TWI370495B - - Google Patents

Info

Publication number
TWI370495B
TWI370495B TW096139003A TW96139003A TWI370495B TW I370495 B TWI370495 B TW I370495B TW 096139003 A TW096139003 A TW 096139003A TW 96139003 A TW96139003 A TW 96139003A TW I370495 B TWI370495 B TW I370495B
Authority
TW
Taiwan
Application number
TW096139003A
Other versions
TW200919593A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW096139003A priority Critical patent/TW200919593A/zh
Priority to US12/244,258 priority patent/US7824945B2/en
Publication of TW200919593A publication Critical patent/TW200919593A/zh
Application granted granted Critical
Publication of TWI370495B publication Critical patent/TWI370495B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/0015—Cantilevers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0118—Cantilevers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0136—Growing or depositing of a covering layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
TW096139003A 2007-10-18 2007-10-18 Elements and modules with micro caps and wafer level packaging method thereof TW200919593A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW096139003A TW200919593A (en) 2007-10-18 2007-10-18 Elements and modules with micro caps and wafer level packaging method thereof
US12/244,258 US7824945B2 (en) 2007-10-18 2008-10-02 Method for making micro-electromechanical system devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096139003A TW200919593A (en) 2007-10-18 2007-10-18 Elements and modules with micro caps and wafer level packaging method thereof

Publications (2)

Publication Number Publication Date
TW200919593A TW200919593A (en) 2009-05-01
TWI370495B true TWI370495B (zh) 2012-08-11

Family

ID=41415165

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096139003A TW200919593A (en) 2007-10-18 2007-10-18 Elements and modules with micro caps and wafer level packaging method thereof

Country Status (2)

Country Link
US (1) US7824945B2 (zh)
TW (1) TW200919593A (zh)

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DE102009029184A1 (de) * 2009-09-03 2011-03-10 Robert Bosch Gmbh Herstellungsverfahren für ein verkapptes mikromechanisches Bauelement, entsprechendes mikromechanisches Bauelement und Kappe für ein mikromechanisches Bauelement
KR101300749B1 (ko) * 2009-12-14 2013-08-28 한국전자통신연구원 음향 센서 및 이의 제조 방법
US9131325B2 (en) * 2010-08-31 2015-09-08 Freescale Semiconductor, Inc. MEMS device assembly and method of packaging same
US8636911B2 (en) * 2010-10-07 2014-01-28 Magic Technologies, Inc. Process for MEMS scanning mirror with mass remove from mirror backside
TWI421983B (zh) * 2011-03-22 2014-01-01 Memsor Corp 微機電裝置及其製造方法
TWI458409B (zh) * 2011-06-21 2014-10-21 Memsor Corp 微機電裝置及其製造方法
US8889451B2 (en) 2012-02-21 2014-11-18 Freescale Semiconductor, Inc. MEMS pressure transducer assembly and method of packaging same
US9402138B2 (en) 2012-10-12 2016-07-26 Infineon Technologies Ag MEMS device and method of manufacturing a MEMS device
US9091820B2 (en) 2013-06-10 2015-07-28 Freescale Semiconductor, Inc. Communication system die stack
US10230458B2 (en) * 2013-06-10 2019-03-12 Nxp Usa, Inc. Optical die test interface with separate voltages for adjacent electrodes
US9442254B2 (en) 2013-06-10 2016-09-13 Freescale Semiconductor, Inc. Method and apparatus for beam control with optical MEMS beam waveguide
US9766409B2 (en) 2013-06-10 2017-09-19 Nxp Usa, Inc. Optical redundancy
US9810843B2 (en) 2013-06-10 2017-11-07 Nxp Usa, Inc. Optical backplane mirror
US9435952B2 (en) 2013-06-10 2016-09-06 Freescale Semiconductor, Inc. Integration of a MEMS beam with optical waveguide and deflection in two dimensions
US9094135B2 (en) 2013-06-10 2015-07-28 Freescale Semiconductor, Inc. Die stack with optical TSVs
US9261556B2 (en) 2013-06-10 2016-02-16 Freescale Semiconductor, Inc. Optical wafer and die probe testing
US11220423B2 (en) * 2018-11-01 2022-01-11 Invensense, Inc. Reduced MEMS cavity gap

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US5596222A (en) * 1994-08-12 1997-01-21 The Charles Stark Draper Laboratory, Inc. Wafer of transducer chips
US6969635B2 (en) * 2000-12-07 2005-11-29 Reflectivity, Inc. Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US6156585A (en) * 1998-02-02 2000-12-05 Motorola, Inc. Semiconductor component and method of manufacture
US7190854B1 (en) * 2000-05-24 2007-03-13 Active Optical Networks, Inc. Methods for forming an array of MEMS optical elements
US6827866B1 (en) * 2000-05-24 2004-12-07 Active Optical Networks, Inc. Deep-well lithography process for forming micro-electro-mechanical structures
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US7057251B2 (en) * 2001-07-20 2006-06-06 Reflectivity, Inc MEMS device made of transition metal-dielectric oxide materials
US20030048036A1 (en) * 2001-08-31 2003-03-13 Lemkin Mark Alan MEMS comb-finger actuator
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DE10160830A1 (de) * 2001-12-11 2003-06-26 Infineon Technologies Ag Mikromechanische Sensoren und Verfahren zur Herstellung derselben
US6787897B2 (en) * 2001-12-20 2004-09-07 Agilent Technologies, Inc. Wafer-level package with silicon gasket
US7208809B2 (en) * 2002-09-19 2007-04-24 Nippon Telegraph And Telephone Corporation Semiconductor device having MEMS
US20050250253A1 (en) * 2002-10-23 2005-11-10 Cheung Kin P Processes for hermetically packaging wafer level microscopic structures
US20050189621A1 (en) * 2002-12-02 2005-09-01 Cheung Kin P. Processes for hermetically packaging wafer level microscopic structures
US7049051B2 (en) * 2003-01-23 2006-05-23 Akustica, Inc. Process for forming and acoustically connecting structures on a substrate
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US7159459B2 (en) * 2005-01-06 2007-01-09 Freescale Semiconductor, Inc. Multiple microelectromechanical (MEM) devices formed on a single substrate and sealed at different pressures and method therefor
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KR100785014B1 (ko) * 2006-04-14 2007-12-12 삼성전자주식회사 Ｓｏｉ웨이퍼를 이용한 ｍｅｍｓ 디바이스 및 그 제조방법

Also Published As

Publication number Publication date
US20090311819A1 (en) 2009-12-17
TW200919593A (en) 2009-05-01
US7824945B2 (en) 2010-11-02

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