^59420 # . 申請補充、修正之日期：民國丨00年8月丨1日 , 九、發明說明： 【發明所屬之技術領域】 本發明為一種光路裝置，特別是一種微型光學讀取頭 光路裝置模組。 【先前技術】 • /光學碩取頭模組為光碟機中至為關鍵的零組件，主要 -春，產生微小光點以頦取光碟片（c〇mPact Disk)所儲存之 資，。光碟機為了能快速且連續地讀取資料，光碟片必須 作尚速的旋轉運動，而光學讀取頭模組也需配合光碟片之 運動而擷取其上之資料訊號。 傳統之光學頭之基本構造，包含有雷射二極體（Laser^59420 # . Date of application for supplementation and revision: August 1st, 1989, IX. Invention: Technical Field of the Invention The present invention relates to an optical path device, and more particularly to a micro optical pickup optical path device. Module. [Prior Art] • The optical pick-up head module is the key component in the CD-ROM, mainly in spring, producing tiny spots of light to capture the storage of the disc (c〇mPact Disk). In order to read data quickly and continuously, the optical disc must perform a rotating motion at a speed, and the optical pickup module also needs to capture the data signal on the optical disc. The basic structure of the traditional optical head, including the laser diode (Laser
Dl0de，LD)、光學鏡片、光學偵測器（Photodetector，PD)、 致動器（Actuator)與承載機構（Carriage)等；而其光 束之動線由雷射光束經分光鏡分光後，以物鏡（〇b j ect i ve 鲁 Lens)聚焦’最後成像光碟片上，而被光碟片反射後的光 束循原路返回，通過分光鏡後收集於光偵測器上。 習知之光學讀取頭係將雷封二極體u、光偵測器16 及光學鏡片10，11，12，13，15等組裝於一殼體内，每個 兀件之固定角度及相對位置均需相當精確，如第1圖所 示’即疋一習知之傳統光學讀取頭之示意圖。由雷射二極 體14發出之光束’經分光鏡（Beam Splitter) 13分光之 後，經由準直透鏡（Collimating Lens)形成一平行光束， 最後為物鏡1〇聚焦在光碟片的紀錄面上。經由紀錄面上的 5 1359420 申請補充、修正之日期：民國100年8月u日 坑洞而反射出不同的光訊號，而這些光訊號則循原光路徑 並通過分光鏡13後再聚焦至光感測器16。 習知之光學讀取頭不僅元件繁多且組裝複雜，且還需 要佔用相當之空間才能完成所有的光程。 例如最早揭露於美國專利公報4731772號，以燒射光 學元件（Diffractive Optical Element，D0E)替代部分 之傳統光學元件，以形成積體化光學模組（I ntegrated Optical Unit，I0U)之架構’如第2圖所示，除可簡化元 件之數量外，更可縮小體積與重量，達成光學頭微型化之 目的。然而此光學頭僅將部分光學元件積體化，雖可縮小 光學頭體積，但仍無法達成光學頭整體積體化之目的。於 是有如第3圖揭露於美國專利公報6717893號，以及如第 4 圖發表於 IEEE Transaction on Magnetics 期刊（ν〇 1 41Dl0de, LD), optical lens, optical detector (Photodetector, PD), actuator (Actuator) and carrier mechanism (Carriage); and the moving line of the beam is split by the laser beam through the beam splitter, the objective lens (〇bj ect i ve Lu Lens) focuses on the final imaging disc, and the beam reflected by the disc returns to the original path, passes through the beam splitter and is collected on the photodetector. The optical reading head of the prior art assembles the lightning sealing diode u, the photodetector 16 and the optical lenses 10, 11, 12, 13, 15 and the like into a casing, and the fixed angle and relative position of each of the components Both need to be quite accurate, as shown in Figure 1, which is a schematic diagram of a conventional optical pickup. The beam emitted by the laser diode 14 is split by a Beam Splitter 13 to form a parallel beam through a Collimating Lens, and finally the objective lens 1 is focused on the recording surface of the disc. The date of application for supplementation and correction via 5 1359420 on the record surface: different optical signals are reflected in the potholes of the Republic of China on August u, and these optical signals follow the original light path and pass through the beam splitter 13 and then focus on the light. Sensor 16. Conventional optical pickups are not only complicated in components but also complicated in assembly, and require a considerable amount of space to complete all optical paths. For example, it is first disclosed in U.S. Patent No. 4,731,772, which replaces a portion of a conventional optical component with a Diffractive Optical Element (D0E) to form an integrated optical unit (I0U) structure. As shown in Fig. 2, in addition to simplifying the number of components, the volume and weight can be reduced, and the optical head can be miniaturized. However, this optical head only integrates a part of the optical elements, and although the volume of the optical head can be reduced, the objective of the optical head is not achieved. Thus, as shown in Figure 3, it is disclosed in U.S. Patent No. 6,671,893, and as shown in Figure 4 in the IEEE Transaction on Magnetics Journal (ν〇 1 41).
No. 2，p. 1058-1060 )之設計架構’進一步將光學頭中包 含物鏡在内之所有元件以微光學元件之方式製作，並整合 成一體之積體化光學頭設計，此兩種設計需另外製作及組 裝一 45度反射鏡，使侧向型雷射光路改變。 另有如第5圖之技術，為利用微機電技術整合—三維 聚焦準直透鏡、分光鏡（BeamSplitter)及體型微加工之 45度反射鏡。此技術可達自動對準及積體化之目的，但鏡 面須以機械結構控制或制動，因此週遭佈滿微结構，對於 空間有效利用能力較低，且體積不易縮小。 故综合以上所述，歸納可發現，習知技術之主要缺點： (1)製程複雜且困難，整體良率不易提高； 6 1359420 ’請補充、修正之曰期：民國100年8月„曰 (2)無法真正有效微小化，因設計製程整合度不高無法將所 " 需之元件整合於同一晶片上；以及 (3)實際上之結構封裝有其相當困難度，故無法符合實際需 求。 故綜上所言，市場上迫切需要一種更具整合性、一體 性及低成本的製程以解決前述光學讀取頭模組所存在之門 題。尤其曰後藍光或HD-DVD高密度儲存世代即將來臨元 ，件尺寸更小，組裝之難度更高，因此積體化光學系統架構 •籲為未來極重要之發展方向。 【發明内容】 本發明為積體化微型光學讀取頭光路裝置，以第一微 稜鏡、第二微棱鏡與第二微稜鏡形成，其可貼附於具有全 像光學元件之玻璃基板上。 • 本發明為積體化微型光學讀取頭光路裝置，包括了一 入各疋丄々 υ 取所、仍现口又"、王I》7TQ字元件上 可採用一個或一個以上之光偵測器，且每 有一個或一個以上之受光區。No. 2, p. 1058-1060) The design structure 'furtherly fabricates all the components including the objective lens in the optical head as micro-optical elements, and integrates them into an integrated optical head design. These two designs A 45 degree mirror is required to be fabricated and assembled to change the lateral laser path. Another technique, as shown in Figure 5, is the integration of a micro-electromechanical technology—a three-dimensional focusing collimating lens, a beam splitter (BeamSplitter), and a 45-degree mirror for body micromachining. This technology can achieve the purpose of automatic alignment and integration, but the mirror must be controlled or braked by mechanical structure, so it is surrounded by micro-structures, which has low space utilization ability and is not easy to shrink in size. Therefore, based on the above, it can be found that the main disadvantages of the prior art are: (1) The process is complicated and difficult, and the overall yield is not easy to improve; 6 1359420 'Please add and amend the flood season: August of the Republic of China 曰 曰 ( 2) It can't be really effective and miniaturized. Because the design process integration is not high, it is impossible to integrate the required components on the same chip; and (3) the actual structure package has its difficulty, so it cannot meet the actual needs. Therefore, in summary, there is an urgent need for a more integrated, integrated and low-cost process in the market to solve the problems of the aforementioned optical pickup module, especially the high-density storage generation of Blu-ray or HD-DVD. As the coming element is smaller, the size of the piece is smaller, and the assembly is more difficult. Therefore, the integrated optical system architecture is called the development direction of the future. SUMMARY OF THE INVENTION The present invention is an integrated optical optical pickup optical path device. Formed by a first micro 稜鏡, a second microprism and a second micro 稜鏡, which can be attached to a glass substrate having a holographic optical element. • The invention is an integrated optical path of the optical optical pickup One, one or more light detectors may be used on the 7TQ word component, and each one or more light receiving zones may be included in the device. .
基板，且一雷射二極體位於基板上。第一微稜鏡於基板上， _ 且位於雷射二極體旁。第二微稜鏡於基板上，且位於第— 微稜鏡側邊旁，其中第一微稜鏡與第二微稜鏡成一固定之 夾角。第三微稜鏡於基板上，且位於第二微稜鏡之相對位 置。其中第一至第三微棱鏡之反射面呈45度之反射鏡面， 但並不受限於該特定之角度。全像光學元件，裝設於第-微稜鏡與第三微稜鏡上方。聚焦物鏡設於全像光學 T 方。光偵測器，γ 個光偵測器上具有 7 1359420 申請補充、修正之日期：民國100年8月1丨日 一種微型積體化光學讀取頭裝置之讀寫運作方法，包 含了以下步驟： 一雷射二極體發射一雷射光束，以水平方向入射一第 一微稜鏡。該雷射光束經由該第一微稜鏡之反射，垂直入 射該第二微稜鏡。該雷射光束經由該第二微棱鏡反射，水 平入射一第三微棱鏡。該雷射光束經由該第三微稜鏡反 射，通過一全像光學元件。該雷射光束自該全像光學元件 通過，到達聚焦物鏡，聚焦於一光碟片表面。該雷射光束 自經該光碟片反射，成為一讀取光束反折回。 讀取光束通過該聚焦物鏡，被全像光學元件繞射成為 一階或多階繞射光束。該繞射光束被該第三微稜鏡及第二 微稜鏡反射，進入該光偵測器之該受光區上，產生一讀取 訊唬，完成該微型積體化光學讀取頭裝置之讀寫運作。 本發明可大為簡化元件之製作，且簡化系統組裝之複 雜度’具體實現光學頭積體化之目的。 故而，關於本發明之優點與精神可以藉由以下發明詳 述及所附圖式得到進一步的瞭解。 【實施方式】 本案將由以下實施例之說明而得充分瞭解，亦使熟習 ^技藝之人士可據以完成之，惟本案之實施並非由下^ 施案例而所限制其實施型態。 如第6圖所示之本發明微型積體化光學讀取頭 Phcal Pickup Head)光路裴置之較佳實施例，其中包 8 1359420 申請補充'修正之日期：民國100年8月丨1日 含之元件如下詳述： 如第6圖所示之基板60,係用以置放各式元件於其上。 如第6圖所示之雷射二極體（LD) 61位於基板60上， 雷射二極體之發射光束波長通常為650nm或405nm。 如第6圖所示之第一微棱鏡（Microprism) 62於基板 60上，且位於雷射二極體（LD) 61側邊旁。 如第6圖所示之第二微稜鏡63於基板60上，且位於 第一微稜鏡（Microprism) 62側邊旁。其中第一微棱鏡62 與第二微稜鏡63成一固定之夾角，該夾角可互成90度， 但並不受限於90度。 如第6圖所示之第三微稜鏡64於基板60上，且位於 第二微稜鏡63之相對位置。其中第一至第三微棱鏡之反射 面呈45度之反射鏡面，但並不受限於該特定之角度。 如第6圖所示之全像光學元件（Holographic Optical Element, HOE)65，裝設於第二微棱鏡63與第三微棱鏡64 上方。 如第6圖所示之聚焦物鏡66，設於全像光學元件65 上方。 如第6圖所示之光偵測器68,而本發明之光學系統可 採用一個或一個以上之光偵測器，且每個光偵測器68上具 有一個或一個以上之受光區。 而本發明積體化光學頭光路裝置之讀寫運作方法，亦 如第6圖所示。 首先，如第6圖所示，邊射型雷射二極體61發射雷 9 1359420 申請補充、修正之日期：民國100年8月11曰 射光束，以水平方向入射第一微棱鏡62。 再如第6圖所示，雷射光束經由第一微稜鏡π之反 射後’垂直入射第二微稜鏡63。 又如第6圖所示，雷射光束再經由第二微棱鏡63之 反射後水平入射第三微棱鏡64。 再如第6圖所示，雷射光束經由第三微稜鏡64之反 射後，通過全像光學元件65。 仍如第6圖所示，雷射光束自全像光學元件65通過 後到達聚焦物鏡66，而聚焦於光碟片67表面。 亦如第6圖所示，經光碟片67反射後成為讀取光束， 循原路返回。 如第6圖所示，讀取光束在通過聚焦物鏡66後，會 被全像光學元件65所繞射成為繞射光束。 且如第6圖所示，其繞射光束依序被第三微稜鏡64、 以及被第二微稜鏡63反射後，最後進入光偵測器之受光區 上’產生聚焦、循執與讀取之訊號並完成整個光束之讀寫 過程。 本發明共採用了三個微稜鏡’除了可使光束反射、且 可支樓全像光學元件65、以及物鏡66之間隔外，其重要 目的是利用光束之多次反射與多次的偏折後，可縮小光學 頭之實體尺寸，以達到微型化之目的。 第7圖所示為本發明相關元件之配置上視圖，已標示 出本發明各光學元件之最佳配備位置。 第8圖所示為使用光學設計分析軟體，對本發明實施 1359420 申請補充、修正乞曰期：民國100年8月丨1日 例進行光學系統模擬以得到之光路設計圖，故可驗證本發 明之可行性。 第9圖所示為以光學設計架構所模擬計算出之聚焦誤 差訊號（Focus Error Signal, FES) ’即所謂之S曲線 (S-Curve)。故透過前述第8圖與第9圖之電腦模擬分析， 已具體驗證本發明之實施可行性。 第10A〜10Q圖為本發明形成棱鏡的方法之第一較佳實 鲁 施例’其製造步驟如第10A〜10Q圖所示： 如第10A圖所示’提供一玻璃晶片1〇1。 如第10B圖所示’沉積一厚度約150nm的鋁金屬層102 在破璃晶片101上’以作為對準層（Alignment Layer)。 如第10C圖所示，形成一光阻層（即第一光阻層）ι〇3 於紹金屬層1〇2上。 如第10D圖所示，使用曝光光罩104於第一光阻層1〇3 正上方。 • 如第10E圖所示，進行曝光、顯影以形成所需圖案於 第一光阻層103上。 如第10F圖所示’調配銘金屬之飯刻液，以進行餘刻 紹金屬層1〇2。 如第10G圖所不，移去第一光阻層1〇3。 如第10H圖所示，塗佈厚膜光阻層（即第二光阻層） 1〇5以形成稜鏡（Prism)結構層，並經軟烤（s〇ftBack) 程序。 如第101圖所示’使用第二曝光光罩，以第一傾 1359420 申請補充、修正之日期：民國100年8月11曰 斜角度進行第一次傾斜曝光。 如第10J圖所示，回復原先第一水平位置，可見第一 傾斜結構107已形成。 如第10K圖所示，以第二次傾斜角度進行第二次傾斜 曝光.，第一傾斜角度與第二傾斜角度為不同之相反角度。 如第10L圖所示，回復原先第二水平位置，可見第二 傾斜結構108已形成，且與第一傾斜結構107成交叉形狀。 如第10M圖所示，除去第二曝光光罩106。 如第10N圖所示，顯影第二光阻層105。 如第100圖所示，於玻璃晶片101上形成的K型 (K-type)稜鏡（Prism)結構，即第一傾斜結構107與第 二傾斜結構108所構成之K型稜鏡結構。 如第10P圖所示，切割一玻璃晶片101與K型棱鏡結 構，以成為適當大小尺寸的複數片玻璃晶片101與K型稜 鏡結構。 如第10Q圖所示，以金屬光罩進行蒸鍍鍍膜製程。即 以圖10P之晶片，以特定傾斜角度，進行習之技藝之蒸鍍 鑛膜形成反射面金屬沉積。 在第10P圖所示之製程後，另如第11A〜11D圖所示， 本發明形成稜鏡的方法之第二較佳實施例，其製造步驟如： 如第11A圖，進行翻模製程（PDMS)。在第11A圖中，具有 底材1101，高分子層1102，翻模層121，K型棱柱狀結構 棱鏡123。 如第11B圖，將所形成之K型稜柱狀結構經翻膜121 12 1359420 申請補充、修正之曰期：民國100年8月11日 後’沉積電鑄黏著層（Drawing of Pattern) 122。 如第11C圖所示’以電鍀（Eiectroforming)方法於 121間形成棱鏡123。 如第11D圖所示，脫模除去層121，並翻轉後即可得 到完整K型稜柱狀結構稜鏡123。而其中本發明之第一稜 鏡與第二稜鏡皆可採用一體成形之積體化製程製作。 以上所述僅為本發明之較佳實施例而已，並非用以限 春定本發明之申請專利範圍；凡其它未脫離本發明所揭示之 精神下所完成之等效改變或修飾，均應包含在下述之申請 專利範圍内。 【圖式簡單說明】 第1圖所示傳統光學讀取頭示意圖 第2圖所示傳統光學讀取頭示意圖 第3圖所示傳統光學讀取頭示意圖 φ 第4圖所示傳統光學讀取頭示意圖 第5圖所示傳統光學讀取頭示意圖 第6圖所示之本發明微型積體化光學讀取頭光路震置 第7圖所示為本發明相關元件之配置上視圖 第8圖所示為使用光學設計分析軟體 第9圖所示為所模擬計算出之聚焦誤差訊號 第10A〜10Q圖為本發明形成稜鏡的方法之第一較佳實施例 第11A 11D圖為本發明形成棱鏡的方法之第二較佳實施例 13 1359420 申請補充、修正之曰期：民國100年8月11曰 【主要元件符號說明】 60基板 61雷射二極體 62第一微稜鏡 63第二微稜鏡 64第三微棱鏡 65全像光學元件 66聚焦物鏡 67光碟片 68光偵測器 101玻璃晶片 10 2紹金屬層 103第一光阻層 104曝光光罩 105第二光阻層 106第二曝光光罩 107第一傾斜結構 108第二傾斜結構 111玻離晶片 112高分子層 113第三光阻層 114第一部分稜枉狀結構稜鏡結構 115第二稜柱狀結構稜鏡 121翻模層 14 1359420 申請補充、修正之日期：民國100年8月11曰A substrate and a laser diode are disposed on the substrate. The first is slightly on the substrate, _ and is located next to the laser diode. The second micro-twist is on the substrate and is located beside the side of the first micro-twist, wherein the first micro-turn and the second micro-turn form a fixed angle. The third is slightly on the substrate and is located at the opposite position of the second micro-turn. The reflecting surfaces of the first to third microprisms are mirrored at 45 degrees, but are not limited to the specific angle. The holographic optical element is mounted above the first micro- and the third micro-turn. The focusing objective is located on the holographic T-square. Photodetector, gamma photodetector with 7 1359420 application supplement, date of revision: August 1st, 100, 100, a micro-integrated optical read head device read and write operation method, including the following steps : A laser diode emits a laser beam, and a first micro-turn is incident in a horizontal direction. The laser beam is reflected by the first micro-turn and vertically incident on the second micro-turn. The laser beam is reflected by the second microprism and horizontally incident on a third microprism. The laser beam is reflected by the third micro-turn through a holographic optical element. The laser beam passes from the holographic optical element to the focusing objective and is focused on the surface of a disc. The laser beam is reflected from the optical disk and becomes a read beam that is folded back. The read beam passes through the focusing objective and is diffracted by the holographic optical element into a first or more order diffracted beam. The diffracted beam is reflected by the third micro-turn and the second micro-turn, enters the light-receiving area of the photodetector, and generates a read signal to complete the micro-integrated optical pickup device. Read and write operations. The present invention greatly simplifies the fabrication of components and simplifies the complexity of system assembly, and specifically achieves the purpose of integrating optical heads. Therefore, the advantages and spirit of the present invention can be further understood from the following detailed description of the invention and the accompanying drawings. [Embodiment] The present invention will be fully understood from the description of the following embodiments, and the skilled person can accomplish the same, but the implementation of the case is not limited by the implementation of the case. A preferred embodiment of the optical circuit device of the present invention, as shown in Fig. 6, wherein the package 8 1359420 is supplemented with the date of the amendment: the date of the Republic of China, August 1 The components are detailed as follows: The substrate 60 as shown in Fig. 6 is used to place various components thereon. A laser diode (LD) 61 as shown in Fig. 6 is located on the substrate 60, and the wavelength of the emission beam of the laser diode is usually 650 nm or 405 nm. A first microprism 62 as shown in Fig. 6 is on the substrate 60 and is located beside the side of the laser diode (LD) 61. The second micro-iridium 63, as shown in Fig. 6, is on the substrate 60 and is located beside the side of the first microprism 62. The first microprism 62 and the second micro-clip 63 form a fixed angle, and the angles can be 90 degrees with each other, but are not limited to 90 degrees. The third micro-turn 64, as shown in Fig. 6, is on the substrate 60 and is located at the opposite position of the second micro-strip 63. The reflecting surfaces of the first to third microprisms are mirrored at 45 degrees, but are not limited to the specific angle. A Holographic Optical Element (HOE) 65 as shown in FIG. 6 is disposed above the second microprism 63 and the third microprism 64. A focusing objective 66 as shown in Fig. 6 is disposed above the hologram optical element 65. The photodetector 68 is shown in Fig. 6, and the optical system of the present invention can employ one or more photodetectors, and each photodetector 68 has one or more light receiving regions thereon. The method for reading and writing the optical path device of the integrated optical head of the present invention is also shown in Fig. 6. First, as shown in Fig. 6, the edge-emitting type laser diode 61 emits a thunder. 9 1359420 The date of application for supplementation and correction: on August 11th, the Republic of China, a beam of light is incident on the first microprism 62 in a horizontal direction. Further, as shown in Fig. 6, the laser beam is incident perpendicularly to the second pupil 63 via the first pupil π. As also shown in Fig. 6, the laser beam is reflected by the second microprism 63 and then incident horizontally on the third microprism 64. As shown in Fig. 6, the laser beam is reflected by the third micro-strip 64 and passed through the holographic optical element 65. Still as shown in Fig. 6, the laser beam passes through the holographic optical element 65 and reaches the focusing objective 66 to focus on the surface of the optical disk 67. As shown in Fig. 6, after being reflected by the optical disk 67, it becomes a reading beam and returns as it is. As shown in Fig. 6, after the reading beam passes through the focusing objective 66, it is diffracted by the holographic optical element 65 into a diffracted beam. And as shown in FIG. 6, the diffracted beam is sequentially reflected by the third micro- 64 and after being reflected by the second micro- 63, and finally enters the light-receiving area of the photodetector to generate focus, cycle and Read the signal and complete the reading and writing process of the entire beam. The invention adopts three micro-turns, except that the light beam can be reflected, and the holographic optical element 65 and the objective lens 66 can be spaced apart, and the important purpose is to utilize multiple reflections of the light beam and multiple deflections. After that, the physical size of the optical head can be reduced to achieve miniaturization. Figure 7 is a top plan view showing the arrangement of the components of the present invention, showing the optimum position of the optical components of the present invention. Figure 8 shows the optical design of the invention using the optical design analysis software, and the application of the 1359420 application of the present invention is supplemented and revised: the optical system design obtained by the optical system simulation in August of the 100th year of the Republic of China, so that the present invention can be verified. feasibility. Figure 9 shows the Focus Error Signal (FES) calculated by the optical design architecture, the so-called S-Curve. Therefore, the feasibility of the implementation of the present invention has been specifically verified through the computer simulation analysis of the above Figs. 8 and 9. Figs. 10A to 10Q are views showing a first preferred embodiment of the method for forming a prism of the present invention. The manufacturing steps are as shown in Figs. 10A to 10Q: A glass wafer 1 is provided as shown in Fig. 10A. As shown in Fig. 10B, an aluminum metal layer 102 having a thickness of about 150 nm is deposited on the glass wafer 101 as an alignment layer. As shown in FIG. 10C, a photoresist layer (ie, a first photoresist layer) is formed on the metal layer 1〇2. As shown in FIG. 10D, the exposure mask 104 is used directly above the first photoresist layer 1〇3. • As shown in Fig. 10E, exposure and development are performed to form a desired pattern on the first photoresist layer 103. As shown in Fig. 10F, 'mix the metal inscription of the metal to carry out the metal layer 1〇2. As shown in Fig. 10G, the first photoresist layer 1〇3 is removed. As shown in Fig. 10H, a thick film photoresist layer (i.e., a second photoresist layer) was coated 1〇5 to form a Prism structure layer and subjected to a soft-bake process. As shown in Figure 101, using the second exposure mask, the first tilting 1359420 application for supplementation, date of revision: the first oblique exposure of the Republic of China on August 11 曰 oblique angle. As shown in Fig. 10J, the original first horizontal position is restored, and it can be seen that the first inclined structure 107 has been formed. As shown in Fig. 10K, the second tilt exposure is performed at the second tilt angle. The first tilt angle and the second tilt angle are opposite angles. As shown in Fig. 10L, the original second horizontal position is restored, and it can be seen that the second inclined structure 108 has been formed and has a cross shape with the first inclined structure 107. As shown in Fig. 10M, the second exposure mask 106 is removed. As shown in Fig. 10N, the second photoresist layer 105 is developed. As shown in Fig. 100, a K-type Pri (Prism) structure formed on the glass wafer 101, that is, a K-type 稜鏡 structure composed of the first inclined structure 107 and the second inclined structure 108 is formed. As shown in Fig. 10P, a glass wafer 101 and a K-type prism structure are cut to form a plurality of glass wafers 101 and a K-type prism structure of an appropriate size. As shown in Fig. 10Q, the vapor deposition process is performed using a metal mask. That is, with the wafer of Fig. 10P, the vapor deposition film of the conventional technique is used to form a reflective surface metal deposition at a specific tilt angle. After the process shown in FIG. 10P, as shown in FIG. 11A to FIG. 11D, a second preferred embodiment of the method for forming germanium according to the present invention, the manufacturing steps are as follows: as shown in FIG. 11A, a mold turning process is performed ( PDMS). In Fig. 11A, there is a substrate 1101, a polymer layer 1102, a mold layer 121, and a K-type prismatic structure prism 123. As shown in Fig. 11B, the formed K-shaped prismatic structure is applied for replenishment and correction after the reticle 121 12 1359420: After August 11, 100, the 'Drawing of Pattern 122' was deposited. As shown in Fig. 11C, the prism 123 is formed between 121s by an Eiectroforming method. As shown in Fig. 11D, the layer 121 is removed from the mold and turned over to obtain a complete K-shaped prismatic structure 稜鏡123. Wherein the first prism and the second crucible of the present invention can be fabricated by an integrated forming process. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention as claimed in the present invention; all other equivalent changes or modifications which are not departing from the spirit of the present invention should be included. Within the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a conventional optical pickup shown in Fig. 1. Fig. 2 is a schematic view of a conventional optical pickup shown in Fig. 3. A conventional optical pickup shown in Fig. 4 is a conventional optical pickup shown in Fig. 4. Figure 5 is a schematic view of a conventional optical pickup shown in Fig. 5. The optical path of the micro-integrated optical pickup of the present invention shown in Fig. 6 is a top view of the arrangement of the components of the present invention shown in Fig. 8. In order to use the optical design analysis software, FIG. 9 shows the focus error signal calculated by the simulation. FIGS. 10A to 10Q are the first preferred embodiment of the method for forming the crucible of the present invention. FIG. 11A 11D is a prism forming method of the present invention. The second preferred embodiment of the method 13 1359420 The application period of supplementation and correction: August 11th, 100th of the Republic of China [Description of main component symbols] 60 substrate 61 laser diode 62 first micro 稜鏡 63 second micro rib Mirror 64 third microprism 65 holographic optical element 66 focusing objective lens 67 optical disk 68 light detector 101 glass wafer 10 2 metal layer 103 first photoresist layer 104 exposure mask 105 second photoresist layer 106 second exposure Photomask 107 first inclined structure 108 second Inclined structure 111 Glass-ion wafer 112 Polymer layer 113 Third photoresist layer 114 First part ribbed structure 115 Structure 115 Second prism-shaped structure 稜鏡 121 Overmolded layer 14 1359420 Date of application for supplementation and revision: Republic of China 100 years August 11曰
122電鑄黏著層 123 K型稜柱狀結構稜鏡 1101底材 1102高分子層 15122 electroforming adhesive layer 123 K-shaped prismatic structure 稜鏡 1101 substrate 1102 polymer layer 15