TWI381129B - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
TWI381129B
TWI381129B TW97124095A TW97124095A TWI381129B TW I381129 B TWI381129 B TW I381129B TW 97124095 A TW97124095 A TW 97124095A TW 97124095 A TW97124095 A TW 97124095A TW I381129 B TWI381129 B TW I381129B
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TW
Taiwan
Prior art keywords
substrate
heat sink
partition
light
clamping
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TW97124095A
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Chinese (zh)
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TW201000809A (en
Inventor
Shih Hsun Wung
Yong-Dong Chen
Wen Xu
Ye-Ke Xie
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Foxconn Tech Co Ltd
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Priority to TW97124095A priority Critical patent/TWI381129B/en
Publication of TW201000809A publication Critical patent/TW201000809A/en
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Publication of TWI381129B publication Critical patent/TWI381129B/en

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Description

發光二極體燈具 Light-emitting diode lamp

本發明涉及一種照明裝置,尤指一種發光二極體燈具。 The invention relates to a lighting device, in particular to a light-emitting diode lamp.

相比於傳統之發光源,發光二極體具有重量輕、體積小、污染低、壽命長高等優點,其作為一種新型發光源,已經被越來越多地應用到各領域當中,如路燈、交通燈、信號燈、射燈及裝飾燈等等。 Compared with the traditional light source, the light-emitting diode has the advantages of light weight, small volume, low pollution and long life. As a new type of light source, it has been more and more applied to various fields, such as street lamps. Traffic lights, signal lights, spotlights and decorative lights, etc.

於一些專業用途如作為戶內外照明設備時,發光二極體模組在工作時會產生大量之熱量,如若熱量不能得到及時地散發,將容易導致發光二極體過熱,使其發光效率降低,甚至於直接燒壞而無法繼續工作。習知之發光二極體燈具往往通過在照明設備內設置與發光二極體模組相固定接觸之散熱器以對發光二極體模組進行散熱。然,此類散熱器通常以鎖螺釘之方式固定安裝於發光二極體燈具上,當需要更換散熱器,或者發光二極體模組與散熱器一體更換時,需要使用相關專業工具拆卸、安裝散熱器,更換流程較複雜。 In some professional applications, such as indoor and outdoor lighting equipment, the LED module generates a large amount of heat during operation. If the heat cannot be dissipated in time, it will easily cause the LED to overheat and reduce its luminous efficiency. Even if it burned directly, it could not continue working. Conventional light-emitting diode lamps often dissipate heat-emitting diode modules by providing a heat sink in fixed contact with the light-emitting diode module in the lighting device. However, such a heat sink is usually fixedly mounted on the light-emitting diode lamp by means of a lock screw. When the heat sink needs to be replaced, or the light-emitting diode module and the heat sink are integrally replaced, the professional tool needs to be disassembled and installed. Radiator, the replacement process is more complicated.

一種發光二極體燈具,包括一座體、一散熱器及貼設於散熱器上之複數發光二極體模組及複數固定該散熱器之扣具,該散熱器包括一基板及由基板底面向下延伸之複數散熱鰭片,該座體內具有一隔板,該散熱器之基板卡置於隔板上而散熱鰭片向下穿過隔板,該扣具橫跨該散熱器基板將該散熱器固定於座體上,而扣具中部抵壓於 該基板上。 A light-emitting diode lamp includes a body, a heat sink, a plurality of light-emitting diode modules attached to the heat sink, and a plurality of fasteners for fixing the heat sink, the heat sink including a substrate and a bottom surface of the substrate a plurality of heat dissipating fins extending downwardly, the body having a partition, the substrate of the heat sink being clamped on the partition plate and the heat radiating fins passing downward through the partition plate, the buckle fixing the heat dissipation across the heat sink substrate The device is fixed on the seat body, and the middle portion of the buckle is pressed against On the substrate.

與習知技術相比,本發明發光二極體燈具通過複數扣具將該散熱器與座體相固定安裝,拆卸及安裝該散熱器只需手動操作該扣具即可,不需使用相關工具,方便安裝、拆卸,從而簡化更換流程,提高工作效率。 Compared with the prior art, the light-emitting diode lamp of the present invention fixes the heat sink and the seat body through a plurality of buckles, and the heat sink only needs to be manually operated, and the related tools are not needed. It is easy to install and disassemble, which simplifies the replacement process and improves work efficiency.

