CN114921827B - Vertical electroplating bias-pulling scratch prevention technology for PCB - Google Patents
Vertical electroplating bias-pulling scratch prevention technology for PCB Download PDFInfo
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- CN114921827B CN114921827B CN202210332466.6A CN202210332466A CN114921827B CN 114921827 B CN114921827 B CN 114921827B CN 202210332466 A CN202210332466 A CN 202210332466A CN 114921827 B CN114921827 B CN 114921827B
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- pcb
- clamping roller
- electroplating
- circuit board
- flexible circuit
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a device for a PCB vertical electroplating bias-pulling scratch prevention process, which belongs to the technical field of PCB processing, and comprises the following process steps: s1, on the basis that an electroplated flexible circuit board PCB is tensioned in a plane through an unreeling machine and a reeling machine to be conveyed, the electroplated flexible circuit board PCB is clamped in the plane through a plurality of negative electrode clamps in an inner cavity of an electroplating cylinder, and the electroplated flexible circuit board PCB is pulled synchronously with the unreeling machine and the reeling machine; s2, through the device for the vertical electroplating bias-pulling scratch prevention process of the PCB, the motion driving of the negative electrode clamp can be realized, and the PCB of the electroplated flexible circuit board can be automatically clamped at the corresponding position.
Description
Technical Field
The invention belongs to the technical field of PCB processing, and particularly relates to a vertical electroplating bias-pulling scratch prevention process for a PCB.
Background
The vertical continuous plating is generally used for plating copper on a circuit board, adopts a spray copper plating process and a full-board copper plating production line of a vertical continuous conveying device, and has the advantages of stable electroplating efficiency, continuous lateral movement of all workpieces from the electroplated side to the other side, and identical production conditions of each workpiece.
When the existing fixing device is installed and used, the fixing device is not provided with a limiting structure, or the limiting structure is simple and has poor limiting effect, so that deviation of products can be generated frequently due to poor fixing effect during production, and once the deviation occurs in vertical continuous electroplating, serious scratch is caused on the products, so that a large number of scratches are scrapped.
In summary, the present invention provides a process for preventing a PCB from being scratched by vertical electroplating.
Disclosure of Invention
The invention aims to provide a vertical electroplating bias-pulling scratch prevention process for a PCB (printed circuit board) so as to solve the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a PCB board vertical electroplating bias-pulling scratch prevention process is characterized in that: the process steps comprise:
s1, on the basis that an electroplated flexible circuit board PCB is tensioned in a plane through an unreeling machine and a reeling machine to be conveyed, the electroplated flexible circuit board PCB is clamped in the plane through a plurality of negative electrode clamps in an inner cavity of an electroplating cylinder, and the electroplated flexible circuit board PCB is pulled synchronously with the unreeling machine and the reeling machine;
s2, the device for the vertical electroplating bias-pulling scratch prevention process of the PCB can realize the motion driving of the negative electrode clamp and automatically clamp and release the PCB of the electroplated flexible circuit board at the corresponding position.
Further, the device for the vertical electroplating bias drawing scratch prevention technology of the PCB comprises: the winding machine, the unreeling machine and a plurality of negative pole clamps are respectively rotated on the frame, the winding machine with the unreeling machine is respectively rotated and is installed in both ends about the frame, the winding machine unreels machine and a plurality of negative pole clamps are respectively through synchronous rotation connection of belt.
Further, the negative electrode clamp comprises an upper clamping roller and a lower clamping roller, the upper clamping roller and the lower clamping roller are all columnar, the circle centers of the upper clamping roller and the lower clamping roller are located in the same vertical plane and pass through the upper clamping roller and the lower clamping roller pair, the lower clamping roller plays a role in guiding the PCB of the electroplated flexible circuit board, the upper clamping roller plays a role in clamping the PCB of the electroplated flexible circuit board, and the upper clamping roller and the lower clamping roller synchronously rotate in different directions when rotating.
Further, the circumference outside of going up the pinch roller still annular is provided with a plurality of clamp structures, clamp structure is including pressing from both sides tight piece and accomodate the groove, wherein the clamp piece accomodates the groove and fixes the setting and be in go up the circumference outside of pinch roller, it is in to press from both sides tight piece through spring coupling press from both sides tight piece accomodate the inslot, and under the spring natural state one side of pressing from both sides tight piece is located the inboard of pressing from both sides tight piece accomodate the groove the limit compression state of spring down the lateral surface of pressing from both sides tight piece with the lateral surface parallel and level of pressing from both sides tight piece accomodate the groove.
Further, the clamping block is further provided with a plurality of through holes, the positions of the through holes are staggered with the mounting positions of the springs, the inner side ends of the through holes are further connected with an electroplating liquid conveying pipe through a spring pressure valve, and the electroplating liquid conveying pipe pumps electroplating liquid through the end liquid inlet of the upper clamping roller.
Further, the end liquid inlet is connected with an electroplating liquid tank at the lower end of the frame through a connecting pipe, a plurality of pumps are arranged in the electroplating liquid tank, and the connecting pipe sucks electroplating liquid into the connecting pipe through the pumps.
Furthermore, the upper clamping roller, the lower clamping roller and the clamping structure positioned on the upper clamping roller are made of teflon.
Further, the frame is positioned in the inner cavity of the electroplating cylinder.
The beneficial effects are that: according to the invention, the winding machine, the unreeling machine and the negative electrode clamps are connected through the belt on the frame, so that the winding machine, the unreeling machine and the negative electrode clamps synchronously rotate, and the negative electrode clamps and the winding machine, the unreeling machine and the negative electrode clamps synchronously rotate, so that the PCB of the electroplated flexible circuit board is not easy to generate bias scratch in the electroplating process, further, the traditional negative electrode clamps are improved to be an upper clamping roller and a lower clamping roller in order to prevent the PCB of the electroplated flexible circuit board from generating bias scratch in the electroplating process, wherein the lower clamping roller guides the PCB of the electroplated flexible circuit board to move forwards, clamps and seeps liquid to the upper clamping roller, and the surface of the PCB of the electroplated flexible circuit board is sprayed with electroplating liquid while clamping the PCB of the electroplated flexible circuit board through the clamping structure arranged on the upper clamping roller.
Drawings
FIG. 1 is a schematic illustration of the process flow of the present invention;
FIG. 2 is a schematic diagram of the main structure of the present invention;
FIG. 3 is a schematic diagram of the cooperation of a PCB, a winder, an unwinder and a plurality of negative electrode clamps of the electroplated flexible circuit board of the invention;
FIG. 4 is an enlarged schematic view of portion A of FIG. 3;
FIG. 5 is a schematic cross-sectional view of an upper nip roll in accordance with the present invention;
FIG. 6 is a schematic cross-sectional view of another angle of the upper nip roll of the present invention.
In the figure: 1. a frame; 2. a winding machine; 3. an unreeling machine; 4. a negative electrode clamp; 401. an upper pinch roller; 402. a lower pinch roller; 5. a belt; 6. a plated flexible circuit board PCB; 4011. a clamping structure; 4012. a clamping block; 4013. a clamping block receiving slot; 4014. a spring; 4015. a through hole; 4016. a spring pressure valve; 4017. a plating liquid delivery pipe; 4018. an end liquid inlet; 4019. a connecting pipe; 7. electroplating liquid tank.
Description of the embodiments
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1 to 6, a process for preventing vertical electroplating bias-pull scratching of a PCB board is characterized in that: the process steps comprise:
s1, on the basis that the PCB6 of the electroplated flexible circuit board is tensioned in a plane through an unreeling machine and a reeling machine to be conveyed, the PCB6 of the electroplated flexible circuit board is clamped in the plane through a plurality of negative electrode clamps in an inner cavity of an electroplating cylinder, and the PCB6 of the electroplated flexible circuit board is pulled synchronously with the unreeling machine and the reeling machine;
s2, the device for the vertical electroplating bias-pulling scratch prevention process of the PCB can realize the motion driving of the negative electrode clamp and automatically clamp and release the electroplated flexible circuit board PCB6 at the corresponding position.
In this embodiment, the device for preventing a vertical electroplating bias-pull scratch process of a PCB board includes: the winding machine comprises a frame 1, wherein a winding machine 2, an unwinding machine 3 and a plurality of negative electrode clamps 4 are respectively and rotatably arranged on the frame 1, the winding machine 2 and the unwinding machine 3 are respectively and rotatably arranged at the left end and the right end of the frame 1, and the winding machine 2, the unwinding machine 3 and the negative electrode clamps 4 are respectively and synchronously rotatably connected through a belt 5.
In this embodiment, the negative electrode fixture 4 includes an upper clamping roller 401 and a lower clamping roller 402, the upper clamping roller 401 and the lower clamping roller 402 are all columnar, the centers of the upper clamping roller 401 and the lower clamping roller 402 are located in the same vertical plane, and the upper clamping roller 401 and the lower clamping roller 402 are used for guiding the electroplated flexible circuit board PCB6, the upper clamping roller 401 is used for clamping the electroplated flexible circuit board PCB6, and the upper clamping roller 401 and the lower clamping roller 402 synchronously rotate in different directions when rotating.
In this embodiment, a plurality of clamping structures 4011 are further annularly disposed on the outer circumference side of the upper clamping roller 401, the clamping structures include clamping blocks 4012 and clamping block accommodating grooves 4013, the clamping block accommodating grooves 4013 are fixedly disposed on the outer circumference side of the upper clamping roller 401, the clamping blocks 4012 are connected in the clamping block accommodating grooves 4013 through springs 4014, one sides of the clamping blocks 4012 are always located on the inner sides of the clamping block accommodating grooves 4013 in a natural state of the springs 4014, and the outer side faces of the clamping blocks 4012 are flush with the outer side faces of the clamping block accommodating grooves 4013 in a limit compression state of the springs 4014.
In this embodiment, the clamping block 4012 is further provided with a plurality of through holes 4015, positions of the through holes 4015 are staggered with the mounting position of the spring 4014, an electroplating liquid delivery pipe 4017 is further connected to the inner side end of the through holes 4015 through a spring pressure valve 4016, and the electroplating liquid delivery pipe 4017 pumps electroplating liquid through an end liquid inlet 4018 of the upper clamping roller 401.
In this embodiment, the end liquid inlet 4018 is connected to the plating liquid tank 7 at the lower end of the frame 1 through a connection pipe 4019, a plurality of pumps are disposed in the plating liquid tank 7, and the connection pipe 4019 sucks the plating liquid into the connection 4019 pipe through the pumps.
In this embodiment, the upper clamping roller 401, the lower clamping roller 402, and the clamping structure 4011 on the upper clamping roller 401 are made of teflon, which is wear-resistant and flexible, so that the surface of the plated flexible circuit board PCB6 will not be scratched or scratched when contacting with the upper clamping roller 401, the lower clamping roller 402, and the clamping structure 4011 on the upper clamping roller 401.
In this embodiment, the frame 1 is located in the inner cavity of the plating cylinder, so that the frame 1 can be connected with the positive electrode of the plating cylinder, so that a complete direct current path is formed among the frame 1, the plated flexible circuit board PCB6 and the negative electrode fixture 4.
When the device for the vertical electroplating bias scratching prevention process of the PCB is used, the winding machine 2, the unwinding machine 3 and the negative electrode clamps 4 are driven to synchronously rotate through the external motor, so that the winding machine 2, the unwinding machine 3 and the negative electrode clamps 4 drive the electroplated flexible circuit board PCB6 to move forwards, when the electroplated flexible circuit board PCB6 moves forwards, the lower clamping roller 402 in the negative electrode clamps 4 and the upper clamping roller 401 synchronously rotate in opposite directions, the lower clamping roller 402 guides the electroplated flexible circuit board PCB6, the upper clamping roller 401 abuts against the electroplated flexible circuit board PCB6 through the clamping blocks 4012 on the clamping structure 4011 on the upper clamping roller, when the clamping blocks 4012 are pressed into the clamping block accommodating grooves 4013, the spring pressure valves 4016 arranged on the clamping blocks 4012 are connected by pressure, and the surface electroplating liquid of the electroplated flexible circuit board PCB6 is oozed out of the electroplated flexible circuit board PCB6 at the moment, and complete direct current paths are formed among the frame 1, the electroplated flexible circuit board 6 and the negative electrode clamps 4, so that the electroplated flexible circuit board 6 is fully electroplated on the PCB6, and the printed circuit boards are fully arranged through the plurality of groups of the printed circuit boards 4.
The foregoing is only a preferred embodiment of the invention, but the scope of the invention is not limited thereto, and any person skilled in the art who is in the field of the invention can apply equivalent substitution or modification to the technical solution and the inventive concept according to the invention within the scope of the invention.
Claims (5)
1. A PCB board vertical electroplating bias-pulling scratch prevention process is characterized in that: the process steps comprise:
s1, on the basis that an electroplated flexible circuit board PCB is tensioned in a plane through an unreeling machine and a reeling machine to be conveyed, the electroplated flexible circuit board PCB is clamped in the plane through a plurality of negative electrode clamps in an inner cavity of an electroplating cylinder, and the electroplated flexible circuit board PCB is pulled synchronously with the unreeling machine and the reeling machine;
s2, the motion driving of the negative electrode clamp can be realized through the device for the vertical electroplating bias-pulling scratch prevention process of the PCB, and the electroplated flexible circuit board PCB can be automatically clamped and released at the corresponding position;
the device for the PCB board vertical electroplating bias drawing scratch prevention process comprises: the winding machine, the unreeling machine and the negative electrode clamps are respectively rotatably arranged on the frame and are respectively rotatably arranged at the left end and the right end of the frame, and the winding machine, the unreeling machine and the negative electrode clamps are respectively and synchronously rotatably connected through belts;
the negative electrode clamp comprises an upper clamping roller and a lower clamping roller, the upper clamping roller and the lower clamping roller are columnar, the circle centers of the upper clamping roller and the lower clamping roller are positioned in the same vertical plane, and clamp the electroplated flexible circuit board PCB through the upper clamping roller and the lower clamping roller, wherein the lower clamping roller plays a role in guiding the electroplated flexible circuit board PCB, the upper clamping roller plays a role in clamping the electroplated flexible circuit board PCB, and the upper clamping roller and the lower clamping roller synchronously rotate in different directions during rotation;
the circumference outside of going up the clamp roller still annular is provided with a plurality of clamp structures, clamp structure is including pressing from both sides tight piece and accomodate the groove, wherein the clamp piece accomodates the groove and fixedly sets up go up the circumference outside of clamp roller, it is in to press from both sides tight piece through spring coupling press from both sides tight piece accomodate the inslot, and under the spring natural state one side of clamp piece is located the inboard of pressing from both sides tight piece accomodate the groove the limit compression state of spring down the lateral surface of clamp piece with the lateral surface parallel and level of clamp piece accomodate the groove.
2. The process for preventing vertical electroplating bias-pull scratching of a PCB according to claim 1, wherein the process comprises the following steps: the clamping block is further provided with a plurality of through holes, the positions of the through holes are staggered with the mounting positions of the springs, the inner side ends of the through holes are further connected with an electroplating liquid conveying pipe through a spring pressure valve, and the electroplating liquid conveying pipe pumps electroplating liquid through the end liquid inlet of the upper clamping roller.
3. The process for preventing vertical electroplating bias-pull scratching of a PCB according to claim 2, wherein the process is characterized in that: the end liquid inlet is connected with an electroplating liquid tank at the lower end of the frame through a connecting pipe, a plurality of pumps are arranged in the electroplating liquid tank, and the connecting pipe sucks electroplating liquid into the connecting pipe through the pumps.
4. The process for preventing vertical electroplating bias-pull scratching of a PCB according to claim 3, wherein the process comprises the following steps: the upper clamping roller, the lower clamping roller and the clamping structure on the upper clamping roller are made of teflon materials.
5. The process for preventing vertical electroplating bias-pull scratching of a PCB according to claim 3, wherein the process comprises the following steps: the frame is positioned in the inner cavity of the electroplating cylinder.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2021116251457 | 2021-12-28 | ||
| CN202111625145 | 2021-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114921827A CN114921827A (en) | 2022-08-19 |
| CN114921827B true CN114921827B (en) | 2023-07-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210332466.6A Active CN114921827B (en) | 2021-12-28 | 2022-03-31 | Vertical electroplating bias-pulling scratch prevention technology for PCB |
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Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10210538B4 (en) * | 2002-03-05 | 2004-11-18 | Atotech Deutschland Gmbh | Horizontal continuous system and method for the galvanotechnical treatment of material to be treated |
| DE10358149B3 (en) * | 2003-12-10 | 2005-05-12 | Höllmüller Maschinenbau GmbH | Process for contact-free transport and treatment of flat material by wet chemical and/or electrolytic processing useful in the transport and treatment, e.g. cleaning and etching, of conductive films and plates |
| JP2006348351A (en) * | 2005-06-16 | 2006-12-28 | Fujifilm Holdings Corp | Device and method for producing film with plated coating |
| KR20100081119A (en) * | 2009-01-05 | 2010-07-14 | 주식회사 익스톨 | Electroplating device for printed circuit board |
| CN209477340U (en) * | 2018-12-31 | 2019-10-11 | 无锡神意环件法兰有限公司 | A kind of home roll mould vehicle hollow shaft special fixture |
| CN111733438A (en) * | 2020-07-02 | 2020-10-02 | 杭州企势科技有限公司 | Clamping device for cylindrical electroplating article |
| CN113089068B (en) * | 2021-03-11 | 2022-09-20 | 深圳市鸿鑫源实业发展有限公司 | Continuous electroplating device |
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| CN114921827A (en) | 2022-08-19 |
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