TWI367525B - Substrate treatment apparatus, substrate treatment method, and storage medium - Google Patents

Substrate treatment apparatus, substrate treatment method, and storage medium

Info

Publication number
TWI367525B
TWI367525B TW097127760A TW97127760A TWI367525B TW I367525 B TWI367525 B TW I367525B TW 097127760 A TW097127760 A TW 097127760A TW 97127760 A TW97127760 A TW 97127760A TW I367525 B TWI367525 B TW I367525B
Authority
TW
Taiwan
Prior art keywords
substrate treatment
storage medium
treatment apparatus
treatment method
substrate
Prior art date
Application number
TW097127760A
Other languages
English (en)
Other versions
TW200919570A (en
Inventor
Hiromitsu Nanba
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200919570A publication Critical patent/TW200919570A/zh
Application granted granted Critical
Publication of TWI367525B publication Critical patent/TWI367525B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02079—Cleaning for reclaiming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW097127760A 2007-08-29 2008-07-22 Substrate treatment apparatus, substrate treatment method, and storage medium TWI367525B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007222135 2007-08-29

Publications (2)

Publication Number Publication Date
TW200919570A TW200919570A (en) 2009-05-01
TWI367525B true TWI367525B (en) 2012-07-01

Family

ID=40611516

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097127760A TWI367525B (en) 2007-08-29 2008-07-22 Substrate treatment apparatus, substrate treatment method, and storage medium

Country Status (3)

Country Link
JP (1) JP5184253B2 (zh)
KR (1) KR101267631B1 (zh)
TW (1) TWI367525B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9153462B2 (en) 2010-12-09 2015-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Spin chuck for thin wafer cleaning
JP5642574B2 (ja) * 2011-01-25 2014-12-17 東京エレクトロン株式会社 液処理装置および液処理方法
US8944080B2 (en) * 2011-08-02 2015-02-03 Visera Technologies Company Limited Cleaning system, cleaning device, and method of using cleaning device
JP6234736B2 (ja) 2013-08-30 2017-11-22 芝浦メカトロニクス株式会社 スピン処理装置
KR102343635B1 (ko) * 2014-12-30 2021-12-29 세메스 주식회사 기판 처리 장치 및 방법
KR200482998Y1 (ko) 2015-12-14 2017-03-24 한전케이피에스 주식회사 발전 설비의 그리스 주입형 커버 장치
JP6990602B2 (ja) * 2018-02-27 2022-01-12 東京エレクトロン株式会社 基板処理装置、基板処理方法及びコンピュータ読み取り可能な記録媒体
KR102139605B1 (ko) * 2018-11-06 2020-08-12 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
CN111146123B (zh) * 2019-12-26 2022-07-26 厦门通富微电子有限公司 一种液体收集装置、显影/刻蚀机台及显影/刻蚀方法
CN111112186B (zh) * 2019-12-27 2022-08-09 上海至纯洁净系统科技股份有限公司 一种晶圆片清洗设备
CN111001606B (zh) * 2019-12-27 2022-03-11 上海至纯洁净系统科技股份有限公司 一种半导体清洗设备
KR102624576B1 (ko) * 2020-11-23 2024-01-16 세메스 주식회사 기판 처리 장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3089846B2 (ja) * 1992-09-03 2000-09-18 富士通株式会社 ウエーハ処理装置
JP3035451B2 (ja) * 1994-07-19 2000-04-24 大日本スクリーン製造株式会社 基板の表面処理装置
JP2003093979A (ja) * 2001-09-25 2003-04-02 Hitachi Ltd スピン処理装置
JP2004063982A (ja) * 2002-07-31 2004-02-26 Seiko Epson Corp 洗浄装置および洗浄方法
JP2005302746A (ja) * 2004-03-05 2005-10-27 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
KR101267631B1 (ko) 2013-05-24
KR20090023278A (ko) 2009-03-04
JP2009076878A (ja) 2009-04-09
JP5184253B2 (ja) 2013-04-17
TW200919570A (en) 2009-05-01

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