1377885 101年6月29日修正替換頁 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種具壓模包覆之保險絲结構及製造方法，特別是指一 種結構簡易，具鑽孔電極端部，係可直接印刷金屬薄膜與壓模包覆的保險 絲結構及製作方法。 【先前技術】 一般電子產品中，保險絲最主要的功用’就是防止超量的電流流過該 電子電路造成危險，當電路板（PCB)承載電流量超過額定最大使用電流時， 常會使昂貴設備受損或燒燬，而當超額的電流流過保險絲時將使它產生高 溫而導致熔斷電路，以保護電子電路免於受到傷害及危險，故當保險絲之 基板使賴騎料時，柯高溫燒灼絲林全，❿域可使㈣鍍製造 方式之金屬_ ’製造困難成本高，產品穩定度不佳，又，使用電鍍之金 屬薄膜，浪費材料及生產不良率高。 再者，目前隨著電器設備越來越複雜，需要的零件越來越多，電路板 上的線路與電子元件也越來触集’於是電路基板之線路勒於微細化， 電子元件採“化’放置於已沾有料的電路板上，然後再糊一加熱技 術使元個定魏路_表面，已是錢朗方法，其可使魏板的零件 可較為密集，使更多功能安置於同樣面積的印刷電路板上，或者能夠以面 積更小的電路_制樣的魏，然而，—般晶片化保險絲，製造上係一 次大量設計在-基板上再行切割成粒，形成平齊的端面，其佔用大量空間， 且切割成粒時容易讓端電極的金屬受到損傷，浪費材料及生產不良率高。 因此習知技術概括具有如下之缺點： 習用之基板使用塑膠材料，不耐高溫燒灼保護不完全 習用之保險絲，製造上係一次大 形成平齊的端面，製造困難成本 量設計在一基板上再行切割成粒， 高，產品穩定度不佳。 3 2. 1377885 101年6月29日修正替換頁 3·習用之保險絲’切割成粒時容易讓端電極的金屬受到損傷，浪費材 料及生產不良率高。 之技術困 故而，如何將上述缺失加以摒除，即為本案發明人所欲解決 難點之所在。 【發明内容】 有鐾於所述％知問題’本案發明人基於多年從事相關產品設計的經 驗二心研九心及於—電極端部進行溶鍊部金屬共接，令電阻值與炫斷特 性固定；因此 本發明^目的是為：本發服供―種具壓模包覆之紐縣構及製造 方法，別;I:指-観構簡易，具鑽孔電_部，係可直接印刷金屬薄膜 與壓模包覆的保險絲結構及製作方法。 、 本發明.的目的還在於n種具雜包覆之錄絲、结構其基板使 用BT或PCB材質，可耐高溫燒灼具保護作用，並可直接印刷金屬薄膜，製 作間便成本低，節储料及生題率性，提高產品穩定度。 為實現這些本發明的目的，並且根據如所實施和概括描述的那樣以及 二他優點，本發明提供卜種具壓模包覆之紐絲結構，其在於技術方案 疋具有： 、 基板’其V熱係數(thermal c〇nductivi切在i瓦特/公尺.克耳文 (W/m.K)以下，提供形成晶聽險絲之基礎； 炫鍊和叹於基板上，其係由—第—金屬薄膜延伸至基板端部，且 在第-金屬薄膜上形成-較小於第一金屬薄膜之第二金屬薄膜； —電極部，係分別設於溶鍊部之兩側端部；以及 保"又體仏又置兀全覆蓋該炫鍊部上，達成保護作用； 其特徵在於，所義二紐部具有圓錄電性端面，觀伸至炫鍊部 反面端部，且與熔鍊部之第-金屬驗電性賴，又其二電極部係 1377885 101年6月29日修正替換頁 由一第一金屬薄膜上形成一第三金屬薄膜及一第四金屬薄膜所構成；另該 保護體，設有壓模包覆，係施設高度壓力成型所設置，具有高抗壓力防爆 特性。 在本發明的另一個方面，該具壓模包覆之保險絲結構，進一步包括， 其中該炼鍊部之形狀可為直線或曲線或螺旋線條。 在本發明的另一個方面，該具壓模包覆之保險絲結構，進/步包括， 其中該基板’係為 BT(BismaleimideTriazine;BT)或 PCB(Printed Circuit Board ; PCB)材質。 在本發明的另一個方面，該具壓模包覆之保險絲結構，進一步包括， 其中該熔鍊部係設置該基板正面者。 在本發明的另一個方面，該具壓模包覆之保險絲結構，進一步包括， 其中該炫鍊部係設置該基板正面及反面者。 又，本發明之製造方法的技術方案是：一種具壓模包覆保險絲之製造 方法，其包括以下製程步驟： (A)提供基板，於該基板的正/反面貼合或離子沉積，使形成第一金 屬薄膜； (B) 以鑽床鑽孔成型； (C) 在鑽孔細之位置貼合絲子沉積，使形成—相同第—金屬薄膜之 側面導通電極部； (D)製成切割對位線； ⑻於電極部位置上之第—金屬薄膜上形成第三金屬薄膜，不要形成位 置的第-金屬薄膜以微影（光阻）或印刷方式覆蓋保護； (F)於電極雜置上之第三金屬_上形成第四金屬_，不要形成位 置的第三金屬戦·影（光阻）或_方式覆蓋保護； ⑹於背面兩纖刻第-金屬_，形成背面電極部； ⑻於正面關第-金屬薄膜’形柄需之_部紐，賴步形成正 5 1377885 面電極部； 1 〇1年6月29日修正替換頁 ⑴於正面第-金屬薄膜上依炫斷特性，形成—較小於第一金屬薄膜之 第二Μ薄膜’形成溶鍊部’其中該第二金屬薄膜·係低於第一 金屬缚膜，其第二金屬薄膜尺寸依_特性可自由改變. ⑴形成保频，設有壓模包覆，係以高度壓力_所設置，’完全覆蓋 設置該熔鍊部上，具有高抗壓力防爆特性，達成保護該炫鍊部作用； (K) 將該包覆體上，印刷設置一規格標示； (L) 切割成粒，完成成品。 在本發明的另-個方面，該具壓模包覆保險絲之製造方法，進一步包 括，其中該製程步驟（D)具有以下子步驟： (D-1)壓膜切割對位線； (D-2)曝光切割對位線； (D-3)顯影切割對位線； (D-4)钱刻切割對位線； (D-5)去膜切割對位線。 在本發明的另一個方面，該具壓模包覆保險絲之製造方法，進一步包 括，其中該製程步驟（G)具有以下子步驟： (G-1)壓膜背面電極部； (G-2)曝光背面電極部； (G-3)顯影背面電極部； (G-4)钱刻背面電極部； (G-5)去臈背面電極部； 在本發明的另一個方面，該具壓模包覆保險絲之製造方法，進一步包 括，其巾該餘步驟⑻具有町子步驟： (H-1)壓膜正面電極部； (H-2)曝光正面電極部； (H-3)顯影正面電極部； I。1年6肋日修正贿 (H-4)蝕刻正面電極部； (H-5)去膜正面電極部； 在本發明的另-個方面，該具壓模包覆保險絲之製造方法，進 括，其中該製程步驟（I)可另具有町子步驟： α-ι)於反面第-金屬薄膜上依騎特性，形成—較小於第—金屬薄 膜之第二金㈣膜，形姐鍊部，其巾該第二金屬薄觀點係低於 #第-金屬薄膜’其第二金顧膜尺寸依賴特性可自由改變。 藉此，在第-金屬薄膜上形雜點係低於第—金屬薄膜之第四金屬薄 膜，可負載敏観及額定兩倍負載電流下，經過丨秒後推化阻斷負載 電流’可達慢速賴之效果’完成微型⑼碰絲之,功效，保障用電 安全，提尚產品的良率及穩定度者。 / 【實施方式】 ' 以下茲將本發明為達成其發明目的之整體構造設計，配合附圖及實施 例’作進一步詳細說明如下： 首先請參閱第一圖所示，係本發明之外觀立體示意圖。其中一種具壓 模包覆之保險絲結構，具有： 一基板2 ’其導熱係數(thermal conductivity)在1瓦特/公尺•克耳 文（W/m· K)以下’提供形成晶片保險絲之基礎； 一炫鍊部3 ’設於基板2上，其係由一第一金屬薄膜40延伸至基板2 端部，且在第一金屬薄膜40上形成一較小於第一金屬薄膜40之第 二金屬薄膜30 ; 二電極部4 ’係分別設於熔鍊部3之兩側端部；以及 一保護體5，係設置完全覆蓋該溶鍊部3上，達成保護作用； 其特徵在於，所述的二電極部4具有圓弧狀電性端面，並延伸至熔鍊 部3 1…年6月29曰修正替換頁 面、反面端部，且與熔鍊部3之第一金屬薄膜40電性連結，又其二 ，極部4係由—第一金屬薄膜40上形成一第三金屬薄膜41及一第四金屬 、所構成，另該保護體5，設有Μ模包覆，係施設高度壓力成型所設 置，具有高抗壓力防爆特性。 又％參閱第二圖至第十圖所示，係本發明之製造方法完成製程步驟 (Α)至（J)的剖視圖或俯視圖。茲說明如後：本發明之製造方法的技術 方案疋種具壓模包覆保險絲之製造方法，其包括以下製程步螺： (Α)提供一基板2，於該基板的正/反面貼合或離子沉積，使形成第一金 屬薄膜40 ; (Β)以鑽床鑽孔21成型； (C) 在鑽孔21成型之位置貼合或離子沉積，使形成一相同第一金屬薄 膜40之側面導通電極部400 ; (D) 製成切割對位線22，.其^具有以下子步驟： (D-1)壓膜切割對位線； (D-2)曝光切割對位線； (D-3)顯影切割對位線； (D-4)钱刻切割對位線； (D-5)去膜切割對位線； (Ε)於電極部4位置上之第一金屬薄膜40上形成第三金屬薄膜41，不 要形成位置的第一金屬薄膜以微影（光阻）或印刷方式覆蓋保護； (F) 於電極部4位置上之第三金屬薄膜41上形成第四金屬薄膜42，不 要形成位置的第三金屬薄膜以微影（光阻）或印刷方式覆蓋保護； (G) 於背面蝕刻第一金屬薄膜40，形成背面電極部422，其中具有以下 子步驟： (G-1)壓膜背面電極部； (G-2)曝光背面電極部； 101年6月29曰修正替換頁 (G-3)顯影背面電極部； (G-4)姓刻背面電極部； (G-5)去膜背面電極部； ⑻:正面娜-金屬薄膜4G，形成所_物基材，並同步形 成正面電極部421 ’其中具有以下子步驟： (H-1)壓膜正面電極部； (H-2)曝光正面電極部； (H-3)顯影正面電極部； (H-4)韻刻正面電極部； (H-5)去膜正面電極部； ⑴於正面第-金屬薄膜40上依溶斷特性，形成—較小於第一金屬薄 膜40之第二金屬薄膜30，形成熔鍊部3，其中該第二金屬薄膜3〇 熔點係低於第-金屬薄膜40，其第二金屬薄膜3〇尺寸依溶斷特性 可自由改變，用來形成不同慢速炫斷規格之保險絲；又，其中該步 驟（I)可另具有以下子步驟： (1-1)一於反面第-金屬薄膜40上依炫斷特性，形成一較小於第一金 屬缚膜40之弟_金屬薄膜3〇，形成溶鍊部3，其中該第二金屬 薄膜30炫點係低於第一金屬薄膜4〇，其第二金屬薄膜3〇尺寸依 熔斷特性可自由改變，用來形成不同慢速熔斷規格之保險絲及 製成微型大電流之晶片保險絲； 〇)形成倾體5，設有賴包覆，係以高賴力·賴置，完全覆 蓋設置贿鍊部3上，具有高抗射防爆雛，軸倾該熔鍊部 3作用； α)將該包諸上’印刷設置—規格標示5〇; (L)切割51成粒，·完成成品。 睛參閱第二_本發明之製造方法完成製程步驟⑷的剖視圖。基板 1377885 101年6月29曰修正替換頁 2 成型，係於 BT(BisfflaleimideTriazine;BT)基板或 PCB(PrintedCircuit1377885 Revision of the page on June 29, 2011. Description of the Invention: [Technical Field] The present invention relates to a fuse structure and a manufacturing method with a stamper coating, in particular, a simple structure with drilling power The extreme part is a fuse structure and a manufacturing method for directly printing a metal film and a stamper. [Prior Art] In general electronic products, the main function of the fuse is to prevent the excessive current from flowing through the electronic circuit. When the current carrying capacity of the circuit board (PCB) exceeds the rated maximum current, it often causes expensive equipment. Loss or burnout, and when excess current flows through the fuse, it will cause high temperature and cause the circuit to be blown to protect the electronic circuit from damage and danger. Therefore, when the substrate of the fuse is used to ride the material, Ke high temperature burning silk forest The whole, the ❿ domain can make (4) the metal of the plating manufacturing method _ 'the manufacturing cost is high, the product stability is not good, and the electroplated metal film is used, the material is wasted and the production failure rate is high. Furthermore, as electrical equipment becomes more and more complex, more and more parts are needed, and the lines and electronic components on the circuit board are more and more touching. Then the circuit of the circuit board is refined, and the electronic components are refined. 'Placed on a circuit board that has been smeared, and then paste a heating technology to make the finite surface of the Wei _ surface, which is already a Qian Lang method, which can make the parts of the Wei board more dense, so that more functions can be placed in the same The area of the printed circuit board, or can be made of a smaller area of the circuit _ sample, however, the general wafer fuse, the manufacturing system is designed on a large number of substrates, then cut into granules to form a flush end face It occupies a lot of space, and it is easy to damage the metal of the terminal electrode when cutting into granules, which wastes materials and has a high production defect rate. Therefore, the conventional technology has the following disadvantages: The conventional substrate is made of plastic material and is not resistant to high temperature burning. Incompletely used fuses are manufactured with a large flush end face, which is difficult to manufacture and designed to be cut into pellets on a substrate. High, product stability is not 3 2. 1377885 Correction of the replacement page on June 29, 101. 3. The fuse used in the 'cutting granules is easy to damage the metal of the terminal electrode, which wastes materials and has a high production failure rate. The lack of it is the place where the inventor of the present invention wants to solve the problem. [Summary of the Invention] In view of the above-mentioned problem, the inventor of the present invention is based on the experience of designing related products for many years. The main part of the sol chain is connected to the metal, so that the resistance value and the snagging characteristic are fixed; therefore, the present invention is intended to be: a new county structure and a manufacturing method for the present invention. - The structure of the structure is simple, and the hole is made of a hole, which is a fuse structure and a manufacturing method for directly printing a metal film and a stamper. The purpose of the invention is also to n kinds of recorded wires with a heterogeneous coating and a structure thereof. The substrate is made of BT or PCB material, which can protect against high temperature burning and can directly print metal film. The cost of production is low, the material storage and the problem rate are improved, and the stability of the product is improved. To achieve the purpose of the present invention, And according to the embodiments as embodied and summarized, and the advantages thereof, the present invention provides a stamped-coated nylon structure, which is characterized in that: the substrate 'its V thermal coefficient (thermal c〇nductivi cut Below iW/m.K. (W/mK), the basis for forming a crystal hearing wire is provided; the chain and the sigh are on the substrate, which is extended from the -metal film to the end of the substrate, and Forming a second metal film smaller than the first metal film on the first metal film; - electrode portions respectively disposed at both end portions of the sol chain portion; and protecting the body The protective chain is achieved on the chain part; the characteristic is that the second part of the right side has a circular recording end face, which extends to the opposite end of the chain part, and is inspected with the first metal of the chain part. The second electrode portion is 1378880. The correction replacement page is formed on a first metal film by a third metal film and a fourth metal film. The protective body is provided with a stamper coating. It is set up with high pressure forming and has high pressure and explosion proof properties. In another aspect of the invention, the die-wrapped fuse structure further includes wherein the shape of the chain portion can be a straight line or a curved line or a spiral line. In another aspect of the invention, the die-wrapped fuse structure includes, wherein the substrate is made of BT (Bismaleimide Triazine; BT) or PCB (Printed Circuit Board; PCB). In another aspect of the invention, the die-wrapped fuse structure further includes, wherein the fuse link is disposed on the front side of the substrate. In another aspect of the invention, the die-wrapped fuse structure further includes, wherein the chain portion is disposed on the front side and the back side of the substrate. Moreover, the technical solution of the manufacturing method of the present invention is: a manufacturing method of a die-wrapped fuse, comprising the following process steps: (A) providing a substrate on which the front/back surface of the substrate is bonded or ion-deposited to form (1) drilling with a drill press; (C) laminating the filament at a fine position of the drilled hole to form a side conductive electrode portion of the same first metal film; (D) forming a cutting pair (8) forming a third metal film on the first metal film at the position of the electrode portion, and protecting the first metal film not in a position by lithography (resistance) or printing; (F) on the electrode miscellaneous The third metal _ is formed on the fourth metal _, the third metal 戦 shadow (photoresist) or _ mode covering protection is not formed at the position; (6) the second metal etched on the back side, forming the back electrode portion; (8) The front side of the -metal film 'shaped handle needs _ part of the new, Lai step to form the positive 5 1377885 surface electrode part; 1 6 June 29, the revised replacement page (1) on the front side - metal film according to the slashing characteristics, the formation - a second tantalum film smaller than the first metal film 'Forming a sol-chain portion' wherein the second metal film is lower than the first metal bond film, and the size of the second metal film is freely changeable according to the _ characteristic. (1) Forming a frequency-maintaining, providing a stamper coating, with a height Pressure _ set, 'completely cover the fuse part, with high pressure explosion-proof characteristics, to achieve the protection of the chain part; (K) on the cover, printing set a specification mark; (L) cutting Granulated to complete the finished product. In another aspect of the invention, the method of manufacturing a stamper-covered fuse further includes, wherein the process step (D) has the following sub-steps: (D-1) laminating the alignment bit line; (D- 2) Exposure cutting alignment bit line; (D-3) developing cutting alignment bit line; (D-4) cutting the alignment bit line; (D-5) removing the film to cut the alignment line. In another aspect of the invention, the method of manufacturing a stamper-covered fuse further includes, wherein the process step (G) has the following sub-steps: (G-1) a film back electrode portion; (G-2) Exposing the back electrode portion; (G-3) developing the back electrode portion; (G-4) etching the back electrode portion; (G-5) removing the back electrode portion; and in another aspect of the invention, the stamping bag The manufacturing method of the fuse further includes the step (8) of the towel having the steps of: (H-1) laminating the front electrode portion; (H-2) exposing the front electrode portion; (H-3) developing the front electrode portion ; I. 1 year 6 rib day correction bribe (H-4) etching front electrode portion; (H-5) stripping front electrode portion; in another aspect of the invention, the method for manufacturing the stamper-covered fuse , wherein the process step (I) may further have a step of the homogenization: α-ι) on the opposite surface of the metal film, forming a second gold (four) film smaller than the first metal film, the shape of the chain The second metal thin view of the towel is lower than the #第-metal film', and the second film size-dependent property can be freely changed. Thereby, the fourth metal film on the first metal film is lower than the fourth metal film of the first metal film, and can be loaded with a sensitive and rated load current of two times, and the load current is blocked by the push-second after the leap second The effect of slow speed is to complete the micro (9) touch, the effect, to ensure the safety of electricity, and to improve the yield and stability of the product. [Embodiment] The following is a detailed structural design of the present invention for achieving the object of the present invention, and is further described in detail below with reference to the accompanying drawings and embodiments. First, please refer to the first figure, which is a perspective view of the appearance of the present invention. . One of the fuse-clad fuse structures has: a substrate 2' having a thermal conductivity of less than 1 watt/meter gram (W/m·K) to provide a basis for forming a chip fuse; A bright chain portion 3' is disposed on the substrate 2, and extends from a first metal film 40 to the end of the substrate 2, and a second metal smaller than the first metal film 40 is formed on the first metal film 40. a film 30; two electrode portions 4' are respectively disposed at both end portions of the melt chain portion 3; and a protective body 5 is provided to completely cover the sol chain portion 3 to achieve protection; The second electrode portion 4 has an arc-shaped electrical end surface and extends to the fuse portion 3 1 ... June 29 曰 correction replacement page, reverse surface end portion, and is electrically connected to the first metal film 40 of the fuse link portion 3 In addition, the pole portion 4 is formed by forming a third metal film 41 and a fourth metal on the first metal film 40. The protective body 5 is provided with a die coating and is subjected to high pressure molding. It is equipped with high pressure and explosion proof properties. Further, referring to the second to tenth drawings, the manufacturing method of the present invention completes the cross-sectional view or the plan view of the process steps (Α) to (J). The following is a description of the manufacturing method of the present invention. The manufacturing method of the stamped-clad fuse includes the following steps: (Α) providing a substrate 2 on the front/back surface of the substrate or Ion deposition is performed to form the first metal thin film 40; (Β) is formed by drilling the drill hole 21; (C) bonding or ion deposition is performed at the position where the drilled hole 21 is formed, so that the side conduction electrode forming the same first metal thin film 40 is formed. The portion 400; (D) is formed into a cutting alignment line 22, which has the following sub-steps: (D-1) lamination cutting alignment line; (D-2) exposure cutting alignment line; (D-3) Developing a dicing bit line; (D-4) cutting the alignment line; (D-5) removing the dicing line; (Ε) forming a third metal on the first metal film 40 at the position of the electrode portion 4 The film 41, the first metal film which does not form a position is covered by lithography (resistance) or printing; (F) the fourth metal film 42 is formed on the third metal film 41 at the position of the electrode portion 4, and the position is not formed. The third metal film is protected by lithography (resistance) or printing; (G) etching the first metal film 40 on the back surface to form The back electrode portion 422 has the following sub-steps: (G-1) laminated film back electrode portion; (G-2) exposed back electrode portion; June 29, 2011 correction replacement page (G-3) developing back electrode portion (G-4) surname engraved back electrode portion; (G-5) stripped back electrode portion; (8): front side-metal thin film 4G, forming the substrate, and simultaneously forming the front electrode portion 421' having the following Sub-step: (H-1) front surface electrode portion of the film; (H-2) exposure front electrode portion; (H-3) development front electrode portion; (H-4) rhyme front electrode portion; (H-5) (1) Forming a second metal film 30 smaller than the first metal film 40 on the front surface of the metal film 40, forming a fuse portion 3, wherein the second metal film 3 is formed on the front surface of the metal film 40. The melting point of the bismuth is lower than that of the first metal film 40, and the size of the second metal film 3 可 can be freely changed according to the melting property, and is used to form fuses of different slow slash specifications; further, the step (I) may have another The following sub-steps: (1-1) forming a smaller film than the first metal bond film 40 according to the squeaking property on the reverse-metal film 40 Forming the melting portion 3, wherein the second metal film 30 is lower than the first metal film 4〇, and the second metal film 3〇 is freely changeable according to the fusing characteristics, and is used to form different slow-melting specifications. The fuse and the chip fuse for making a miniature current; 〇) forming a tilting body 5, which is provided with a high-relief and a high-relief, which is completely covered with the bribe chain portion 3, has a high anti-explosion-proof embryo, and the shaft is tilted. The fuse link 3 functions; α) the package is printed on the 'printing specification—the specification is 5 〇; (L) is cut into 51 granules, and the finished product is completed. Referring to the second method of the present invention, a cross-sectional view of the process step (4) is completed. Substrate 1377885 June 29, 2011 Correction Replacement Page 2 Forming, on BT (BisfflaleimideTriazine; BT) substrate or PCB (PrintedCircuit
Board; PCB)基板貼合銅落’ BT基板或PCB基板材料為含玻璃纖維等之BT 基板或PCB基板’於BT基板或PCB基板上下兩面貼合或離子沈積形成第一 金屬薄膜40 ;其中該第一金屬薄膜40之材料，可為金、銀、銅等金屬導電 材料。 請參閱第三圖係本發明之製造方法完成製程步驟的俯視圖及第四 圖係本發明之製造方法完成製程步驟（C)的剖視圖。其中，鑽孔21，係以 鑽床成型方式於 BT(Bismaleimide Triazine ; BT)基板或 PCB(PrintedThe PCB substrate or the PCB substrate material is a BT substrate or a PCB substrate containing glass fibers, and the first metal film 40 is formed by bonding or ion-depositing on the upper and lower sides of the BT substrate or the PCB substrate; The material of the first metal film 40 may be a metal conductive material such as gold, silver or copper. Referring to the third drawing, a plan view of a process step of the manufacturing method of the present invention and a fourth drawing are a cross-sectional view showing a process step (C) of the manufacturing method of the present invention. Among them, the drill hole 21 is formed by drilling in a BT (Bismaleimide Triazine; BT) substrate or PCB (Printed).
Circuit Board ·’ PCB)基板上成型，再於鑽孔成型之位置兩側用貼合或離子 沉積製作’使形成一相同第一金屬薄膜之側面導通電極部4〇〇 ; 請參閱第五圖係本發明之製造方法完成製程步驟（的的俯視圖。製作 切割對位線22，係經過壓膜、曝光、顯影、蝕刻、去膜等製程。 明參閱弟六圖係本發明之製造方法完成製程步驟（F)的剖視圖。該步 驟（F)’係於第一金屬薄膜40上形成第三金屬薄膜41及第四金屬薄膜π ; 其中該第三金屬薄膜41及第四金屬薄膜42其材料為銅、鎳或鍚等金屬導 電材料，不需形成弟二金屬薄膜41及第四金屬薄膜42的位置以微影（光阻） 或印刷方式覆蓋保護。 請參閱第七圖係本發明之製造方法完成製程步驟（G)的剖視圖。該步 驟（G)製作背面電極，係於BT(Bisinaleimide Triazine ; BT)基板或pCB (Printed Circuit Board ; PCB)基板背面兩側形成電極，製作時經過壓膜、 曝光、顯影、蝕刻、去膜等製程，且以光阻或印刷材料為遮避材料。 請參閱第八圖係本發明之製造方法完成製程步驟（H)的俯視圖。該步 驟00製作正面線路，係於BT(Bismaleimide Triazine ; BT)基板或PCB (Printed Circuit Board ; PCB)基板正面蝕刻第-金屬薄膜4〇形成所需之 熔鍊部3基材，並同步形成正面電極，製作時經過壓膜、曝光、顯影、兹 刻、去膜等製程’且以光阻或印刷材料為遮避材料。 10 1377885 技 101年6月29日修正替換頁 ^閱第九圖係本發明之製造方法完成製程步驟⑴的俯視圖。該步 驟⑴正面線路鍍鍚’係於第—金屬薄膜40上可形成第二金屬薄膜30其 大小視冷晴财自由改變，製作時以光喊印珊料為遮避枯料。 請參閱第十圖係本發明之製造方法完成製程步帮⑺的剖視圖。該步 驟⑴形成保護體5 ’設有顧包覆，其係以高度勤細所設置完全 覆蓋設置__ 3上，具有說壓力_，達絲護娜鍊部3作 的成品 請參閲科-_本發明之觀綠進行製程麵⑴_視圖。本 發明具壓模包覆保險絲經過切割線51切割成粒後，即為微型晶聽險絲】 以上所述係本發明之-較佳可行實施例總要說明，惟非因此即拘限本 發明之專利㈣，故而舉凡吾人運財發明說明書及圖式内容所為之等效 結構或製造紐’直接細接運其相隨魏域者，觸理皆理應包 含於本發明之精神範疇的範圍内，合予陳明。 再，為使本發《域現其進步倾實祕，雜級时施上之優 1·本發日月之基板使用BT或PCB材質，可耐高溫燒灼具保護作用。 2·本發攸觀上先狐再行_絲，形辭__面，製作簡 便成本低，提高產品穩定度。 3. 本發明切割成粒時，不容易讓端電極的金屬 生產良率性高。 受到損傷，節省材料及 4·具工商界及產業界上利用價值與實際所需。 综上所述，本發明在突破先前之技術結構及製造方法下，確實已 已付合發明專利之申請要件， 所欲增進之功效’且也非熟悉該項技藝者所易於思及；再者，本發明申許 前未曾公開，其所具之進步性'實用性，顯 月 爰依法提出發明申請。 1377885 101年6月29日修正替換頁 【圖式簡單說明】 第一圖係本發明之外觀立體示意圖。 第二圖係本發明之製造方法完成製程步驟（A)的剖視圖。 第三圖係本發明之製造方法完成製程步驟（B)的俯視圖。 第四圖係本發明之製造方法完成製程步驟（C)的剖視圖。 第五圖係本發明之製造方法完成製程步驟（D)的俯視圖。 第六圖係本發明之製造方法完成製程步驟（F)的剖視圖。 第七圖係本發明之製造方法完成製程步驟（G)的剖視圖。 第八圖係本發明之製造方法完成製程步驟（H)的俯視圖。 第九圖係本發明之製造方法完成製程步驟（I)的俯視圖。 第十圖係本發明之製造方法完成製程步驟（J)的剖視圖》 第十一圖係本發明之製造方法進行製程步驟（L)的俯視圖。 【主要元件符號說明】 保險絲....................................1 基板.......................................2 鑽孔.......................................21 對位線....................................22 溶鍊部....................................3 第二金屬薄膜...........................30 電極部....................................4 第一金屬薄膜...........................40 側面導通電極部........................400 第三金屬薄膜...........................41 第四金屬薄膜...........................42 正面電極部..............................421 12 1377885 101年6月29日修正替換頁 背面電極部..............................422 保護體....................................5 標示.......................................50 切割.......................................51 13Circuit Board · 'PCB' is formed on the substrate, and then fabricated on both sides of the hole forming position by bonding or ion deposition to form a side conductive electrode portion 4 of the same first metal film; see the fifth figure The manufacturing method of the present invention completes the top view of the process step. The dicing alignment line 22 is formed by a process of laminating, exposing, developing, etching, removing film, etc. The process of the manufacturing method of the present invention is completed. (F) is a cross-sectional view of the third metal film 41 and the fourth metal film π formed on the first metal film 40. The third metal film 41 and the fourth metal film 42 are made of copper. The metal conductive material such as nickel or tantalum does not need to form the position of the second metal film 41 and the fourth metal film 42 to be protected by lithography (resistance) or printing. Please refer to the seventh figure for the manufacturing method of the present invention. A cross-sectional view of the process step (G). The step (G) is to fabricate a back electrode, which is formed on the back side of a BT (Bisinaleimide Triazine; BT) substrate or a pCB (Printed Circuit Board; PCB) substrate. Overpressure film, exposure, development, etching, film removal, etc., and photoresist or printed material as the shielding material. Please refer to the eighth drawing, which is a top view of the manufacturing process step (H) of the manufacturing method of the present invention. The front side of the BT (Bismaleimide Triazine; BT) substrate or PCB (Printed Circuit Board; PCB) substrate is etched on the front side of the metal film 4 to form the desired melt link 3 substrate, and the front side electrode is formed simultaneously. When the process of lamination, exposure, development, engraving, film removal, etc. is used, and the photoresist or printed material is used as the shielding material. 10 1377885 Technology Revision June 29, 2011 Correction page The manufacturing method completes the top view of the process step (1). The step (1) front side plating is performed on the first metal film 40 to form a second metal film 30, the size of which is changed according to the cold and clear, and the light is printed as Please refer to the tenth figure for the manufacturing method of the present invention to complete the cross-sectional view of the process step (7). This step (1) forms the protective body 5' with the cover, which is completely covered by the height and fineness setting _ _ 3 , with the pressure _, the finished product of the Daxie Na Na chain part 3, please refer to the section - the process view of the invention (1)_ view. The stamped fuse of the invention is cut into granules by the cutting line 51. The above is a description of the preferred embodiment of the present invention, but it is not limited to the patent (4) of the present invention. Therefore, the description and schema of the invention are The equivalent structure or manufacturing of the 'new' directly and in conjunction with the Wei domain, it should be included in the scope of the spirit of the invention, and combined with Chen Ming. In addition, in order to make the field "the progress of the field is now secret, the quality of the miscellaneous class is applied. 1. The substrate of the hair and the moon is made of BT or PCB material, which can protect against high temperature burning. 2. The first fox is on the hair of the hair _ _ silk, the shape of the word _ _ face, the production is simple and low cost, improve product stability. 3. When the present invention is cut into granules, it is not easy to make the metal production efficiency of the terminal electrode high. Injury, saving materials and the use of value and actual needs in the business and industry. In summary, the present invention has already fulfilled the application requirements of the invention patents under the prior art structure and manufacturing method, and the effect of the invention is not well known to those skilled in the art; The invention has not been disclosed before the application of the invention, and its progressive 'practicality'. 1377885 Correction replacement page on June 29, 2011 [Simplified illustration of the drawings] The first figure is a perspective view of the appearance of the present invention. The second drawing is a cross-sectional view of the manufacturing process of the present invention which completes the process step (A). The third drawing is a plan view of the manufacturing process of the present invention to complete the process step (B). The fourth drawing is a cross-sectional view showing the manufacturing process step (C) of the manufacturing method of the present invention. The fifth drawing is a plan view of the manufacturing process of the present invention to complete the process step (D). Figure 6 is a cross-sectional view showing the manufacturing process of the present invention completing the process step (F). The seventh drawing is a cross-sectional view showing the manufacturing process step (G) of the manufacturing method of the present invention. The eighth drawing is a plan view of the manufacturing process step (H) of the present invention. The ninth drawing is a plan view of the manufacturing process of the present invention which completes the process step (I). Figure 11 is a cross-sectional view showing the manufacturing process of the present invention (J). The eleventh drawing is a plan view of the manufacturing process of the present invention. [Main component symbol description] Fuse....................................1 Substrate....... ..................................2 Drilling............. ..........................21 alignment line.................... ................22 Solvent Chain.............................. ......3 Second metal film........................30 Electrode part......... ...........................4 First metal film.................. .........40 Side conduction electrode section........................400 Third metal film....... ....................41 Fourth Metal Film......................... ..42 Front electrode section..............................421 12 1377885 Corrected replacement page back electrode on June 29, 101 Department..............................422 Protector................ ....................5 Marking............................ ...........50 cutting..................................... ..51 13