TWI394238B - 小型模塑記憶卡及其製造方法 - Google Patents

小型模塑記憶卡及其製造方法 Download PDF

Info

Publication number
TWI394238B
TWI394238B TW096149275A TW96149275A TWI394238B TW I394238 B TWI394238 B TW I394238B TW 096149275 A TW096149275 A TW 096149275A TW 96149275 A TW96149275 A TW 96149275A TW I394238 B TWI394238 B TW I394238B
Authority
TW
Taiwan
Prior art keywords
memory card
circuit
circuit layer
package
electrically connected
Prior art date
Application number
TW096149275A
Other languages
English (en)
Other versions
TW200845323A (en
Inventor
Ben Wei Chen
David Hung-Dien Chen
Jin S Wang
Original Assignee
Kingston Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kingston Technology Corp filed Critical Kingston Technology Corp
Publication of TW200845323A publication Critical patent/TW200845323A/zh
Application granted granted Critical
Publication of TWI394238B publication Critical patent/TWI394238B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B29C45/2708—Gates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

小型模塑記憶卡及其製造方法
本發明係關於一種小型模塑記憶卡之製作方法；更詳細地說，係關於一種記憶卡之形狀模塑結構，其具有一平滑且無瑕疵之外觀。
記憶卡廣泛地使用於許多電子商品，諸如：數位相機、行動電話以及個人行動助理(personal digital assistant；PDA)等等。記憶卡的尺寸隨著時間具有縮小的趨勢。舉例來說，以目前而言，某些記憶卡，如：微型安全數位卡(micro secure digital card；micro SD card)或多媒體微型卡(multimedia compact micro card；MMC micro card)，其寬度與長度皆短於1公分，其厚度薄於1毫米。
美國專利第6,624,005號，「半導體記憶卡及其製作方法」(Semiconductor memory cards and method of making same)，係揭露一種於封裝模塑程序(encapsulating molding process)完畢後，利用「仿切餅乾」(cookie cutting pattern)方式製作一記憶卡之方法。該方法可切開本體及印刷電路板層，或基底面板。上述之方法最適合本身為長方形之記憶卡，或是其側邊為直線之記憶卡。
一般來說，隨著記憶卡的發展，例如：迷你安全數位(mini secure digital；mini SD)記憶卡以及micro SD記憶卡，其記憶卡之外形逐漸演變出複雜的形狀。由於記憶卡外形複雜的關係，對於封裝模塑程序完成後之陸續製作過程，將變得難以處理。首先，方才所提及之仿切餅乾方式係不再適用，且無法獲得預期效果。其次， 去角之切除動作除了邊角之平面觀點，更需要考慮該卡高度與厚度之立體觀點，如mirco SD卡。
先前技術係針對切割複合形狀記憶卡提出某些可行之方法。如第1圖所示，於封裝模塑程序完成後，利用水刀(water－jet machine)、精準雷射(precision laser)或研磨機(grinder)將基底面板52上之記憶卡30割開或個別分開(singulated)。由於該形狀切割過程需要考量立體維度，此程序將費時且頗為昂貴。
