TWI371655B - Radiation-sensitive resin composition for forming a spacer, production of the spacer and liquid crystal display element - Google Patents
Radiation-sensitive resin composition for forming a spacer, production of the spacer and liquid crystal display elementInfo
- Publication number
- TWI371655B TWI371655B TW094100634A TW94100634A TWI371655B TW I371655 B TWI371655 B TW I371655B TW 094100634 A TW094100634 A TW 094100634A TW 94100634 A TW94100634 A TW 94100634A TW I371655 B TWI371655 B TW I371655B
- Authority
- TW
- Taiwan
- Prior art keywords
- spacer
- radiation
- production
- liquid crystal
- forming
- Prior art date
Links
- 125000006850 spacer group Chemical group 0.000 title 2
- 239000004973 liquid crystal related substance Substances 0.000 title 1
- 230000005855 radiation Effects 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D333/00—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom
- C07D333/50—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom condensed with carbocyclic rings or ring systems
- C07D333/72—Benzo[c]thiophenes; Hydrogenated benzo[c]thiophenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
- C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
- C09D201/02—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C09D201/06—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
- C09D201/08—Carboxyl groups
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Materials For Photolithography (AREA)
- Liquid Crystal (AREA)
- Graft Or Block Polymers (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004015158A JP2005208360A (en) | 2004-01-23 | 2004-01-23 | Radiation-sensitive resin composition for forming spacer, spacer and method for forming the same, and liquid crystal display element |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200525297A TW200525297A (en) | 2005-08-01 |
TWI371655B true TWI371655B (en) | 2012-09-01 |
Family
ID=34879019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094100634A TWI371655B (en) | 2004-01-23 | 2005-01-10 | Radiation-sensitive resin composition for forming a spacer, production of the spacer and liquid crystal display element |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2005208360A (en) |
KR (1) | KR100856992B1 (en) |
CN (1) | CN100428027C (en) |
TW (1) | TWI371655B (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007334324A (en) * | 2006-05-18 | 2007-12-27 | Mitsubishi Chemicals Corp | Curable composition, cured product, color filter and liquid crystal display device |
WO2007135962A1 (en) * | 2006-05-18 | 2007-11-29 | Mitsubishi Chemical Corporation | Curable composition, cured product, color filter, and liquid crystal display device |
JP4952918B2 (en) * | 2007-05-23 | 2012-06-13 | Jsr株式会社 | Radiation-sensitive resin composition, spacer and protective film for liquid crystal display element, and method for forming them |
JP5293934B2 (en) * | 2007-06-13 | 2013-09-18 | Jsr株式会社 | Radiation-sensitive composition for forming colored layer, color filter, and color liquid crystal display element |
KR101121038B1 (en) * | 2008-07-01 | 2012-03-15 | 주식회사 엘지화학 | Photoresist resin composition containing a number of photo-initiators, transparent thin film layer and liquid crystal display using the same |
JP2012163735A (en) * | 2011-02-07 | 2012-08-30 | Toyo Ink Sc Holdings Co Ltd | Photosensitive resin composition, and protective film and insulating film for touch panel using the composition |
TW201308003A (en) * | 2011-07-29 | 2013-02-16 | Sanyo Chemical Ind Ltd | Photosensitive resin composition, cured product and spacer |
JP6079277B2 (en) * | 2013-02-04 | 2017-02-15 | 日本ゼオン株式会社 | Radiation sensitive resin composition and electronic component |
KR102329947B1 (en) * | 2017-12-22 | 2021-11-22 | 동우 화인켐 주식회사 | Photosensitive resin composition and insulation pattern formed from the same |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09208611A (en) * | 1996-02-06 | 1997-08-12 | Japan Synthetic Rubber Co Ltd | Phosphor-dispersed, radiation-sensitive composition |
JPH11327150A (en) * | 1998-03-17 | 1999-11-26 | Mitsubishi Chemical Corp | Positive photoresist composition |
JP2001154206A (en) | 1999-11-25 | 2001-06-08 | Jsr Corp | Radiation sensitive resin composition for spacer, spacer and liquid crystal display element |
JP4330096B2 (en) * | 1999-12-16 | 2009-09-09 | 日本化薬株式会社 | Resin composition, film thereof and cured product thereof |
JP2002278064A (en) * | 2001-03-15 | 2002-09-27 | Jsr Corp | Radiation sensitive resin composition, spacer for display panel and display panel |
JP2003066604A (en) * | 2001-08-28 | 2003-03-05 | Jsr Corp | Radiation sensitive resin composition for spacer, spacer and liquid crystal display element |
JP3734436B2 (en) * | 2001-09-19 | 2006-01-11 | 奇美実業股▲分▼有限公司 | Photosensitive resin composition for liquid crystal display spacers |
JP2003202667A (en) * | 2002-01-08 | 2003-07-18 | Asahi Kasei Corp | Photosensitive resin composition |
-
2004
- 2004-01-23 JP JP2004015158A patent/JP2005208360A/en active Pending
-
2005
- 2005-01-10 TW TW094100634A patent/TWI371655B/en not_active IP Right Cessation
- 2005-01-11 CN CNB200510000493XA patent/CN100428027C/en not_active Expired - Fee Related
- 2005-01-21 KR KR1020050005692A patent/KR100856992B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20050076753A (en) | 2005-07-27 |
TW200525297A (en) | 2005-08-01 |
JP2005208360A (en) | 2005-08-04 |
CN1645220A (en) | 2005-07-27 |
KR100856992B1 (en) | 2008-09-04 |
CN100428027C (en) | 2008-10-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |