1375374 六、發明說明： 【發明所屬之技術領幻 [0001]本發明係關於一種插座及插座組件，尤其係關於一種將 晶片固定於電路板上的插座及插座組件。 【先前技術】 [0002] 目前，大部分的晶片是通過SMT技術將其打件固定在電路 板上的。但是若是晶片來料不良，需要重工更換晶片時 ，則需通過烙鐵將錫膏熔開，方可將晶片從電路板上拔 φ 下來。然而運用烙鐵不易操作，且較為浪費作業時間。 另外’若是晶片中燒錄資料異常，需要重工重新燒錄時 ’由於線上燒錄耗費時間較長，♦會造成作、業時間的浪 費。 ;^ 【發明内容】 / [0003] 有鑑於此，本發明接根 枚供一種將晶片可分離地固定在電路 板上的插座。 [0004] \岁'.1375374 VI. Description of the Invention: [0001] The present invention relates to a socket and socket assembly, and more particularly to a socket and socket assembly for securing a wafer to a circuit board. [Prior Art] [0002] At present, most of the wafers are fixed to the circuit board by SMT technology. However, if the wafer is in poor material and needs to be reworked, the solder paste should be melted through the soldering iron to pull the wafer off the board. However, the use of a soldering iron is not easy to operate, and it is a waste of work time. In addition, if the data in the wafer is abnormal, it needs to be re-burned. ‘Because the online burning takes a long time, ♦ will cause waste of work and business hours. SUMMARY OF THE INVENTION [0003] In view of the above, the present invention is directed to a socket for detachably securing a wafer to a circuit board. [0004] \年'.
[0005] 種插座&包括包括一第—定位元件及一第二定位元 牛“第$位元件及第二定位元件相互配合用於固定 入片 /第定位元件包括接觸部、彈性連接部及一嵌 〇 4，該第一疋位几件包括接觸部、彈性連接部及一扣 。4該嵌合部及扣合部在彈性連接部的彈性作 用下彼 此配。進仃扣合固定將晶片固定於其内，該第一、第二 定位元件的接觸部與晶片引_性連接。 098143982 表單編號Α0101 第3頁/共16頁 0982075298-0 T3T5374 [0006] 一種插座組件，其包括一插座及一電路板。該插座包括 一第一定位元件及一第二定位元件，該第一定位元件及 第二定位元件打件固定在電路板上。該第一定位元件及 第二定位元件相互配合用於固定晶片，該第一定位元件 包括接觸部、彈性連接部及一嵌合部；該第二定位元件 包括接觸部、彈性連接部及一扣合部，該嵌合部及扣合 部在彈性連接部的彈性作用下彼此配合進行扣合固定將 晶片固定於其内，該第一、第二定位元件的接觸部與晶 片引腳電性連接。 [0007] 相較於先前技術，該晶片是插座的嵌合部和扣合部在彈 性連接部的彈性作用下彼此配合進行扣合固定將晶片固 定於其内，若發現晶片來料不良，需要重工更換時，僅 y 僅需要用手擠壓插座的彈性連接部，使得相互匹配之嵌 合部和扣合部彼此分開，再將晶片放入插座内，合攏插 座即可，此過程僅僅需要幾秒鐘的時間，且無需借助任 何工具即可完成，其作業時間短，#作簡單。若發現晶 -Π/-- : · '· 片中燒錄資料異常，由於本案的插i更換晶片的時間短 • - /： - Λ \ 人 .Λ 〇 且操作簡單，則僅需更換燒錄資料完整的晶片即可，然 後於其他時間重新燒錄資料異常的晶片以便下次利用， 如此既不會耽誤作業時間，重新燒錄好的晶片也可作為 下次更換的原料，不會造成浪費。 【實施方式】 [0008] 請參閱圖1，係本發明的插座組件具體實施方式的示意圖 。該插座組件10包括一電路板11及一插座12。該插座12 可以通過SMT技術打件固定在電路板11上的。 098143982 表單編號Α0101 第4頁/共16頁 0982075298-0 1375374 [0009] 凊一併參閱圖2及圖3，該插座12包括第一定位元件15及 第二定位元件16，該第一、第二定位元件15、16相互配 合將晶片（請參閱圖4)固定在電路板上。 [0010] 該第一定位元件15包括安裝部、接觸部 '彈性連接部丨51 、阻擋部159及嵌合部152。安裝部用於將第一定位元件 15女裝在電路板11上。本實施例中，安裝部包括多個分 離設置的底板150，該底板150的下表面通過SMT技術打 件固定在電路板11上。 # [0011] 該彈性連接部151包括連接臂157及彈性臂154。連接臂 157與安裝部固定連接》本實施例中，锌連接臂157是自 底板150的一端垂直延伸形成。婊彈性臂包括一第一 平板153、一連接桿155及一第二乎'板ν▲第一平板 153及第二平板156與該底板150平行，該第一平板153之 一端連接該連接臂157的端部。該連接桿155是一相對該 • 底板15 0傾斜向上延伸的矩形平巍，該第__平板丨5 3之另 一端與該連接桿155的一端^慧:二||第浐平板156之兩端 为別與該欲合部15 2及該連；:丨.灸专的另一端相連。該彈 性臂154是金屬連接片。該接觸部用於與晶片的各引腳電 性連接。該接觸部可以是設置在底板15〇的上表面的兩個 凸包158及設置在第一平板上153的一個凸包158。該凸 包158用於與晶片的引腳電性連接。該嵌合部152包括一 凹面（未標示）。該位於兩端的底板15〇邊緣向上彎折形成 一阻擋部159。 [0012] 該第二定位元件16包括安裝部、接觸部、彈性連接部161 098143982 、阻擋部169及扣合部152。安裝部用於將第二定位元件 表單編號A0101 第5頁/共16頁 0982075298-0 16安裝在電路板11上。本實施例中，安裝部包括多個分 離設置的底板160，該底板160的下表面通過SMT技術打 件固定在電路板11上。 [0013] 該彈性連接部161包括連接臂167及彈性臂164。連接臂 167與安裝部固定連接。本實施例中，該連接臂167是自 底板160的一端垂直延伸形成。彈性臂164包括一第一平 板163、一連接桿165及一第二平板166。該第一平板163 及第二平板166與該底板160平行，該第一平板163之一 端連接該連接臂167的端部。該連接桿165是一相對該底 板160傾斜向上延伸的矩形平板，該第一平板163之另一 端與該連接桿165的一端相連，該/第土¥板1'66之兩端分 別與該扣合部162及該連接桿165的另端相連。該彈性 臂164是金屬連接片。該接觸部用於與晶片的各引腳電性 連接。該接觸部可以是設置在底板160的上表面的兩個凸 包168和設置在第一平板上163的一個凸包168。該凸包 168用於與晶片的引腳電性連接。減扣合部152包括一凸 面（未標示）。該位於兩端的底扳160邊緣向上彎折形成一 阻擂部169。 [0014] 請一併參閱圖4及圖5，圖4是晶片組裝至打件固定在電路 板上的插座内的示意圖，圖5是圖4所示的晶片、插座及 電路板結構自另一方向上觀看的示意圖。將晶片組裝至 插座時，用手擠壓嵌合部152及扣合部162的彈性連接部 151、161，使得相互匹配的嵌合部152的凹面和扣合部 162的凸面分開，分別與嵌合部152及扣合部162相連的 彈性連接部151、161彼此彈開，兩者之間距離增大，從 098143982 表單编號A0101 第6頁/共16頁 0982075298-0 1375374 而打開插座12，此時將晶片放入，晶片放置在第一、第 二定位元件15、16的底板150、160上，晶片的引腳與插 座12的底板150、160及第一平板上153、163上的凸包 158、168電性連接，從而保證晶片正常工作，收攏第一 '第二定位元件15、16，使得扣合部162的凸面進入嵌合 部152的凹面内，在彈性連接部151、161的彈性作用下 ，該嵌合部152的凹面與扣合部162的凸面緊密結合，且 嵌合部152及扣合部162壓住晶片的頂面，連接桿155、[0005] The socket & includes a first positioning element and a second positioning element. The "positional element" and the second positioning element cooperate with each other for fixing the piece/position element including a contact portion, an elastic connection portion, and The first cymbal 4 includes a contact portion, an elastic connecting portion and a buckle. The fitting portion and the engaging portion are matched with each other under the elastic action of the elastic connecting portion. The socket of the first and second positioning elements is fixedly connected to the wafer. 098143982 Form No. 1010101 Page 3 of 16 0982075298-0 T3T5374 [0006] A socket assembly including a socket and a circuit board, the socket includes a first positioning component and a second positioning component, and the first positioning component and the second positioning component are fixed on the circuit board. The first positioning component and the second positioning component cooperate with each other. The first positioning component includes a contact portion, an elastic connecting portion and a fitting portion; the second positioning member includes a contact portion, an elastic connecting portion and a fastening portion, and the engaging portion and the fastening portion are elastic even The elastic portion of the portion cooperates with each other to fasten and fix the wafer, and the contact portions of the first and second positioning members are electrically connected to the wafer pins. [0007] Compared to the prior art, the wafer is a socket. The fitting portion and the engaging portion cooperate with each other under the elastic action of the elastic connecting portion to fasten and fix the wafer therein. If it is found that the wafer is poorly fed and needs to be replaced by heavy work, only y only needs to squeeze the socket by hand. The elastic connecting portion separates the mating fitting portion and the engaging portion from each other, and then puts the wafer into the socket and closes the socket. This process takes only a few seconds and can be completed without any tools. , its working time is short, # is simple. If you find crystal-Π/--: · '· The burning data in the film is abnormal, because the insertion of the chip in this case is short! - /: - Λ \人.Λ 〇 And the operation is simple, only need to replace the complete wafer of the burned data, and then re-burn the abnormal data of the wafer at other times for the next use, so that the operation time is not delayed, and the re-burned wafer is also As a raw material for the next replacement, no waste is caused. Embodiments [0008] Referring to Figure 1, there is shown a schematic view of a specific embodiment of a socket assembly of the present invention. The socket assembly 10 includes a circuit board 11 and a socket 12. The socket 12 can be fixed on the circuit board 11 by SMT technology. 098143982 Form number Α 0101 Page 4 / Total 16 page 0992075298-0 1375374 [0009] Referring to FIG. 2 and FIG. 3 together, the socket 12 includes A positioning member 15 and a second positioning member 16, the first and second positioning members 15, 16 are coupled to each other to fix the wafer (see Fig. 4) to the circuit board. [0010] The first positioning member 15 includes a mounting portion. The contact portion 'elastic connection portion 丨 51 , the blocking portion 159 , and the fitting portion 152 . The mounting portion is for placing the first positioning member 