TWI388267B - Spring plate assembly and method of soldering spring plate onto printed circuit board by said spring plate assembly - Google Patents

Description

Shrapnel assembly and method for welding shrapnel to a circuit board using the shrapnel assembly

The invention relates to a shrapnel, in particular to a shrapnel which is arranged on a circuit board and used as a circuit contact.

More and more electronic or communication devices utilize metal domes as electrical contacts for removable or switchable electronic components. As shown in FIG. 1, the conventional elastic piece 20 includes a base portion 21 for soldering to the circuit board 10, and an elastic portion 22 which is bent in the opposite direction from the base plate 21 and extends away from the circuit board 10.

In the process of soldering the elastic piece 20 to the circuit board 10, the elastic piece 20 is aligned with the welding position on the circuit board 10 by the hand tool, and the elastic piece 20 is welded to the circuit board 10 by the welding tool on the other side. Since the volume of the elastic piece 20 is relatively small, the movement of the clamping or the alignment is quite inconvenient, and the welding error is liable to occur, and when the number of the elastic pieces 20 is large, the problem of poor welding efficiency is caused.

It is an object of the present invention to provide a shrapnel assembly that facilitates soldering of shrapnel to a circuit board.

Another object of the present invention is to provide a method of welding a shrapnel to a circuit board using the above-described shrapnel assembly.

Therefore, the present invention provides a shrapnel assembly, which is made of a metal material and is disposed on a circuit board and includes a clamping portion and at least one elastic body. The clamping portion has a first segment on a surface of the circuit board and a second segment extending from one end of the first segment along the side edge of the circuit board to the opposite surface of the circuit board, the first segment and The second segment cooperates to clamp the board. The shrapnel body has a base extending from the other end of the first segment along the surface of the circuit board, and an elastic portion extending from the base toward the direction away from the circuit board.

Furthermore, the present invention further provides a method of soldering a spring piece to a circuit board, comprising: (A) preparing a spring piece assembly as described above; (B) clamping the spring piece assembly on the circuit board with its clamping portion And aligning the base of the shrapnel body with the solder pad; (C) soldering the shrapnel body to the solder pad; and (D) removing the clamping portion.

By clamping the clamping portion on the circuit board, the elastic body is fixed on the surface of the circuit board, and the process of welding the elastic body to the circuit board can be easily performed to effectively improve the efficiency and yield of the welding.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.

The preferred embodiment of the shrapnel assembly of the present invention and the method of soldering the shrapnel to the circuit board using the shrapnel assembly is applicable to a circuit board 30 as shown in FIG. 2, and the upper surface of the circuit board 30 is formed with two phase intervals. The pad 31 and a hole 32 extending through the circuit board 30.

First, a shrapnel assembly 40 as shown in Figs. 2 and 3 is prepared.

The elastic piece assembly 40 is integrally formed of a metal material, and includes a clamping portion 41 for being clamped on the circuit board 30, and a plurality of elastic body 42 extending from the clamping portion 41.

The clamping portion 41 has a first section 411 on the upper surface of the circuit board 30, and a second section 412 extending from one end of the first section 411 to the lower surface of the circuit board 30 by a reverse bend along the side edge of the circuit board 30. The first segment 411 and the second segment 412 cooperate to clamp the circuit board 30.

Also, the first segment 411 is formed with a ridge 413 spaced from the circuit board 30 and defining a space 414. The second section 412 is formed with a protrusion 415 that can fit into the hole 32 of the circuit board 30.

Each of the shrapnel bodies 42 has a base portion 421 extending from the other end of the first segment 411 along the surface of the circuit board 30, and an elastic portion 422 extending from the base portion 421 in a direction opposite to the direction away from the circuit board 30. Further, the base portion 421 is formed with a constant hole 423.

The number of the shrapnel bodies 42 is exemplified by two in the embodiment, and the actual implementation is not limited thereto, and may be only one, or two or more. Further, the type of the shrapnel body 42 is not limited to the type disclosed in the embodiment.

Further, an indentation 43 (see Fig. 4) is formed at the junction of the first section 411 and the base 421 to make the thickness of the joint thin. Alternatively, at least one notch 44 (see Fig. 5) may be formed at the junction of the first section 411 of the clamping portion 41 and the base 421 to narrow the width of the joint.

After the preparation of the shrapnel assembly 40 is completed, the shrapnel assembly 40 is clamped on the circuit board 30 with its clamping portion 41, so that the base portions 421 are aligned with the corresponding pads 31 with their through holes 423, and the protrusions are made. The 415 is embedded in the slot 32 of the circuit board 30.

Then, solder is applied to the through holes 423, the solder is brought into contact with the base portion 421 and the pad 31, and the solder is subjected to a high-temperature heat treatment, and the respective elastic body 42 is welded to the pad 31 through the through holes 423.

Finally, a tool such as a tweezers is inserted into the space 414 of the ridge 413, and the clamping portion 41 is biased to be broken along the indentation 43 (see FIG. 4) or the notch 44 (see FIG. 5), and the clamping portion 41 is pulled. Separately removed from the circuit board 30 so that the two shrapnel bodies 42 are independently soldered to the pads 31, respectively.

In summary, by preparing the shrapnel assembly 40, the clip body 41 is clamped on the circuit board 30, and the shrapnel body 42 is fixed on the surface of the circuit board 30, so that the soldering elastic body 42 can be easily welded. The process on the board 30 is effective to improve the efficiency and yield of the soldering, and indeed achieves the effects of the present invention.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

<Prior technology>

10. . . Circuit board

20. . . shrapnel

twenty one. . . Base

twenty two. . . Elastic part

<Embodiment>

30. . . Circuit board

31. . . Solder pad

32. . . Hole slot

40. . . Shrapnel assembly

41. . . Grip

411. . . First paragraph

412. . . Second paragraph

413. . . Uplift

414. . . space

415. . . Protrusion

42. . . Shrapnel body

421. . . Base

422. . . Elastic part

423. . . Through hole

43. . . Indentation

44. . . gap

1 is a perspective assembled view of a conventional elastic piece welded to a circuit board; FIG. 2 is an exploded perspective view of a preferred embodiment of a method for welding a spring piece to a soldering pad of a circuit board of the present invention; FIG. 3 is a preferred embodiment of the present invention; FIG. 4 is a partial side view of the preferred embodiment; and FIG. 5 is a plan view of another embodiment of the preferred embodiment.

30. . . Circuit board

32. . . Hole slot

40. . . Shrapnel assembly

41. . . Grip

411. . . First paragraph

412. . . Second paragraph

413. . . Uplift

414. . . space

415. . . Protrusion

42. . . Shrapnel body

421. . . Base

422. . . Elastic part

423. . . Through hole

Claims (12)

A shrapnel assembly made of a metal material for being disposed on a circuit board, wherein the circuit board is formed with at least one solder pad, the shrapnel assembly comprising: a clamping portion having a surface on the circuit board a first segment and a second segment extending from one end of the first segment along a side edge of the circuit board to a second opposite surface of the circuit board, the first segment and the second segment being matched Holding the circuit board; and at least one elastic body having a base extending from the other end of the first segment along the surface of the circuit board and solderable to the base of the soldering pad, and extending from the base toward the circuit board The elastic portion, the first portion of the clamping portion and the base portion are formed with an indentation or at least one notch, and the first portion of the clamping portion can be broken along the indentation or the notch and the base portion Separating, the clamping portion forms a ridge spaced from the circuit board and defining a space. The shrapnel assembly of claim 1, wherein the ridge portion is formed in the first section of the nip portion. The shrapnel assembly of claim 1, wherein the base of the shrapnel body is formed with a through hole for alignment with the pad. The shrapnel assembly of claim 1, wherein the clamping portion is integrally formed with the elastic body. A shrapnel assembly made of a metal material for being disposed on a circuit board, wherein the circuit board is formed with at least one solder pad, the shrapnel assembly comprising: a clamping portion having a surface on the circuit board The first segment and the first segment of the first segment are bent back along the side edge of the circuit board to a second segment of the opposite surface of the circuit board, the first segment and the second segment cooperate to clamp the circuit board, the clamping portion is formed with a protrusion protruding toward the circuit board, the protrusion portion being formed on the a second segment of the clamping portion; and at least one elastic body having a base extending from the other end of the first segment along the surface of the circuit board and solderable to the base of the bonding pad, and a base portion facing away from the circuit board a direction extending elastic portion, an intersection of the first portion of the clamping portion and the base portion is formed with an indentation or at least one notch, and the first portion of the clamping portion can be broken along the indentation or the notch The base is separated. The shrapnel assembly of claim 5, wherein the base of the shrapnel body is formed with a through hole for alignment with the pad. The shrapnel assembly of claim 5, wherein the clamping portion is integrally formed with the elastic body. A method for soldering a shrapnel to a circuit board, suitable for a circuit board having at least one solder pad formed thereon, comprising: (A) preparing a shrapnel assembly, the shrapnel assembly comprising: a clamping portion having a a first segment on a surface of the circuit board and a second segment extending from one end of the first segment along a side edge of the circuit board to a second opposite surface of the circuit board, the first segment and the first segment The two segments cooperate to clamp the circuit board; and the at least one spring body has a base extending from the other end of the first segment along the surface of the circuit board, and an elasticity extending from the base toward the circuit board unit; (B) the elastic assembly is placed on the circuit board with its clamping portion, and the base of the elastic body is aligned with the bonding pad; (C) the elastic body is soldered to the bonding pad; D) Remove the clamping portion. A method of soldering a spring piece to a circuit board according to claim 8 of the invention, wherein in the step (A), the joint between the first section of the clamping portion and the base portion is formed with an indentation or at least a notch, and the clamping portion forms a ridge having a space between the circuit board, and in step (D), a tool is inserted into the ridge of the clamping portion, and the tool is used to apply the force The grip is removed. A method of soldering a shrapnel to a circuit board according to item 8 of the patent application, wherein in the step (A), the holding portion forms a protrusion protruding toward the circuit board, and in the step ( In B), the protrusion is fastened to the circuit board. According to the method of claim 8, the method of welding the elastic piece to the circuit board, wherein in the step (A), the base of the elastic body is formed with a uniform hole, and in the step (B), the through hole is Appropriate to the pad. A method of soldering a shrapnel to a circuit board according to claim 11 wherein the step (C) is to solder the shrapnel body to the solder pad through the through hole.