1374199 九、發明說明： 【發明所屬之技術領域】 本發明關於在「通過設備」（連續設備） (Durchlaufanlange )中將平坦物作無接觸式水平運送以作 運送及處理的方法與裝置。本發明宜用於將電路板與導體 膜（Leiterfolie，英：conductor film)作濕化學式及電解 貝式的處理，它們也可以極薄。舉例而言，這些處理，在 電路板技術的場合，係關於表面的清洗與刻蝕、將鑽孔屑 (Bohrmehl )從孔除去‘’將孔壁鍍金屬變貫通接點 (Dinxhkantaktierung )、將導電層及構造作電解而補強（加 粗加厚），將該導電路（Leiterbahn )顯影、定影（stripptn ) (除去未感光之感光漆部分）及刻蝕，以及將表面氧化及 還原、以及其他程序〇在細電路板的場合，其構造與孔的 尺寸越做越小。這種導線路與其距離可達25μιη或更小的 範圍。舉例而言，在起始層的場合，在表面的銅層厚度為 4μιη。這表示，這種全面鍍了很薄的銅的表面要極小心地 操作。在實用上，電路板與導體膜係用運送滾子運送通過 該通過設備。在此，雜質會呈粒子形式被滾壓或壓入到該 易受損的表面中’造成沈積或凹陷部。即使這種沈積或凹 陷很小，但在電路板的進一步製程時會造成細導線構造中 的瑕疵位置，因此變成廢料，該整面的電路板做成貫通接 點之後，將電路圖形做上去，為此將一種不導電之對光敏 感的感光漆（Galvanoresist )塗到該平坦物的整面上。這 这種感光漆用光罩作構造化（Strukturieren )、曝光、顯 1374199 景> 及疋影。此電路圖形在另一道程序作電鍍加粗加厚◊被 感光漆遮蓋的區域在此程序時須保持未處理。感光漆中的 構造的尺寸比所要製造的電路圖形來顯得很小，這種作了 構造化的感光漆對機械應力很敏感。在感光漆上滾動的「運 送滾子」會傷害該構造。因此在細導線技術的場合，所要 處理的平坦物須作無接觸式的運送，至少要避免運送滾子 在該年坦物的使用區域上滚動，或導引元件在其上滑動的 情事。相反地，該一般很大的使用部分（Nutze)的邊緣則 不重要，匕們在電路板製成後被切掉並丟棄。 在運送導體膜時（當其厚度在5 Ομιη範圍或更小時具 有门度可撓f生），則難度更高：該表面被電解質流過，會 ，它從，送路徑偏轉出纟。如此，表面會在導引元件上； 損在最嚴重的情形會造成運送堵塞的情事，但是導體膜 用電解質流過的作紫只e v f , ^ 幻作業乃疋必需者，俾當要在相同的「通過 认備」中生產電路板時，其孔中可作良好的物質交換。 【先前技術】 文獻德專利DE 102 〇6 660 C1提到一種在通過裝置中 將所處理的平坦物運 —運k的裝置與方法。運送作業利用不會 才貝极平坦物表面的運 連k滾子達成。為此，一個上運送滾子 及—個下運送滚子疗娃 #地且互相錯開地排列，且具有稍微 + Η的直程。如，μ_ — — ，溥而可撓的平坦物可閃避過滚子的壓 固麸：Γ又保護免受損壞。在厚及剛性的電路板的場合，1374199 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a method and apparatus for transporting and processing flat articles in a "passing device" (continuous equipment) (Durchlaufanlange) for contactless horizontal transport. The present invention is preferably used for the treatment of a circuit board and a conductor film (Leiterfolie, conductive film) as a wet chemical type and an electrolytic type, which can also be extremely thin. For example, in the case of circuit board technology, these processes are related to the cleaning and etching of the surface, removing the drilling debris (Bohrmehl) from the hole, and changing the metallization of the hole wall to the contact point, which will conduct electricity. The layer and structure are electrolyzed to reinforce (bold thickening), the conductive circuit (Leiterbahn) is developed, stripptn (removing the unsensitized lacquer portion) and etching, and the surface is oxidized and reduced, and other procedures In the case of a thin circuit board, the structure and the size of the hole are made smaller. Such a guide line can be in a range of up to 25 μm or less. For example, in the case of the starting layer, the thickness of the copper layer on the surface is 4 μm. This means that the surface of this fully plated copper is handled with extreme care. Practically, the circuit board and the conductor film are transported through the passing device by means of a transport roller. Here, the impurities may be rolled or pressed into the easily damaged surface in the form of particles, causing deposits or depressions. Even if such deposition or dishing is small, in the further process of the circuit board, the position of the crucible in the structure of the thin wire is caused, so that it becomes waste material, and after the entire circuit board is made to pass through the joint, the circuit pattern is made up. To this end, a non-conductive, light-sensitive lacquer (Galvanoresist) is applied to the entire surface of the flat. This varnish is structured with a reticle, exposed, exposed, and smeared. This circuit pattern shall be left untreated in this program when it is plated thick and thickened by another procedure. The size of the construction in the varnish is small compared to the circuit pattern to be fabricated. This structured lacquer is sensitive to mechanical stress. The "transport roller" that rolls on the varnish will damage the structure. Therefore, in the case of thin wire technology, the flat to be treated must be transported in a contactless manner, at least to avoid rolling of the rollers over the area of use of the object during the year, or the fact that the guiding member slides thereon. Conversely, the edge of the generally large portion of the Nutze is not important, they are cut and discarded after the board is made. It is more difficult to transport the conductor film (when its thickness is in the range of 5 Ομηη or less), the difficulty is higher: the surface is flown by the electrolyte, and it is deflected from the delivery path. In this way, the surface will be on the guiding element; the damage will cause the transportation jam in the most serious situation, but the conductive film flows through the electrolyte only for the purple evf, ^ illusion operation is necessary, jingle to be in the same When producing a circuit board in "Approval", a good material exchange can be made in the hole. [Prior Art] The document DE 102 〇 6 660 C1 refers to a device and method for transporting processed flats in a passing device. The transport operation is achieved using a transport k-roller that does not surface the flat surface of the shell. To this end, an upper transport roller and a lower transport roller are placed in a staggered arrangement with a slight + 直 straight stroke. For example, μ_ — — , a sturdy, flat material that evades the roller's compacted bra: it protects against damage. In the case of thick and rigid boards,
的比糾a 2置的比例可減少，也因此使可能有瑕疫的位置 的比例也減少，作饰T * A H 部不再能閃避過滾子壓力β 文獻德專利DP j 40 3 5932 C2提到在一濕化學設備中將 1374199 導體膜運送的方法。該電路板或導體膜被斜斜地設置的運 送滾子將其邊緣拿住並作運送。導體膜被張緊，並被拉入 運送平面中。如此該利用區域的表面保持實際上無接觸。 這種張緊的拉力在運送電路板時不會有不良影響。但在導 體膜的場合就有一種危險，即其尺寸準破度 (Maflhaltigkeit)會受此拉力影響，隨著導體膜變得更薄， 這種張緊的拉力需加大，俾將導體膜完全地且平坦地保持 在運送平面中，如果導體膜從運送平面偏離，例如受到工 作容器中一股電解質流衝擊而偏離，或受一噴灑噴嘴（它 將電解質導向平坦物表面）而偏離，則有—種危險，即： 該導體膜在運送時會碰到構造元件並受損。在最不利的情 形，运點會導致導體膜積滯的情事。因此隨著膜厚度減少， 張緊力量要加大。這點由於尺寸準確度的理由（該尺寸準 確度，在細導線技術的情形要很準確）係不可能者。因此 最薄的導體膜（例如厚度25μπι者）不再能用這種裝置可 靠地生產。 文獻DE 101 54 884 Α1提到一種很相似的方法及一種 對應地相似的裝置，用於將平坦物在通過設備中運送。此 處也用斜設的運送料（它們在電路板與㈣膜的邊緣滾 動）xe成拉動張力，這種拉動張力要使平坦物變強勃。如 此該使用區域同樣地伴拉危拉 四饰得無接觸。因此在這種裝置，要將 導體模無礙地運送，所靈的私说&丄 W而的拉伸張力，以及在細導線技術 中導體膜的容許拉伸張六， P浪刀，會限制其實際上的應用範圍。 在電路板的場合，例如厘# Λ 1 . 1夕J如厚度〇 2mrn或更大者，這種拉 ^374199 伸張力並不疋問題。#中在前表面區（叩_)中處 理時，物質交換係在貫通孔與盲孔中發生。 文獻DE 195 19 21 1 A1提到的電路板的濕化學處理的 裝置與方法係將平坦物在「通過設備」中在槽液面下方水 平運送者，电解質從垂直於運送方向設置的噴嘴管流出， 它們會積滞在「運送滾子」上。喷嘴管與運送滾子沿運送 方向交錯地設置上平坦物上側及下侧。如此，受到該沿表 面流過的電解質的影響，在喷嘴管的區域在平坦物的兩側 產生不同的靜壓力及動態壓力，如此，依柏努力原理，電 解質會從較大靜壓力的那一側穿過貫通孔朝向較低塵力的 那邊的方向流過去。低靜壓力所在之處，電解質以較大速 度沿平坦物表面流過，此速度比起該平坦物之對立側上的 :速更高。這點在貫通孔中造成極佳的物質交換，因此該 前案適用於處理電路板。然而該運送 動，因此這種方式不適合處理細小電路板，尤其是= 表面设有構造化的感光漆時尤然。然而，彳曰有越來越多 的具有微導體技術的構造及具有报小的貫通孔與盲孔的電 =與多層物要處理，它們更需要密集的物 貝乂換’纟盲孔的場合，柏努力原理對物質交換幫不上大 忙’因為平坦物的兩面的壓力差並沒有作用。因此這種前 案對於盲孔的處理近乎無能為力。 【發明内容】 ’它們可在一通 及具有孔最薄導 本發明的目的在提供一種方法與裝置 過設備中將具有貫通孔及盲孔的電路板以 1374199 體=安全的運送，其中，該使區域的表面不得被接觸到， Μ尺寸要保持不變，即使在極薄的導體膜的情形亦然。 ^外’該貫穿孔與盲孔要能有密集的物質交換。 I種目的達成之道係利时請專利範圍帛1〜第1〇項 的方法以及申請專利範圍第11〜2!項的裝置實現。 在本發明中，平坦物運送經過該通過設備的作業，係 利用運送滾+，# .富， δΛ運运滾子只將平坦物在使用區域外的二 ^拿住’❹區域不被運送手段及其他導引元件接觸。 旦疋即使报高度可撓性的導體膜也要在運送平面中導進。 這點只能部分地利用一張力達成，該張力垂直於平括物運 :向作用到該導體膜。當張力太大時，則導體膜的尺寸 保持性會喪失，而張力太小時，在導體膜的場合，就沒有 運达安全性。該只作適當地張緊的導體膜被流動的電解質 伙輸运路徑偏轉出來。這種缺點，依本發明係利用電解質 流在兩側斜斜沿運送方向流到平坦物上而可克服。如此， 液流在平坦物的上側及下側呈鏡像對稱流到表面，使 流引起的力量相抵消，如&，即使該平坦物只適量地張°緊 但該平坦物仍保留在運送平面卜㈣運向方向中所選 液抓方向’還可進_步有助於該薄導體膜的運送。如此. 整體上’即使是很薄的導體膜，其使用區域也可達成確實 無接觸的運送，且能保持所需的尺寸 (Maflhaltzkeit)。 確度 一在細導線技術的場合對於保持此尺寸準確度的要 常高。當導線路徑及中間空間為5G_的場合 ，、疋位的 1374199 谷許誤差（T〇Ieranz)舉例而言，可容許為土1〇%，亦即土 5μΐΏ。在通過設備中，所要處理的平坦物的尺寸可達66〇χ 660平方毫米。在製造時由這些所謂的使用部分（Nutzen), 切出電路板，一般$較小的電路板。#定位之容許誤差絕 對值為± 5μηι時，則容許之相對誤差為± 8ppm。這表示， 當在通過設備中將導體膜作濕化學處理時，實際上不得有 任何殘留之尺寸的變化，因為在進一步的程序時，同樣要 將容許誤差列入計算。在此所容許的，垂直於平坦物運送 方向的定量的拉伸張力係利用運送滾子施加，這些運送滾 子設成只稍微地傾斜，運送滾子的轴在此傾斜位置的角度 只從平坦物的運送方向之垂直方向偏離最小的值。如此^ 作用到平坦物上之垂直於運送方向的拉力很小，這點對於 避免所要運送的薄導體膜有殘留的伸張而言，乃是必需 者。 較厚的導體膜與電路板，其盲孔大部分也都很細小。 這些盲孔的物質交換可依本發明利用另—種電解質流達 成·_電解質從噴^管沿近乎垂直的流動方向流到平坦物表 面，該噴嘴管同樣地橫過平坦物的運送方向設置。這些在 上側成一角度呈鏡像對稱在電解質流沿著運送方向係與平 坦物的下側上的電解質流稍微錯開。其電解質流的中心並 不正好重合。如此，在貫通孔中也造成附加的物質交換作 用:由於垂直的電解質流（特別是當體積流很大及/或流 過很大時）該適度張緊的平坦物會從輪送路徑偏轉開來， 因此只有在生產具有盲孔的較厚導體，或電路板之時，才 ^74199 將此電解質流啟動。也可採用-節流閥（Dr〇SseI ’英：The ratio of the ratio of the a2 can be reduced, so that the proportion of the position where the plague may be reduced is also reduced, and the T*AH part can no longer evade the roller pressure. The document DP d 40 3 5932 C2 A method of transporting 1374199 conductor film in a wet chemical equipment. The board or conductor film is held diagonally by a transport roller that holds its edge and carries it. The conductor film is tensioned and pulled into the transport plane. Thus the surface of the utilization area remains virtually contactless. This tensioning tension does not adversely affect the transport of the board. However, in the case of a conductor film, there is a danger that the dimensional breaking degree (Maflhaltigkeit) is affected by the tensile force. As the conductor film becomes thinner, the tension of the tension needs to be increased, and the conductor film is completely removed. Groundly and flatly held in the transport plane, if the conductor film deviates from the transport plane, for example by a jet of electrolyte in the working vessel, or by a spray nozzle that directs the electrolyte to the surface of the flat, A hazard, ie: The conductor film will encounter structural components and be damaged during transport. In the most unfavourable situation, the point of transport can lead to the accumulation of conductor film. Therefore, as the film thickness decreases, the tensioning force is increased. This is not possible due to the reason for dimensional accuracy (which is accurate in the case of fine wire technology). Therefore, the thinnest conductor film (e.g., 25 μm thick) can no longer be reliably produced by such a device. Document DE 101 54 884 Α 1 refers to a very similar method and a correspondingly similar device for transporting flat objects in a passing device. Here too, the inclined transport material (they are rolled on the edge of the circuit board and the (4) film) xe to pull the tension, which pulls the flat to make the flat object strong. Therefore, the area of use is similarly accompanied by the pull of the four. Therefore, in such a device, it is necessary to convey the conductor mold without any hindrance, the tension of the spirit and the tension of the conductor, and the allowable stretching of the conductor film in the fine wire technique. Limit the scope of its actual application. In the case of a circuit board, such as PCT # Λ 1. 1 J J, such as thickness 〇 2mrn or more, this tension 374199 stretch tension is not a problem. When the medium is treated in the front surface area (叩_), the substance exchange system occurs in the through holes and the blind holes. The apparatus and method for wet chemical treatment of a circuit board mentioned in the document DE 195 19 21 1 A1 is to transport the flat material horizontally below the liquid level in the "passing device", the electrolyte is provided from a nozzle tube arranged perpendicular to the conveying direction. When they flow out, they will accumulate on the "transport roller". The nozzle tube and the transport roller are alternately disposed on the upper side and the lower side of the upper flat in the transport direction. Thus, under the influence of the electrolyte flowing along the surface, different static pressures and dynamic pressures are generated on both sides of the flat object in the region of the nozzle tube. Thus, according to the principle of the Ebever effort, the electrolyte will be from a larger static pressure. The side passes through the through hole toward the direction of the lower dust side. Where the low static pressure is, the electrolyte flows along the surface of the flat surface at a relatively high speed, which is higher than the speed on the opposite side of the flat. This results in excellent material exchange in the through-holes, so this case is suitable for handling boards. However, this transport is therefore not suitable for handling small circuit boards, especially when the surface is provided with a structured lacquer. However, there are more and more structures with micro-conductor technology and electrics with small through-holes and blind holes, and multi-layer materials to be processed, they need dense material shells for 'blind holes'. The principle of cypress efforts does not help the material exchange. 'Because the pressure difference between the two sides of the flat has no effect. Therefore, this predecessor is almost incapable of handling blind holes. SUMMARY OF THE INVENTION [They can provide a method and apparatus in a device and a device having a through hole and a blind hole in a method and apparatus for the purpose of the present invention, wherein the circuit board is safely transported by 1374199. The surface of the area must not be touched, and the size of the crucible should remain the same, even in the case of extremely thin conductor films. ^Outer The through hole and the blind hole should have a dense substance exchange. For the purpose of achieving the purpose of the I species, the method of the patent scope 帛1 to the first item and the device of the application scope of the patent range 11~2! In the present invention, the flat material is transported through the passing equipment, and the transporting roller +, #, 富, δΛ transport roller is used to hold only the flat object outside the use area, and the '❹ area is not transported. Contact with other guiding elements. Even if a highly flexible conductor film is reported, it is guided in the transport plane. This can only be achieved in part by a force that is perpendicular to the flat material: to the conductor film. When the tension is too large, the dimensional retention of the conductor film is lost, and the tension is too small, and in the case of the conductor film, there is no safety. The conductor film, which is only properly tensioned, is deflected by the flowing electrolyte transport path. This disadvantage is overcome by the present invention by utilizing the flow of electrolyte on both sides obliquely in the direction of transport to the flat. In this way, the liquid flow is mirror-symmetrical to the surface on the upper side and the lower side of the flat object, so that the force caused by the flow cancels out, such as & even if the flat material is only tightly clamped, the flat remains in the transport plane. (4) The selected liquid picking direction in the direction of transport can also be used to facilitate the transport of the thin conductor film. In this way, on the whole, even a very thin conductor film can achieve a truly contactless transport and maintain the required dimensions (Maflhaltzkeit). The accuracy is always high in maintaining the accuracy of this dimension in the case of fine wire technology. When the wire path and the intermediate space are 5G_, the 1374199 valley error (T〇Ieranz) of the clamp can be, for example, 1% by soil, that is, 5 μΐΏ. In the passing device, the size of the flat to be processed can reach 66 〇χ 660 mm 2 . At the time of manufacture, these so-called use parts (Nutzen) cut out the board, typically a smaller board. When the absolute value of the allowable error of positioning is ± 5μηι, the relative error allowed is ± 8ppm. This means that when the conductor film is subjected to wet chemical treatment in the passing equipment, there must not be any residual dimensional change, because in further procedures, the tolerance is also included in the calculation. Here, the quantitative tensile tension perpendicular to the direction in which the flat object is conveyed is applied by the transport rollers which are set to be only slightly inclined, and the angle of the axis of the transport roller at this inclined position is only from the flat The vertical direction of the object transport direction deviates from the smallest value. Such a pulling force on the flat object perpendicular to the conveying direction is small, which is necessary for avoiding residual stretching of the thin conductor film to be transported. For thicker conductor films and circuit boards, the blind holes are mostly small. The material exchange of these blind holes can be carried out according to the invention by means of another electrolyte flow. The electrolyte flows from the spray tube in a nearly vertical flow direction to the surface of the flat object, which is likewise disposed across the transport direction of the flat. These are mirror symmetrical at an angle on the upper side and the electrolyte flow is slightly offset from the electrolyte flow on the underside of the flats along the transport direction. The center of the electrolyte flow does not coincide exactly. In this way, an additional substance exchange effect is also caused in the through-holes: due to the vertical electrolyte flow (especially when the volume flow is large and/or the flow is large) the moderately tensioned flats are deflected away from the transfer path. So, only when producing thick conductors with blind holes, or boards, ^74199 starts this electrolyte flow. Also available - throttle valve (Dr〇SseI ‘English:
Ch〇ke)或其他改變電解質流的手段，以配合該平坦物的需 求在薄導體膜的場合，實際上不會有盲孔，這種界限約 在】〇〇μηι的厚度。在此厚度以下，不須使電解質垂直流過， 或只需小量之體積流。 特別是該近乎垂直流到平坦物上的第二股電解質流的 體積流可以改變’且可利用電解質循環回路中的可調整的 泵、節流閱、滯積盤（Stauscheiben)、翻蓋片（Da沖e) 以配合平坦物的厚度。 依本發明’在貫通孔中進一步的物質交換作用係利用 ==原：達成，在槽液面下方，在平坦物附近兩側有電 二、/麗s ’垂直於運运方向。電解質從該喷麗管斜斜地 一運送方向噴出，沿表面流過，在平坦物兩側之電解質的 不同机速造成不同大小的靜壓力，使電解質流經電路板中 的貫通孔過去。在適當張緊的導體膜的場合這種電解質流 = = : =使平坦物從輸送路徑偏轉出來。若想二 运滚子張力張緊將平坦物保持在輸 n:r尺寸須保持，因此不可能用此方式：因 七明’平坦物兩側的壓力差局部受限制，且在上 :與：側交替地垂直於運送方向在小小的面積區域= 。如由於電解質流廣泛地作用到導體膜上的 側的力量就自相抵消’使平坦物不會從輸句 這種從電解質錢管出來斜斜地沿運送方開^ 鏡像對稱噴出的電解質則有助於導體^平面呈 埯廷。如此，適當 ΓΙ374199 地張緊導體膜也可安全確實地留在輸送路徑中。由於在平 坦物兩側電解質中雖然整體上，上下力量相抵消，但在局 部的小地方，仍都有局部地交替的靜壓差，因此柏努力原 理仍適用於此，以造成上下流通。由於今日在同樣的通過 設備中，另外所要處理的較厚的平坦物（它們要一如導體 膜作處）越做越厚，由於對於其貫穿孔中的物質交換而言， 這種優點具有重大意義。 ° 本發明在以下利用示意性（但非照比例）的圖式第】 〜第5圖詳細說明。 【實施方式】 的 、， 、/、π辨又驅動 運运滚子」（2)沿運送方向（3)運送。運送滾子⑺只在 平坦物的邊緣將之夾住此邱八 ，此〇卩分不屬於平坦物的使用區域 因此表面易受損的平扭物士鈐 物也月b夠生產。越來越多的薄的及 很4的平坦物也都要作、晶彳卜興 乍濕化學及/或電解質方式處理。在雷 路板技術中，此導電臈的厚度 辨値的技,, 又d為或更小。如果此導 ^ ^ 構成，則它會具特別高度可撓 性且其表面特別容易受損。這 θ 、k 2使仔要運送通過渴彳卜興 通過設備極為困難。 濕化學式 在細導線技術的導體膜的八 確神u — 膜的~合’另外還須保持尺寸準 確性。拉力只能有限地作用 4 了半 時，再也不可能像先前技術所二:者：：上：因此在運送 較大的傾斜調整將導體膜張緊。但未張达滾^作 流及電解質流從輸送路徑偏 ：道’膜會受紊 出I，並導致運送積滯。 12 1374199 依本發明，要運送導體膜而不影響到尺寸準確度，係 將運送滾子（2)的轴（4)作很小的傾斜調整，@時利用一調整 裝置沿箭頭(5)的方向調整一股小的壓迫力量f，它作用到 上軸（4)。這一種同犄的措施的作用，係使導體膜在運送時 -叉適置的張緊，該一樣大的第一組電解質流⑻的作用係 可使該平坦物⑴在運送平面（2G)巾安全地導[這點係利 用-樣大的第-電解質流⑻達成，該第一電解質⑻流在運 送平面（17)的上側⑹與下側⑺呈鏡像對稱的方式朝向平坦 物的表面m解質流⑻的方向朝向運送方向（3)。利用 第一電解質流（8)從兩側以角度α準確設定地斜斜流向平坦 物，即使是薄的導體膜也可在運送平面（2〇)中導進。此第 电解貝流（8)從電解質噴灑管〇〇)流出，該電解質噴灑管 對運送面成對地設置，且具有電解質開口（9)，位於其中， 成列設置。舉例而言，這些開口 (9)可為孔或喷嘴。電解質 喷灑官（10)在運送平面（2〇)兩側垂直於運送方向至少延伸過 該平坦物的整個寬度範圍。電解質作循環，利用泵（圖未 不）經過電解質喷灑管（10)送到充以電解質工作容器（圖 未示）並由該處送回一泵漥池（Pumpensumpf)。 在平坦物兩側受到電解質流（8)引起的二股力量互相反 向相抵消’而該電解質流沿運送方向成一角度。的流動方 向則有助於運送》此角度^:在5。〜60。範圍，且宜為15。 (相對於平坦物的表面）。 對於特定的導體膜，該軸（4)所需的傾斜位置主要依，運 送滾子（2)的軸（4)上的力量F而定。運送滾子（2)支承在上 13 1374199 ::)的方式，使它們能逆著該作用…而配合平坦物的 將^^鴻的下側（7)的運送滚子的支承方式，使它們 這此—®疋值之預设。該力量？宜來自強簧力或重力。 ::力量也可設計成可調整者。隨著電路板厚度遞增，— 又=遞增的力量，當摩擦值大時，所需力量f較少，當 2㈣小’所需力量F較Αβ#運送滾子由—種軟橡耀 該運送滾子的跑動面即使在電解質中，其摩擦值 還疋很大。軸（4)的傾斜位置（第「圖中未示）在此情形中 °、很】例如0.1。由硬而平滑的材料（例如聚乙烯） 構成的運送滚子（2)需要將轴（4)調成較大的傾斜位置，例如 〇。，俾造成平坦物之定量的張力。為了-目了然起見， 在第1及第2圖中，沿運送方向⑺，該運送滚子⑺隔很大 的距離。運送滚子（2)也可設成較密的順序，如此，電解質 喷灑管（10)位於二邊緣的運送滾子（2)之間。 第2圖中的設置有利於具有盲孔的電路板的處理。此 平坦物再被具有軸（4)之受驅動的運送滾子（2)運送。第二電 解質(1 1)由-列的第二組開σ (12)從電解質喷麗管⑽)流 出，並造成密集的物質交換（即使在盲孔中亦然）。開口（丨2) 穿過内電解質喷灑管（13)與外電解質喷灑管（1〇)的壁。此第 二電解質流(11)的出口角度泠與出口角度α大不同。出口 角度沒在60°〜90。的範圍，且宜為8〇。。當出口角度沒 小於90時，第二電解質流（Π)也朝平坦物（1)的運送方 向。此第二電解質流(11)可一如第一電解質流(8)，由同樣 的電解質噴m管（10)供應。這種廉價的實施例適用於處理 1374199 具有盲孔的電路板，這些電路板由於較厚，不會被第二電 解質流（η)由輸送路徑偏轉出來《即使第二電解質流（11)在 平坦物（1)上側（6)與下側（7)的位置沿運送方向略錯開，如 第2圖所示，情形亦復如此。這種上下互錯開的方式，還 使的電解質流另外可流穿過貫通孔，而盲孔中仍一樣可作 物質交換。但對於很敏感易受損的導體膜而言，此第二電 解質流（11)卻顯得有妨礙。當液流报強時，導體膜的運送 女全性受影響，而當液流弱時，則在相同之通過設備中要 處厘的電路板的盲孔中的物質交換作用就太差。因此這二 種電解f流（8)(i 1)宜&二個電解質喷麗管經由二個可互相 獨立作調整的電解質循環作供應，該二電解質喷灑管也可 沿運送方向(3)前後相隨設在平坦物兩側。為了縮短設備長 度或提高處理時間，故宜選用一種「管中管」結構。它只 需报小的空間以建入設備中。圖式中的所示之圓形管可;見 為「管中管」的一種結構的例子，也可將矩形管互相套合。 此外，同樣可用銑切、粘合或押出的實施例做為_結：元 H中的二個電解f循環。電解f喷麗管⑽）與内電解質喷 選管（13)内的電解質流⑻⑴）可互相獨立地作調整。這種 調整係為體積流及流速的調整。特別是當導體膜很薄時， :如厚度小於等於5〇μιη時，則第二電解質流可完全關掉。 :種可實方式可最薄的導體膜與電路板都在同一通過設備 疮處理且無需將設備改裝。各電解質液(8)(11)所需的密集 ㈣I程的措施（它們作用於圖令未示的電解質 泵與閥）調整。 电斛貞 15 1374199 在電路板的場合，例如厚度^麵或更大者則在通 過時’液流穿過孔_ (特別是當孔直徑很小時，例如 0.2mm即使第二電解f流也啟動的情形，這種時間仍嫌太 少。沿運送方向看’電解質噴麗管的數目須增力。，俾有較 長的處理時間以供孔中作物質交換。》了避免這種設備工 程上的額外成本’故依本發明另—實施例，第—電解質流 係設計成使平坦物中的貫通孔在該設備的較長距離範:中 被電解質流過’而不必將電解質噴灑管的數目增加。這點 達成之道係利用柏努力轉。由於在平坦物⑴的上側⑹與 下側⑺的電解質壓力不同’故孔被電解f流過。電解質從 較大靜壓力那一側經這些孔流到較小靜壓力那一側。在這 種平坦物兩侧有壓力差的情形，即使適當張緊的導體膜： 會從輸送路徑偏轉出來。其結果會使導體膜在設備中積滞 :前。、因此依本發明，在平坦物的上側⑻與下側在相反側 周^成在又替的位置有壓力差因此作用到導體膜上的整體 力；Ϊ上下互相抵消。此外’該平坦物還受其沿運送方向之 分量在運送平面中導進。 第3圖顯示局部壓力差的產生方式。電解質喷獾管（它 們具有内«管或不具有内喷灑管）㈣地設在運送平面 (2〇)兩側。這些喷濃管内有相隔的開口，在上側(6)的電解 貝噴灑官（10)的第-組開口（9)和τ側⑺的第一組開口⑺各 錯開了-段距離’ it一段錯開距離為同一倒開口互相間隔 巨離的帛。如此’在平坦物兩側沿著平坦物(1)表面產生 了交替的區域，其上下側電解質的速度不g。利用這種從 1374199 電解質喷灑官（1 〇)的開口（9)迅速流出的電解質，在平坦物 表面在開口（9)附近的區域（14)具有高的動壓力及小的靜壓 力。在開口（9)之開流速較小。因此在處的區域具有低的動 壓力及高的靜壓力。這些區域垂直於運送方向交替。由於 在平坦物兩側電解質喷灑管（1〇)的開口（9)係交錯者，因此 ”亥交替壓力區域也係交錯者，因此在平坦物兩側該第一電 解貝抓（8)的區域中局部的高靜壓和一個對側的低靜壓對 抗，造成局部的壓力差。這種局部的壓力差在一較大的運 送路徑中造成電解質流從貫穿孔流過。因此造成時間較長 的有效物質交換。這種在各地點利用柏努力定律的做法， 可配合第二種電解質流（1 ”組合使用。它們別是在盲孔的 場合特別有效。為此也可使用一内管（8)。平坦物係利用受 驅動的運送滾子（2)作運送，該運送滾子（4)用軸（4)支承住。 第4圖的側視圖顯示使用本發明的一電解質式通過設 備。在此電解程序，在孔中及盲孔中的物質交換也決定程 序的經濟性。較大的物質交換作用，可使之能用大的電流 密度》在電鍍時，係設法使活性的長度一一亦即陰極長度 沿運送方向相對於通過設備的長度的比例——做得很大。 因此，此處特別適用「管中管」結構。這種設計對導體膜 及電路板都適用。特別是在用電解方式構成電路圆案時， 有一點很重要的，即：該平坦物（1)之使用區域不能被構造 元件接觸到。該構造化的感光漆（Galvanovesist)位於此 區域中，它在細導線技術中，對於機械性負荷非常敏感。 第—組呈鏡像對稱的電解質流（8)也可將薄的導體膜保持在 17 陰極（16)下方的輸 (否則它們可能會損壞;:：此就不需其他的絕緣手段 種在電解時會溶掉或表面卜陰極（16)可為一 地或全部同時當作:掉傳子⑺可部分 .yu ^ 衣于，將電流傳導到平坦物（1)上。 運的電極端子’例如端子夹或接觸輪也可以使用。 同二i =們設成:微傾斜)用於部分地或完全地 ^ 以將電流傳導到平坦物上。 '圖.1不本發明的裝置的上視圖，以電解設備為例。 物⑴係作4分圖不，用虛線表示。運送滾子（2)只將平 坦物⑴的二邊緣(17)夹住。使用區域⑽並未與該設備的 結構元件接觸。 運送滾子或接觸滾子（2)或接觸滾子⑺係固定在受驅動 的抽（4)上。此轴方向沿圖示的方向對平坦物（1)的運送方向 偏離了-角度r。4了避免拉力太大，故只選設了一很小 的角度r。在導體膜的場合，其值為〇 〇5。〜^ 5。。當要 處：的導體膜很薄時（例如厚度25_或更小），該角度 7且為0·2。隨著該設備中所要生產的電路板的最少厚度 遞增，軸（4)可完全不傾斜，因為第—電解質流⑻已足以使 此平坦物穩定化並作導進。在陽極（16)之間設有—條具一 整合的内噴灑管（13)的電解質噴灑管（1〇)。這些管具有分別 的電解質循環路徑，它們經由管連接件（19)接到各泵。 為了將平坦物（特別是很薄的導體膜）安全地導引， 故在本發明所有的實施例中，如果平坦物（1)的上側（6)及下 側（7)的各流體動力條件完全相等，則甚有利。要很廉價地 】8 ^/4199 ’可以將平坦物⑴的上側⑹與下側⑺上 口又置的電解質喷灑管（1 至少右^ M旳電解質循環系統。 電解=對電解質喷灌管⑽係接到—猶環，亦即接到- 點可確在電解質錢管中的相同的液體動力 ”牛對於一對内噴灑管（13)而言，情妒士 _ # 與下側⑺的管係接到另-共同之電解質循環系統1上側⑷ 係調整成固定者，例如γλ閥， (s_cheibe)。和用栗閥、翻蓋片或滯積盤 在上述說明中，各種程序的處理液通稱為「電解質。 學及電解式處理的場合，當平坦物從—程序職 留序時：須作沖刷，俾避免前一程序之程序液殘 也#重要冲刷耘序中在孔中及盲孔中的物質交換作用 很重要。因此本發明也關於在槽液面下方的這種程序， 吳5之，係關於在通過設備中的沖刷浴槽。 在本發明說明書中，其#眘 Μ ^ 士 基於貫用理由，在表示該平坦物 簡。由不同厚度d著手，因為在實際上厚度d可很 早j里。此處說明電路板、導電膜與極.薄的導電膜。 在此相平坦物比較厚之平坦物更有可挽性，在實際上 的情形太多如此。 為了將平坦物安全地運送通過該通過設備，故平坦物 =了撓性或勒性（Steifigkeit)很重要。這裡要指明同樣 旱的板或膜可有不同的韋刃性。舉例而言，一片由塑膜核心 】9 及鍵f在其上的賴膜外皮構成的平坦物，即使其厚度d 保持樣’但如核心厚度減少’鍍膜厚度增加 隨之遞增。 本發明在實用上適用於所有目前種類的平坦物的電路 板技術卩下的例子說明此點。但它也適用於水平通過的 二他平i一物作濕化學及電解處理，例如在太陽能電池。當 之厚度2.4mm，貫穿孔直徑〇 3_時，該濕化學式 及/或電解處理作業需要在孔中有密集的物質交換。這些 板中的目孔的情形亦然。依本發明，彳達成極佳的物質交 換。舉例而言，當導體膜厚度為5—時，孔直徑與孔深 2比例、力1 . 1。因此要在孔中作物質交換，並不須用電解 貝岔集机過。因此，導體膜的處理宜不要有垂直的電解質 流。 運送作業係利用稍微傾斜設置的運送滾子造成，該運 送滾子/、將平坦物的邊緣夾住，並將之運送。因此平坦物 的使用域不會被接觸度，運送滾的車由的傾斜朝肖，使得 4而可撓的平坦物能被張緊，但不會張得太緊，對於作用 到運送滾子上的壓迫力量而言，也是一樣，不會造成過度 負荷要防止薄導體膜從運送平面偏離，係由其兩側由成對 置的電解質噴灑管用相同量的電解質流過該導體膜，此 液流係對運送平面呈一個角度，此角度與9〇β差很多，其 中液*IL方向朝向平坦物的運送方向。同時電解質流在上側 及下側的力量呈反向互相抵消，使得即使只是稍微張緊的 導體膜也可在運送平面中安全地導送並作處理。 20 【圖式簡單說明】 第1圖係運送滾子的侧視 緣澴動，它具有電解質噴灑管 以及幫助導體膜運送， 圖’該運送滾子在平坦物邊 ’以將平坦物作濕化學處理 第2圖係另一用於處理電路板的電解質流的相似側視 該電路板具有盲孔與貫通孔， 弟 3 圖係 一 )¾ ^fh ® Tto R ' ”’、 處理設備沿平坦物運送方向的剖面 及側視圖，在平坦物兩側有交替的局部電解質流， 側視：4目係一用於處理導電膜與電路板的電解質設備的 第5圖係第4圖的雷站 __ 幻包解質設備的上視圖。 要元件符號說明】 (1) 平坦物（電路板或導體膜） (2) 運送滾子'接觸滾子 (3) 運送方向 (4) 軸 (5) 力里方向的箭頭 (6) 上側 (7) 下側ι (8) 第—種電解質流 (9) 第一開口 (1〇) 電解質噴灑管 ου 第二電解質流 (12) 第二開口 1374199 (13) (14) (15) (16) (17) (18) (19) (20) 内噴灑管 具較少靜壓力的區域 具較大靜壓力的區域 陽極 平坦物邊緣 平坦物之使用區域 管連接件 運送平面 22Ch〇ke) or other means of changing the electrolyte flow to match the needs of the flat material in the case of a thin conductor film, there is virtually no blind hole, which is about 厚度μηι thickness. Below this thickness, it is not necessary to have the electrolyte flow vertically, or a small volume flow is required. In particular, the volume flow of the second electrolyte stream which flows almost perpendicularly onto the flat can be changed 'and the adjustable pump in the electrolyte circuit, the throttle, the stagnant disk, the flap (Da) Punch e) to match the thickness of the flat. According to the present invention, a further material exchange action in the through-hole is achieved by using == original: under the bath surface, there are electricity on both sides of the flat object, and the second side is perpendicular to the transport direction. The electrolyte is ejected obliquely from the spray tube in a direction of transport, flowing along the surface, and different machine speeds of the electrolyte on both sides of the flat object cause static pressure of different magnitudes, causing the electrolyte to flow through the through holes in the circuit board. In the case of a suitably tensioned conductor film, this electrolyte flow = = : = deflects the flat from the conveying path. If you want to maintain the tension of the second roller, keep the flat at the n:r size must be maintained, so it is impossible to use this method: because the pressure difference between the sides of the flat is partially restricted, and above: and: The sides are alternately perpendicular to the transport direction in a small area =. If the force of the side of the conductor film is widely counteracted by the force of the electrolyte flow, the flattening material will not be ejected from the electrolyte, and the electrolyte will be sprayed symmetrically along the transport side. Help the conductor ^ plane to appear. In this way, the appropriate ΓΙ 199 199199 tensioning conductor film can also be safely and surely left in the conveying path. Since the upper and lower forces are offset in the electrolyte on both sides of the flat material, there is still a partial static static pressure difference in the small part of the local area. Therefore, the principle of the cypress efforts is still applicable to the circulation. Since today, in the same passing equipment, the thicker flats to be treated (they are as good as the conductor film) are thicker and thicker, which is significant for the exchange of substances in the through-holes. significance. The present invention will be described in detail below using schematic (but not to scale) drawings. [Embodiment] The , , /, π discrimination and drive transport rollers (2) are transported in the transport direction (3). The transport roller (7) clamps the Qiu Ba only at the edge of the flat object. This split is not a use area of the flat object. Therefore, the flat twisted material of the surface is also damaged. More and more thin and very flat materials are also processed, crystallized, and chemically treated. In the lightning board technology, the thickness of the conductive crucible is determined by the technique, and d is smaller or smaller. If this guide is constructed, it will be particularly highly flexible and its surface will be particularly susceptible to damage. This θ, k 2 makes it difficult to transport through the equipment through thirst. Wet chemical formula In the conductor film of fine wire technology, the shape of the film must be kept accurate. The pulling force can only be used for a limited period of time. For a half time, it is no longer possible to use the second technique: 2:: Therefore, the conductor film is tensioned by transporting a large tilt adjustment. However, the unexpanded flow and electrolyte flow are deflected from the transport path: the membrane is subject to turbulence I and causes transport to accumulate. 12 1374199 According to the invention, to transport the conductor film without affecting the dimensional accuracy, the shaft (4) of the transport roller (2) is adjusted with a small tilt, @@ an adjustment device along the arrow (5) The direction adjusts a small compression force f which acts on the upper shaft (4). The effect of this homogenous measure is to tension the conductor film during transport, and the same large first set of electrolyte flow (8) acts to transport the flat (1) in the transport plane (2G). Safely conducting [this is achieved by using a large-sized first-electrolyte flow (8), which flows toward the surface m of the flat object in a mirror-symmetrical manner on the upper side (6) and the lower side (7) of the transport plane (17). The direction of the mass flow (8) is towards the transport direction (3). With the first electrolyte flow (8), the flat flow is obliquely set at an angle α from both sides, and even a thin conductor film can be guided in the transport plane (2〇). This first electrolysis stream (8) flows out of the electrolyte spray pipe, which is disposed in pairs to the conveying surface, and has an electrolyte opening (9) in which it is arranged in a row. For example, these openings (9) can be holes or nozzles. The electrolyte sprayer (10) extends at least across the entire width of the flat on either side of the transport plane (2〇) perpendicular to the transport direction. The electrolyte is circulated and sent to the electrolyte working vessel (not shown) through the electrolyte spray pipe (10) through a pump (not shown) and sent back to a pumping pond (Pumpensumpf). The two forces caused by the electrolyte flow (8) on both sides of the flat object counteract each other in the opposite direction and the electrolyte flow is angled in the transport direction. The flow direction helps to transport this angle ^: at 5. ~60. The range is preferably 15. (relative to the surface of the flat). For a particular conductor film, the desired tilt position of the shaft (4) depends primarily on the force F on the shaft (4) of the transport roller (2). The transport rollers (2) are supported in the manner of the upper 13 1374199::) so that they can counteract the action... and cooperate with the flat rollers to support the transport rollers of the lower side (7) of the flats, making them This is the default for the 疋 value. The power? It should be from strong spring force or gravity. :: Power can also be designed as an adjuster. As the thickness of the board increases, - again = the strength of the increase, when the friction value is large, the required force f is less, when 2 (four) small 'the required force F is higher than the Αβ# transport roller by the kind of soft rubber Yao the delivery roll Even if it is in the electrolyte, the running surface of the child is still very large. The inclined position of the shaft (4) (not shown in the figure) is in this case °, very, for example, 0.1. The transport roller (2) composed of a hard and smooth material (for example, polyethylene) requires the shaft (4) Adjusting to a large inclined position, such as 〇., 俾 causes a quantitative tension of the flat. For the sake of clarity, in the first and second figures, the transport roller (7) is separated in the transport direction (7). A large distance. The transport rollers (2) can also be arranged in a denser order, such that the electrolyte spray tube (10) is located between the transport rollers (2) at the two edges. The arrangement in Figure 2 is advantageous. Handling of a circuit board with blind holes. This flat object is then transported by a driven transport roller (2) having a shaft (4). The second electrolyte (1 1) is opened by a second set of σ (12) Flowing out of the electrolyte spray tube (10) and causing intensive material exchange (even in blind holes). Opening (丨2) through the inner electrolyte spray tube (13) and the outer electrolyte spray tube (1〇) The outlet angle 泠 of the second electrolyte stream (11) is different from the outlet angle α. The outlet angle is not in the range of 60° to 90°, and is preferably 8〇. When the exit angle is not less than 90, the second electrolyte flow (Π) is also directed toward the transport of the flat object (1). This second electrolyte flow (11) can be as the first electrolyte flow (8), by the same The electrolyte spray tube (10) is supplied. This inexpensive embodiment is suitable for processing 1374199 circuit boards having blind holes which are not thickened by the second electrolyte flow (η) from the transport path even if The position of the second electrolyte stream (11) on the upper side (6) and the lower side (7) of the flat object (1) is slightly shifted in the transport direction, as shown in Fig. 2. This is also the case. The electrolyte flow can also flow through the through hole, and the blind hole can still be exchanged as a substance. However, for a very sensitive and vulnerable conductor film, the second electrolyte flow (11) appears to be hindered. When the liquid flow is strong, the transport of the conductor film is completely affected, and when the flow is weak, the material exchange effect in the blind hole of the circuit board which is the same in the same device is too poor. Therefore, the two kinds of electrolysis f flow (8) (i 1) should be & two electrolyte spray tubes Two electrolyte cycles which can be adjusted independently of each other are supplied, and the two electrolyte spray pipes can also be disposed on both sides of the flat object in the transport direction (3). In order to shorten the length of the device or increase the processing time, it is preferable to use one type. "In-pipe tube" structure. It only needs to report a small space to build into the device. The circular tube shown in the figure can be seen; see an example of a structure of the "tube-in-tube", which can also be fitted to each other. In addition, the same embodiment that can be milled, bonded or extruded can be used as the two electrolysis f cycles in the element: H. The electrolysis f spray tube (10) and the electrolyte flow (8) (1) in the inner electrolyte discharge tube (13) can be adjusted independently of each other. This adjustment is the adjustment of volume flow and flow rate. Particularly when the conductor film is thin, if the thickness is 5 〇 μηη or less, the second electrolyte flow can be completely turned off. The thinnest conductor film and circuit board are treated in the same way as the sore treatment without the need to modify the equipment. The intensive (four)-way measures required for each electrolyte solution (8) (11) (which act on the electrolyte pump and valve not shown) are adjusted. Electric raft 15 1374199 In the case of a circuit board, for example, if the thickness is ^face or larger, the liquid flow through the hole _ when passing (especially when the hole diameter is small, for example 0.2 mm even if the second electrolysis f flow starts In this case, the time is still too small. The number of electrolyte spray tubes must be increased in the direction of transport. There is a longer processing time for material exchange in the holes. The additional cost ', in accordance with another embodiment of the invention, the first-electrolyte flow system is designed such that the through-holes in the flat are flowed through the electrolyte over a longer distance of the device' without having to count the number of electrolyte spray tubes This is achieved by using the cypress to make a difference. Since the electrolyte pressure is different between the upper side (6) and the lower side (7) of the flat object (1), the holes are flowed through the electrolysis f. The electrolyte passes through the holes from the side of the larger static pressure. Flow to the side of the smaller static pressure. In the case of a pressure difference on either side of the flat, even a properly tensioned conductor film: will deflect out of the conveying path. As a result, the conductor film will accumulate in the equipment: Before It is clear that the upper side (8) of the flat object and the lower side are on the opposite side, and there is a pressure difference at the replacement position, so that the overall force acts on the conductor film; the upper and lower sides cancel each other. In addition, the flat object is also transported by the edge. The component of the direction is guided in the transport plane. Figure 3 shows how the partial pressure difference is generated. Electrolyte squirt tubes (they have internal or non-inner spray tubes) (4) are located on the transport plane (2〇) Sides. These spray tubes have spaced apart openings, and the first set of openings (9) of the electrolysis shell sprayer (10) on the upper side (6) and the first set of openings (7) of the τ side (7) are staggered by a distance - it A staggered distance is the same distance between the same inverted openings. Thus, 'there are alternating areas along the surface of the flat object (1) on both sides of the flat object, and the speed of the electrolyte on the upper and lower sides is not g. Using this electrolyte from 1374199 The electrolyte that rapidly flows out of the opening (9) of the sprayer (1 ,) has a high dynamic pressure and a small static pressure in the region (14) near the opening (9) on the surface of the flat object. Opening at the opening (9) The flow rate is small, so the area in the area has a low dynamic pressure And high static pressure. These areas alternate perpendicular to the direction of transport. Since the openings (9) of the electrolyte spray tubes (1) on both sides of the flat are interlaced, the alternating pressure areas are also interlaced, so The local high static pressure in the region of the first electrolysis (8) on both sides of the flat object and the low static pressure on the opposite side cause a local pressure difference. This local pressure difference is in a larger transport path. The electrolyte flow is caused to flow through the through-holes, thus causing a long-term exchange of effective substances. This method of using the cypress effort law at each location can be combined with the second electrolyte flow (1 ”. They are blind The hole is particularly effective. For this purpose, an inner tube (8) can also be used. The flat material is transported by means of a driven transport roller (2) which is supported by a shaft (4). The side view of Fig. 4 shows an electrolyte type passage device using the present invention. In this electrolysis procedure, the exchange of substances in the holes and in the blind holes also determines the economics of the process. Larger material exchange, which enables it to use large current densities. In electroplating, it is necessary to make the length of the activity one by one, that is, the ratio of the length of the cathode in the direction of transport relative to the length of the passing device. . Therefore, the "tube-in-tube" structure is particularly suitable here. This design is suitable for both conductor films and circuit boards. In particular, when constructing a circuit case by electrolysis, it is important that the area of use of the flat object (1) is not accessible to the structural element. This structured lacquer (Galvanovesist) is located in this area and is very sensitive to mechanical loads in thin wire technology. The first group of mirror-symmetric electrolyte flows (8) can also hold thin conductor films below the 17 cathodes (16) (otherwise they may be damaged;:: no additional insulation is required for electrolysis) Will dissolve or the surface of the cathode (16) can be considered as one or all at the same time: the drop (7) can be part of the yu, the current is conducted to the flat (1). Clips or contact wheels can also be used. Same as i = they are set to: micro-tilt) for partial or complete conduction of current to the flat. Fig. 1 is a top view of the apparatus of the present invention, taking an electrolysis apparatus as an example. The object (1) is divided into 4 points and is indicated by a broken line. The transport roller (2) clamps only the two edges (17) of the flat (1). The area of use (10) is not in contact with the structural elements of the device. The transport roller or contact roller (2) or contact roller (7) is attached to the driven pump (4). This axial direction is offset from the direction of transport of the flat object (1) by an angle r in the direction shown. 4 to avoid too much tension, so only choose a small angle r. In the case of a conductor film, the value is 〇 〇5. ~^ 5. . When the conductor film to be used is thin (e.g., thickness 25_ or less), the angle 7 is 0 and 2. As the minimum thickness of the board to be produced in the apparatus is increased, the shaft (4) may not tilt at all because the first electrolyte flow (8) is sufficient to stabilize and guide the flat. An electrolyte spray tube (1) having an integrated inner spray tube (13) is provided between the anodes (16). These tubes have separate electrolyte circulation paths that are connected to the respective pumps via tube connections (19). In order to safely guide the flat object (especially a very thin conductor film), in all embodiments of the invention, if the hydrodynamic conditions of the upper side (6) and the lower side (7) of the flat object (1) are It is very equal, which is very advantageous. It is very cheap to be 8 ^ / 4199 'electrolyte spray pipe that can be placed on the upper side (6) of the flat object (1) and the upper side (7) (1 at least right ^ M旳 electrolyte circulation system. Electrolysis = electrolyte sprinkler pipe (10) Received - Judah, that is, received - the same liquid power in the electrolyte tube" cattle for a pair of inner spray tubes (13), the gentleman _ # with the lower side (7) of the piping The upper side (4) of the other-common electrolyte circulation system 1 is adjusted to a fixed one, such as a γ λ valve, (s_cheibe), and a chestnut valve, a flip cover or a stagnation disc. In the above description, the processing liquids of various programs are collectively referred to as " Electrolyte. In the case of electrolysis and electrolysis, when the flat object is from the program, it must be flushed, and the process of the previous procedure is avoided. # Importantly flushing the substance in the hole and in the blind hole The exchange function is very important. Therefore, the present invention also relates to such a procedure below the level of the tank, Wu 5, relating to the flushing bath in the passing device. In the present specification, the #慎Μ^ is based on the rationale. , in the representation of the flat object. By different thickness d Hand, because in practice the thickness d can be very early. Here, the circuit board, the conductive film and the extremely thin conductive film are explained. In this case, the flatness is thicker and more flat, and in fact, Too much of this is the case. In order to transport the flats safely through the passing device, it is important that the flats = flexibility or steerability. It is to be noted here that the same dry board or film can have different edge properties. For example, a flat piece composed of a plastic film core 9 and a film b on which the key f is placed, even if the thickness d is kept as 'but if the core thickness is reduced', the increase in coating thickness is increased. This is illustrated by the following examples of circuit board technology applicable to all current types of flats. However, it is also suitable for horizontally passing dimethoate for wet chemical and electrolytic treatment, such as in solar cells. 2.4mm, the diameter of the through hole 〇3_, the wet chemical and / or electrolytic treatment operations require dense material exchange in the holes. The case of the mesh holes in these plates is also the case. According to the invention, the 彳 achieves excellent Material exchange For example, when the thickness of the conductor film is 5, the diameter of the hole is proportional to the depth of the hole 2, and the force is 1.1. Therefore, material exchange is required in the hole, and it is not necessary to use an electrolytic beryllium collector. Therefore, the conductor The membrane should be treated without vertical electrolyte flow. The transport operation is caused by a slightly inclined transport roller that grips the edge of the flat and transports it. Therefore, the use of the flat is not Will be touched, the angle of the car that is transported by the slanting of the car, so that the flexible flat can be tensioned, but it will not be too tight, the same is true for the pressing force acting on the transport roller. Does not cause excessive load to prevent the thin conductor film from deviating from the plane of transport, by the opposite sides of the electrolyte spray tube flowing through the conductor film with the same amount of electrolyte, the liquid flow system is at an angle to the transport plane, this The angle is much different from 9〇β, where the liquid*IL direction is toward the direction in which the flat is transported. At the same time, the forces of the electrolyte flow on the upper side and the lower side cancel each other in the opposite direction, so that even a slightly tensioned conductor film can be safely guided and processed in the transport plane. 20 [Simple description of the drawings] Figure 1 shows the side view edge of the transport roller. It has an electrolyte spray tube and helps the conductor film to be transported. Figure 'The transport roller is on the flat edge' to wet the flat material. Processing Figure 2 is another similar side view of the electrolyte flow for processing the board. The board has blind holes and through holes. The 3 diagram is a) 3⁄4 ^fh ® Tto R ' ” ', processing equipment along the flat Cross section and side view of the transport direction, alternating local electrolyte flows on both sides of the flat object, side view: 4 mesh system for processing electrolyte membranes and circuit boards, Figure 5, diagram of the mine station _ Upper view of the magic pack eliminator. Component symbol description] (1) Flat (board or conductor film) (2) Transport roller 'contact roller (3) Transport direction (4) Shaft (5) Force Arrow in the direction (6) Upper side (7) Lower side ι (8) First electrolyte flow (9) First opening (1〇) Electrolyte spray tube ο Second electrolyte flow (12) Second opening 1374199 (13) (14) (15) (16) (17) (18) (19) (20) The area of the spray pipe with less static pressure has Area of large static pressure Anode Flat edge Area of use of flats Pipe joints Transport plane 22