15 on the circuit board 11. In this embodiment, the mounting portion includes a plurality of separately disposed bottom plates 150, and the lower surface of the bottom plate 150 is fixed to the circuit board 11 by SMT technology. # [0011] The elastic connecting portion 151 includes a connecting arm 157 and a resilient arm 154. The connecting arm 157 is fixedly coupled to the mounting portion. In the present embodiment, the zinc connecting arm 157 is formed to extend perpendicularly from one end of the bottom plate 150. The first elastic plate includes a first flat plate 153, a connecting rod 155 and a second 'plate'. The first flat plate 153 and the second flat plate 156 are parallel to the bottom plate 150. One end of the first flat plate 153 is connected to the connecting arm 157. The end. The connecting rod 155 is a rectangular flat yoke extending obliquely upward with respect to the bottom plate 150. The other end of the __plate 丨5 3 and one end of the connecting rod 155 are: two || The end is not connected to the other end of the joint and the moxibustion. The elastic arm 154 is a metal connecting piece. The contact portion is for electrically connecting to each pin of the wafer. The contact portion may be two convex hulls 158 disposed on the upper surface of the bottom plate 15 and a convex hull 158 disposed on the first flat plate 153. The bump 158 is used to electrically connect to the pins of the wafer. The fitting portion 152 includes a concave surface (not shown). The edge of the bottom plate 15 at both ends is bent upward to form a blocking portion 159. [0012] The second positioning element 16 includes a mounting portion, a contact portion, an elastic connecting portion 161 098143982, a blocking portion 169, and a fastening portion 152. The mounting portion is used to mount the second positioning component form number A0101, page 5 / page 16 0982075298-0 16 on the circuit board 11. In this embodiment, the mounting portion includes a plurality of separately disposed bottom plates 160, and the lower surface of the bottom plate 160 is fixed to the circuit board 11 by SMT technology. [0013] The elastic connecting portion 161 includes a connecting arm 167 and a resilient arm 164. The connecting arm 167 is fixedly coupled to the mounting portion. In this embodiment, the connecting arm 167 is formed to extend perpendicularly from one end of the bottom plate 160. The elastic arm 164 includes a first flat plate 163, a connecting rod 165 and a second flat plate 166. The first plate 163 and the second plate 166 are parallel to the bottom plate 160, and one end of the first plate 163 is connected to an end of the connecting arm 167. The connecting rod 165 is a rectangular flat plate extending obliquely upward with respect to the bottom plate 160. The other end of the first flat plate 163 is connected to one end of the connecting rod 165, and the two ends of the/the soil board 1'66 are respectively connected with the buckle The joint 162 and the other end of the connecting rod 165 are connected. The resilient arms 164 are metal tabs. The contact portion is for electrically connecting to each pin of the wafer. The contact portion may be two convex hulls 168 disposed on the upper surface of the bottom plate 160 and one convex hull 168 disposed on the first flat plate 163. The bump 168 is used to electrically connect to the pins of the wafer. The reduced engagement portion 152 includes a convex surface (not labeled). The edges of the bottom plate 160 at both ends are bent upward to form a dam portion 169. [0014] Please refer to FIG. 4 and FIG. 5 together. FIG. 4 is a schematic