請參閱圖1至圖2,為本發明一較佳實施例之發光二極體燈具,其包括一座體10、置於該座體10上之一散熱器20、貼設於該散熱器20一面之複數發光二極體模組30、將該散熱器20固定於該座體10之上之二扣具40、覆蓋於發光二極體模組30上之一導光罩50及蓋置於座體10之上之一燈罩60將該發光二極體模組30與導光罩50罩設於座體10內。 Referring to FIG. 1 to FIG. 2 , a light-emitting diode lamp according to a preferred embodiment of the present invention includes a body 10 , a heat sink 20 disposed on the base 10 , and a surface attached to the heat sink 20 . The plurality of light-emitting diode modules 30, the two fasteners 40 for fixing the heat sink 20 to the base 10, the light guide cover 50 covering the light-emitting diode module 30, and the cover A light cover 60 on the body 10 covers the light-emitting diode module 30 and the light guide cover 50 in the base 10.

請一併參閱圖3,該座體10呈長方體狀,其包括由四豎立板體(未標示)首尾相接而成之一框架12及自該框架12內側面向內延伸而出並將該框架內部分割成上下兩部分(未標示)之一隔板14。該隔板14位於該框架12內側之中部且垂直於該框架12之每一板體。該隔板14中央垂直向下凹陷形成一矩形承載部142(如圖2所示)用以放置該散熱器20。該承載部142之底面(未標示)開設有貫通該隔板14以供該散熱器20通過之一矩形通口144。該隔板14上靠近承載部142一側之兩端處分別開設有二配合孔146,以與螺釘(圖未示)配合而分別將二卡件100固定安裝於該隔板14之上;靠近承載部142另一側之兩端處分別開設有四配合孔146,以與螺釘配合分別將四卡件100 固定安裝於該隔板14之上。該等配合孔146兩兩平行並列,位於承載部142同一端之六配合孔146為一組並將三卡件100固定其上以安裝一扣具40。 Referring to FIG. 3 together, the base 10 has a rectangular parallelepiped shape, and includes a frame 12 which is connected end to end by four upright plates (not shown) and extends inwardly from the inner side of the frame 12 and the frame is extended. The interior is divided into one of the upper and lower portions (not shown). The partition 14 is located at an inner portion of the inner side of the frame 12 and perpendicular to each of the frames of the frame 12. The center of the partition 14 is vertically downwardly recessed to form a rectangular carrying portion 142 (shown in FIG. 2) for placing the heat sink 20. A bottom surface (not shown) of the carrying portion 142 is opened through the partition plate 14 for the heat sink 20 to pass through a rectangular opening 144. Two engaging holes 146 are respectively defined in the two ends of the baffle 14 on the side of the baffle 14 to be fixedly mounted on the baffle 14 by screws (not shown); Four matching holes 146 are respectively defined at two ends of the other side of the carrying portion 142 to cooperate with the screws to respectively respectively fix the four card members 100 It is fixedly mounted on the partition plate 14. The matching holes 146 are juxtaposed in parallel, and a plurality of six matching holes 146 at the same end of the carrying portion 142 are fixed and the three card members 100 are fixed thereon to mount a buckle 40.

上述散熱器20可由導熱性能良好之金屬材料如鋁、銅等一體製成,其包括一矩形基板22及自該基板22底面垂直向下延伸出之複數散熱鰭片24。該基板22於外形上與該座體10承載部142相一致以使該基板22剛好安置於該承載部142內,且當該基板22之周緣卡置於該座體10承載部142上時,基板22之頂面相齊平於或者略高於該承載部142之頂面,該等散熱鰭片24向下穿過承載部142通口144凸伸到承載部142下方。該等散熱鰭片24相互平行間隔排列於該基板22底面之中部,該等散熱鰭片24之間形成複數與散熱鰭片24延伸方向平行之縱向通道(未標示)及垂直切斷散熱鰭片24之複數橫向流道(未標示)。該等散熱鰭片24整體上之外形與該座體10之通口144之外形相對應,以使該等散熱鰭片24能穿過該通口144。該基板22頂面開設有複數螺孔220以與複數固定件(圖未示)配合安裝該發光二極體模組30及該導光罩50。 The heat sink 20 may be integrally formed of a metal material such as aluminum or copper having good thermal conductivity, and includes a rectangular substrate 22 and a plurality of heat dissipation fins 24 extending vertically downward from the bottom surface of the substrate 22. The substrate 22 is identical in shape to the carrier 10 of the base 10 such that the substrate 22 is disposed in the carrier 142, and when the periphery of the substrate 22 is placed on the carrier 142 of the base 10 The top surface of the substrate 22 is flush with or slightly above the top surface of the carrying portion 142, and the heat dissipating fins 24 protrude downwardly through the carrying portion 142 of the carrying portion 142 to the underside of the carrying portion 142. The heat dissipating fins 24 are arranged in parallel with each other at a middle portion of the bottom surface of the substrate 22. The heat dissipating fins 24 form a plurality of longitudinal channels (not labeled) parallel to the extending direction of the heat dissipating fins 24 and vertically cut the heat dissipating fins. 24 multiple transverse flow paths (not shown). The heat dissipation fins 24 have a shape corresponding to the outer shape of the opening 144 of the base 10 so that the heat dissipation fins 24 can pass through the opening 144. A plurality of screw holes 220 are defined in the top surface of the substrate 22 to mount the LED module 30 and the light guide cover 50 in cooperation with a plurality of fixing members (not shown).

