TWI390664B - Substrate holder module and substrate assembling apparatus having the same - Google Patents

Description

Substrate holder module and substrate assembly device having the substrate holder module

The present invention relates to a substrate holder module that uses gas injection pressure to adhere upper and lower substrates to each other, and a substrate assembly apparatus having the substrate holder module.

Conventionally, a cathode ray tube (CRT) has been used as a display device. However, CRTs have the disadvantage of being bulky and heavy. Therefore, flat display panels such as liquid crystal displays (LCDs), plasma display panels (PDPs), and organic light emitting devices (OLEDs) have been increasingly used. The flat display panel described above is characterized by its light weight, thin thickness, and low power consumption.

In the case of a flat display panel, a pair of upper and lower substrates are assembled to each other to manufacture a flat display panel. That is, for example, in order to manufacture an LCD, a lower substrate on which a plurality of thin film transistors and a plurality of pixel electrodes are formed is held and fixed to a lower chuck. Subsequently, a sealing member such as a sealant is applied along the boundary of the lower substrate, and the liquid crystal is dropped onto the lower substrate. Further, the upper substrate on which the common electrode and the color filter are formed is held and fixed to the upper chuck which is oppositely disposed on the top of the lower chuck. Each of the upper and lower chucks has an electrostatic chuck portion for holding and fixing the upper substrate to the portion.

In order to adhere the upper and lower substrates to each other, conventional use has been utilized. The mechanical adhesion method of the upper chuck. In this case, however, there is a problem in that the upper and lower substrates are not completely adhered to each other, and there is a certain degree of separate space between the upper and lower substrates. Subsequently, in order to complete the adhesion obtained between the upper and lower substrates, the interior of the chamber is changed from a vacuum state to an atmospheric condition. At this time, since the unnecessary gas is introduced through a separate space between the upper and lower substrates, the obtained device is defective.

Therefore, the present invention has been conceived to solve the above problems in the prior art. The present invention provides a substrate holder module and a substrate assembly apparatus having the substrate holder module, wherein gas injection pressure is used to adhere the upper and lower substrates to each other, so that the inside of the chamber is transformed into an atmospheric condition to complete the upper portion. When the adhesion obtained between the lower substrate and the lower substrate is prevented, introduction of an unnecessary gas between the upper and lower substrates can be prevented.

According to an aspect of the present invention, a substrate holder module is provided, comprising: an upper chuck having a nozzle for holding and fixing a substrate; and a bypass unit that is correspondingly disposed to communicate with the nozzle and Manufactured to be movable up and down; and a pressure adjustment unit coupled to the bypass unit, the pressure adjustment unit including an integrated tube for converting the bypass unit and the nozzle into a vacuum state or The bypass unit and the nozzle supply a gas.

The nozzle may be configured to pass through the upper chuck such that one end of the nozzle is disposed to be exposed on an upper surface of the upper chuck, and the other end of the nozzle is disposed to be exposed On the lower surface of the upper chuck. The bypass unit may include a flange disposed correspondingly on a top end of the nozzle exposed on an upper surface of the upper chuck, a shaft coupled to the flange, and a drive unit Used to move the axis up and down. The pressure adjustment unit may include: a first tube connected to the exhaust pump; a second tube connected to the gas storage unit; and the integrated tube having one end disposed to be coupled to the first tube and the The second tube is between and the other end is connected to the shaft of the bypass unit.

The pressure adjustment unit may further include: a first valve installed in the first tube to control communication between the first tube and the integrated tube; and a second valve installed in the second a tube to control communication between the second tube and the integrated tube; and a third valve installed in the integrated tube to control between the integrated tube and the shaft of the bypass unit Connectivity. The upper chuck may be provided with an electrostatic chuck portion for holding and fixing the substrate by using an electrostatic force.

According to another aspect of the present invention, a substrate assembly apparatus including: a chamber; a substrate holder module having a bypass unit and a pressure adjustment unit, wherein the bypass unit and the pressure adjustment unit are used Transforming a nozzle of an upper chuck disposed in the chamber into a vacuum state or supplying gas to the nozzle; and a lower chuck disposed opposite the upper chuck for holding and fixing the substrate .

The bypass unit may be correspondingly disposed to communicate with the nozzle, and the bypass unit may be coupled to a pressure adjustment unit having an integrated tube for transforming the bypass unit and the nozzle The gas is supplied to the bypass unit and the nozzle in a vacuum state. The integrated tube can be connected to both a first tube connected to the exhaust pump and a second tube connected to the gas storage unit. The upper chuck is connectable to a drive unit for moving the upper chuck up and down, and the lower chuck is connected to a drive unit for moving the lower chuck up and down.

According to still another aspect of the present invention, a substrate processing method includes: aligning an upper substrate to an upper chuck disposed in a chamber, and aligning the lower substrate to a lower chuck, respectively; Attaching the upper substrate to the upper chuck by converting a nozzle provided in the upper chuck to a vacuum state; by using an electrostatic chuck portion provided in the upper chuck An upper substrate is held and fixed to the upper chuck, and then the upper substrate is coupled with the lower substrate; and gas is supplied to the nozzle such that an injection pressure of the gas adheres the upper substrate to the On the lower substrate.

The lower substrate may be held and fixed to the lower chuck using an electrostatic chuck portion provided in the lower chuck. When the upper substrate is adhered to the upper chuck, a first tube connected to an exhaust pump of the pressure adjustment unit and an integrated tube connected between the first tube and the bypass unit may be used The bypass unit and the nozzle are transformed into a vacuum state. A first valve installed in the first tube may be used to control communication between the first tube and the integrated tube, and a third valve installed in the integrated tube may be used to control the integration The communication between the tube and the bypass unit allows the bypass unit and the nozzle to be converted into a vacuum state. After the upper substrate is held and fixed to the upper chuck by using the electrostatic chuck portion, the substrate processing method may further include moving the convex upward by the axis of the driving unit and the bypass unit The flange separates the flange from the nozzle. After the flange is separated from the nozzle by moving the flange upward, the chamber can be changed to a vacuum state. In the process of supplying the gas to the nozzle, a second tube connected to the gas storage unit of the pressure adjustment unit and an integrated tube connected between the second tube and the bypass unit are used to the bypass unit And supplying the gas to the nozzle. The gas may be injected on top of the upper substrate, the gas being supplied to the nozzle in communication with the flange of the bypass unit using the pressure adjustment unit. A second valve installed in the second tube may be used to control communication between the second tube and the integrated tube, and the third valve installed in the integrated tube may be used to control the integration The communication between the tube and the bypass unit is such that the gas can be supplied to the bypass unit and the nozzle.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

Preferred embodiments of the present invention can be understood in more detail from the following description taken in conjunction with the drawings.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments which will be described below, but may be embodied in other various forms which are different from each other, and only the embodiments of the present invention are provided to complete the disclosure of the present invention and are fully understood by those skilled in the art. The scope of the invention. Throughout the drawings, the same reference numerals are used to designate the same elements.

1 to 3 are cross-sectional views sequentially illustrating a method of assembling upper and lower substrates by using a substrate assembling apparatus according to an embodiment of the present invention.

Referring to FIGS. 1 through 3, a substrate assembly apparatus includes a chamber 100 having an internal space, and a substrate holder module 200 including an upper chuck 210 disposed in an upper portion of the chamber 100 for holding and fixing The upper substrate 101; the lower chuck 410 is disposed opposite to the upper chuck 210 for holding and fixing the lower substrate 102; and the upper driving unit 300 is connected to the upper side of the upper chuck 210 for upward And moving the upper chuck 210 downward; and a lower driving unit 500 connected to the lower side of the lower chuck 410 for moving the lower chuck 410 up and down.

The chamber 100 includes an upper chamber 110 and a lower chamber 120 having a space for performing the joining and separating process of the upper substrate 101 and the lower substrate 102. At this time, the upper chamber 110 and the lower chamber 120 are preferably combined in a detachable manner. Although not shown, the chamber 100 further includes an additional pressure adjustment unit for adjusting the pressure of the internal space in the chamber 100, and an additional exhaust unit for discharging impurities in the chamber 100. The chamber 100 further includes two lifting members for moving the upper chamber 110 and the lower chamber 120 upward and downward, respectively, such that the upper chamber 110 and the lower chamber 120 are movable upward and downward, thereby allowing the substrate to enter or Leaving the chamber 100.

The lower chuck 410 is disposed adjacent to the inner surface of the lower chamber 120 such that the lower chuck 410 is used to hold and secure the lower substrate 102. The lower chuck 410 includes a lower holder 411 that is manufactured to be shaped into a rectangular plate, and a lower electrostatic chuck portion 412 that is mounted on the lower holder 411 for holding and fixing the lower substrate 102. Here, it is preferable that the lower electrostatic chuck portion 412 is mounted to be exposed on the upper surface of the lower holder 411. Although the lower holder 411 and the lower electrostatic chuck portion 412 according to the present embodiment are manufactured to be formed into a rectangular plate, the present invention is not limited thereto, but the lower holder 411 and the lower electrostatic chuck portion 412 may depend on the lower substrate. The shape of 102 is deformed in various ways. The lower electrostatic chuck portion 412 is a device for holding and fixing the lower substrate 102 by using an electrostatic force, and thus it is preferable that the lower electrostatic chuck portion 412 is manufactured to be sized according to the lower substrate 102. Here, the lower electrostatic chuck portion 412 is manufactured in an integrated manner to be mounted on the lower holder 411. However, the present invention is not limited thereto, but a plurality of lower electrostatic chuck portions 412 may be prepared in a matrix manner and mounted on the lower holder 411. Therefore, if the lower substrate 102 is positioned on the lower chuck 410, the electrostatic force of the lower electrostatic chuck portion 412 will hold and secure the lower substrate 102 to the lower electrostatic chuck portion 412. Although the lower electrostatic chuck portion 412 for holding and fixing the lower substrate 102 by using an electrostatic force is mounted on the lower holder 411 in this embodiment, the present invention is not limited thereto, but can be used to hold and fix the lower portion. Any other unit of substrate 102. Although not shown, the lower chuck 410 may additionally be provided with a lift pin (not shown) for assisting in attaching/detaching the lower substrate 102.

The lower chuck 410 is coupled to the lower drive unit 500 for moving the lower chuck 410 up and down. Here, the lower drive unit 500 includes a lower drive shaft 520 connected to a lower portion of the lower holder 411, and a lower power supply unit 510 for supplying power to the lower drive shaft 520. At this time, the lower drive shaft 520 is mounted to pass through a portion of the lower chamber 120. Accordingly, the lower sealing member 530 (eg, bellows) is mounted to close the circumference of the lower drive shaft 520 to prevent the seal of the chamber 100 from being broken by the lower drive shaft 520. Thus, the lower driving unit 500 is used to move the lower chuck 410 upward so that the lower substrate 102 can be engaged with the upper substrate 101. Although not shown, the lower drive unit 500 further includes an aligning unit for moving the lower chuck 410 in the X, Y, and θ directions to adjust the position of the lower chuck 410. Therefore, the alignment unit is used to move the lower chuck 410 in the X, Y, and θ directions so that the lower substrate 102 can be aligned with the upper substrate 101. Further, the aligning unit may further have an additional camera or position sensor for identifying the positions of the upper substrate 101 and the lower substrate 102. The present invention is naturally not limited thereto, but the aligning unit as described above may be mounted to the upper driving unit 300 disposed opposite to the lower driving unit 500.

The substrate holder module 200 is for holding and fixing the upper substrate 101 or adhering the upper substrate 101 to the lower substrate 102. The substrate holder module 200 as described above includes an upper chuck 210 for holding and fixing the upper substrate 101 by using the vacuum suction force of the nozzle 213 and the electrostatic force of the upper electrostatic chuck portion 212; the bypass unit 220 , which is disposed on the upper side of the upper chuck 210 and is configured to be movable upward and downward; and a pressure adjustment unit 230 connected to the bypass unit 220 for converting the nozzle 213 of the upper chuck 210 into a vacuum state or Gas is supplied to the nozzle 213.

The upper chuck 210 is disposed adjacent to the inner surface of the upper chamber 110 and serves to hold and fix the upper substrate 101. The upper chuck 210 as described above has an upper holder 211 which is manufactured to be shaped into a rectangular plate, and an upper electrostatic chuck portion 212 which is mounted to the upper holder 211 for holding and fixing the upper substrate 101; A nozzle 213 is disposed to pass through the upper holder 211 and the upper electrostatic chuck portion 212. Although the upper holder 211 and the upper electrostatic chuck portion 212 according to the embodiment of the present invention are manufactured to be formed into a rectangular plate, the present invention is not limited thereto, but it may be modified in various ways depending on the shape of the upper substrate 101. The upper electrostatic chuck portion 212 is a device for holding and fixing the upper substrate 101 by using an electrostatic force, and thus it is preferable that the upper electrostatic chuck portion 212 is manufactured to be sized according to the upper substrate 101. Here, the upper electrostatic chuck portion 212 is manufactured in an integrated manner to be mounted on the upper holder 211. However, the present invention is not limited thereto, but a plurality of upper electrostatic chuck portions 212 may be prepared in a matrix manner and mounted on the upper holder 211. One end of each of the nozzles 213 is disposed to be exposed on the upper surface of the upper holder 211, and the other end thereof is disposed to be exposed on the lower surface of the upper electrostatic chuck portion 212. At this time, each end of the nozzle 213 exposed on the upper surface of the upper holder 211 will be described as being in communication with the bypass unit 220 as follows, while the bypass unit 220 is connected to the pressure adjustment unit 230. Thus, if the pressure adjusting unit 230 is used to change the bypass unit 220 and the nozzle 213 into a vacuum state, the vacuum suction force of the nozzle 213 will cause the upper substrate 101 to adhere to the lower surface of the upper chuck 210. When the upper substrate 101 is adhered to the lower substrate 102, the pressure adjusting unit 230 serves to supply the bypass unit 220 and the nozzle 213 with gas. Thus, by the lower side of the upper chuck 210, that is, on the top of the upper substrate 101, gas is injected so that the injection pressure of the gas can cause the upper substrate 101 to adhere to the lower substrate 102. The bypass unit 220 and the pressure adjustment unit 230 will be described in detail below.

The pressure adjusting unit 230 is for allowing the upper substrate 101 to be held on the upper chuck 210 or the upper substrate 101 to be adhered to the lower substrate 102. That is, the pressure adjusting unit 230 is connected to the nozzle 213 of the upper chuck 210 through the bypass unit 220, so that the pressure adjusting unit 230 is used to change the nozzle 213 into a vacuum state or supply the gas to the nozzle 213. The pressure adjustment unit 230 includes an exhaust pump 231 for converting the bypass unit 220 and the nozzle 213 into a vacuum state, and a gas storage unit 234 for supplying gas to the bypass unit 220 and the nozzle 213; the first tube 232 Connected to the exhaust pump 231; a second tube 235 connected to the gas storage unit 234; and an integrated tube 237 having one end disposed to be connected between the first tube 232 and the second tube 235, and the integrated tube 237 The other end is connected to the bypass unit 220. The pressure adjustment unit 230 further includes a first valve 233 installed in the first tube 232 to control communication between the first tube 232 and the integrated tube 237, and a second valve 236 installed in the second tube 235 for control A communication between the second tube 235 and the integrated tube 237; and a third valve 238 installed in the integrated tube 237 to control communication between the integrated tube 237 and the bypass unit 220. Here, the first valve 233 and the third valve 238 according to the present embodiment use, for example, a pneumatic valve, and the second valve 236 uses an electric power supply type solenoid valve. The invention is naturally not limited thereto, and various valves can be used. Thus, each of the first tube 232 connected to the exhaust pump 231 and the second tube 235 connected to the gas storage unit 234 is in communication with a single integrated tube 237 connected to the bypass unit 220. That is, the first tube 232 and the second tube 235 are not separately and independently connected to the bypass unit 220, but they are integrated through the integrated tube 237 to be connected to the bypass unit 220. The integrated pipe 237 as described above is used to convert the bypass unit 220 and the nozzle 213 into a vacuum state by using the exhaust pump 231 connected to the integrated pipe 237 via the first pipe 232. In addition, the integrated tube 237 is also used to supply the gas in the gas storage unit 234 to the bypass unit 220 and the nozzle 213. Thus, the first tube 232 and the second tube 235 which are conventionally separated from each other as described above are connected to a single integrated tube 237 which is connected to the bypass unit 220 according to the present embodiment. Therefore, since a single integrated tube 237 is connected to the bypass unit 220, the configuration can be simplified and thus the number of valves to be installed can be reduced, thereby reducing malfunctions in any device that may be caused by valves in the device.

The bypass unit 220 is disposed to be coupled between the pressure adjustment unit 230 and the nozzle 213 of the upper chuck 210. The bypass unit 220 includes a flange 223 that is disposed to be attached to or detached from an end of each nozzle 213 that is exposed on an upper surface of the upper holder 211; a shaft 222 that is coupled to the flange 223 An upper side; and a drive unit 221 for moving the shaft 222 up and down. For example, a cylinder can be used as the drive unit 221, but any other unit for moving the shaft 222 and the flange 223 up and down can of course be used as the drive unit 221. Here, it is preferable that the number of bypass units 220 corresponds to the number of nozzles 213 formed in the upper chuck 210. The shaft 222 and flange 223 of the bypass unit 220 are manufactured to have any empty internal shape to communicate with the nozzle 213 provided in the upper chuck 210. The shaft 222 of the bypass unit 220 is connected to the exhaust pump 231 through the first pipe 232 and the integrated pipe 237, and is connected to the gas storage unit 234 through the second pipe 235 and the integrated pipe 237. Thus, when the exhaust pump 231 is used to change the shaft 222 and the flange 223 of the bypass unit 220 into a vacuum state, each nozzle 213 that communicates with the flange 223 is changed to a vacuum state. At this time, the vacuum suction force of the nozzle 213 causes the upper substrate 101 correspondingly disposed to the lower side of the upper chuck 210 to adhere to the upper chuck 210. Subsequently, the upper electrostatic chuck portion 212 of the upper chuck 210 is for holding the upper substrate 101 and fixing the upper substrate 101 to the upper chuck 210, and the suction process of the exhaust pump 231 is suspended. Subsequently, the interior of the chamber 100 is switched to a vacuum state. However, at this time, each nozzle 213 continues to maintain the vacuum state for adsorbing the upper substrate 101, and if the chamber 100 is now switched to the vacuum state, the pressure in the nozzle 213 is turned higher than in the chamber 100. pressure. The pressure difference between the nozzle 213 and the chamber 100 causes a force for pushing the upper substrate 101. If the driving force is greater than the electrostatic force of the upper electrostatic chuck portion 212, the problematic phenomenon that occurs is that the upper substrate 101 is dropped. In order to solve the above problem, according to the present embodiment, the bypass unit 220 is manufactured to be movable up and down. That is, although the upper electrostatic chuck portion 212 is for holding the upper substrate 101 and fixing the upper substrate 101 to the upper chuck 210, the driving unit 221 of the bypass unit 220 and the shaft 222 are used to move the flange 223 upward. This causes the flange 223 to be separated from the nozzle 213 such that the nozzle 213 is exposed in the chamber 100 and, in turn, causes the pressure in the nozzle 213 to be the same as the pressure in the chamber 100. Therefore, it is possible to prevent a problem in which the upper substrate 101 is dropped due to the pressure difference between the nozzle 213 and the chamber 100. Further, the gas in the gas storage unit 234 is supplied to the shaft 222 of the bypass unit 220 through the second tube 235 and the integrated tube 237. Gas in the shaft 222 is supplied to the nozzle 213 through the flange 223. As described above, the gas supplied to the nozzle 213 is injected on the top of the upper substrate 101 through the lower side of the upper chuck 210, so that the upper substrate 101 is adhered to the lower substrate 102. That is, when the upper substrate 101 is adhered to the lower substrate 102, according to the present embodiment, the injection pressure of the fluid (for example, gas) is used to stick the upper substrate 101 without using any mechanical adhesion method. Attached to the lower substrate 102. Thus, the upper substrate 101 can be adhered to the lower substrate 102 such that there is no separate space between the upper substrate 101 and the lower substrate 102. Subsequently, in order to complete the adhesion obtained between the upper substrate 101 and the lower substrate 102, the inside of the chamber 100 is changed to an atmospheric condition. At this time, since the upper substrate 101 and the lower substrate 102 are adhered to each other, unnecessary gas can be prevented from being introduced between the upper substrate 101 and the lower substrate 102.

The upper chuck 210 is coupled to the upper drive unit 300 for moving the upper chuck 210 up and down. Here, the upper drive unit 300 includes an upper drive shaft 320 connected to an upper portion of the upper holder 211, and an upper power source 310 for supplying power to the upper drive shaft 320. At this time, the upper drive shaft 320 is mounted to pass through a portion of the upper chamber 110. Therefore, the upper seal member 330 (for example, a bellows) is mounted to close the peripheral portion of the upper drive shaft 320 to prevent the seal of the chamber 100 from being broken by the upper drive shaft 320. Thus, the upper drive unit 300 is used to move the upper chuck 210 downward so that the upper substrate 101 can be coupled with the lower substrate 102.

Hereinafter, a substrate processing method according to an embodiment of the present invention will be sequentially described with reference to FIGS. 1 through 3.

Referring to FIG. 1, a lower substrate 102 on which a thin film transistor (not shown) and a pixel electrode (not shown) are formed is positioned on a lower chuck 410 in the chamber 100. At this time, the electrostatic force of the lower electrostatic chuck portion 412 mounted on the lower holder 411 will hold and fix the lower substrate 102 to the lower chuck 410. Subsequently, a sealing member such as a sealant is applied along the boundary of the lower substrate 102, and the liquid crystal is dropped on the lower substrate 102. Further, the upper substrate 101 on which the common electrode (not shown) and the color filter pattern (not shown) are formed is correspondingly positioned on the lower surface of the upper chuck 210. The pressure adjustment unit 230 is configured to convert the bypass unit 220 and the nozzle 213 into a vacuum state. Here, the first tube 232 connected to the exhaust pump 231 has been connected to the shaft 222 of the bypass unit 220 through the integrated tube 237. Therefore, if the shaft 222 and the flange 223 of the bypass unit 220 are converted into a vacuum state by the integrated tube 237, the nozzle 213 communicating with the flange 223 is also changed to a vacuum state. At this time, the vacuum adsorption force by the nozzle 213 causes the upper substrate 101 to adhere to the lower surface of the upper chuck 210. Subsequently, the upper electrostatic chuck portion 212 serves to hold and fix the upper substrate 101 adhering to the lower surface of the upper chuck 210 to the upper chuck 210, and then terminate the suction process of the exhaust pump 231.

Referring to Figure 2, the bypass unit 220 is separated from the upper chuck 210. That is, the drive unit 221 of the bypass unit 220 and the shaft 222 are used to move the flange 223 upward such that the flange 223 is separated from the nozzle 213. Subsequently, the interior of the chamber 100 is changed to a vacuum state. At this time, the nozzle 213 is opened due to the upward and downward movement of the flange 223, so that the nozzle 213 is exposed to the chamber 100, and thus the pressure of the nozzle 213 is the same as the pressure in the chamber 100. Therefore, according to the present embodiment of the invention, it is possible to prevent the occurrence of a problematic phenomenon in which the upper substrate 101 is dropped due to the pressure difference between the nozzle 213 and the chamber 100. Further, a sealing member such as a sealant is applied along the boundary of the upper substrate 101. Subsequently, although not shown, an additional alignment unit (not shown) mounted to the lower chuck 410 is used to align the upper substrate 101 and the lower substrate 102 with each other.

Referring to FIG. 3, the upper driving unit 300 is for moving the upper chuck 210 downward, or the lower driving unit 500 is for moving the upper chuck 210 upward so that the upper substrate 101 and the lower substrate 102 are coupled to each other. Subsequently, the electrostatic force of the upper electrostatic chuck portion 212 is released, so that the upper substrate 101 is separated from the upper chuck 210. At this time, the upper substrate 101 is placed on the lower substrate 102. Subsequently, the drive unit 221 and the shaft 222 of the bypass unit 220 are used to move the flange 223 downward such that the flange 223 is in communication with the nozzle 213 of the upper chuck 210. Subsequently, gas is supplied through the gas storage unit 234. At this time, the gas is supplied into the shaft 222 of the bypass unit 220 through the second tube 235 and the integrated tube 237. The gas in the shaft 222 is supplied into the nozzle 213 through the flange 223 such that the gas is injected on the top of the upper substrate 101 through the lower side of the upper chuck 210. At this time, the injection pressure of the gas injected through the nozzle 213 will cause the upper substrate 101 to adhere to the lower substrate 102. That is, the upper substrate 101 is closely adhered to the lower substrate 102 so that there is no separate space between the upper substrate 101 and the lower substrate 102. Subsequently, in order to complete the adhesion obtained between the upper substrate 101 and the lower substrate 102, the inside of the chamber 100 is changed to an atmospheric condition. At this time, the injection pressure of the gas causes the upper substrate 101 and the lower substrate 102 to closely adhere to each other as described above. Therefore, although the inside of the chamber 100 is changed to atmospheric conditions to complete the obtained adhesion, it is possible to prevent introduction of an unnecessary gas between the upper substrate 101 and the lower substrate 102.

Subsequently, although not shown, the electrostatic force of the lower electrostatic chuck portion 412 of the lower chuck 410 is released, and the upper substrate 101 and the lower substrate 102, which have subsequently adhered to each other, are separated from the lower chuck 410. The upper substrate 101 and the lower substrate 102, which have been adhered to each other, are moved to an additional curing device, and then light or heat is irradiated to the sealing member to cure the sealing member. This causes the upper substrate 101 and the lower substrate 102 to be completely assembled to each other.

While the substrate assembly apparatus according to the present embodiment is exemplarily illustrated, the present invention is applicable to various substrate processing apparatuses in which a pair of substrates are first assembled to each other and then the assembled substrates are processed.

According to the invention thus constructed, the following advantages are expected.

As described above, the nozzle of the upper chuck according to the present invention is connected to the pressure adjusting unit having the exhaust pump and the gas storage unit through the bypass unit. Subsequently, when the upper and lower substrates are adhered to each other, the gas in the gas storage unit is injected on the top of the upper substrate. Thus, the injection pressure of the gas causes the upper substrate to closely adhere to the lower substrate. Therefore, when the inside of the chamber is changed to atmospheric conditions in order to complete the obtained adhesion, it is possible to prevent introduction of an unnecessary gas between the upper and lower substrates.

Further, a first tube connected to the exhaust pump and a second tube connected to the gas storage unit may be connected to the bypass unit through a single integrated tube. That is, each of the first and second tubes is not directly connected to the bypass unit, but the first and second tubes are integrated by the integrated tube connected to the bypass unit, so that there is an advantage that the configuration is simplified. .

Further, the bypass unit is manufactured to be movable upward and downward such that when the interior of the chamber is changed to a vacuum state, the bypass unit can be moved upward to separate the bypass unit from the nozzle. At this time, the nozzle is exposed in the chamber and thereby the pressure in the nozzle is the same as the pressure in the chamber, and therefore, according to the present invention, it is possible to prevent the upper substrate from falling due to the pressure difference between the nozzle and the chamber. The occurrence of the problem phenomenon.

Although the present invention has been illustrated and described with reference to the drawings and the preferred embodiments, the invention is not limited thereto and is defined by the appended claims. Accordingly, it will be apparent to those skilled in the art that various modifications and changes can be made without departing from the spirit and scope of the invention as defined by the appended claims.

While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

100. . . Chamber

101. . . Upper substrate

102. . . Lower substrate

110. . . Upper chamber

120. . . Lower chamber

200. . . Substrate holder module

210. . . Upper chuck

211. . . Upper holder

212. . . Upper electrostatic chuck section

213. . . nozzle

220. . . Bypass unit

230. . . Pressure adjustment unit

300. . . Upper drive unit

310. . . Upper power supply

320. . . Upper drive shaft

330. . . Upper seal

410. . . Lower chuck

411. . . Lower retainer

412. . . Lower electrostatic chuck section

500. . . Lower drive unit

510. . . Lower power unit

520. . . Lower drive shaft

530. . . Lower sealing part

1 to 3 are cross-sectional views sequentially illustrating a method of assembling upper and lower substrates by using a substrate assembling apparatus according to an embodiment of the present invention.

100. . . Chamber

101. . . Upper substrate

102. . . Lower substrate

110. . . Upper chamber

120. . . Lower chamber

200. . . Substrate holder module

210. . . Upper chuck

211. . . Upper holder

212. . . Upper electrostatic chuck section

213. . . nozzle

220. . . Bypass unit

230. . . Pressure adjustment unit

300. . . Upper drive unit

310. . . Upper power supply

320. . . Upper drive shaft

330. . . Upper seal

410. . . Lower chuck

411. . . Lower retainer

412. . . Lower electrostatic chuck section

500. . . Lower drive unit

510. . . Lower power unit

520. . . Lower drive shaft

530. . . Lower sealing part

Claims (19)

A substrate holder module comprising: an upper chuck having a nozzle for holding and fixing a substrate; a bypass unit disposed correspondingly to communicate with the nozzle and manufactured to move up and down And a pressure adjustment unit connected to the bypass unit, the pressure adjustment unit including an integrated tube for converting the bypass unit and the nozzle into a vacuum state or to the bypass unit and the The nozzle supplies gas. The substrate holder module of claim 1, wherein the nozzle is configured to pass through the upper chuck such that one end of the nozzle is disposed to be exposed on an upper surface of the upper chuck And the other end of the nozzle is disposed to be exposed on a lower surface of the upper chuck. The substrate holder module of claim 1, wherein the bypass unit comprises: a flange correspondingly disposed on a top end of the nozzle exposed on an upper surface of the upper chuck a shaft coupled to the flange; and a drive unit for moving the shaft up and down. The substrate holder module of claim 1, wherein the pressure adjustment unit comprises: a first tube connected to the exhaust pump; a second tube connected to the gas storage unit; and the integration The tube has one end disposed to connect between the first tube and the second tube and the other end to the shaft of the bypass unit. The substrate holder module of claim 4, wherein the pressure adjusting unit further comprises: a first valve installed in the first tube to control the first tube and the integrated tube a communication between the second valve installed in the second tube to control communication between the second tube and the integrated tube; and a third valve installed in the integrated tube for control Communication between the integrated tube and the shaft of the bypass unit. The substrate holder module of claim 1, wherein the upper chuck is provided with an electrostatic chuck portion for holding and fixing the substrate by using an electrostatic force. A substrate assembly apparatus comprising: a chamber; a substrate holder module having a bypass unit and a pressure adjustment unit, wherein the bypass unit and the pressure adjustment unit are disposed in the chamber The nozzle of the upper chuck is changed to a vacuum state or supplies gas to the nozzle; and a lower chuck is disposed opposite the upper chuck for holding and fixing the substrate. The substrate assembly apparatus of claim 7, wherein the bypass unit is correspondingly disposed to communicate with the nozzle, and the bypass unit is connected to a pressure adjustment unit having an integrated tube, the integration A tube is used to convert the bypass unit and the nozzle into the vacuum state or to supply gas to the bypass unit and the nozzle. The substrate assembly apparatus of claim 8, wherein the integrated tube is connected to both a first tube connected to the exhaust pump and a second tube connected to the gas storage unit. The substrate assembly apparatus of claim 7, wherein the upper chuck is connected to a driving unit for moving the upper chuck up and down, and the lower chuck is connected to Move the drive unit of the lower chuck down. A substrate processing method comprising: respectively aligning an upper substrate to an upper chuck disposed in a chamber, and aligning the lower substrate to a lower chuck, respectively; by being provided on the upper chuck The upper nozzle is changed to a vacuum state to adhere the upper substrate to the upper chuck; the upper substrate is held and fixed to the upper portion by using an electrostatic chuck portion provided in the upper chuck a chuck, and then coupling the upper substrate to the lower substrate; and supplying a gas to the nozzle such that an injection pressure of the gas adheres the upper substrate to the lower substrate. The substrate processing method of claim 11, wherein the lower chuck is held and fixed to the lower chuck using an electrostatic chuck portion provided in the lower chuck. The substrate processing method of claim 11, wherein the adhering the upper substrate to the upper chuck comprises using a first tube connected to an exhaust pump of a pressure adjusting unit and connected to the first An integrated tube between the tube and the bypass unit converts the bypass unit and the nozzle into the vacuum state. The substrate processing method of claim 13, wherein the first valve installed in the first tube is used to control communication between the first tube and the integrated tube, and the installation is used A third valve in the manifold is used to control communication between the manifold and the bypass unit such that the bypass unit and the nozzle are transformed into the vacuum state. The substrate processing method of claim 11, wherein after the upper substrate is held and fixed to the upper chuck by using the electrostatic chuck portion, further comprising passing the driving unit and the side The shaft of the road unit moves the flange up and down to separate the flange from the nozzle. The substrate processing method of claim 15, wherein the chamber is changed to the vacuum state after the flange is separated from the nozzle by moving the flange upward. The substrate processing method of claim 11, wherein supplying the gas to the nozzle comprises using a second tube connected to a gas storage unit of the pressure adjustment unit and connecting to the second tube and the bypass unit An integrated tube is provided to supply the gas to the bypass unit and the nozzle. The substrate processing method according to claim 17, wherein the gas is injected on a top of the upper substrate, and the gas is supplied to a flange of the bypass unit using the pressure adjusting unit The nozzles that are connected. The substrate processing method of claim 17, wherein a second valve installed in the second tube is used to control communication between the second tube and the integrated tube, and is installed in the installation A third valve in the manifold is used to control communication between the manifold and the bypass unit to supply the gas to the bypass unit and the nozzle.