TWI364462B - Melted salt bath, extraction article obtained by using the melted salt bath, a process for preparing a metal manufacture, and a metal manufacture - Google Patents
Melted salt bath, extraction article obtained by using the melted salt bath, a process for preparing a metal manufacture, and a metal manufacture Download PDFInfo
- Publication number
- TWI364462B TWI364462B TW094133635A TW94133635A TWI364462B TW I364462 B TWI364462 B TW I364462B TW 094133635 A TW094133635 A TW 094133635A TW 94133635 A TW94133635 A TW 94133635A TW I364462 B TWI364462 B TW I364462B
- Authority
- TW
- Taiwan
- Prior art keywords
- salt bath
- metal manufacture
- melted salt
- preparing
- article obtained
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 3
- 239000002184 metal Substances 0.000 title 2
- 150000003839 salts Chemical class 0.000 title 2
- 238000000605 extraction Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacture And Refinement Of Metals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004290519 | 2004-10-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200617187A TW200617187A (en) | 2006-06-01 |
TWI364462B true TWI364462B (en) | 2012-05-21 |
Family
ID=36142554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094133635A TWI364462B (en) | 2004-10-01 | 2005-09-28 | Melted salt bath, extraction article obtained by using the melted salt bath, a process for preparing a metal manufacture, and a metal manufacture |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080105553A1 (en) |
JP (1) | JP4785141B2 (en) |
KR (1) | KR100900117B1 (en) |
CN (1) | CN101035930B (en) |
DE (1) | DE112005002435B4 (en) |
TW (1) | TWI364462B (en) |
WO (1) | WO2006038476A1 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4883534B2 (en) * | 2008-03-26 | 2012-02-22 | 住友電気工業株式会社 | Molten salt bath, method for producing molten salt bath, and tungsten precipitate |
JP5532504B2 (en) * | 2009-03-05 | 2014-06-25 | 住友電気工業株式会社 | Photocatalytic element |
JP5568883B2 (en) * | 2009-03-27 | 2014-08-13 | 住友電気工業株式会社 | Molten salt bath and method for producing molten salt bath |
JP2011011366A (en) | 2009-06-30 | 2011-01-20 | Sumitomo Electric Ind Ltd | Method of manufacturing metal laminated structure |
JP5583985B2 (en) | 2010-02-19 | 2014-09-03 | 住友電気工業株式会社 | Metal laminated structure |
US20150010875A1 (en) * | 2012-01-31 | 2015-01-08 | Halotechnics, Inc. | Thermal energy storage with molten salt |
JP6405199B2 (en) * | 2013-11-19 | 2018-10-17 | 住友電気工業株式会社 | Electrodeposition electrolyte and method for producing metal film |
AU2015315441B2 (en) * | 2014-09-09 | 2020-10-29 | Clean Resources PTE. LTD. | A system, apparatus, and process for leaching metal and storing thermal energy during metal extraction |
CN105714332B (en) * | 2016-04-15 | 2019-03-22 | 华北理工大学 | A kind of method of fused salt electro-deposition vanadium |
EP3633076A4 (en) * | 2017-05-22 | 2021-03-03 | Sumitomo Electric Industries, Ltd. | Molten salt titanium plating solution composition and method for manufacturing titanium-plated member |
WO2018216319A1 (en) * | 2017-05-22 | 2018-11-29 | 住友電気工業株式会社 | Method for producing titanium-plated member |
US11352508B2 (en) * | 2018-01-19 | 2022-06-07 | Dynalene Inc. | Molten salt inhibitor and method for corrosion protection of a steel component |
JP7086172B2 (en) * | 2018-03-08 | 2022-06-17 | 住友電気工業株式会社 | Titanium-plated member manufacturing method and titanium-plated member |
JPWO2021176769A1 (en) * | 2020-03-04 | 2021-09-10 | ||
KR102306152B1 (en) * | 2021-03-19 | 2021-09-28 | 한국지질자원연구원 | Method for analyzing solubility of metal oxide using oxygen sensor, apparatus for analyzing solubility of metal oxide using oxygen sensor, metal refining apparatus using oxygen sensor, and metal refining method using oxygen sensor |
CN116855965B (en) * | 2023-09-04 | 2023-11-14 | 浙江百能科技有限公司 | PTA alkali recovery furnace molten salt separation and purification device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2786809A (en) * | 1953-09-30 | 1957-03-26 | Horizons Titanium Corp | Electrolytic cladding |
BE640801A (en) * | 1963-02-18 | |||
CA2012009C (en) * | 1989-03-16 | 1999-01-19 | Tadashi Ogasawara | Process for the electrolytic production of magnesium |
DK169354B1 (en) * | 1992-07-08 | 1994-10-10 | Danfoss As | Melting bath and method for electrolytic surface coating with refractory metals from fluoride-containing salt melts |
US6187168B1 (en) * | 1998-10-06 | 2001-02-13 | Aluminum Company Of America | Electrolysis in a cell having a solid oxide ion conductor |
JP3594530B2 (en) * | 2000-03-30 | 2004-12-02 | 独立行政法人 科学技術振興機構 | Tantalum plating method |
DK174876B1 (en) * | 2001-02-26 | 2004-01-12 | Danfoss As | Implant and implant surface modification process |
JP2004084059A (en) * | 2002-07-04 | 2004-03-18 | Sumitomo Electric Ind Ltd | Die for plating with fine pattern, fine metal structure, die for fine working, method for producing die for plating with fine pattern, and method for producing fine metal structure |
JP4636563B2 (en) * | 2004-11-24 | 2011-02-23 | 住友電気工業株式会社 | Molten salt bath and method for producing metal deposit |
-
2005
- 2005-09-22 DE DE112005002435.0T patent/DE112005002435B4/en not_active Expired - Fee Related
- 2005-09-22 JP JP2006539225A patent/JP4785141B2/en not_active Expired - Fee Related
- 2005-09-22 US US11/664,095 patent/US20080105553A1/en not_active Abandoned
- 2005-09-22 KR KR1020077009342A patent/KR100900117B1/en active IP Right Grant
- 2005-09-22 WO PCT/JP2005/017510 patent/WO2006038476A1/en active Application Filing
- 2005-09-22 CN CN2005800335362A patent/CN101035930B/en not_active Expired - Fee Related
- 2005-09-28 TW TW094133635A patent/TWI364462B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200617187A (en) | 2006-06-01 |
DE112005002435B4 (en) | 2014-01-02 |
CN101035930B (en) | 2012-12-12 |
JPWO2006038476A1 (en) | 2008-05-15 |
KR20070058649A (en) | 2007-06-08 |
JP4785141B2 (en) | 2011-10-05 |
US20080105553A1 (en) | 2008-05-08 |
DE112005002435T5 (en) | 2007-08-30 |
CN101035930A (en) | 2007-09-12 |
KR100900117B1 (en) | 2009-06-01 |
WO2006038476A1 (en) | 2006-04-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |