TWI374495B - - Google Patents
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- Publication number
- TWI374495B TWI374495B TW099130341A TW99130341A TWI374495B TW I374495 B TWI374495 B TW I374495B TW 099130341 A TW099130341 A TW 099130341A TW 99130341 A TW99130341 A TW 99130341A TW I374495 B TWI374495 B TW I374495B
- Authority
- TW
- Taiwan
- Prior art keywords
- chamber
- plasma
- gas
- substrate
- lower chamber
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 84
- 230000007246 mechanism Effects 0.000 claims description 33
- 238000001020 plasma etching Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000002002 slurry Substances 0.000 claims description 2
- 238000010892 electric spark Methods 0.000 claims 1
- 238000007689 inspection Methods 0.000 claims 1
- 238000005192 partition Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 description 69
- 150000002500 ions Chemical class 0.000 description 49
- 150000003254 radicals Chemical class 0.000 description 39
- 238000005530 etching Methods 0.000 description 31
- 230000002093 peripheral effect Effects 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 238000005513 bias potential Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 239000012773 agricultural material Substances 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010616 electrical installation Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000009304 pastoral farming Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32422—Arrangement for selecting ions or species in the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32357—Generation remote from the workpiece, e.g. down-stream
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009212727A JP4855506B2 (ja) | 2009-09-15 | 2009-09-15 | プラズマエッチング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201110229A TW201110229A (en) | 2011-03-16 |
| TWI374495B true TWI374495B (enExample) | 2012-10-11 |
Family
ID=43758463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099130341A TW201110229A (en) | 2009-09-15 | 2010-09-08 | Plasma etching apparatus |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20110303365A1 (enExample) |
| EP (1) | EP2479781B1 (enExample) |
| JP (1) | JP4855506B2 (enExample) |
| KR (1) | KR101224143B1 (enExample) |
| CN (1) | CN102318043B (enExample) |
| TW (1) | TW201110229A (enExample) |
| WO (1) | WO2011033850A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9111729B2 (en) | 2009-12-03 | 2015-08-18 | Lam Research Corporation | Small plasma chamber systems and methods |
| US9449793B2 (en) | 2010-08-06 | 2016-09-20 | Lam Research Corporation | Systems, methods and apparatus for choked flow element extraction |
| US9967965B2 (en) | 2010-08-06 | 2018-05-08 | Lam Research Corporation | Distributed, concentric multi-zone plasma source systems, methods and apparatus |
| US10283325B2 (en) | 2012-10-10 | 2019-05-07 | Lam Research Corporation | Distributed multi-zone plasma source systems, methods and apparatus |
| KR101495288B1 (ko) * | 2012-06-04 | 2015-02-24 | 피에스케이 주식회사 | 기판 처리 장치 및 방법 |
| GB201309583D0 (en) * | 2013-05-29 | 2013-07-10 | Spts Technologies Ltd | Apparatus for processing a semiconductor workpiece |
| CN104241070A (zh) * | 2013-06-24 | 2014-12-24 | 中微半导体设备(上海)有限公司 | 用于感应耦合等离子体腔室的气体注入装置 |
| CN105336559B (zh) * | 2014-08-14 | 2018-01-09 | 北京北方华创微电子装备有限公司 | 一种反应腔室及半导体加工设备 |
| KR101680850B1 (ko) * | 2016-06-28 | 2016-11-29 | 주식회사 기가레인 | 배기유로의 크기가 조절되는 플라즈마 처리 장치 |
| CN108155080A (zh) * | 2016-12-02 | 2018-06-12 | 北京北方华创微电子装备有限公司 | 等离子体产生装置及包括该装置的半导体设备 |
| KR102070544B1 (ko) * | 2019-04-17 | 2020-01-29 | 주식회사 기가레인 | 플라즈마 안테나 및 이를 포함하는 플라즈마 처리장치 |
| JP6909824B2 (ja) * | 2019-05-17 | 2021-07-28 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、半導体装置の製造方法及びプログラム |
| KR102498696B1 (ko) * | 2019-12-23 | 2023-02-13 | 주식회사 히타치하이테크 | 플라스마 처리 장치 |
| CN111508802B (zh) * | 2020-04-22 | 2023-10-13 | 北京北方华创微电子装备有限公司 | 反应腔室及其刻蚀方法 |
| US11521834B2 (en) | 2020-08-26 | 2022-12-06 | Tokyo Electron Limited | Plasma processing systems and methods for chemical processing a substrate |
| US12131888B2 (en) | 2020-08-31 | 2024-10-29 | Tokyo Electron Limited | Gas cluster assisted plasma processing |
| CN119943711B (zh) * | 2024-12-25 | 2025-10-17 | 启东新微智造科技有限公司 | 一种集成光电子器件制造的蚀刻机构 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3267690B2 (ja) * | 1992-09-22 | 2002-03-18 | マツダ株式会社 | エアバッグ装置 |
| JPH08107101A (ja) * | 1994-10-03 | 1996-04-23 | Fujitsu Ltd | プラズマ処理装置及びプラズマ処理方法 |
| JPH08186095A (ja) * | 1994-12-28 | 1996-07-16 | Kawasaki Steel Corp | コンタクトホールの形成方法およびエッチング装置 |
| US6352049B1 (en) * | 1998-02-09 | 2002-03-05 | Applied Materials, Inc. | Plasma assisted processing chamber with separate control of species density |
| US6203657B1 (en) * | 1998-03-31 | 2001-03-20 | Lam Research Corporation | Inductively coupled plasma downstream strip module |
| WO2000036631A1 (en) * | 1998-12-11 | 2000-06-22 | Surface Technology Systems Limited | Plasma processing apparatus |
| DE10024883A1 (de) * | 2000-05-19 | 2001-11-29 | Bosch Gmbh Robert | Plasmaätzanlage |
| US20020185226A1 (en) * | 2000-08-10 | 2002-12-12 | Lea Leslie Michael | Plasma processing apparatus |
| JP2008028022A (ja) * | 2006-07-19 | 2008-02-07 | Tokyo Electron Ltd | プラズマエッチング方法およびコンピュータ読取可能な記憶媒体 |
| KR100963287B1 (ko) * | 2008-02-22 | 2010-06-11 | 주식회사 유진테크 | 기판처리장치 및 기판처리방법 |
-
2009
- 2009-09-15 JP JP2009212727A patent/JP4855506B2/ja active Active
-
2010
- 2010-07-16 EP EP10816963.2A patent/EP2479781B1/en active Active
- 2010-07-16 US US13/203,191 patent/US20110303365A1/en not_active Abandoned
- 2010-07-16 WO PCT/JP2010/062035 patent/WO2011033850A1/ja not_active Ceased
- 2010-07-16 CN CN201080007916.XA patent/CN102318043B/zh active Active
- 2010-07-16 KR KR1020117018564A patent/KR101224143B1/ko active Active
- 2010-09-08 TW TW099130341A patent/TW201110229A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP2479781A4 (en) | 2012-08-29 |
| CN102318043A (zh) | 2012-01-11 |
| KR20120022705A (ko) | 2012-03-12 |
| EP2479781B1 (en) | 2014-05-14 |
| TW201110229A (en) | 2011-03-16 |
| EP2479781A1 (en) | 2012-07-25 |
| US20110303365A1 (en) | 2011-12-15 |
| JP4855506B2 (ja) | 2012-01-18 |
| JP2011066033A (ja) | 2011-03-31 |
| WO2011033850A1 (ja) | 2011-03-24 |
| CN102318043B (zh) | 2014-11-05 |
| KR101224143B1 (ko) | 2013-01-21 |
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