (4) based on the sensed operation positions P4, P5, and P6. The touch A on the first substrate is also referred to in FIGS. 13 and 14 and the 13th view shows the third block of the present invention. FIG. 14 shows the third embodiment of the present invention. It is to be noted that the touch device 1A and the first embodiment of the present embodiment have the main difference that the touch control device of the present embodiment has a touch-setting device of 10 〇a. Each strip-shaped electric s3, s4, S5, S6' of the type 22 and the strip electrodes s2, s3, ^, ❹ and the conductive layer 13 of the first substrate 1〇 are separated by a third predetermined distance d3, - a knife H is connected to the microprocessor by the first scanning circuit 51, and the other components are shown by the same reference numerals and will not be described again. 〃 ° The embodiment of the present embodiment is similar to the previous embodiment, and includes the same operation mode and resistive touch operation mode. When the touch device 1 is touched as follows: when the face 12 is not subjected to a touch operation, the conductive layers of the first electrode pattern 22 and the substrate (7) are called the eye distance. The first distance C3 is formed at the first electrode pattern 22 and the distance d3'.曰13 between -14 - 201033868
當觸控物件輕觸第一基材10之觸控操作面12、但導電 層13與第一電極圖型22之間並未接觸時,位在該操作位置 處之導電層13因受壓,而使導電層13與第一電極圖型22 之間之第三預定距離d3改變,故使導電層13與第一電極圖 型22之間之電容耦合變化,使觸控裝置100a操作於電容式 觸控位置感測模式。藉由第—掃描電路51掃描感測導電層 13與第-電極圖型22間之電容氣合變化,送出掃描感測^ 號N1至微處理器3〇。微處理器3〇依據接收到之電容耦合 變化’而計算出觸控之操作位置。 D 與第一實施例相似,當觸控物件觸壓該觸控裝置i〇〇a 之觸控操作面12或以筆寫輸人操作該觸控裝置IGOa之觸控 操作面12時,位在該操作位置處之,電層13與第一電極圖 型22間因受壓接觸,此時第一預定間距d3=〇,使觸控裝產 l〇〇a操作於電阻式觸控位置感測模式。此時,第一基材 之導電層U與第一電極圖型22之其中—條狀電極(;如條 :電極S4)接觸時,驅動電壓乂會施加至該條狀電極上,並 Ik由第一掃描電路51掃描感測第一電極關Μ之該條狀電 極S4之電壓變化,使微處理器3〇依據其電壓變化 觸控之操作位置。 由以上之實施例可知,本發明所提供之感壓式觸控裝 置確具產業上之利用價值’故本發明業已符合於專利之要 件。惟以上之敘述僅為本發明之較佳實施例說明,凡精於此 項技蟄者當可依據上述之朗而作其它難之改良,惟這些 改變仍屬於本發明之發明精神及以下所界定之專利範圍中一。 -15 - 201033868 【圖式簡單說明】 第1圖係顯示本發明第—奋 筮,国〆 个|乃第實施例之系統方塊圊; 第2圖係顯示第1圖中 中要構件之立體分解圖; •=顯不第1圖中第—基材與第二基材在結合後,第 笛4 極圖型及第二電極圖型之相對位置關係; 第4圖係顯示第3圖之4-4斷面之剖視圖;When the touch object touches the touch operation surface 12 of the first substrate 10 but the conductive layer 13 is not in contact with the first electrode pattern 22, the conductive layer 13 located at the operation position is pressed. The third predetermined distance d3 between the conductive layer 13 and the first electrode pattern 22 is changed, so that the capacitive coupling between the conductive layer 13 and the first electrode pattern 22 is changed, so that the touch device 100a operates in a capacitive manner. Touch position sensing mode. The scan sensing circuit 51 scans the capacitive sensing change between the conductive layer 13 and the first electrode pattern 22, and sends the scanning sensing signal N1 to the microprocessor 3. The microprocessor 3 calculates the operational position of the touch based on the received capacitive coupling change. Similar to the first embodiment, when the touch object touches the touch operation surface 12 of the touch device i〇〇a or the touch operation surface 12 of the touch device IGOa is written by a pen, At the operation position, the electrical layer 13 and the first electrode pattern 22 are contacted by pressure, and the first predetermined spacing d3=〇, so that the touch device is operated in the resistive touch position sensing. mode. At this time, when the conductive layer U of the first substrate is in contact with the strip electrode (such as the strip electrode S4) of the first electrode pattern 22, the driving voltage 乂 is applied to the strip electrode, and Ik is The first scanning circuit 51 scans the voltage change of the strip electrode S4 sensing the first electrode switch, so that the microprocessor 3 changes the touch operation position according to the voltage thereof. It can be seen from the above embodiments that the pressure sensitive touch device provided by the present invention has industrial use value. Therefore, the present invention has met the requirements of the patent. However, the above description is only for the preferred embodiment of the present invention, and those skilled in the art can make other difficult improvements according to the foregoing, but these changes still belong to the inventive spirit of the present invention and are defined below. One of the patent scopes. -15 - 201033868 [Simple description of the drawings] Fig. 1 shows the system block of the first embodiment of the present invention, which is the system block of the first embodiment; and Fig. 2 shows the three-dimensional decomposition of the components in the first figure. Fig. 1 = Fig. 1 shows the relative positional relationship between the fourth polar pattern and the second electrode pattern after the first substrate and the second substrate are bonded; Fig. 4 shows the fourth figure of Fig. 4 Sectional view of the -4 section;
^ 6 貞:本發明第—實施例之第二基材之俯視圖; θ Utf本發明第二實施例之第二基材之俯視圖; 、7B圖絲示本發明之觸«置在受到❹者手和 作時之操作示意圖; =圖係顯不第7Α、7Β圖中斧觸控位置與對應之電容值表 ―圖係顯示本發明之觸控裝置以觸控物件操作之示意圖 弟圖係顯不配合第9圖觸控物件在進行觸控操作之系命 方塊圖; 第、、11B、i1C圖係顯示本發明之觸控裝置以觸控物件 進行手寫輸入之示意圖; 第U圖係顯示配合第11A、11B、UC圖觸控物件在進行手 寫輸入操作之系統圖; $圖係顯示本發明第三實施例之系統方塊圖; 第14圖係顯示本發明第三實施例之剖視圖。 【主要元件符號說明】 100 ' 100a 觸控裝置^ 6 俯视: a top view of the second substrate of the first embodiment of the present invention; θ Utf a top view of the second substrate of the second embodiment of the present invention; and 7B of the wire showing the touch of the present invention Schematic diagram of operation during operation; = diagram showing the position of the axe and the corresponding capacitance value table in the figure 7 - Figure 7 shows the schematic diagram of the touch device operated by the touch object of the present invention The figure of the touch object in FIG. 9 is a block diagram of the touch operation; the first, 11B, and i1C diagrams show the handwriting input of the touch device of the present invention by using the touch object; 11A, 11B, UC diagram touch object in the system diagram of handwriting input operation; $ is a system block diagram showing a third embodiment of the present invention; and Fig. 14 is a cross-sectional view showing a third embodiment of the invention. [Main component symbol description] 100 ' 100a touch device
Cx ' Cxi ' Cx2 Cy、Cyl、Cy2 dl PI 、 P2 、 P3 、 P4 、 P5 、 201033868 ίο 11 12 13 20 21 22 ' 22a 221 ❹ 23 24 30 40 51 52 60 7、7aCx ' Cxi ' Cx2 Cy, Cyl, Cy2 dl PI , P2 , P3 , P4 , P5 , 201033868 ίο 11 12 13 20 21 22 ' 22a 221 ❹ 23 24 30 40 51 52 60 7 , 7a
d2 d3 P6D2 d3 P6