為了減少製作時間與成本，針對該複合形狀切割製程之改善方案因應產生。利用先前技術，而非前述之仿切餅乾方式，使用一組個別形狀模塑來處理該複合形狀。該記憶卡需切割之部分僅包含其具有直線之部份，而非其具有複合形狀之部分。在此，水刀、精準雷射或研磨機並非用來切割整個記憶卡之線條，而是用來切割其單一線條。標準起槽機(standard router)、分割器(singulator)、穿孔器(punch)，或任一種在標準半導體後半段製程可以使用之工具，即可將已完成之記憶卡由該基底面板移除或分離。
如第1A圖所示，一習知記憶卡結構包含一具有一上表面與一下表面之電路基板10。一電路層12與複數電性接點14係分別位於該電路基板10之上表面與下表面。一記憶晶片16、一控制晶片18與若干電性元件20係位於電路基板10之上表面並與該電路層12電性連接。一封裝材料覆蓋物22係用以封裝該電路基板10以及其上表面之所有元件，並暴露出電路基板10下表面之該等電性接點14，該等電性接點14係用以與外部電性連接。
下文將說明利用前述之先前技術，製作該封裝材料覆蓋物22之 方法。首先，將電路基板10置於模具24之較低表面。該模具24具有一封裝口26設置於該電路基板10上方。將封裝材料由電路基板10上面之封裝口26注入，以封裝該電路基板10、記憶晶片16、控制晶片18以及該等電性元件20。於封裝材料固化後，將該記憶卡由該模具中取出。第1B圖顯示習知模塑程序，將封裝材料注入該記憶卡30頂端之過程。第1C圖顯示一已完成之記憶卡30。然而，已完成之記憶卡30，其封裝口仍殘留一標註記號28。由於記憶卡30結構之尺寸很小，一旦記憶卡30於製作過程中，外觀有任何瑕疵殘留在其表面(如第1C圖中，封裝口26殘留之標註記號28)，其外觀瑕疵將會很顯眼。再者，未來記憶卡之尺寸將會日趨縮小，使得殘留於記憶卡表面之瑕疵將更難以忽略。
據此，根據本發明之方法及系統，提供一記憶卡之模塑結構係用以解決前述先前技術之缺點。
本發明之一目的在於提供一記憶卡之形狀模塑結構，利用一模具將一封裝材料擠壓於至少一封裝口，而形成一封裝材料覆蓋物，該至少一封裝口係位於一電路基板之至少一側邊。之後將殘留於該封裝材料覆蓋物之外表面之封裝口之一標註記號移除，藉此解決傳統記憶卡外觀具瑕疵之問題。
本發明之再一目的在於提供一記憶卡之形狀模塑結構，其係利用一形狀模具壓製(pressing)製程，用以形成一記憶卡之一封裝材料覆蓋物，以簡化該製作程序。
為達上述目的，本發明係提供一記憶卡之一形狀模塑結構，其 包含一電路基板、至少一晶片以及一封裝材料覆蓋物。該電路基板之一上表面與一下表面分別具一電路層與複數電性接點。該晶片係位於該電路基板之該上表面，並與該電路層電性連接。該封裝材料覆蓋物係用以覆蓋所有上述元件並暴露出該等電性接點。該封裝材料覆蓋物係利用一模具將封裝材料擠壓於至少一封裝口而形成，該封裝口係位於該電路基板之至少一側邊。之後，將殘留於該封裝材料覆蓋物上之封裝口之一標註記號移除。
本發明係關於一小型記憶卡之模塑方法；更詳細地說，係關於一記憶卡之模塑結構，具有一平滑且無瑕疵之外觀。以下說明用以使該技術領域具有通常知識者得以實施及使用本發明，且依照專利申請書及其相關規定提出。在此列舉之實施例、一般原理及特徵係可迅速地被該技術領域具有通常知識者所瞭解，故本發明之實施態樣並非用來限制本發明之範疇，本發明之權利範圍應根據在此說明之原理及特徵作最寬廣的解釋。
如第2、3圖所示，一記憶卡30之模塑構造包含一電路基板32，該電路基板32具一上表面與一下表面。一電路層34與複數電性接點36分別位於該電路基板32之上表面及下表面。該等電性接點36經由複數導線(未顯示)電性連接至該電路層34。該電性接點36亦用以與外界電性連接。一記憶晶片38、一控制晶片40以及部分電性元件42係位於該電路基板32之上表面，並與電路層34電性連接。其中，該等電性元件42係選自：電阻、電容器、電感以及變壓器。記憶晶片38以及控制晶片40利用金屬線接合、 覆晶(flip chip)或表面黏著技術(surface mount technology；SMT)(表面黏著，未顯示)與該電路層34電性連接。一封裝材料覆蓋物44係用以覆蓋所有上述元件，並暴露出電路基板32下表面之該等電性接點36。如第3圖所示，該封裝材料覆蓋物44之外表面為平滑且無瑕疵。