view of the wafer assembled to the socket fixed on the circuit board, and FIG. 5 is the structure of the wafer, the socket and the circuit board shown in FIG. A schematic view of the upward viewing. When assembling the wafer to the socket, the fitting portions 152 and the elastic connecting portions 151 and 161 of the engaging portion 162 are pressed by hand so that the concave surfaces of the mating fitting portions 152 and the convex surfaces of the engaging portions 162 are separated, respectively The elastic connecting portions 151 and 161 of the engaging portion 152 and the engaging portion 162 are bounced apart from each other, and the distance between the two is increased. The socket 12 is opened from 098143982 Form No. A0101 Page 6/16 pages 0992075298-0 1375374. At this time, the wafer is placed, and the wafer is placed on the bottom plates 150, 160 of the first and second positioning members 15, 16, the pins of the wafer and the bottom plates 150, 160 of the socket 12 and the projections on the first flat plates 153, 163. The packages 158, 168 are electrically connected to ensure normal operation of the wafer, and the first 'second positioning elements 15, 16 are gathered such that the convex surface of the fastening portion 162 enters the concave surface of the fitting portion 152 at the elastic connecting portions 151, 161. Under the elastic action, the concave surface of the fitting portion 152 is tightly coupled with the convex surface of the engaging portion 162, and the fitting portion 152 and the engaging portion 162 press against the top surface of the wafer, and the connecting rod 155,
1 6 5抵住晶片的二相對側邊，該兩端底板1 5 0、1 6 0的阻 擋部159、169抵住晶片的另外二相對側邊，從而將晶片 固定在插座12内。 / 、' \ / ，''、 \ / ' [0015] 相較於先前技術，該插座12是打件固$在電/路板11上的1 6 5 is pressed against the opposite sides of the wafer, and the blocking portions 159, 169 of the two end plates 150, 160 are pressed against the other two opposite sides of the wafer to fix the wafer in the socket 12. / , ' \ / , '', \ / ' [0015] Compared to the prior art, the socket 12 is a piece of work on the electric / road board 11
，晶片是通過插座12的嵌合部152和扣合部162在彈性連 接部151、161的彈性作用力下將晶片固定在其内的，晶 片無需打件至電路板12上，若發現晶片來料不良，需要 重工更換時，僅僅需要用手擠Μ插彈性連接部151 、161，使得相互匹配的敌洽部it的命面及扣合部162 Κ ' '.n'i 的凸面彼此分開，再將晶片放入插座12内，合攏插座12 即可，此過程僅僅需要幾秒鐘的時間，且無需借助任何 工具即可完成，其作業時間短，操作簡單。若發現晶片 中燒錄資料異常，由於本案的插座12更換晶片的時間短 且操作簡單，則僅需更換燒錄資料完整的晶片即可，然 後於其他時間重新燒錄資料異常的晶片以便下次利用， 如此既不會耽誤作業時間，重新燒錄好的晶片也可作為 下次更換的原料，不會造成浪費。 098143982 表單編號A0101 第7頁/共16頁 0982075298-0 1375374 [0016] 惟，該插座12並不限於上述實施方式所述，例如，該底 板的個數可根據需要變更，至少有一個即可，該底板150 、160及第一平板上158、168上的凸包的個數也可根據 需要變更；該插座12的嵌合部152、扣合部162的形狀、 材料也可根據需要變更，只要二者之間彼此匹配，可相 互扣合固定即可，該嵌合部及扣合部在彈性連接部的彈 性作用下彼此配合進行扣合固定將晶片固定於其内；該 插座12的彈性連接部151、161的形狀也可根據需要變更 ，只要其一端打件固定在電路板上，一端與扣合部或嵌 合部相連即可，並不限於上述實施方式所述。 [0017] 雖然本發明已以實施例揭露如上，，被'其並非隹以限定本 1 · 發明，任何所屬技術領域中具有通常和識者/在不脫離 本發明之精神和範圍内，當可作些許之更動與潤飾，故 本發明之保護範圍當視後附之申請專利範圍所界定者為 準。 Λ冷、;:' . .'、"· .'，.、·： 、' ) \'乂，. 【圖式簡單說明】 V m ,, ..’ .> -：7 ! [0018] 圖1係本發明的插座組件具體實施方式的示意圖。 [0019] 圖2係圖1中插座的立體結構示意圖。 [0020] 圖3係圖2中插座的部分剖面圖。 [0021] 圖4係晶片組裝至打件固定在電路板上的插座内的示意圖 [0022] 圖5係圖4所示的晶片、插座及電路板結構自另一方向上 觀看的示意圖。 【主要元件符號說明】 098143982 表單編號 A0101 第 8 頁/共 16 頁 0982075298-0 137.5374The wafer is fixed in the wafer by the fitting portion 152 of the socket 12 and the fastening portion 162 under the elastic force of the elastic connecting portions 151, 161, and the wafer does not need to be wound onto the circuit board 12, and if the wafer is found If the material is defective and needs to be replaced by heavy work, only the elastic connecting portions 151 and 161 are required to be squeezed by hand, so that the matching surfaces of the matching matching portion and