1360873 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種晶片打線技術，特別是一種用於晶片 打線製程的支架固定結構。 【先前技術】 隨著半導體製程技術的進步與積體電路的密度不斷增 加，構裝元件之引腳愈來愈多也越來越精細，而對速度之要 求亦愈來愈快，使得製作體積小、速度快及高密度之構裝元 件己成趨勢。 於半導體封裝製程中，主要包括有黏晶、打線與封裝等 主要步驟，當晶片黏貼至基板後，使用熱板及壓板將晶片與 基板固定於打線機台上以利打線作業，但由於導線架製作其 引腳越做越精細，現行之打線機台無法在熱板上開設真空孔 以固定導線架而影響製程良率。 一種習知的打線製程如第1A圖與第1B圖所示，當晶 片10設置於導線架20上後，須進行打線製程以電性連接晶 片10與導線架20的引腳22。當鋼嘴30在拉線過程中會施 予引腳22 —個向下的施力，使得引腳22上下晃動甚至彎折， 此嚴重影響打線製程的穩定度。 【發明内容】 為了解決上述問題，本發明目的之一係提供一種支架固定 結構，利用支撐構件支撐導線架的引腳以避免打線製程中引 腳受鋼嘴施力上下晃動而影響打線穩定度。 5 I36Q873 本發明目的之一係提供一種支架固定結構，利用在 上相對於支撐構件的位置開設真空孔以解決彡丨腳太過細资益「、承板 在引腳下獨設真空孔的顺。 减法直接 為了達到上述目的，本發明-實施例之支架 用於一晶片打線製程，此支架固定結構包含：—導二楫， 具有複數個晶片承座及複數個引腳環繞設晉^曰支架 且A曰曰片承座Η 緣；其中晶片承座係用以承載複數個晶片。複數個支 = 设置於引腳之下表面。一導熱承板設置於導線架支架^ 4 支撐構件接觸，其中複數個真空吸孔設置於導熱承 與 吸孔係分佈於導熱承板與支撐構件之接觸區域。、以及且j空 板設置於導線架支架上方’其中壓板具有複數個窗口以^ 出導線架支架之上表面的打線區域。 以下藉由具體實施例配合所附的圖式詳加說明，备 易瞭解本發明之目的、技術内容、特點及其所達成之2戈谷 【實施方式】 以限 其詳細說明如下，所述較佳實施例僅做一 定本發明。 F用 首先，請先參考第2A圖及第2B圖，第2八圖為本 施例之導線架支架結構俯視圖；第怨圖所示為 實 架固定結構之結構示意圖。此實關之支架 = -晶片打線製程，此支架固定結構包括:一導線架= 於 導線架支架100具有複數個晶片i 個：’ =置於晶片承座U。周緣，其中晶片承】== 載的片120,之後晶片12〇再利用打線技 、承 導通。複數個支樓構件200設置於引腳„/之下= 6 1360873 構件200 ’意即，於導熱承板300上開設槽孔讓出支撐構件200之 位置’此更有利於導熱承板300與導線架支架100及晶片12〇之熱能 傳遞。 接著’ s青參考第3A圖’第3A圖為本發明不同實施例之支撐構 件設置於導線架支架引腳下表面的仰視圖β由於支撐構件2〇〇係用來 承受鋼嘴向下之施力，故可以理解的是，支撐構件200只要是可撐住 欲打線之引腳112 ’其形狀應不受限’如圖所示，其可為柱狀、球狀、 條狀或是幾何形狀。此外，除了如第3Α圖所示支撐構件可以是由複 數個獨立的支撐物(如支撐物202、204)分別支撐欲打線之引腳112 ; 或由數條條狀支撐物(如支撐物2〇6、207及208)同時支撐數個引腳i 12 外，更可由一個單獨的支撑物(如支撐物21〇)支撲所有引腳η]或所 有欲打線的引腳，請參考第3B圖所示。另外，請參考第圖與第 3D圖，支撐構件(支樓物212、214)亦可對稱或不對稱設置於引腳 的下表面。 根據上述，本發明的特徵之一，利用支撐構件設置於導線架支 架引腳的下表面以避免打線製程時引腳過度晃動，其中支撐構件可由 複數個獨立的支撐物所構成；或是，數個絲的支撐物同時支標數個 引腳；亦献，-如環狀的支撐_時支觸有引腳或是欲打線的引 腳。此外’續構件的形狀更可依則腳位置、形狀或大小作不同設 計’製程上相當彈性。另，不需更改現有打線機台 的結構即 可改善打線時引腳晃動的問題。 综合上述，本發明係提供一種支架固定結構，利用支樓構件 支撐導線架引腳以避免打線製程中弓丨腳受鋼嘴施力而上下晃 動，導《彡響打線穩定度。此外，利用在導熱承板上相對於支撐 構件的位μ設解決⑽太過細密無法直接在⑽下方開 設真空孔的問題。 8 1360873 以上所述之實施例僅係為說明本發明之技術思想及特 點，其目的在使熟習此項技藝之人士能夠瞭解本發明之内容 並據以實施，當不能以之限定本發明之專利範圍，即大凡依 本發明所揭示之精神所作之均等變化或修飾，仍應涵蓋在本 發明之專利範圍内。 【圖式簡單說明】 第1A圖及第1B圖為習知支架固定結構局部剖視圖。 第2A圖為本發明一實施例之導線架支架結構俯視圖。 第2B圖及第2C圖所示為根據本發明支架固定結構之結構示 意圖。 第2D圖所示為根據本發明又一實施例之支架固定結構之結 構示意圖。 第3A圖、第3B圖、第3C圖及第3D圖為本發明不同實施例 之支撐構件設置於導線架支架引腳下表面的仰視圖。 【主要元件符號說明】 10 晶片 20 導線架 22 引腳 30 鋼嘴 100 導線架支架 110 晶片承座 9 1360873 112 引腳 120 晶片 130 銲塾 200 支撐構件 202,204,206,208,208,210,212,214 支撐物 300 導熱承板 302 真空吸孔 304 凹槽 400 壓板 402 窗口 500 鋼嘴1360873 IX. Description of the Invention: [Technical Field] The present invention relates to a wafer wire bonding technique, and more particularly to a stent fixing structure for a wafer wire bonding process. [Prior Art] With the advancement of semiconductor process technology and the increasing density of integrated circuits, the pins of the components are becoming more and more fine, and the requirements for speed are getting faster and faster, making the production volume Small, fast and high-density components have become a trend. In the semiconductor packaging process, the main steps include die bonding, wire bonding and packaging. After the wafer is pasted to the substrate, the wafer and the substrate are fixed on the wire bonding machine using a hot plate and a pressing plate to facilitate the wire bonding operation, but the wire frame is used. As the pins are made finer and finer, the current wire-bonding machine cannot open vacuum holes on the hot plate to fix the lead frame and affect the process yield. A conventional wire bonding process is shown in Figs. 1A and 1B. When the wafer 10 is placed on the lead frame 20, a wire bonding process is required to electrically connect the wafer 10 and the leads 22 of the lead frame 20. When the steel nozzle 30 is in the process of pulling the wire, a downward force is applied to the pin 22, so that the pin 22 is shaken up and down or even bent, which seriously affects the stability of the wire bonding process. SUMMARY OF THE INVENTION In order to solve the above problems, one object of the present invention is to provide a bracket fixing structure that supports a lead frame of a lead frame by using a supporting member to prevent the lead wire from being shaken up and down by the force of the steel nozzle in the wire bonding process to affect the wire stability. 5 I36Q873 One of the objects of the present invention is to provide a bracket fixing structure, which utilizes a vacuum hole at a position relative to the supporting member to solve the problem that the foot is too thin, and the vacuum hole of the carrier plate is provided under the pin. Subtraction directly In order to achieve the above object, the stent of the present invention is used for a wafer wire-bonding process, and the stent-fixing structure comprises: a guiding die, a plurality of wafer sockets and a plurality of pins surrounding the mounting bracket and A chip holder is used for carrying a plurality of wafers. The plurality of supports are disposed on the lower surface of the lead. A heat conducting plate is disposed on the lead frame support ^ 4 supporting member contact, wherein the plurality The vacuum suction holes are disposed in the contact area between the heat conduction bearing and the suction hole in the heat conducting plate and the supporting member, and the j empty plate is disposed above the lead frame bracket. The pressing plate has a plurality of windows to output the lead frame bracket. The wire bonding area of the upper surface. The following is a detailed description of the specific embodiments and the accompanying drawings, and the purpose, technical content, characteristics and the achieved 2 are easily understood. [Embodiment] The detailed description is as follows, and the preferred embodiment only makes a certain invention. F First, please refer to FIG. 2A and FIG. 2B, and FIG. 2 is the lead frame of the embodiment. The top view of the bracket structure; the second figure shows the structure of the fixed structure of the frame. The bracket of the actual frame = - wafer wire-laying process, the frame fixing structure includes: a lead frame = the lead frame bracket 100 has a plurality of wafers i : ' = placed on the wafer holder U. The periphery, where the wafer is loaded === the loaded sheet 120, after which the wafer 12〇 is reused by the wire bonding technique, and the through-wire is passed. The plurality of branch members 200 are placed under the pin „/= 6 1360873 The member 200' means that a slot is formed in the heat conducting plate 300 to give a position of the support member 200. This is more advantageous for the heat transfer of the heat conducting plate 300 and the lead frame holder 100 and the wafer 12. Next, 's Qing refers to FIG. 3A'. FIG. 3A is a bottom view of the support member of the different embodiments of the present invention, which is disposed on the lower surface of the lead frame of the lead frame bracket, because the support member 2 is used to withstand the downward direction of the steel mouth. Therefore, it can be understood that the support member 200 can be a column, a ball, a strip or a geometric shape as long as it can support the pin 112 of the wire to be drawn. . In addition, the support member may be supported by a plurality of independent supports (such as supports 202, 204) for supporting the pins 112 to be wired, or by a plurality of strip supports (such as the support 2). 〇6, 207 and 208) support a number of pins i 12 at the same time, and a single support (such as support 21〇) can be used to slap all pins η] or all the pins to be wired. Please refer to section 3B. The figure shows. In addition, referring to the figures and 3D, the support members (the branches 212, 214) may also be symmetrically or asymmetrically disposed on the lower surface of the pin. According to the above, one of the features of the present invention is that the support member is disposed on the lower surface of the lead frame bracket pin to avoid excessive sway of the lead during the wire bonding process, wherein the support member may be composed of a plurality of independent supports; or The support of the wire supports several pins at the same time; also, - such as the ring support _ when the contact pin or the wire to be wired. In addition, the shape of the continuation member can be made different depending on the position, shape or size of the foot. In addition, the problem of pin sway during wire bonding can be improved without changing the structure of the existing wire machine. In summary, the present invention provides a bracket fixing structure, which utilizes a support member to support the lead frame pins to prevent the bow and the foot from being shaken up and down by the force of the steel nozzle during the wire-drawing process, and guides the stability of the click line. Further, the problem of (10) being too fine to directly open the vacuum hole under (10) is solved by the position μ on the heat-conductive plate relative to the support member. 8 1360873 The embodiments described above are merely illustrative of the technical spirit and characteristics of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the contents of the present invention and to implement the patents of the present invention. </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1A and 1B are partial cross-sectional views of a conventional stent fixing structure. 2A is a top plan view of a lead frame support structure according to an embodiment of the present invention. Figs. 2B and 2C are views showing the structure of the stent fixing structure according to the present invention. Fig. 2D is a view showing the structure of a stent fixing structure according to still another embodiment of the present invention. 3A, 3B, 3C, and 3D are bottom views of the support members of the different embodiments of the present invention disposed on the lower surface of the lead frame bracket pins. [Main component symbol description] 10 Wafer 20 Lead frame 22 Pin 30 Steel nozzle 100 Lead frame holder 110 Wafer holder 9 1360873 112 Pin 120 Wafer 130 Weld 200 Support members 202, 204, 206, 208, 208, 210, 212, 214 Support 300 Thermal support plate 302 Vacuum suction hole 304 Groove 400 platen 402 window 500 steel mouth