V 第一基材 導電層結合面 觸控操作面 導電層 第二基材 電極圖型結合面 第一電極圖型 内凹區段 第二電極圖型 絕緣層 微處理器 驅動電壓供應電路 第一掃描電路 第二掃描電路 絕緣隔點 觸控物件 第一電容 第二電容 第一預定距離 第二預定距離 第三預定距離 操作位置 驅動電壓 17 - 201033868 N1 掃描感測信號 N2 掃描感測信號 N3 掃描感測信號 N4 掃描感測信號 si、s2、s3、s4、、s5、 s6、 條狀電極 si, 、 s2, 、 s3’ 、 s4, 、 s5,、 條狀電極 s6, O si”、s2”、s3”、s4”、 s5,,、s6” 條狀電極 X 第二轴向 Y 第一轴向 I 觸壓方向 L 移動方向 -18 -V first substrate conductive layer bonding surface touch operation surface conductive layer second substrate electrode pattern bonding surface first electrode pattern concave section second electrode pattern insulating layer microprocessor driving voltage supply circuit first scanning Circuit second scanning circuit insulation compartment touch object first capacitance second capacitance first predetermined distance second predetermined distance third predetermined distance operation position driving voltage 17 - 201033868 N1 scanning sensing signal N2 scanning sensing signal N3 scanning sensing Signal N4 scans the sensing signals si, s2, s3, s4, s5, s6, strip electrodes si, s2, s3', s4, s5, strip electrodes s6, Osi", s2", s3 ", s4", s5,,, s6" strip electrode X second axial direction Y first axial direction I touch direction L movement direction -18 -
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Cited By (4)
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TWI467452B (en) * | 2010-10-22 | 2015-01-01 | Japan Display Inc | Touch panel |
US9530732B1 (en) | 2015-06-25 | 2016-12-27 | Vanguard International Semiconductor Corporation | Efficient layout placement of a diode |
TWI583003B (en) * | 2015-04-29 | 2017-05-11 | 世界先進積體電路股份有限公司 | Semiconductor devices |
US11797119B2 (en) | 2017-04-14 | 2023-10-24 | Sensel, Inc. | Selectively adhered resistive force sensor |
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EP0756733B1 (en) * | 1995-02-22 | 2002-09-18 | Koninklijke Philips Electronics N.V. | Low-cost resistive tablet with touch and stylus functionality |
US20010013855A1 (en) * | 1998-06-12 | 2001-08-16 | Jean-Philippe Fricker | Resistive and capacitive touchpad |
US6492979B1 (en) * | 1999-09-07 | 2002-12-10 | Elo Touchsystems, Inc. | Dual sensor touchscreen utilizing projective-capacitive and force touch sensors |
TW200834391A (en) * | 2007-02-12 | 2008-08-16 | Young Fast Optoelectronics Co | Complex touch sensing device |
TWM321553U (en) * | 2007-02-16 | 2007-11-01 | Young Fast Optoelectronics Co | Touch control panel with dual sensing interfaces |
TW200909912A (en) * | 2007-08-17 | 2009-03-01 | Mildex Optical Inc | Flat-plane resistive and capacitive integrated touch panel |
TWM335736U (en) * | 2007-11-02 | 2008-07-01 | Young Fast Optoelectronics Co | Improved structure of duplexing touch panel |
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Publication number | Priority date | Publication date | Assignee | Title |
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TWI467452B (en) * | 2010-10-22 | 2015-01-01 | Japan Display Inc | Touch panel |
TWI583003B (en) * | 2015-04-29 | 2017-05-11 | 世界先進積體電路股份有限公司 | Semiconductor devices |
US9530732B1 (en) | 2015-06-25 | 2016-12-27 | Vanguard International Semiconductor Corporation | Efficient layout placement of a diode |
US11797119B2 (en) | 2017-04-14 | 2023-10-24 | Sensel, Inc. | Selectively adhered resistive force sensor |
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