CN105005367A - Mainboard heat dissipation structure and mobile terminal - Google Patents
Mainboard heat dissipation structure and mobile terminal Download PDFInfo
- Publication number
- CN105005367A CN105005367A CN201510412647.XA CN201510412647A CN105005367A CN 105005367 A CN105005367 A CN 105005367A CN 201510412647 A CN201510412647 A CN 201510412647A CN 105005367 A CN105005367 A CN 105005367A
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- heat
- heat pipe
- cpu
- heat dissipation
- radiation structure
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a mainboard heat dissipation structure, which comprises a fixed support, wherein a main heat dissipation zone used for controlling the temperature rise of a CPU (Central Processing Unit) is arranged in the fixed support; the CPU and the main heat dissipation zone are in heat conduction connection through a heat pipe; one end of the heat pipe is connected with the CPU; one end, which is far away from the CPU, of the heat pipe is positioned in the main heat dissipation zone; the part, which is positioned in the main heat dissipation zone, of the heat pipe is provided with heat dissipation fins used for increasing a heat conduction area; and the heat dissipation fins are inserted into the fixed support. The invention also discloses a mobile terminal provided with the mainboard heat dissipation structure. In the scheme, the mainboard heat dissipation structure is provided with the heat pipe connected with the CPU, so that heat generated when the CPU works can be quickly transmitted to the main heat dissipation zone, the continuous and quick heat dissipation of the CPU is realized, and the heat dissipation fins inserted into the fixed support are arranged on the heat pipe to enlarge the heat conduction area between the heat pipe and the main heat dissipation zone so as to quicken efficiency for heat to be transmitted to the main heat dissipation zone from the heat pipe.
Description
Technical field
The present invention relates to heat dissipation of terminal technical field, particularly relate to a kind of mainboard radiation structure and mobile terminal, further, relate to a kind of mainboard radiation structure and mobile phone.
Background technology
The rhythm of life of modern society people is more and more faster, and interpersonal communication is also more and more closely with frequent, and people are very strong for the dependence of communication facilities.Wherein, mobile phone is one of most widely used communication terminal, and the feature such as light with it, simple to operate and complete function of mobile phone obtains the favor of people and popularizes comprehensively.Mobile phone is mobile terminal, and size is less, but the demand of people to the function of mobile phone and processing power is very high, and therefore, the degree of integration of mobile phone is more and more higher, and the kernel of the CPU of mobile phone also gets more and more, and the frequency of CPU is also more and more higher simultaneously.So high frequency and performance, make the working temperature of CPU more and more higher, and the rising of the temperature of CPU will have a strong impact on its serviceability, and therefore, the efficiently radiates heat of CPU is quite important.
Except mobile phone terminal, current most of electronic product terminal is provided with the problem that high integrated and high performance CPU, the CPU in these electronic product terminals in use also need to solve heat radiation.
Based on above-mentioned situation, we are necessary the radiator structure designing a kind of efficient CPU and mainboard, to ensure the serviceability of CPU and to extend the life-span of CPU.
Summary of the invention
One object of the present invention is: provide a kind of mainboard radiation structure, and by arranging the heat pipe be connected with CPU, the heat produced when CPU is worked is passed to main radiating area fast, realizes the heat radiation continuously and healthily of CPU, effectively reduces the working temperature of CPU.
One object of the present invention is: provide a kind of mainboard radiation structure, by arranging the radiating fin inserted in fixed support on heat pipe, increase the heat-conducting area between heat pipe and main radiating area, accelerate the efficiency that heat transmits to main radiating area from heat pipe, effectively ensure the radiating efficiency of CPU.
One object of the present invention is: provide a kind of mainboard radiation structure, by arranging the heat-conducting connecting consistent with CPU end surface shape on heat pipe, increase the heat-conducting area between heat pipe and CPU, accelerate the efficiency that heat transmits from CPU to heat pipe, effectively ensure the radiating efficiency of CPU.
One object of the present invention is: provide a kind of mobile terminal, by arranging the mainboard radiation structure with heat pipe in mobile terminal, effectively improving the radiating efficiency of CPU, ensureing the lasting reliability service of mobile terminal.
For reaching this object, the present invention by the following technical solutions:
A kind of mainboard radiation structure, comprise fixed support, the main radiating area for control CPU temperature rise is provided with in described fixed support, be connected by heat pipe for thermal conductivity between described CPU with described main radiating area, one end of described heat pipe is connected with described CPU, described heat pipe is positioned at described main radiating area away from one end of described CPU, and the part that described heat pipe is positioned at described main radiating area is provided with the radiating fin for increasing heat-conducting area, and described radiating fin inserts in described fixed support.
A kind of mobile terminal, comprises above-mentioned mainboard radiation structure.
Beneficial effect of the present invention is:
(1) provide a kind of mainboard radiation structure, by arranging the heat pipe be connected with CPU, the heat produced when CPU is worked is passed to main radiating area fast, realizes the heat radiation continuously and healthily of CPU, effectively reduces the working temperature of CPU.
(2) a kind of mainboard radiation structure is provided, by arranging the radiating fin inserted in fixed support on heat pipe, increase the heat-conducting area between heat pipe and main radiating area, accelerate the efficiency that heat transmits to main radiating area from heat pipe, effectively ensure the radiating efficiency of CPU.
(3) provide a kind of mobile terminal, by arranging the mainboard radiation structure with heat pipe in mobile terminal, effectively improving the radiating efficiency of CPU, ensureing the lasting reliability service of mobile terminal.
Accompanying drawing explanation
According to drawings and embodiments the present invention is described in further detail below.
The positional structure schematic diagram that Fig. 1 is the fixed support described in embodiment and CPU;
Fig. 2 for the fixed support described in embodiment and heat pipe assemble after schematic diagram;
Fig. 3 for the fixed support described in embodiment and nano-sized carbon heat dissipation film assemble after schematic diagram;
Fig. 4 for the heat pipe described in embodiment and heat-conducting connecting assemble after structural representation.
In Fig. 1 to Fig. 4:
1, center; 2, sheet metal; 3, standing groove; 4, the first fin groove; 5, CPU; 6, heat pipe; 7, radiating fin; 8, heat-conducting connecting; 9, nano-sized carbon heat dissipation film.
Embodiment
Technical scheme of the present invention is further illustrated by embodiment below in conjunction with accompanying drawing.
As shown in figures 1-4, in the present embodiment, on the one hand, a kind of mainboard radiation structure, comprise fixed support, the main radiating area for control CPU5 temperature rise is provided with in described fixed support, be connected by heat pipe 6 heat conduction between described CPU5 with described main radiating area, one end of described heat pipe 6 is connected with described CPU5, described heat pipe 6 is positioned at described main radiating area away from one end of described CPU5, the part that described heat pipe 6 is positioned at described main radiating area is provided with the radiating fin 7 for increasing heat-conducting area, and described radiating fin 7 inserts in described fixed support.
Heat pipe 6 is a kind of heat transfer elements, and it takes full advantage of the Rapid Thermal hereditary property of heat-conduction principle and phase change medium, is delivered to rapidly outside thermal source by the heat of thermal objects through heat pipe 6, and its capacity of heat transmission exceedes the capacity of heat transmission of any known metal.Heat pipe 6 can adopt core heat pipe, two-phase closed type hot siphon (also known as gravity assisted heat pipe), gravity auxiliary heat pipe, rotating heat pipe, electrohydrodynamic heat pipe, magneto hydrodynamic heat pipe, infiltration heat pipe in any one.In the present embodiment, described heat pipe 6 is electrohydrodynamic heat pipes.This electrohydrodynamic heat pipe has very high thermal conductivity and excellent isothermal, effectively can ensure that the heat fast and reliable of CPU5 is outwards transmitted.
Current mobile terminal only can arrange radiator structure for PCB substantially, namely the heat produced during CPU5 work must be passed to radiator structure by PCB and realize heat radiation, because PCB does not possess excellent heat conductivility, therefore the radiating efficiency of CPU5 is lower, CPU5 is easily in higher working temperature, thus the serviceability affecting CPU5 even shortens the life-span of CPU5, greatly reduces the reliability of mobile terminal.The present embodiment is by arranging heat pipe 6, CPU5 is connected with the direct heat conduction in main radiating area, because heat pipe 6 possesses splendid heat transfer efficiency, therefore the radiating efficiency of CPU5 is very high, effective CPU5 of guarantee continues to be in lower working temperature, thus improve serviceability and the reliability of CPU5, and effectively extend the serviceable life of CPU5.In addition, the one-piece construction of heat pipe 6 is less, therefore the heat-conducting area between heat pipe 6 and described main radiating area is also less, have impact on the heat transfer efficiency between heat pipe 6 and described main radiating area to a certain extent, the present embodiment by arranging the radiating fin 7 inserted in fixed support on heat pipe 6, increase the heat-conducting area between heat pipe 6 and main radiating area, accelerate the efficiency that heat transmits to main radiating area from heat pipe 6, effectively ensure the radiating efficiency of CPU5.
Described heat pipe 6 is provided with the heat-conducting connecting 8 of fitting with CPU5 surface near one end of described CPU5.
Described heat-conducting connecting 8 is copper sheets or aluminium flake that shape is consistent with described CPU5 end surface shape, and one end of described heat-conducting connecting 8 is welded with described heat pipe 6, and the other end of described heat-conducting connecting 8 is connected by heat-conducting glue with described CPU5 end face.In the present embodiment, described CPU5 end face is rectangle, and described heat-conducting connecting 8 is also rectangle, and described heat-conducting connecting 8 is copper sheets.In other embodiment, described CPU5 can be circular, and described heat-conducting connecting 8 is circular, and described heat-conducting connecting 8 is aluminium flakes.
Described heat-conducting glue has excellent heat conductivility, can provide the high coefficient of heat transfer ensured for components and parts, for components and parts in use stable of large thermal value plays guaranteeing role, improves usability and the life-span of components and parts; Described heat-conducting glue also has superior electrical resistance, ageing-resistant, cold-and-heat resistent alternation performance, adds mobile terminal safety coefficient in use.Described heat-conducting glue adopts organosilicon heat-conducting glue, epoxide resin AB glue, polyurethane adhesive, any one in polyurethane guide hot glue.In the present embodiment, described heat-conducting glue is organosilicon heat-conducting glue.
The present embodiment by arranging the heat-conducting connecting 8 consistent with CPU5 end surface shape on heat pipe 6, and heat-conducting connecting 8 and described CPU5 end face are fitted, what take full advantage of CPU5 can thermal conductivity region, thus the heat-conducting area increased between heat pipe 6 and CPU5, accelerate the efficiency that heat transmits from CPU5 to heat pipe 6.But described heat-conducting connecting 8 is harder materials, even if therefore the surface of described heat-conducting connecting 8 is very smooth, still can there is gap between described heat-conducting connecting 8 and described CPU5 end face, thus affect the heat transfer efficiency of described CPU5 and described heat pipe 6.Based on above-mentioned situation, the present embodiment arranges described heat-conducting glue between described heat-conducting connecting 8 and described CPU5 end face, for fully filling the gap between described heat-conducting connecting 8 and described CPU5 end face, make described heat-conducting connecting 8 and the abundant heat conduction of described CPU5 end face, thus effectively improve the radiating efficiency of described CPU5.
The sheet metal 2 that described fixed support comprises center 1 and is arranged on inside described center 1, described sheet metal 2 part is positioned at described main radiating area.
In the present embodiment, described CPU5 be inserted into be provided with central processing unit interface PCB on, described PCB and described CPU5 forms the mainboard of mobile terminal, and described PCB is arranged on the side of described sheet metal 2.Because described sheet metal 2 is positioned at the side of described PCB, therefore, the heat of described PCB can be dispelled the heat by described sheet metal 2, in addition, described CPU5 is connected with described sheet metal 2 is realized dispelling the heat by described heat pipe 6, make the mainboard of mobile terminal be connected with described sheet metal 2 by two passages of heat and realize dispelling the heat, add approach and the heat transfer efficiency of heat conduction, thus effectively improve the radiating efficiency of mainboard.
Described center 1 offers the standing groove 3 for installing described heat pipe 6, the corresponding described standing groove 3 of described sheet metal 2 offers mouth of stepping down.
In the present embodiment, described standing groove 3 comprises and is positioned at described center 1 side and the straight-line groove parallel with the side of described center 1, and the deep-slotted chip breaker between described direct groove and described CPU5, and described straight-line groove is positioned at described main radiating area.The corresponding described standing groove 3 of described heat pipe 6 is provided with rectilinear tubes and curved pipe, and described radiating fin 7 is arranged in described rectilinear tubes.
By offering described standing groove 3 in described center 1, described heat pipe 6 can be inlaid in described center 1, make the structure of described center 1 compacter, shorten the heat conduction distance of CPU5, and be conducive to the thickness realizing thinning mobile terminal.
Described standing groove 3 radially stretches out and offers some first fin grooves 4, and on described sheet metal 2 and the both sides of mouth of stepping down described in being positioned at offer some second fin grooves, described radiating fin 7 is inlaid in described first fin groove 4 and described second fin groove.
By described radiating fin 7 being inlaid in described first fin groove 4 and described second fin groove, make described radiating fin 7 and described center 1 and described sheet metal 2 close contact, simultaneously, described heat pipe 6 is inlaid in described standing groove 3, described heat pipe 6 is directly contacted with described sheet metal 2 with described center 1, thus realize two approach transferring heat, improve the radiating efficiency of mainboard.
Described radiating fin 7 is connected with described center 1 and described sheet metal 2 by heat-conducting glue.Described heat-conducting glue adopts organosilicon heat-conducting glue, epoxide resin AB glue, polyurethane adhesive, any one in polyurethane guide hot glue.In the present embodiment, described heat-conducting glue is organosilicon heat-conducting glue.Described radiating fin 7 is harder materials, even if therefore the surface of described radiating fin 7 is very smooth, still can there is gap between described radiating fin 7 and described center 1, described sheet metal 2, thus affect the heat transfer efficiency of described heat pipe 6 and described center 1, described sheet metal 2.Based on above-mentioned situation, the present embodiment arranges heat-conducting glue between described radiating fin 7 and described center 1, described sheet metal 2, for fully filling described radiating fin 7 and the gap between described center 1 and described sheet metal 2, make described heat pipe 6 and described center 1 and described sheet metal 2 fully heat conduction, thus effectively improve the radiating efficiency of described CPU5.
Described radiating fin 7 adopts the ring segment being arranged on described heat pipe 6 perimembranous, and some described ring segments are arranged along the axial direction gap of described heat pipe 6, and described radiating fin 7 is fixed by welding on described heat pipe 6.In the present embodiment, described radiating fin 7 is along the axial direction spaced set of described heat pipe 6.
Described main radiating area is provided with electrographite heat dissipation film or nano-sized carbon heat dissipation film 9.This electrographite heat dissipation film or nano-sized carbon heat dissipation film 9 are the main materials making heat radiator, possess excellent heat dispersion, can improve the radiating efficiency of described main radiating area.In the present embodiment, described main radiating area is provided with nano-sized carbon heat dissipation film 9, and this nano-sized carbon heat dissipation film 9 is pasted onto the side of described sheet metal 2.
On the other hand, a kind of mobile terminal, comprises above-mentioned mainboard radiation structure.This mobile terminal also comprises the front frame and after-frame that are separately positioned on described center 1 both sides, and described front frame, center 1 and after-frame surround one for installing the installing space of internal component.By arranging the mainboard radiation structure with heat pipe 6 in mobile terminal, effectively improving the radiating efficiency of CPU5, ensureing the lasting reliability service of mobile terminal.
" first ", " second " is herein only used to be distinguished in description, not special implication.
It is to be understood that; above-mentioned embodiment is only preferred embodiment of the present invention and institute's application technology principle; in technical scope disclosed in this invention, the change that any those skilled in the art of being familiar with easily expect or replacement, all should be encompassed in protection scope of the present invention.
Claims (10)
1. a mainboard radiation structure, it is characterized in that, comprise fixed support, the main radiating area for control CPU temperature rise is provided with in described fixed support, be connected by heat pipe for thermal conductivity between described CPU with described main radiating area, one end of described heat pipe is connected with described CPU, described heat pipe is positioned at described main radiating area away from one end of described CPU, the part that described heat pipe is positioned at described main radiating area is provided with the radiating fin for increasing heat-conducting area, and described radiating fin inserts in described fixed support.
2. a kind of mainboard radiation structure according to claim 1, is characterized in that, described heat pipe is provided with the heat-conducting connecting of fitting with CPU surface near one end of described CPU.
3. a kind of mainboard radiation structure according to claim 2, is characterized in that, described fixed support comprises center and is arranged on the sheet metal inside described center, and described metal plate sections is positioned at described main radiating area.
4. a kind of mainboard radiation structure according to claim 3, is characterized in that, described center offers the standing groove for installing described heat pipe, and the corresponding described standing groove of described sheet metal offers mouth of stepping down.
5. a kind of mainboard radiation structure according to claim 4, it is characterized in that, described standing groove radially stretches out and offers some first fin grooves, on described sheet metal and the both sides of mouth of stepping down described in being positioned at offer some second fin grooves, described radiating fin is inlaid in described first fin groove and described second fin groove.
6. a kind of mainboard radiation structure according to any one of claim 3 to 5, is characterized in that, described radiating fin is connected with described center and described sheet metal by heat-conducting glue.
7. a kind of mainboard radiation structure according to any one of claim 2 to 5, it is characterized in that, described heat-conducting connecting is the copper sheet or aluminium flake that shape is consistent with described CPU end surface shape, one end of described heat-conducting connecting is welded with described heat pipe, and the other end of described heat-conducting connecting is connected by heat-conducting glue with described CPU end face.
8. a kind of mainboard radiation structure according to any one of claim 1 to 5, it is characterized in that, described radiating fin adopts the ring segment being arranged on described heat pipe perimembranous, some described ring segments are arranged along the axial direction gap of described heat pipe, and described radiating fin is fixed by welding on described heat pipe.
9. a kind of mainboard radiation structure according to any one of claim 1 to 5, is characterized in that, described main radiating area is provided with electrographite heat dissipation film or nano-sized carbon heat dissipation film.
10. a mobile terminal, is characterized in that, comprises the mainboard radiation structure described in any one of claim 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510412647.XA CN105005367A (en) | 2015-07-14 | 2015-07-14 | Mainboard heat dissipation structure and mobile terminal |
| PCT/CN2016/081490 WO2017008559A1 (en) | 2015-07-14 | 2016-05-10 | Mainboard heat dissipation structure and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510412647.XA CN105005367A (en) | 2015-07-14 | 2015-07-14 | Mainboard heat dissipation structure and mobile terminal |
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| CN105005367A true CN105005367A (en) | 2015-10-28 |
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| CN201510412647.XA Pending CN105005367A (en) | 2015-07-14 | 2015-07-14 | Mainboard heat dissipation structure and mobile terminal |
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| CN (1) | CN105005367A (en) |
| WO (1) | WO2017008559A1 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105955428A (en) * | 2015-12-23 | 2016-09-21 | 天津科企融生产力促进有限公司 | Heat conduction and dissipation device for computers |
| CN106026328A (en) * | 2016-05-27 | 2016-10-12 | 广东欧珀移动通信有限公司 | Charging method and device for terminal and terminal |
| WO2017008559A1 (en) * | 2015-07-14 | 2017-01-19 | 广东欧珀移动通信有限公司 | Mainboard heat dissipation structure and mobile terminal |
| CN106441313A (en) * | 2016-08-31 | 2017-02-22 | 江苏艾倍科科技股份有限公司 | Big dipper double-module vehicle-mounted integrated terminal support |
| WO2017185603A1 (en) * | 2016-04-26 | 2017-11-02 | 乐视控股（北京）有限公司 | Electric appliance |
| CN108762443A (en) * | 2018-05-24 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of T-type radiator applied to computer |
| CN110073649A (en) * | 2016-12-07 | 2019-07-30 | Lg电子株式会社 | Mobile terminal |
| CN115087295A (en) * | 2021-03-12 | 2022-09-20 | 北京小米移动软件有限公司 | Middle frame assembly, manufacturing method of middle frame assembly and mobile terminal |
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| CN113618189B (en) * | 2021-08-02 | 2022-09-20 | 深圳市格安电子有限公司 | Numerical control unit floating isolation type directional airflow heat dissipation PCBA automatic tin soldering equipment |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201252095Y (en) * | 2008-09-09 | 2009-06-03 | 昆山迪生电子有限公司 | Heat conduction structure for the compression joint of a CPU and a heat pipe of a notebook |
| CN102623417A (en) * | 2011-01-26 | 2012-08-01 | 伍战中 | High efficiency computer motherboard heat sink |
| CN104635867A (en) * | 2015-02-15 | 2015-05-20 | 无锡市崇安区科技创业服务中心 | Notebook computer framework capable of controlling temperature intelligently |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7698815B2 (en) * | 2003-04-14 | 2010-04-20 | Thermal Corp. | Method for forming a heat dissipation device |
| CN100345289C (en) * | 2004-04-08 | 2007-10-24 | 广达电脑股份有限公司 | Hot-piping radiator |
| CN201886399U (en) * | 2010-11-11 | 2011-06-29 | 青岛科技大学 | Nano heat pipe type radiator for CPU (central processing unit) of laptop |
| CN201935144U (en) * | 2010-11-16 | 2011-08-17 | 浙江新强照明科技有限公司 | Heat dissipation structure of high power LED lamp |
| CN201965529U (en) * | 2011-03-14 | 2011-09-07 | 上海大学 | Mobile internet device heat abstractor |
| CN203689339U (en) * | 2013-12-08 | 2014-07-02 | 重庆侨成科技发展有限公司 | Laptop CPU radiating module with firmly fixed heat pipes |
| CN105005367A (en) * | 2015-07-14 | 2015-10-28 | 广东欧珀移动通信有限公司 | Mainboard heat dissipation structure and mobile terminal |
-
2015
- 2015-07-14 CN CN201510412647.XA patent/CN105005367A/en active Pending
-
2016
- 2016-05-10 WO PCT/CN2016/081490 patent/WO2017008559A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201252095Y (en) * | 2008-09-09 | 2009-06-03 | 昆山迪生电子有限公司 | Heat conduction structure for the compression joint of a CPU and a heat pipe of a notebook |
| CN102623417A (en) * | 2011-01-26 | 2012-08-01 | 伍战中 | High efficiency computer motherboard heat sink |
| CN104635867A (en) * | 2015-02-15 | 2015-05-20 | 无锡市崇安区科技创业服务中心 | Notebook computer framework capable of controlling temperature intelligently |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017008559A1 (en) * | 2015-07-14 | 2017-01-19 | 广东欧珀移动通信有限公司 | Mainboard heat dissipation structure and mobile terminal |
| CN105955428A (en) * | 2015-12-23 | 2016-09-21 | 天津科企融生产力促进有限公司 | Heat conduction and dissipation device for computers |
| WO2017185603A1 (en) * | 2016-04-26 | 2017-11-02 | 乐视控股（北京）有限公司 | Electric appliance |
| CN106026328A (en) * | 2016-05-27 | 2016-10-12 | 广东欧珀移动通信有限公司 | Charging method and device for terminal and terminal |
| CN106441313A (en) * | 2016-08-31 | 2017-02-22 | 江苏艾倍科科技股份有限公司 | Big dipper double-module vehicle-mounted integrated terminal support |
| CN110073649A (en) * | 2016-12-07 | 2019-07-30 | Lg电子株式会社 | Mobile terminal |
| CN108762443A (en) * | 2018-05-24 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of T-type radiator applied to computer |
| CN108762443B (en) * | 2018-05-24 | 2020-08-04 | 苏州浪潮智能科技有限公司 | T-shaped heat dissipation device applied to computer |
| CN115087295A (en) * | 2021-03-12 | 2022-09-20 | 北京小米移动软件有限公司 | Middle frame assembly, manufacturing method of middle frame assembly and mobile terminal |
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| Publication number | Publication date |
|---|---|
| WO2017008559A1 (en) | 2017-01-19 |
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