the convex portions of the engaging portions 162 Κ ' '.n'i are separated from each other. The wafer is placed in the socket 12 and the socket 12 is closed. This process takes only a few seconds and can be completed without any tools. The operation time is short and the operation is simple. If it is found that the burning data in the wafer is abnormal, since the socket 12 of the present invention has a short time for replacing the wafer and the operation is simple, only the wafer with the complete burning data needs to be replaced, and then the abnormally abnormal wafer is re-burned at another time for the next time. By using, this will not delay the operation time, and the re-burned wafer can also be used as the raw material for the next replacement without waste. 098143982 Form No. A0101 Page 7 / Total 16 Page 0992075298-0 1375374 [0016] However, the socket 12 is not limited to the above embodiment, for example, the number of the bottom plate may be changed as needed, at least one, The number of the convex hulls on the bottom plates 150 and 160 and the first flat plates 158 and 168 may be changed as needed. The shape and material of the fitting portion 152 and the engaging portion 162 of the socket 12 may be changed as needed, as long as The two can be matched with each other, and can be fastened and fixed to each other. The engaging portion and the engaging portion cooperate with each other under the elastic action of the elastic connecting portion to fasten and fix the wafer therein; the elastic connection of the socket 12 The shape of the portions 151 and 161 may be changed as needed, as long as one end of the member is fixed to the circuit board and one end is connected to the engaging portion or the fitting portion, and is not limited to the above embodiment. [0017] While the invention has been described above by way of example, the invention is not to be construed as limiting the scope of the invention. The scope of protection of the present invention is subject to the definition of the scope of the appended patent application. Λ冷,;:' . . ', "· .',.,·: , ' ) \'乂,. [Simple diagram] V m ,, ..' .> -:7 ! [0018 1 is a schematic view of a specific embodiment of a socket assembly of the present invention. 2 is a schematic perspective view of the socket of FIG. 1. 3 is a partial cross-sectional view of the socket of FIG. 2. 4 is a schematic view of the wafer assembly to the socket in which the workpiece is fixed on the circuit board. [0022] FIG. 5 is a schematic view of the wafer, socket and circuit board structure shown in FIG. 4 viewed from another direction. [Main component symbol description] 098143982 Form number A0101 Page 8 of 16 0982075298-0 137.5374
[0023] 插座組件： 10 [0024] 電路板： 11 [0025] 插座： 12 [0026] 第一定位元件： 15 [0027] 第二定位元件： 16 [0028] 嵌合部： 152 [0029] 扣合部： 162 [0030] 底板： 150 > 160 [0031] 彈性連接部： .. 151 、 161 [0032] 第一平板： 153 Ί63 [0033] 連接桿： 155 、 165 [0034] 第二平板： 内1:56々166夕 :爻夕U -、夕乂 V々丨人. [0035] 彈性臂： 屮5和16¾ f U [0036] 連接臂： Λ . 157 、 167 [0037] 凸包： 158 、 168 [0038] 阻擋部： 159 、 169 098143982 表單編號A0101 第9頁/共16頁 0982075298-0[0023] Socket assembly: 10 [0024] Circuit board: 11 [0025] Socket: 12 [0026] First locating element: 15 [0027] Second locating element: 16 [0028] Fitting: 152 [0029] Buckle Joint: 162 [0030] Base plate: 150 > 160 [0031] Elastic connection: .. 151, 161 [0032] First plate: 153 Ί 63 [0033] Connecting rod: 155, 165 [0034] Second plate: Inside 1:56々 166 eve: 爻夕 U -, 夕乂V々丨人. [0035] Elastic arm: 屮5 and 163⁄4 f U [0036] Connecting arm: Λ . 157 , 167 [0037] Convex hull: 158 , 168 [0038] Blocking: 159, 169 098143982 Form No. A0101 Page 9 / Total 16 Page 0992075298-0