1377334 六、發明說明： 【發明所屬之技術領域】 本發明侧於-種散熱餘，尤其是—種可依據溫 度感測元件之感測結果，用以控制散熱風扇之運轉模式的 散熱模組。 【先前技術】 請參照第1圖所示’係揭示―種習知散熱模組9，該 散熱模組9包含一散熱器91、一散熱風看92、一電路板 93及一溫度感測元件94。該散熱器91設有數個鰭片9n ，該散熱風扇92具有一基座921，該基座921結合該散 熱器91 ;該電路板93設置於該基座921之表面；該溫度 感測元件94設有一感測面941及數個接腳942，各該接 腳942電性連接該電路板93。 又’該散熱風扇92之基座921另設有一缺口 922， 當該電路板93結合於該基座921時，該感測元件94可利 用該接腳942穿伸於該缺口 922，令該感測面941接觸該 散熱器91之表面；藉此，習知散熱模組9應用於各式電 子產品進行散熱的過程中，該溫度感測元件94可用以咸 測該散熱器91之溫度，並配合控制該散熱風扇92之運^ 模式，例如：當該溫度感測元件94感測該散熱器91之溫 度過高時，即可控制該散熱風扇92的運轉速度加快，Z 產生更多之風量；或者，當先前所感測之該散熱器9ι的 溫度較低時，則可控制該散熱風扇92的運轉速度減緩， 以達到省電之效果。 4 緣較ΐ^11及—第二表面112 ;又，該座體11之外周 nj —外環部12,該外環部12具有一凸出面 該凸出面】^面121與該第一表面⑴具有一高度差，、且 娜片η \設有數個鰭片13及數個結合孔14;其中各 =二為環狀排列設置’以便於各該韓片13之間形 二二^間15 ’而各該鰭片13彼此之間具有間距，各 該、·“孔14分別位於其中任二相_片13之間。1377334 VI. Description of the Invention: [Technical Field] The present invention is directed to a heat dissipation module, and more particularly to a heat dissipation module for controlling the operation mode of a heat dissipation fan according to a sensing result of a temperature sensing component. [Previous Art] Referring to FIG. 1 , a conventional heat dissipation module 9 is disclosed. The heat dissipation module 9 includes a heat sink 91 , a heat dissipation view 92 , a circuit board 93 , and a temperature sensing element . 94. The heat sink 91 is provided with a plurality of fins 9n. The heat dissipation fan 92 has a base 921. The base 921 is coupled to the heat sink 91. The circuit board 93 is disposed on the surface of the base 921. The temperature sensing component 94 is disposed. A sensing surface 941 and a plurality of pins 942 are disposed, and each of the pins 942 is electrically connected to the circuit board 93. In addition, the base 921 of the cooling fan 92 is further provided with a notch 922. When the circuit board 93 is coupled to the base 921, the sensing component 94 can be used to extend through the notch 922. The measuring surface 941 contacts the surface of the heat sink 91; thereby, the conventional heat dissipation module 9 is applied to heat dissipation of various electronic products, and the temperature sensing component 94 can be used to measure the temperature of the heat sink 91, and In conjunction with controlling the operation mode of the heat dissipation fan 92, for example, when the temperature sensing element 94 senses that the temperature of the heat sink 91 is too high, the operation speed of the heat dissipation fan 92 can be controlled to be accelerated, and Z generates more air volume. Or, when the temperature of the heat sink 9ι previously sensed is low, the running speed of the heat dissipation fan 92 can be controlled to be slowed down to achieve the effect of power saving. 4 is opposite to the ΐ^11 and the second surface 112; further, the outer circumference of the base 11 is the outer ring portion 12, the outer ring portion 12 has a convex surface, the convex surface, the surface 121 and the first surface (1) There is a height difference, and the nano sheet η \ is provided with a plurality of fins 13 and a plurality of bonding holes 14; wherein each = two is arranged in a ring shape so that the two pieces of the Korean film 13 are shaped between two and two 15' Each of the fins 13 has a spacing therebetween, and each of the "holes 14" is located between any two of the phases 13 .
1散熱風扇2具有—基座2卜該基座2ι設有一袖接 # 22及一線圈組23，該軸接部22可供一扇輪％ έ士人， ==组23係用以驅動該扇輪24旋轉作動；又，^座 八㈣較佳延伸出數個支擇肋21卜各該支撐肋2U =1二/ 212 ’藉此’ #該散熱風扇2安裝於該散熱 間15時’該基座21之各支撐肋211可結合 ^…之凸出面m，且各該穿孔212分別對位該散 各結合孔14，以便利用數個固定元件25 (如螺 名14，、I5崎等）穿伸各該穿孔212並固^於各該結合 ;7該散熱風扇2與該散熱lil可相互結合固定。 該控制組件3具有—電路板31，該電路板Μ設有一 311 n電性連接璋312;其中該電子元件 可至少一種主動式或被動式電子元件所構成，且該 ，元件3U電性連接該散熱風扇2之線圈組^用二 控制該線圈組23驅動該扇輪24旋轉作動。 '該溫度感測元件4設有一第二電性連接埠41及-感 =面42 ’該第二電性連接埠41與該第一電性連接蜂犯 电性連接’該感測面42朝向該座體η之第—表面hi。 !377334 片該，龍5設置於該賴器〗之座體u及該溫度 感測70件4之間；該導熱膠體5係為熱傳導效率佳及具有 彈性緩衝功能的-片體，該片體更佳可兼具有絕緣功能， 以避免產生如漏電等問題。又，該導熱膠體5具有相對之 -第-貼接面51及-第二貼接面52，該第—貼接面51 貼接該溫度感測元件4之制面42，該第二 接該散熱器1之第一表面m。 本發明散熱模組於實際使用時，該散熱器i之第二 表面2可、”^ σ於各式電子產品在運作時容易產生高敎之 部位，以制㈣散㈣提供私電子產轉仙散熱效 果，另外’該溫度感測元件4可用以感測該散熱器i之溫 度，再配合控制該散熱風扇2之運轉模式，例如：當該溫 度感測元件4 _該賴器丨之溫度過高時，即可控制該 散熱風扇2的·速度域，以產生更多之風量；或者， 當先狀該散絲1的溫度較低時，财控制該散 熱風扇2的運轉速度減緩，以達到省電之效果；藉此，達 到使該散熱風扇2 ^於過度損耗及兼可提升散熱效果之 功效。 藉由前揭之結構特徵，本發明散熱模組之主要特點 在於. 第4、5及6圖所示，當該散熱風扇2之基座 女裝於該散熱器1時，由於該導熱膠體 熱器1之座體11及該溫度_元件4之間，因此，該^ 該溫度感測元件， 座體…一表面m之間所可能產生的間隙，再配合 1377334 該導熱膠體5的彈性缓衝功能，確保該溫度感測元件4、 導熱膠體5及座體11彼此之間可毫無間隙地呈現密合貼 接狀態（如第6圖所示），令該溫度感測元件4可透過該 I熱膠體5更為精確喊應該散熱H 1之溫度高低；再 者’於安f過財，該導熱雜5兼可有效髓該溫度感 測το件4不至於受到該散熱器1的過度壓迫而損壞。 藉由上述本發明散熱模組之結構設計概念，本發明 政熱模組村進—步包含如下所述之至少—附屬結構特徵 或其組δ，使本發明散熱模組之功能更趨近於完善，其 中： 。〆、1 The cooling fan 2 has a base 2, the base 21 is provided with a sleeve #22 and a coil set 23, and the shaft joint 22 is available for a fan wheel. The gentleman is used to drive the The fan wheel 24 is rotated and rotated; further, the seat 8 (four) preferably extends a plurality of support ribs 21 each of the support ribs 2U =1 2 / 212 'by this '# when the cooling fan 2 is installed in the heat dissipation room 15' Each of the support ribs 211 of the base 21 can be combined with the convex surface m of the ..., and each of the through holes 212 respectively aligns the respective coupling holes 14 so as to utilize a plurality of fixing elements 25 (such as screw name 14, I5, etc.) Each of the through holes 212 is stretched and fixed to each of the joints; 7 the heat dissipating fan 2 and the heat dissipating li1 are fixed to each other. The control unit 3 has a circuit board 31. The circuit board is provided with a 311 n electrical connection 312. The electronic component can be formed by at least one active or passive electronic component, and the component 3U is electrically connected to the heat dissipation. The coil set of the fan 2 controls the coil set 23 to drive the fan wheel 24 to rotate. The temperature sensing element 4 is provided with a second electrical connection 41 and a sensed surface 42. The second electrical connection 41 is electrically connected to the first electrical connection. The sensing surface 42 is oriented. The first surface hi of the seat η. !377334 piece, the dragon 5 is disposed between the seat body u of the device and the temperature sensing 70 piece 4; the heat conductive gel body 5 is a sheet body having good heat conduction efficiency and elastic buffering function, the sheet body It is better to have an insulation function to avoid problems such as leakage. Moreover, the thermal adhesive body 5 has a first-but-contact surface 51 and a second contact surface 52, and the first-contact surface 51 is attached to the surface 42 of the temperature sensing element 4, and the second contact The first surface m of the heat sink 1. In the actual use of the heat dissipating module of the present invention, the second surface 2 of the heat sink i can be used to produce a high-tech product in the operation of various electronic products. The heat dissipation effect, in addition, the temperature sensing component 4 can be used to sense the temperature of the heat sink i, and then cooperate with the operation mode of the heat dissipation fan 2, for example, when the temperature sensing component 4_the temperature of the heat sink is over When high, the speed domain of the cooling fan 2 can be controlled to generate more air volume; or, when the temperature of the first loose filament 1 is low, the operating speed of the cooling fan 2 is slowed down to save The effect of the electric power; thereby achieving the effect of excessively dissipating the heat dissipating fan and improving the heat dissipating effect. With the structural features disclosed above, the main features of the heat dissipating module of the present invention are: 4, 5 and 6 As shown in the figure, when the base of the heat dissipation fan 2 is worn on the heat sink 1, due to the space between the seat body 11 of the thermal thermal gel 1 and the temperature element 4, the temperature sensing element , the body...a possible difference between the surfaces m And the elastic buffering function of the thermal conductive colloid 5 is ensured that the temperature sensing element 4, the thermal conductive gel 5 and the base body 11 can be brought into close contact with each other without any gap (as shown in Fig. 6). Therefore, the temperature sensing element 4 can more accurately oscillate the temperature of the heat dissipation H1 through the I thermal gel 5. In addition, the heat conduction impurity 5 can effectively effect the temperature sensing τ. The member 4 is not damaged by the excessive compression of the heat sink 1. With the structural design concept of the heat dissipation module of the present invention, the political heating module of the present invention comprises at least the auxiliary structure features as described below or The group δ makes the function of the heat dissipation module of the invention closer to perfection, wherein:
明> 4第3及4圖所示，本發明散熱模組之控制組 件3的路板31可直接結合於該散熱風扇2之基座21， 以提升該控制組件3之結合穩固性；當該電路板Μ與該 基座21相互結合時，該第一電性連接蟑312較佳係朝向 該座體11之第-表面，以方便該溫度感測元件4之第二 電性連料41電性連接該第—電性連接痒312。 堉多照弟 闯r/y不 十私a欣热模組之控制组件3 的電路板3丨與該散熱風扇2之基座21可為—體成型結 &，間言之，座21可視為電路板3!，或電路板31 藉此’以簡化該散熱模組之結構複雜度 及提升組裝便利性。 _ ^ 4 ’當本翻散熱模組之電 路板31直接…該基座21時，該基座21較佳設有一缺 口 213 (或可以透孔取代），該電路板3ι之第 璋犯及電性連制第-紐連接埠31的溫度感測元件 1377334 4係對位該缺口 213,以便該導熱膠體5可透過該缺D 213順利貼接於該散熱器1之座體u ;另外，如第5圖所 示，該缺口 213更兼具可用以對位該溫度感測元件4及該 導熱膠體5之功能，以提升該散熱模組之組裝便利性。或 者，如第8圖所示，當本發明散熱模組之電路板31直接 結合該基座21時，該基座21之最大外徑（D1)較佳係 小於該電路板31之最大外徑（D2)，而該溫度感測元件4 及該導熱膠體5相對位於該電路板31之外周邊，藉此， 可在未設置上述缺口 213的前提條件下，使該導熱膠體5 仍可順利貼接於該散熱器1之座體U。 睛再參照第3及4圖所示，當本發明散熱模組之散 熱器1的凸出面121與第一表面具有高度差設計，且 該基座21之各支撐肋211結合該散熱器丨之凸出面ΐ2ι 時丄該基座21與該座體U之間可形成一間隙，該間隙可 供容置該導熱賴5，以作為該導_體5彈性變形之空 間。 工 由上得知，藉由本發明散熱模組之導熱膠體5的結 構設計，可確保該溫度感測元件4具有較佳之溫度感測功 能’·再者，更有利於該溫度感測元件4、導熱膠體5及座 體Π彼此之間王現密合貼接狀態，以達到提升組裝便 性之功效。 雖然本發明已利用上述較佳實施例揭示，然其並非 ==本發明’任何熟習此技藝者在不脫離本發明之精 神和範圍之内’相對上述實施例進行各種更動與修改仍屬 本發明所保護之技術㈣，因此本侧之保護範圍當視後 1377334 附之申請專利範圍所界定者為準。 1377334 【圖式簡單說明】 第1圖：習知散熱模組之組合剖視圖。 第2圖：習知散熱模組之局部放大圖。 第3圖：本發明散熱模組之立體分解圖。 第4圖：本發明散熱模組之組合剖視圖。 第5圖：本發明散熱模組於組裝前之局部放大圖。 第6圖：本發明散熱模組於組裝後之局部放大圖。 第7圖：本發明散熱模組另一實施方式之組合剖視圖 (一）。 第8圖.本發明散熱模組另一實施方式之組合剖視圖 【主要元件符號說明】 〔本發明〕 1 散熱瘡 n座體 111 第一表面 112第二表面 12 外環部 Λ ώ 面 13 鰭'片 14結合孔 15 容置空間 2 散熱風扇 21基座 211 支撐肋 212穿孔 213 缺口 22 軸接部 23 線圈組 —12 —4 and 4, the road plate 31 of the control module 3 of the heat dissipation module of the present invention can be directly coupled to the base 21 of the heat dissipation fan 2 to improve the combination stability of the control assembly 3; When the circuit board and the base 21 are coupled to each other, the first electrical connection 312 is preferably facing the first surface of the base 11 to facilitate the second electrical connection 41 of the temperature sensing component 4. The first electrical connection is electrically connected to the itch 312.堉多照弟闯r/y不十私a The module of the control module 3 of the heating module 3 and the base 21 of the cooling fan 2 can be a body-formed knot & It is used for the circuit board 3!, or the circuit board 31 to simplify the structural complexity of the heat dissipation module and improve assembly convenience. _ ^ 4 'When the circuit board 31 of the heat sink module is directly connected to the base 21, the base 21 is preferably provided with a notch 213 (or can be replaced by a through hole), and the circuit board 3i is smashed and electrically The temperature sensing component 1377334 4 of the sexually connected first-new junction port 31 is aligned with the notch 213 so that the thermal conductive paste 5 can be smoothly attached to the seat body u of the heat sink 1 through the defect D 213; As shown in FIG. 5, the notch 213 has a function of aligning the temperature sensing element 4 and the thermal conductive paste 5 to improve the assembly convenience of the heat dissipation module. Alternatively, as shown in FIG. 8, when the circuit board 31 of the heat dissipation module of the present invention is directly coupled to the base 21, the maximum outer diameter (D1) of the base 21 is preferably smaller than the maximum outer diameter of the circuit board 31. (D2), the temperature sensing element 4 and the thermal conductive paste 5 are located opposite to the outer periphery of the circuit board 31, whereby the thermal conductive adhesive body 5 can be smoothly attached without the provision of the above-mentioned notch 213. Connected to the base U of the heat sink 1. Referring to Figures 3 and 4 again, when the convex surface 121 of the heat sink 1 of the heat dissipation module of the present invention has a height difference from the first surface, and the support ribs 211 of the base 21 are combined with the heat sink When the convex surface ΐ2 is ι, a gap can be formed between the pedestal 21 and the base U, and the gap can accommodate the heat-conductive lining 5 as a space for elastic deformation of the guiding body 5. It is known that the structural design of the thermal conductive gel 5 of the heat dissipation module of the present invention can ensure that the temperature sensing component 4 has a better temperature sensing function. Further, the temperature sensing component 4 is more advantageous. The thermal conductive gel 5 and the seat body are in close contact with each other to achieve the effect of improving assembly convenience. Although the present invention has been disclosed in the above-described preferred embodiments, it is not intended to be a part of the present invention. It is to be understood that the present invention may be practiced without departing from the spirit and scope of the invention. The technology to be protected (4), therefore, the scope of protection of this side is subject to the definition of the patent application scope of 1377334. 1377334 [Simple description of the diagram] Figure 1: A cross-sectional view of a conventional heat dissipation module. Figure 2: A partial enlarged view of a conventional heat dissipation module. Figure 3: An exploded perspective view of the heat dissipation module of the present invention. Figure 4 is a cross-sectional view showing the combination of the heat dissipation module of the present invention. Fig. 5 is a partial enlarged view of the heat dissipation module of the present invention before assembly. Figure 6 is a partial enlarged view of the heat dissipation module of the present invention after assembly. Figure 7 is a cross-sectional view showing a combination of another embodiment of the heat dissipation module of the present invention (1). Figure 8 is a cross-sectional view showing another embodiment of the heat dissipating module of the present invention. [Main component symbol description] [Invention] 1 heat soak n seat 111 first surface 112 second surface 12 outer ring portion ώ face 13 fin ' Sheet 14 joint hole 15 accommodating space 2 heat sink fan 21 base 211 support rib 212 through hole 213 notch 22 shaft joint portion 23 coil group - 12 -