TWI368598B - Polysilicon deposition and anneal process enabling thick polysilicon films for mems applications - Google Patents

Polysilicon deposition and anneal process enabling thick polysilicon films for mems applications

Info

Publication number
TWI368598B
TWI368598B TW097112551A TW97112551A TWI368598B TW I368598 B TWI368598 B TW I368598B TW 097112551 A TW097112551 A TW 097112551A TW 97112551 A TW97112551 A TW 97112551A TW I368598 B TWI368598 B TW I368598B
Authority
TW
Taiwan
Prior art keywords
polysilicon
anneal process
process enabling
mems applications
deposition
Prior art date
Application number
TW097112551A
Other languages
English (en)
Other versions
TW200906708A (en
Inventor
Thomas Kieran Nunan
Original Assignee
Analog Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Analog Devices Inc filed Critical Analog Devices Inc
Publication of TW200906708A publication Critical patent/TW200906708A/zh
Application granted granted Critical
Publication of TWI368598B publication Critical patent/TWI368598B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/0065—Mechanical properties
    • B81C1/00666—Treatments for controlling internal stress or strain in MEMS structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/025—Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0161—Controlling physical properties of the material
    • B81C2201/0163—Controlling internal stress of deposited layers
    • B81C2201/0164—Controlling internal stress of deposited layers by doping the layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0161—Controlling physical properties of the material
    • B81C2201/0163—Controlling internal stress of deposited layers
    • B81C2201/0167—Controlling internal stress of deposited layers by adding further layers of materials having complementary strains, i.e. compressive or tensile strain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0161—Controlling physical properties of the material
    • B81C2201/0163—Controlling internal stress of deposited layers
    • B81C2201/0169—Controlling internal stress of deposited layers by post-annealing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
TW097112551A 2007-04-05 2008-04-07 Polysilicon deposition and anneal process enabling thick polysilicon films for mems applications TWI368598B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US91027407P 2007-04-05 2007-04-05

Publications (2)

Publication Number Publication Date
TW200906708A TW200906708A (en) 2009-02-16
TWI368598B true TWI368598B (en) 2012-07-21

Family

ID=39831548

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097112551A TWI368598B (en) 2007-04-05 2008-04-07 Polysilicon deposition and anneal process enabling thick polysilicon films for mems applications

Country Status (3)

Country Link
US (1) US7754617B2 (zh)
TW (1) TWI368598B (zh)
WO (1) WO2008124595A2 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5305735B2 (ja) * 2008-05-26 2013-10-02 株式会社東芝 微小電気機械システム装置およびその製造方法
JP5866968B2 (ja) 2011-01-13 2016-02-24 セイコーエプソン株式会社 プロジェクター
CN102328901A (zh) * 2011-08-15 2012-01-25 天津理工大学 一种金颗粒修饰的氧化锌纳米阵列复合体系的制备方法
CN105548274A (zh) * 2015-12-09 2016-05-04 天津大学 原位合成具有二级孔洞结构的氧化镉纳米气敏元件
CN111048416A (zh) * 2019-12-25 2020-04-21 上海华力微电子有限公司 多晶硅薄膜的沉积方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7189332B2 (en) * 2001-09-17 2007-03-13 Texas Instruments Incorporated Apparatus and method for detecting an endpoint in a vapor phase etch
US20030222296A1 (en) * 2002-06-04 2003-12-04 Applied Materials, Inc. Method of forming a capacitor using a high K dielectric material
US7019434B2 (en) * 2002-11-08 2006-03-28 Iris Ao, Inc. Deformable mirror method and apparatus including bimorph flexures and integrated drive
US20040157426A1 (en) 2003-02-07 2004-08-12 Luc Ouellet Fabrication of advanced silicon-based MEMS devices
TWI395258B (zh) * 2005-11-11 2013-05-01 Semiconductor Energy Lab 微結構以及微機電系統的製造方法

Also Published As

Publication number Publication date
US20090042372A1 (en) 2009-02-12
WO2008124595A3 (en) 2009-01-29
TW200906708A (en) 2009-02-16
WO2008124595A2 (en) 2008-10-16
US7754617B2 (en) 2010-07-13

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