TWI372006B - - Google Patents

Info

Publication number
TWI372006B
TWI372006B TW095110408A TW95110408A TWI372006B TW I372006 B TWI372006 B TW I372006B TW 095110408 A TW095110408 A TW 095110408A TW 95110408 A TW95110408 A TW 95110408A TW I372006 B TWI372006 B TW I372006B
Authority
TW
Taiwan
Application number
TW095110408A
Other languages
Chinese (zh)
Other versions
TW200701852A (en
Inventor
Makoto Ueno
Taeko Takarabe
Yuji Matsushita
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006030635A external-priority patent/JP4762742B2/en
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200701852A publication Critical patent/TW200701852A/en
Application granted granted Critical
Publication of TWI372006B publication Critical patent/TWI372006B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
TW095110408A 2005-03-31 2006-03-24 Method for producing flexible copper-clad laminated substrate and multi-layer laminate TW200701852A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005104156 2005-03-31
JP2006030635A JP4762742B2 (en) 2006-02-08 2006-02-08 Method for producing flexible copper-clad laminate

Publications (2)

Publication Number Publication Date
TW200701852A TW200701852A (en) 2007-01-01
TWI372006B true TWI372006B (en) 2012-09-01

Family

ID=37073287

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110408A TW200701852A (en) 2005-03-31 2006-03-24 Method for producing flexible copper-clad laminated substrate and multi-layer laminate

Country Status (4)

Country Link
KR (1) KR101245791B1 (en)
CN (1) CN101151946B (en)
TW (1) TW200701852A (en)
WO (1) WO2006106723A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5347980B2 (en) * 2010-01-14 2013-11-20 住友金属鉱山株式会社 Metallized polyimide film and flexible wiring board using the same
KR101441235B1 (en) * 2013-03-14 2014-09-17 홍익대학교 산학협력단 Stiffness-gradient stretchable substrate, manufacturing method of the same substrate, stretchable electronics package produced using the substrate and manufacturing method of the same package
CN103212505B (en) * 2013-03-18 2017-08-29 深圳市振勤电子科技有限公司 The barrier structure of metal material spraying
JP6427454B2 (en) * 2015-03-31 2018-11-21 日鉄ケミカル＆マテリアル株式会社 Copper-clad laminate and printed wiring board
DE102015113928A1 (en) * 2015-08-21 2017-02-23 Schreiner Group Gmbh & Co. Kg Object with an electronic unit and ladder structures on a support structure
JP6252567B2 (en) * 2015-09-03 2017-12-27 王子ホールディングス株式会社 Release sheet, release sheet manufacturing method and laminate
JP6642194B2 (en) * 2016-03-29 2020-02-05 味の素株式会社 Manufacturing method of printed wiring board
JP6652111B2 (en) * 2017-07-18 2020-02-19 トヨタ自動車株式会社 Solar cell manufacturing method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2216318Y (en) * 1994-11-24 1995-12-27 刘宝申 Flexible polyester film coated copper foil plate and film-coated circuit board
JP3641952B2 (en) * 1998-11-05 2005-04-27 ソニーケミカル株式会社 Polyimide film and flexible substrate
JP2000286514A (en) * 1999-03-29 2000-10-13 Sumitomo Bakelite Co Ltd Adhesive-backed board for flexible printed circuit
JP4504602B2 (en) * 2001-09-04 2010-07-14 三井化学株式会社 Polyimide copper clad laminate and method for producing the same
CN1180006C (en) * 2002-11-22 2004-12-15 中国科学院长春应用化学研究所 Preparation method of polyether imide flexible printed circuit substrate material

Also Published As

Publication number Publication date
KR20070120555A (en) 2007-12-24
CN101151946B (en) 2010-10-27
KR101245791B1 (en) 2013-03-20
TW200701852A (en) 2007-01-01
WO2006106723A1 (en) 2006-10-12
CN101151946A (en) 2008-03-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees