TWI366956B - Zero insertion force printed circuit assembly connector system and method - Google Patents

Zero insertion force printed circuit assembly connector system and method

Info

Publication number
TWI366956B
TWI366956B TW095120036A TW95120036A TWI366956B TW I366956 B TWI366956 B TW I366956B TW 095120036 A TW095120036 A TW 095120036A TW 95120036 A TW95120036 A TW 95120036A TW I366956 B TWI366956 B TW I366956B
Authority
TW
Taiwan
Prior art keywords
printed circuit
circuit assembly
connector system
insertion force
zero insertion
Prior art date
Application number
TW095120036A
Other languages
English (en)
Other versions
TW200717932A (en
Inventor
Romi Mayder
John W Andberg
Don Chiu
Noriyuki Sugihara
Original Assignee
Advantest Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Singapore Pte Ltd filed Critical Advantest Singapore Pte Ltd
Publication of TW200717932A publication Critical patent/TW200717932A/zh
Application granted granted Critical
Publication of TWI366956B publication Critical patent/TWI366956B/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889Interfaces, e.g. between probe and tester
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
TW095120036A 2005-10-19 2006-06-06 Zero insertion force printed circuit assembly connector system and method TWI366956B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/253,446 US7147499B1 (en) 2005-10-19 2005-10-19 Zero insertion force printed circuit assembly connector system and method

Publications (2)

Publication Number Publication Date
TW200717932A TW200717932A (en) 2007-05-01
TWI366956B true TWI366956B (en) 2012-06-21

Family

ID=37497182

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095120036A TWI366956B (en) 2005-10-19 2006-06-06 Zero insertion force printed circuit assembly connector system and method

Country Status (7)

Country Link
US (1) US7147499B1 (zh)
JP (1) JP2007115683A (zh)
KR (1) KR101284400B1 (zh)
CN (1) CN1953276B (zh)
DE (1) DE102006034396A1 (zh)
MY (1) MY142737A (zh)
TW (1) TWI366956B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060236495A1 (en) * 2005-04-25 2006-10-26 Romi Mayder Method and apparatus for non-contact cleaning of electronics
US7541819B2 (en) * 2005-10-28 2009-06-02 Teradyne, Inc. Modularized device interface with grounding insert between two strips
US7504822B2 (en) * 2005-10-28 2009-03-17 Teradyne, Inc. Automatic testing equipment instrument card and probe cabling system and apparatus
US20110117767A1 (en) * 2009-11-13 2011-05-19 Hiromitsu Sato Connector device
WO2011058643A1 (ja) * 2009-11-13 2011-05-19 株式会社データンク フラッシュメモリ用マガジン
US8896320B2 (en) * 2011-08-31 2014-11-25 Infineon Technologies Ag Measuring device and a method for measuring a chip-to-chip-carrier connection
US8933722B2 (en) 2011-08-31 2015-01-13 Infineon Technologies Ag Measuring device and a method for measuring a chip-to-chip-carrier connection
US9063170B2 (en) * 2012-12-27 2015-06-23 Teradyne, Inc. Interface for a test system
US9583845B1 (en) * 2015-10-27 2017-02-28 Dell Products, Lp Electrical connector for an information handling system
JP2020098747A (ja) * 2018-12-19 2020-06-25 タイコエレクトロニクスジャパン合同会社 インターポーザおよびインターポーザの製造方法
JP2024514321A (ja) * 2021-04-08 2024-04-01 テクトロニクス・インコーポレイテッド 高精度、高帯域幅スイッチング・アッテネータ関連アプリケーション

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6069483A (en) * 1997-12-16 2000-05-30 Intel Corporation Pickup chuck for multichip modules
JP2003344483A (ja) * 2002-05-31 2003-12-03 Fujitsu Ltd ハンドリング装置およびこれを使用した試験装置
US6744267B2 (en) * 2002-07-16 2004-06-01 Nptest, Llc Test system and methodology
US6833696B2 (en) 2003-03-04 2004-12-21 Xandex, Inc. Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment

Also Published As

Publication number Publication date
KR20070042901A (ko) 2007-04-24
CN1953276B (zh) 2010-10-06
KR101284400B1 (ko) 2013-07-09
MY142737A (en) 2010-12-31
DE102006034396A1 (de) 2007-06-28
CN1953276A (zh) 2007-04-25
JP2007115683A (ja) 2007-05-10
US7147499B1 (en) 2006-12-12
TW200717932A (en) 2007-05-01

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