TWI366956B - Zero insertion force printed circuit assembly connector system and method - Google Patents
Zero insertion force printed circuit assembly connector system and methodInfo
- Publication number
- TWI366956B TWI366956B TW095120036A TW95120036A TWI366956B TW I366956 B TWI366956 B TW I366956B TW 095120036 A TW095120036 A TW 095120036A TW 95120036 A TW95120036 A TW 95120036A TW I366956 B TWI366956 B TW I366956B
- Authority
- TW
- Taiwan
- Prior art keywords
- printed circuit
- circuit assembly
- connector system
- insertion force
- zero insertion
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/253,446 US7147499B1 (en) | 2005-10-19 | 2005-10-19 | Zero insertion force printed circuit assembly connector system and method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200717932A TW200717932A (en) | 2007-05-01 |
TWI366956B true TWI366956B (en) | 2012-06-21 |
Family
ID=37497182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095120036A TWI366956B (en) | 2005-10-19 | 2006-06-06 | Zero insertion force printed circuit assembly connector system and method |
Country Status (7)
Country | Link |
---|---|
US (1) | US7147499B1 (zh) |
JP (1) | JP2007115683A (zh) |
KR (1) | KR101284400B1 (zh) |
CN (1) | CN1953276B (zh) |
DE (1) | DE102006034396A1 (zh) |
MY (1) | MY142737A (zh) |
TW (1) | TWI366956B (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060236495A1 (en) * | 2005-04-25 | 2006-10-26 | Romi Mayder | Method and apparatus for non-contact cleaning of electronics |
US7541819B2 (en) * | 2005-10-28 | 2009-06-02 | Teradyne, Inc. | Modularized device interface with grounding insert between two strips |
US7504822B2 (en) * | 2005-10-28 | 2009-03-17 | Teradyne, Inc. | Automatic testing equipment instrument card and probe cabling system and apparatus |
US20110117767A1 (en) * | 2009-11-13 | 2011-05-19 | Hiromitsu Sato | Connector device |
WO2011058643A1 (ja) * | 2009-11-13 | 2011-05-19 | 株式会社データンク | フラッシュメモリ用マガジン |
US8896320B2 (en) * | 2011-08-31 | 2014-11-25 | Infineon Technologies Ag | Measuring device and a method for measuring a chip-to-chip-carrier connection |
US8933722B2 (en) | 2011-08-31 | 2015-01-13 | Infineon Technologies Ag | Measuring device and a method for measuring a chip-to-chip-carrier connection |
US9063170B2 (en) * | 2012-12-27 | 2015-06-23 | Teradyne, Inc. | Interface for a test system |
US9583845B1 (en) * | 2015-10-27 | 2017-02-28 | Dell Products, Lp | Electrical connector for an information handling system |
JP2020098747A (ja) * | 2018-12-19 | 2020-06-25 | タイコエレクトロニクスジャパン合同会社 | インターポーザおよびインターポーザの製造方法 |
JP2024514321A (ja) * | 2021-04-08 | 2024-04-01 | テクトロニクス・インコーポレイテッド | 高精度、高帯域幅スイッチング・アッテネータ関連アプリケーション |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6069483A (en) * | 1997-12-16 | 2000-05-30 | Intel Corporation | Pickup chuck for multichip modules |
JP2003344483A (ja) * | 2002-05-31 | 2003-12-03 | Fujitsu Ltd | ハンドリング装置およびこれを使用した試験装置 |
US6744267B2 (en) * | 2002-07-16 | 2004-06-01 | Nptest, Llc | Test system and methodology |
US6833696B2 (en) | 2003-03-04 | 2004-12-21 | Xandex, Inc. | Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment |
-
2005
- 2005-10-19 US US11/253,446 patent/US7147499B1/en active Active
-
2006
- 2006-05-19 MY MYPI20062312A patent/MY142737A/en unknown
- 2006-06-06 TW TW095120036A patent/TWI366956B/zh active
- 2006-07-25 DE DE102006034396A patent/DE102006034396A1/de not_active Withdrawn
- 2006-10-16 JP JP2006281382A patent/JP2007115683A/ja active Pending
- 2006-10-19 KR KR1020060101743A patent/KR101284400B1/ko active IP Right Grant
- 2006-10-19 CN CN200610149978XA patent/CN1953276B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR20070042901A (ko) | 2007-04-24 |
CN1953276B (zh) | 2010-10-06 |
KR101284400B1 (ko) | 2013-07-09 |
MY142737A (en) | 2010-12-31 |
DE102006034396A1 (de) | 2007-06-28 |
CN1953276A (zh) | 2007-04-25 |
JP2007115683A (ja) | 2007-05-10 |
US7147499B1 (en) | 2006-12-12 |
TW200717932A (en) | 2007-05-01 |
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