上述發光二極體模組30包括複數縱長矩形之電路板32及複數均勻安裝於每一電路板32上之發光二極體34。該等電路板32之貼合於該散熱器20基板22之頂面。該等發光二極體34沿該電路板32長度方向排列成一直線,從而將其熱量均勻地傳導至該散熱器20上。 The light-emitting diode module 30 includes a plurality of vertically long rectangular circuit boards 32 and a plurality of light-emitting diodes 34 uniformly mounted on each of the circuit boards 32. The circuit boards 32 are attached to the top surface of the substrate 22 of the heat sink 20. The light-emitting diodes 34 are arranged in a line along the length of the circuit board 32 to conduct their heat uniformly to the heat sink 20.

上述扣具40由一彈性金屬線體連續彎折而成,其包括一平直卡持部42、由該卡持部42兩端延伸出之二相互平行 之夾持部44及分別由二夾持部44之自由端(未標示)對稱傾斜向外延伸出之二插入部46。該卡持部42與該二夾持部44之間還有二連接段420,該二連接段420由卡持部42之兩端傾斜向內對稱延伸而出。每一夾持部44包括間隔交替設立之二平直壓制段442及二n形把持段444。該壓制段442與該卡持部42相互垂直。該把持段444所在平面垂直於該卡持部42與該壓制段442所在平面。該插入部46大致呈L形,由該夾持部44把持段444之自由端(未標示)水平延伸而出。每一插入部46包括由把持段444傾斜向外延伸而出之一傾斜段462及由傾斜段462向外彎折平直延伸而出之一插入段464。該二插入部46與該卡持部42及該夾持部44之壓制段442處於同一平面。該二插入段464平行於該卡持部42。該扣具40之卡持部42對應夾置於安裝於該座體10承載部142一側之一卡件100內,該扣具40之二插入部46之二插入段464分別對應夾置於安裝於該承載部142另一側之二卡件100內。該夾持部44之二壓制段442對應壓制於該散熱器20基板22之頂面。該插入部46之傾斜段462一併壓制該基板22之頂面與該座體10隔板14之頂面。 The buckle 40 is continuously bent by an elastic metal wire body, and includes a flat holding portion 42. The two extending from the two ends of the holding portion 42 are parallel to each other. The clamping portion 44 and the two insertion portions 46 extending outward from the free ends (not shown) of the two clamping portions 44 are symmetrically inclined outward. There are two connecting segments 420 between the latching portion 42 and the two clamping portions 44. The two connecting segments 420 extend obliquely inwardly from opposite ends of the latching portion 42. Each of the clamping portions 44 includes two flat pressing sections 442 and two n-shaped holding sections 444 which are alternately arranged. The pressing section 442 and the holding portion 42 are perpendicular to each other. The plane of the holding section 444 is perpendicular to the plane of the holding portion 42 and the pressing section 442. The insertion portion 46 is substantially L-shaped, and the free end (not labeled) of the grip portion 444 of the clamping portion 44 extends horizontally. Each of the insertion portions 46 includes an inclined portion 462 which is obliquely extended outwardly from the holding portion 444 and an outwardly extending portion 464 which is bent outwardly from the inclined portion 462. The two insertion portions 46 are flush with the holding portion 42 and the pressing portion 442 of the clamping portion 44. The two insertion sections 464 are parallel to the holding portion 42. The latching portion 42 of the clip 40 is correspondingly disposed in a latching member 100 mounted on the side of the receiving portion 142 of the base 10. The two inserting portions 464 of the latching portion 40 are respectively placed in the latching portion 464. Installed in the two card members 100 on the other side of the carrying portion 142. The two pressing sections 442 of the clamping portion 44 are correspondingly pressed against the top surface of the substrate 22 of the heat sink 20. The inclined section 462 of the insertion portion 46 collectively presses the top surface of the substrate 22 and the top surface of the partition 14 of the base 10.

上述導光罩50為一彎折之金屬片體,其罩設於該發光二極體模組30之上,包括一縱長導光板52及均勻分佈於該導光板52上之複數導光孔54。該導光板52上之導光孔54之數量與發光二極體模組30之發光二極體34數量相一致,每一發光二極體34對應穿過一導光孔54以改變出光方向。該導光板52之兩相對側形成有抵壓於散熱器20基板 22頂面上之安裝緣(未標號),該安裝緣上開設有複數通孔520以供複數固定件(圖未示)如螺釘等分別穿過並螺合於該散熱器20基板22中部之複數螺孔220內,從而固定該導光罩50。 The light guide cover 50 is a bent metal sheet body, and is disposed on the light emitting diode module 30, and includes a longitudinal light guide plate 52 and a plurality of light guide holes uniformly distributed on the light guide plate 52. 54. The number of the light guiding holes 54 on the light guiding plate 52 is the same as the number of the light emitting diodes 34 of the LED module 30. Each of the light emitting diodes 34 passes through a light guiding hole 54 to change the light emitting direction. The opposite sides of the light guide plate 52 are formed with a substrate pressed against the heat sink 20 a mounting edge (not labeled) on the top surface of the mounting surface (not labeled), the mounting flange is provided with a plurality of through holes 520 for a plurality of fixing members (not shown) such as screws to be respectively passed through and screwed into the middle portion of the substrate 22 of the heat sink 20 The plurality of screw holes 220 are inside, thereby fixing the light guide cover 50.

上述燈罩60由透明材料如有機玻璃、樹脂等製成,其為一矩形板體,在外形上與該座體10框架12相一致。該燈罩60之周緣對稱開設有複數透孔62,供複數固定件(圖未示)分別穿過並與該框架12頂端配合而將該燈罩60安裝固定。 The lamp cover 60 is made of a transparent material such as plexiglass, resin or the like, and is a rectangular plate body which conforms in shape to the frame 12 of the base 10. The periphery of the lamp cover 60 is symmetrically opened with a plurality of through holes 62 through which a plurality of fixing members (not shown) are respectively passed and engaged with the top end of the frame 12 to fix and fix the lamp cover 60.

上述卡件100由一金屬片狀體一體彎折而成,其中部形成一呈拱形容置部(未標示)以夾置該扣具40。該卡件兩端均為可抵壓於該座體10隔板14頂面上之平直片體。該卡件兩端之中部分別開設一穿孔102以供二螺釘分別穿過並螺合於該座體10隔板14上對應之二配合孔146內,從而固定該卡件100。 The card member 100 is integrally bent by a metal sheet body, and an inner portion thereof forms an arched receiving portion (not shown) to sandwich the clip 40. Both ends of the card member are flat sheets which can be pressed against the top surface of the partition plate 14 of the base body 10. A through hole 102 is defined in each of the two ends of the card member for the two screws to pass through and screw into the corresponding two matching holes 146 of the partition plate 14 of the base body 10 to fix the card member 100.

請一併參閱圖4,組裝上述發光二極體燈具時,先將貼設有發光二極體模組30之散熱器20放置於該座體10之承載部142之上,該散熱器20散熱鰭片24對應穿過承載部142通口144;然後將導光罩50對應安裝於該散熱器20基板22上並罩設該發光二極體模組30;再將二扣具40分別對應置於該基板22之兩端,二卡件100分別夾置二扣具40之卡持部42,四卡件100分別夾置二扣具40之四插入段464,十二螺釘分別穿過該六卡件100之十二穿孔102並螺合於座體10上對應之螺孔146內,從而將該二扣具40固定於座體10之隔板14上並分別橫跨散熱器20基板22之兩相對 端,即將該散熱器20固定於該座體10之上;最後將該燈罩60蓋置於該座體10之框架12之上並罩設該發光二極體模組30及導光罩50。拆卸上述散熱器20時,只需直接用手指夾緊扣具40之二夾持部44,使二夾持部44相向靠緊並一併帶動扣具40之二插入段462相向移動直至從對應之二卡件100容置部內脫離而出,此時該扣具40之卡持部42固定卡制於該隔板14上,該扣具40以該卡持部42為軸轉動打開後,即可直接將裝設有發光二極體模組30之散熱器20取出。再次安裝散熱器20時,只需反向操作上述流程即可。 Referring to FIG. 4, when assembling the above-mentioned light-emitting diode lamp, the heat sink 20 to which the light-emitting diode module 30 is attached is placed on the bearing portion 142 of the base body 10, and the heat sink 20 dissipates heat. The fins 24 are correspondingly disposed through the port 144 of the carrying portion 142; the light guide cover 50 is correspondingly mounted on the substrate 22 of the heat sink 20 and the light emitting diode module 30 is covered; At the two ends of the substrate 22, the two latching members 100 respectively sandwich the latching portions 42 of the two latching members 40. The four latching members 100 respectively sandwich the four inserting segments 464 of the two latching members 40, and the twelve screws respectively pass through the six latching members. The twelve through holes 102 of the card member 100 are screwed into the corresponding screw holes 146 of the base body 10, so that the two buckles 40 are fixed to the partition plate 14 of the base body 10 and respectively span the base plate 22 of the heat sink 20. Two relative The heat sink 20 is fixed on the base 10; the cover 60 is placed on the frame 12 of the base 10 and the light-emitting diode module 30 and the light guide 50 are covered. When the heat sink 20 is removed, the two clamping portions 44 of the fastener 40 are directly clamped by the fingers, so that the two clamping portions 44 are opposite to each other and the two insertion portions 462 of the fastener 40 are moved toward each other until the corresponding ones are moved. The latching portion 42 of the latching member 40 is detached from the accommodating portion. At this time, the latching portion 42 of the latching member 40 is fixedly locked to the partitioning plate 14. After the latching member 40 is pivoted and opened, The heat sink 20 equipped with the light-emitting diode module 30 can be directly taken out. When the heat sink 20 is installed again, it is only necessary to operate the above process in reverse.

本發明之發光二極體燈具之散熱器20安置於該座體10之上,該發光二極體模組30貼設於該散熱器20上,二扣具40將該散熱器20與座體10相固定安裝,拆卸及安裝該散熱器20只需手動操作該扣具即可,不需使用相關工具,方便安裝、拆卸,從而簡化更換流程,提高工作效率。 The heat sink 20 of the light-emitting diode lamp of the present invention is disposed on the base 10 , the light-emitting diode module 30 is attached to the heat sink 20 , and the second buckle 40 is used to mount the heat sink 20 and the base body 10 phase fixed installation, disassembly and installation of the radiator 20 only need to manually operate the buckle, without the use of relevant tools, easy to install and disassemble, thus simplifying the replacement process and improving work efficiency.

綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,於爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims.

10‧‧‧座體 10‧‧‧ body

12‧‧‧框架 12‧‧‧Frame

14‧‧‧隔板 14‧‧‧Baffle

142‧‧‧承載部 142‧‧‧Loading Department

144‧‧‧通口 144‧‧‧ mouth

146‧‧‧配合孔 146‧‧‧With holes

20‧‧‧散熱器 20‧‧‧ radiator

22‧‧‧基板 22‧‧‧Substrate

220‧‧‧螺孔 220‧‧‧ screw hole

24‧‧‧散熱鰭片 24‧‧‧ Heat sink fins

30‧‧‧發光二極體模組 30‧‧‧Lighting diode module

32‧‧‧電路板 32‧‧‧ boards

34‧‧‧發光二極體 34‧‧‧Lighting diode

40‧‧‧扣具 40‧‧‧ buckle

42‧‧‧卡持部 42‧‧‧Cars Department

420‧‧‧連接段 420‧‧‧ Connection section

44‧‧‧夾持部 44‧‧‧Clamping Department

442‧‧‧壓制段 442‧‧‧Suppressed paragraph

444‧‧‧把持段 444‧‧‧Control section

46‧‧‧插入部 46‧‧‧Insert Department

462‧‧‧傾斜段 462‧‧‧Sloping section

464‧‧‧插入段 464‧‧‧Insert paragraph

50‧‧‧導光罩 50‧‧‧Light guide

52‧‧‧導光板 52‧‧‧Light guide plate

520‧‧‧通孔 520‧‧‧through hole

54‧‧‧導光孔 54‧‧‧Light guide hole

60‧‧‧燈罩 60‧‧‧shade

62‧‧‧透孔 62‧‧‧through hole

100‧‧‧卡件 100‧‧‧ card

圖1係本發明一較佳實施例之立體組合圖。 1 is a perspective assembled view of a preferred embodiment of the present invention.

圖2係圖1之立體分解圖。 2 is an exploded perspective view of FIG. 1.

圖3係圖1之倒置立體分解圖。 Figure 3 is an inverted perspective exploded view of Figure 1.

圖4係圖1中發光二極體燈具去掉燈罩之立體組合圖。 FIG. 4 is a perspective assembled view of the light-emitting diode lamp of FIG. 1 with the lamp cover removed.

10‧‧‧座體 10‧‧‧ body

12‧‧‧框架 12‧‧‧Frame

14‧‧‧隔板 14‧‧‧Baffle

142‧‧‧承載部 142‧‧‧Loading Department

144‧‧‧通口 144‧‧‧ mouth

146‧‧‧配合孔 146‧‧‧With holes

20‧‧‧散熱器 20‧‧‧ radiator

22‧‧‧基板 22‧‧‧Substrate

220‧‧‧螺孔 220‧‧‧ screw hole

24‧‧‧散熱鰭片 24‧‧‧ Heat sink fins

30‧‧‧發光二極體模組 30‧‧‧Lighting diode module

32‧‧‧電路板 32‧‧‧ boards

34‧‧‧發光二極體 34‧‧‧Lighting diode

40‧‧‧扣具 40‧‧‧ buckle

42‧‧‧卡持部 42‧‧‧Cars Department

420‧‧‧連接段 420‧‧‧ Connection section

44‧‧‧夾持部 44‧‧‧Clamping Department

442‧‧‧壓制段 442‧‧‧Suppressed paragraph

444‧‧‧把持段 444‧‧‧Control section

46‧‧‧插入部 46‧‧‧Insert Department

462‧‧‧傾斜段 462‧‧‧Sloping section

464‧‧‧插入段 464‧‧‧Insert paragraph

50‧‧‧導光罩 50‧‧‧Light guide

52‧‧‧導光板 52‧‧‧Light guide plate

520‧‧‧通孔 520‧‧‧through hole

54‧‧‧導光孔 54‧‧‧Light guide hole

60‧‧‧燈罩 60‧‧‧shade

62‧‧‧透孔 62‧‧‧through hole

100‧‧‧卡件 100‧‧‧ card

Claims (8)

一種發光二極體燈具,包括一座體、一散熱器及貼設於散熱器上之複數發光二極體模組及複數固定該散熱器之扣具,該散熱器包括一基板及由基板底面向下延伸之複數散熱鰭片,其改良在於:該座體內具有一隔板,該散熱器之基板卡置於隔板上而散熱鰭片向下穿過隔板,該扣具橫跨該散熱器基板將該散熱器固定於座體上,而扣具中部抵壓於該基板上,該扣具一端固定連接到隔板上,扣具之另一端通過彈性形變活動連接到隔板上,該扣具由一彈性金屬線體連續彎折而成,其包括一樞接固定於該隔板上之卡持部、分別由該卡持部兩端延伸而出並抵壓於基板上之二夾持部及分別由二夾持部之自由端向外延伸出並活動連接到該隔板上之二插入部。 A light-emitting diode lamp includes a body, a heat sink, a plurality of light-emitting diode modules attached to the heat sink, and a plurality of fasteners for fixing the heat sink, the heat sink including a substrate and a bottom surface of the substrate The lower extension of the plurality of heat dissipation fins is improved in that: the base has a partition, the substrate of the heat sink is clamped on the partition and the heat dissipation fins pass down through the partition, and the buckle spans the heat sink The substrate is fixed on the base body, and the middle portion of the buckle is pressed against the substrate. The buckle is fixedly connected to the partition at one end, and the other end of the buckle is connected to the partition by elastic deformation. The utility model is characterized in that the elastic metal wire body is continuously bent, and comprises a clamping portion pivotally fixed to the partition plate, and two clamping portions respectively extending from the two ends of the clamping portion and pressing against the substrate And a second insertion portion extending outwardly from the free ends of the two clamping portions and movably connected to the partition. 如申請專利範圍第1項所述之發光二極體燈具,其中該隔板中央向下凹陷形成一承載部,該承載部之底面開設有貫通該隔板之一通口供該散熱鰭片通過,該散熱器基板周緣卡置於該承載部上。 The light-emitting diode lamp of claim 1, wherein the bottom of the partition is recessed downwardly to form a bearing portion, and the bottom surface of the partition portion is open through a through-port of the partition for the heat-dissipating fin to pass through, The periphery of the heat sink substrate is stuck on the carrying portion. 如申請專利範圍第2項所述之發光二極體燈具,其中該基板之頂面與座體承載部之頂面相齊平或者略高於座體承載部之頂面。 The illuminating diode lamp of claim 2, wherein the top surface of the substrate is flush with the top surface of the carrier portion of the housing or slightly higher than the top surface of the carrier portion of the housing. 如申請專利範圍第1項所述之發光二極體燈具,還有一第一卡件及二第二卡件安裝於該隔板上並分別位於基板之相對兩側,該等卡件均為一金屬片彎折而成,其兩端與隔板連接,其中部拱起形成一容置部以供該扣具之卡持部樞接、該扣具之插入部插設。 The light-emitting diode lamp of claim 1, wherein a first card member and two second card members are mounted on the spacer and are respectively located on opposite sides of the substrate, and the card members are all The metal piece is bent, and the two ends are connected to the partition plate, and the middle portion is arched to form a receiving portion for pivotally connecting the locking portion of the buckle, and the insertion portion of the buckle is inserted. 如申請專利範圍第1項所述之發光二極體燈具,其中該扣具之二夾持部相互平行且垂直於該卡持部,該扣具之二插入部分別由二夾持部對稱傾斜向外延伸而出。 The illuminating diode lamp of claim 1, wherein the two clamping portions of the fastening device are parallel to each other and perpendicular to the clamping portion, and the two insertion portions of the fastening device are symmetrically inclined by the two clamping portions respectively. Extend outwards. 如申請專利範圍第5項所述之發光二極體燈具,其中該夾持部包括間隔交替設立之二壓制段及二連接壓制段之把持段,該插入部由該夾持部之自由端水平延伸而出,包括由把持段自由端傾斜向外延伸而出之一傾斜段及由傾斜段向外彎折平直延伸而出之一插入段,該插入段插置於該第二卡件容置部。 The illuminating diode lamp of claim 5, wherein the clamping portion comprises two pressing segments alternately set up and two holding segments of the connecting pressing segment, the insertion portion being free from the free end of the clamping portion Extending out, comprising extending from the free end of the gripping section to an outwardly inclined section and extending outwardly from the inclined section to form an insertion section, the insertion section being inserted into the second card component Set up. 如申請專利範圍第6項所述之發光二極體燈具,其中該二插入部與該卡持部及該夾持部壓制段處於同一平面,該平面垂直於該把持段所在平面。 The illuminating diode lamp of claim 6, wherein the two insertion portions are in the same plane as the clamping portion and the pressing portion of the clamping portion, and the plane is perpendicular to a plane of the holding portion. 如申請專利範圍第6項所述之發光二極體燈具,其中該夾持部壓制段壓制於該散熱器基板之上,該插入部一併壓制於該散熱器基板及該座體隔板之上。 The light-emitting diode lamp of claim 6, wherein the pressing portion of the clamping portion is pressed onto the heat sink substrate, and the insertion portion is pressed together on the heat sink substrate and the spacer plate. on.
TW97124095A 2008-06-27 2008-06-27 Led lamp TWI381129B (en)

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TWI381129B true TWI381129B (en) 2013-01-01

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI242402B (en) * 2002-07-03 2005-10-21 Hon Hai Prec Ind Co Ltd Mounting device assembly
TWM318702U (en) * 2007-03-30 2007-09-11 Venius Internat Co Ltd LED module
CN101144597A (en) * 2007-09-18 2008-03-19 朱敬华 High light LED lamp and its LED module group assembling method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI242402B (en) * 2002-07-03 2005-10-21 Hon Hai Prec Ind Co Ltd Mounting device assembly
TWM318702U (en) * 2007-03-30 2007-09-11 Venius Internat Co Ltd LED module
CN101144597A (en) * 2007-09-18 2008-03-19 朱敬华 High light LED lamp and its LED module group assembling method

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