第4A、4B圖係描繪該封裝材料覆蓋物44之製程。首先，將電路基板32置於模具46，該電路基板32之一側邊具有一封裝口48。將熱固性封裝材料注入封裝口48以形成一封裝件48’，該熱固性封裝材料係選自：酚樹脂(phenolic resin)、尿素樹脂(urea resin)、三聚氰氨樹脂(melamine resin)與環氧樹脂(epoxy resin)。該熱固性封裝材料係於攝氏120度與250度間之溫度下固化，以形成該封裝材料覆蓋物44。接著，完成後之記憶卡由該模具46中取出，並且將殘留在該封裝材料覆蓋物44上之該封裝口48之一標註記號移除，使得記憶卡30之模塑結構呈現一平滑無瑕疵之外觀。進一步地，如第4C圖所示，該模具46於該電路基板32之不同側邊上亦可安置若干封裝口48，用以分散(disperse)該熱固性封裝材料。
本發明之特徵在於，該模具於側邊具有封裝口之設計，並善用一形狀模塑，以擠壓之方式形成該記憶卡之封裝材料覆蓋物。每一個記憶卡之複合形狀皆可利用該模具製成，不論其為邊角或去角、具平面或立體維度。該封裝口48僅設置於該記憶卡之直線側邊，且該封裝件48’於該移除步驟中能被簡易地切開或開孔。因此，之後只需將殘留在該封裝材料覆蓋物44上之該封裝口48之 該標註記號移除，便能使該記憶卡之模具結構之外型為平滑且無瑕疵。
如第5圖所示，本發明可於一製造程序中，聚設於複合形狀模塑結構之一基底面板52中。基底面板52適可連接複數模塑記憶卡30，且基底面板52包含複數標註基準點(fiducial mark)50以及複數固定孔51。該等封裝件48'亦於記憶卡30之模塑過程中用以當作與基底面板52之一連接件(connection bar)，使得基底面板52於模塑過程中能與該等記憶卡30保持連接。該等封裝件48'於稍後將被切除、開孔或切割(singulated)，以將該等記憶卡30由該基板面板52分離，並且不留下任何明顯之標註記號28。該等標註基準點50係為了於模塑程序之初始，元件黏著或金屬線接合之校準目的。在注入封裝材料步驟期間與之後，該等固定孔51用以塑形(molding)與分離該基底面板52上之該等記憶卡30。
本發明不限應用於現存之記憶卡，如：MMC卡、智慧多媒體卡(smart media card；SM card)、安全數位卡(secure digital card；SD card)、小型快閃卡(compact flash card；CF card)以及記憶條卡(memory stick card；MS card)，更能提供一有效率之方法及系統，以為小尺寸之記憶卡(如：micro SD卡以及MMC卡)或未來更小尺寸之記憶卡，形成封裝材料之覆蓋物。
上述所列舉之實施例僅用來例舉本發明之實施態樣，以及闡釋本發明之技術特徵，並非用來限制本發明之範疇。任何熟悉此項技藝之人士均可在不違背本發明之技術原理及精神的情況下，對上述實施例進行修改及變化，因此本案之權利範圍應以下述申請 專利範圍所主張之內容為依據。
10、32‧‧‧電路基板
12、34‧‧‧電路層
14、36‧‧‧電性接點
16、38‧‧‧記憶晶片
18、40‧‧‧控制晶片
20、42‧‧‧電性元件
22、44‧‧‧封裝材料覆蓋物
24、46‧‧‧模具
26、48‧‧‧封裝口
28‧‧‧標註記號
30‧‧‧記憶卡
48'‧‧‧封裝件
50‧‧‧標註基準點
51‧‧‧固定孔
52‧‧‧基底面板
第1圖係為先前技術之複合形狀記憶卡，其模塑結構之基底面板之俯視圖；第1A圖係為先前技術之記憶卡之模塑結構，其封裝方式之示意圖；第1B圖係為先前技術中，具一封裝口於頂端之晶片之模塑結構，其於模塑過程之立體圖；第1C圖係為先前技術具一標註記號之記憶卡，其模塑結構之立體圖；第2圖係為根據本發明之記憶卡之模塑結構之立體圖；第3圖係為根據本發明之記憶卡之模塑結構之剖面示意圖第4A圖係為根據本發明之一實施例之封裝步驟示意圖；第4B圖係為根據本發明之另一實施例之封裝步驟示意圖；第4C圖係為根據本發明之再一實施例之封裝步驟示意圖；以及第5圖係為於一製程中，一複合形狀模塑結構之基板面板之示意圖。
32‧‧‧電路基板
34‧‧‧電路層
36‧‧‧電性接點
38‧‧‧記憶晶片
40‧‧‧控制晶片
42‧‧‧電性元件
44‧‧‧封裝材料覆蓋物
46‧‧‧模具
48‧‧‧封裝口

Claims (23)

  1. 一種提供一模塑記憶卡(molded memory card)之方法，包含下列步驟：於一模具(mold)中提供一電路；由至少一封裝口(encapsulant inlet)注入封裝材料，以提供一封裝材料覆蓋物於該電路上，該封裝口係位於該模具中之該電路之至少一側邊表面上；以及移除殘留在該封裝材料覆蓋物上之該封裝口之一標註記號(trace mark)。
  2. 如請求項1所述之方法，其中該電路包含：一電路基板(circuit substrate)，具有一上表面與一下表面；一電路層與複數電性接點(electric contacts)，其分別位於該上表面與該下表面，該等電性接點係與該電路層電性連接，並用以與外部電性連接；以及至少一晶片，設置於該電路基板之該上表面，並與該電路層電性連接。
  3. 如請求項1所述之方法，其中該封裝材料覆蓋物係由一熱固性封裝材料(thermosetting encapsulant)製成。
  4. 如請求項3所述之方法，其中該熱固性封裝材料係選自：酚樹脂(phenolic resin)、尿素樹脂(urea resin)、三聚氰氨樹脂(melamine resin)與環氧樹脂(epoxy resin)。
  5. 如請求項3所述之方法，其中該熱固性封裝材料係於攝氏120 度與250度之間的溫度固化。
  6. 如請求項2所述之方法，其中該晶片與該電路層係利用金屬線接合、覆晶(flip chip)或表面黏著技術(surface mount technology；SMT)達成電性連接。
  7. 如請求項2所述之方法，其中該晶片係為一記憶體晶片。
  8. 如請求項2所述之方法，更包含一控制晶片以及複數電子元件，其中該控制晶片與該等電子元件係設置於該電路基板之該上表面，並與該電路層電性連接。
  9. 如請求項8所述之方法，其中該複數電子元件係選自：電阻、電容、電感與變壓器。
  10. 如請求項8所述之方法，其中該控制晶片與該電路層係利用金屬線接合、覆晶或表面黏著技術達成電性連接。
  11. 如請求項2所述之方法，其中複數導線係設置於該電路基板，用以電性連接該電路層至該等電性接點。
  12. 如請求項1所述之方法，更包含下列步驟：由該模具中形成具複合形狀(complex shape)、邊角或去角之記憶卡。
  13. 如請求項1所述之方法，更包含僅設置於該記憶卡之直線側邊之複數封裝口。
  14. 如請求項1所述之方法，更包含於一製程中製作之一具複合形狀模塑(multiple shape-molding)結構之基底面板。
  15. 如請求項1所述之方法，更包含具有複數標註基準點之一基底面板，於該注入封裝材料步驟前，用於元件黏著或金屬線 接合之校準。
  16. 如請求項1所述之方法，更包含利用具有複數固定孔之一基底面板，於該注入封裝材料步驟期間與之後，用於模塑與分離複數記憶卡。
  17. 一模塑記憶卡，包含：一電路基板，具一上表面與一下表面；一電路層與複數電性接點，其分別位於該上表面與該下表面，該等電性接點電性連接至該電路層，並用以與外部電性連接；至少一晶片，設置於該電路基板之該上表面，並電性連接至該電路層；以及一封裝材料覆蓋物，用以封裝前述元件並僅暴暴露出該等電性接點；其中，一標註記號係不可見於該模塑記憶卡上。
  18. 如請求項17所述之模塑記憶卡，其中該封裝材料覆蓋物係由一熱固性封裝材料製成。
  19. 如請求項18所述之模塑記憶卡，其中該熱固性封裝材料係選自：酚樹脂、尿素樹脂、三聚氰氨樹脂與環氧樹脂。
  20. 如請求項17所述之模塑記憶卡，其中該晶片係為一記憶體晶片。
  21. 如請求項17所述之模塑記憶卡，更包含一控制晶片以及複數電子元件，其中該控制晶片與該等電子元件係設置於該電路基板之該上表面，並與該電路層電性連接。
  22. 如請求項17所述之模塑記憶卡，其中複數導線係設置於該電路基板，用以電性連接該電路層至該等電性接點。
  23. 一種提供複數模塑記憶卡之方法，包含下列步驟：於一模具中提供複數電路，該模具包含設置於各該電路之複數側邊表面之複數封裝口；於各該封裝口注入封裝材料，用以提供一封裝材料覆蓋物於各該電路上；由該模具中移除該等電路，其中各該封裝材料覆蓋物包含複數標註記號；以及移除各該封裝材料覆蓋物之該等標註記號。
TW096149275A 2007-01-18 2007-12-21 小型模塑記憶卡及其製造方法 TWI394238B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/624,615 US7601563B2 (en) 2005-06-10 2007-01-18 Small form factor molded memory card and a method thereof

Publications (2)

Publication Number Publication Date
TW200845323A TW200845323A (en) 2008-11-16
TWI394238B true TWI394238B (zh) 2013-04-21

Family

ID=39638853

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096149275A TWI394238B (zh) 2007-01-18 2007-12-21 小型模塑記憶卡及其製造方法

Country Status (4)

Country Link
US (2) US7601563B2 (zh)
CN (1) CN101641799B (zh)
TW (1) TWI394238B (zh)
WO (1) WO2008089415A2 (zh)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7939923B2 (en) * 2006-02-02 2011-05-10 Panasonic Corporation Memory card and method for manufacturing memory card
TW200739756A (en) * 2006-04-03 2007-10-16 qin-dong Liu Method of packaging flash memory cards
TW200845236A (en) * 2007-05-04 2008-11-16 Utac Taiwan Memory card and method for fabricating the same
TWI355220B (en) 2008-07-14 2011-12-21 Unimicron Technology Corp Circuit board structure
US8860197B2 (en) 2008-12-31 2014-10-14 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University Integrated circuits secure from invasion and methods of manufacturing the same
JP2012008817A (ja) * 2010-06-25 2012-01-12 Toshiba Corp 半導体メモリカード
US9439334B2 (en) 2012-04-03 2016-09-06 X-Card Holdings, Llc Information carrying card comprising crosslinked polymer composition, and method of making the same
US9122968B2 (en) 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
GB2508837A (en) * 2012-12-12 2014-06-18 Univ Warwick Multilayer manufacturing method utilising mould
US10906287B2 (en) 2013-03-15 2021-02-02 X-Card Holdings, Llc Methods of making a core layer for an information carrying card, and resulting products
USD730908S1 (en) * 2014-05-02 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD730910S1 (en) * 2014-05-02 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD730907S1 (en) * 2014-05-02 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD729251S1 (en) * 2014-06-27 2015-05-12 Samsung Electronics Co., Ltd. Memory card
USD730909S1 (en) * 2014-06-27 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD727912S1 (en) * 2014-06-27 2015-04-28 Samsung Electronics Co., Ltd. Memory card
USD727911S1 (en) * 2014-06-27 2015-04-28 Samsung Electronics Co., Ltd. Memory card
USD727913S1 (en) * 2014-06-27 2015-04-28 Samsung Electronics Co., Ltd. Memory card
USD736215S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736212S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736214S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD727910S1 (en) * 2014-07-02 2015-04-28 Samsung Electronics Co., Ltd. Memory card
USD773466S1 (en) * 2015-08-20 2016-12-06 Isaac S. Daniel Combined secure digital memory and subscriber identity module
USD798868S1 (en) * 2015-08-20 2017-10-03 Isaac S. Daniel Combined subscriber identification module and storage card
USD783622S1 (en) * 2015-08-25 2017-04-11 Samsung Electronics Co., Ltd. Memory card
USD783621S1 (en) * 2015-08-25 2017-04-11 Samsung Electronics Co., Ltd. Memory card
USD773467S1 (en) * 2015-11-12 2016-12-06 Samsung Electronics Co., Ltd. Memory card
USD772232S1 (en) * 2015-11-12 2016-11-22 Samsung Electronics Co., Ltd. Memory card
EP3762871B1 (en) 2018-03-07 2024-08-07 X-Card Holdings, LLC Metal card

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6022763A (en) * 1996-05-10 2000-02-08 Kabushiki Kaisha Toshiba Substrate for semiconductor device, semiconductor device using the same, and method for manufacture thereof
US6444501B1 (en) * 2001-06-12 2002-09-03 Micron Technology, Inc. Two stage transfer molding method to encapsulate MMC module
US6462273B1 (en) * 2001-03-16 2002-10-08 Micron Technology, Inc. Semiconductor card and method of fabrication
US20020154283A1 (en) * 2001-04-18 2002-10-24 Canon Kabushiki Kaisha Position measuring method and apparatus
US6624005B1 (en) * 2000-09-06 2003-09-23 Amkor Technology, Inc. Semiconductor memory cards and method of making same
US20030197261A1 (en) * 2002-04-20 2003-10-23 Samsung Electronics Co., Ltd. Memory card
US20040090829A1 (en) * 2001-02-28 2004-05-13 Tomomi Miura Memory card and its manufacturing method
US7057277B2 (en) * 2003-04-22 2006-06-06 Industrial Technology Research Institute Chip package structure
US7089661B2 (en) * 2003-04-11 2006-08-15 Flex-P Industries Sdn Bhd. Method for packaging small size memory cards
US20060197261A1 (en) * 2005-03-01 2006-09-07 Fuji Photo Film Co., Ltd. Method of manufacturing liquid ejection head
US20060202294A1 (en) * 2005-03-10 2006-09-14 Faris Sadeg M Nanolithography and microlithography devices and method of manufacturing such devices
US20060281229A1 (en) * 2005-06-10 2006-12-14 Koh Wei H Method for molding a small form factor digital memory card

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2602343B2 (ja) * 1990-05-07 1997-04-23 三菱電機株式会社 Ｉｃカード
US7174628B1 (en) * 2005-03-03 2007-02-13 Super Talent Electronics, Inc. Memory card production using prefabricated cover and molded casing portion
US7396704B2 (en) * 2005-02-15 2008-07-08 Sumitomo Chemical Company, Limited Lid made of resin for case for accommodating solid-state imaging device and solid-state imaging apparatus

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6022763A (en) * 1996-05-10 2000-02-08 Kabushiki Kaisha Toshiba Substrate for semiconductor device, semiconductor device using the same, and method for manufacture thereof
US6624005B1 (en) * 2000-09-06 2003-09-23 Amkor Technology, Inc. Semiconductor memory cards and method of making same
US20040090829A1 (en) * 2001-02-28 2004-05-13 Tomomi Miura Memory card and its manufacturing method
US6462273B1 (en) * 2001-03-16 2002-10-08 Micron Technology, Inc. Semiconductor card and method of fabrication
US20020154283A1 (en) * 2001-04-18 2002-10-24 Canon Kabushiki Kaisha Position measuring method and apparatus
US6444501B1 (en) * 2001-06-12 2002-09-03 Micron Technology, Inc. Two stage transfer molding method to encapsulate MMC module
US20030197261A1 (en) * 2002-04-20 2003-10-23 Samsung Electronics Co., Ltd. Memory card
US7089661B2 (en) * 2003-04-11 2006-08-15 Flex-P Industries Sdn Bhd. Method for packaging small size memory cards
US7057277B2 (en) * 2003-04-22 2006-06-06 Industrial Technology Research Institute Chip package structure
US20060197261A1 (en) * 2005-03-01 2006-09-07 Fuji Photo Film Co., Ltd. Method of manufacturing liquid ejection head
US20060202294A1 (en) * 2005-03-10 2006-09-14 Faris Sadeg M Nanolithography and microlithography devices and method of manufacturing such devices
US20060281229A1 (en) * 2005-06-10 2006-12-14 Koh Wei H Method for molding a small form factor digital memory card

Also Published As

Publication number Publication date
TW200845323A (en) 2008-11-16
CN101641799A (zh) 2010-02-03
US20070117276A1 (en) 2007-05-24
US7601563B2 (en) 2009-10-13
US7989268B2 (en) 2011-08-02
WO2008089415A2 (en) 2008-07-24
WO2008089415A3 (en) 2008-10-09
US20090283313A1 (en) 2009-11-19
CN101641799B (zh) 2013-11-13

Similar Documents

Publication Publication Date Title
TWI394238B (zh) 小型模塑記憶卡及其製造方法
US7288441B2 (en) Method for two-stage transfer molding device to encapsulate MMC module
TWI402950B (zh) 具單邊遮蓋的系統封裝模組
US7220615B2 (en) Alternative method used to package multimedia card by transfer molding
RU2291484C2 (ru) Способ изготовления бесконтактной чип-карты и бесконтактная чип-карта
US20040090829A1 (en) Memory card and its manufacturing method
US7112875B1 (en) Secure digital memory card using land grid array structure
US7521290B2 (en) Method of manufacturing circuit device
US20070270040A1 (en) Chamfered Memory Card
US7811859B2 (en) Method of reducing memory card edge roughness by edge coating
JP4518127B2 (ja) 電子回路装置の製造方法および電子回路装置
US20060118926A1 (en) Semiconductor package, memory card including the same, and mold for fabricating the memory card
JPH10284525A (ja) 半導体装置の製造方法
US6021563A (en) Marking Bad printed circuit boards for semiconductor packages
US7633763B1 (en) Double mold memory card and its manufacturing method
US20140291822A1 (en) Integrated circuit package
CN100463132C (zh) 晶片封装结构及其制造方法
TWI728528B (zh) 記憶卡結構及其製造方法
US20240128185A1 (en) Semiconductor device and pre-forming adaptor thereof
KR20090118159A (ko) 반도체 패키지 제조용 몰드 및 이를 이용한 반도체 패키지제조 방법
JP2015082528A (ja) 電子装置の製造方法
US6838756B2 (en) Chip-packaging substrate