1355025 九、發明說明： . 【發明所屬之技術領域】 本發明係關於一種真空塾’詳δ之，係關於一種用於抵 靠一封裝件之真空塾。 【先前技術】 參考圖1 ’顯示一種習知用於抵靠—封裝件之真空塾之 使用狀態圖，其中該真空墊2抵靠於該封裝件1，且一刀具 _ 25係對應該真空墊2之切割槽道23。該封裝件！包括一基板 條（Substrate Strip)ll、複數個晶粒12及複數個銲球13。該 基板條11具有一第一表面ln及一第二表面112。每一晶粒 . 12係以複數個導電凸塊（圖中未示）電性連接至該基板條u 上並配置一底膠12 1於該晶粒12與基板條11之間，以保 • 護該等導電凸塊。該等銲球13係位於該基板條11之第二表 面 112 〇 該真空墊2包括一第一表面21、複數個凹槽22、複數個 • 切割槽道23及複數個連通孔24。該等凹槽22位於該第一表 面2 1係用以谷納該等晶粒12。該等切割槽道23位於該第 一表面21。該等連通孔24連通該等凹槽22至一真空源（圖 中未示）。 該省知真空墊2之缺點如下。當該底膠121溢流於該基板 條11之第一表面111，而使該第一表面111凹凸不平時，則 -該真二墊2無法緊密貼合於該基板條丨丨之第一表面in，導 致抽真空失敗’或是在該刀具25沿該等切割槽道23切割 後導致破真空的現象。因此，無法有效固定該封裝件 125639.doc 1，而在切割該封裝件i時易產生誤差。此外，當該等晶粒 12之厚度較大，或是該等晶粒12上疊設有散熱片（圖中未 示）時，則需設法加深該凹槽22之深度，或是另行製作一 具有適备深度之凹槽之真空塾，因而導致製程步驟繁複及 製造成本提高。 因此，有必要提供一種創新且具進步性&真空塾，以解 決上述問題》1355025 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a vacuum crucible, relating to a vacuum crucible for abutting a package. [Prior Art] Referring to FIG. 1', there is shown a state of use of a conventional vacuum yoke for abutting a package, wherein the vacuum pad 2 abuts against the package 1, and a cutter _ 25 corresponds to a vacuum pad. 2 cutting channel 23. The package! A substrate strip ll, a plurality of dies 12 and a plurality of solder balls 13 are included. The substrate strip 11 has a first surface ln and a second surface 112. Each of the dies 12 is electrically connected to the substrate strip u by a plurality of conductive bumps (not shown) and is disposed between the die 12 and the substrate strip 11 to ensure Protect the conductive bumps. The solder balls 13 are located on the second surface 112 of the substrate strip 11. The vacuum pad 2 includes a first surface 21, a plurality of grooves 22, a plurality of cutting channels 23, and a plurality of communication holes 24. The grooves 22 are located on the first surface 21 for contacting the crystal grains 12. The cutting channels 23 are located on the first surface 21. The communication holes 24 communicate the grooves 22 to a vacuum source (not shown). The disadvantages of the vacuum pad 2 are as follows. When the primer 121 overflows the first surface 111 of the substrate strip 11 to make the first surface 111 rugged, the true two pad 2 cannot be closely adhered to the first surface of the substrate strip. In, causing a failure to evacuate' or causing a vacuum to break after the cutter 25 is cut along the cutting channels 23. Therefore, the package 125639.doc 1 cannot be effectively fixed, and an error is easily generated when the package i is cut. In addition, when the thickness of the dies 12 is large, or if the heat sinks (not shown) are stacked on the dies 12, it is necessary to try to deepen the depth of the grooves 22, or create another one. A vacuum crucible having a groove of a suitable depth results in complicated process steps and increased manufacturing costs. Therefore, it is necessary to provide an innovative and progressive & vacuum vacuum to solve the above problems.
【發明内容】 本發明提供—種用於抵靠-封裝件之真空墊，該封裝件 包括-基板條（Substrate Strip)、複數個晶粒及複數個鲜 球，該基板條具有一頂面及一底面，該等晶粒係位於該基 板條之頂面，該等銲球係位於該基板條之底面。SUMMARY OF THE INVENTION The present invention provides a vacuum pad for abutting a package, the package comprising a substrate strip, a plurality of crystal grains, and a plurality of fresh balls, the substrate strip having a top surface and A bottom surface, the dies are located on a top surface of the substrate strip, and the solder balls are located on a bottom surface of the substrate strip.
該真空塾包括一第一表面及至少一凹槽。該第一表面用 以抵靠該基板條之底面。該至少―凹槽用以容納該等辉 球，且位於該第一表面並連通至一真空源。 本發明另提供一種切割封裝件之方法，包括以下步驟： ⑷提供-封裝件及一真空墊’該封裝件包括一基板條 (Substrate Strip)、複數個晶粒及複數個銲球，該基板條具 有頂面及底面H曰曰粒係位於該基板條之頂面，該 等銲球係位於該基板條之底面’該真空墊包括一第一表面 及至少-凹槽’該至少一凹槽係位於該第一表面；⑻將該 封裝件置於該真空墊之上，使得該真空塾之該第一表面抵 靠該基板條之底面’且該等薛球容納於該至少—凹槽中；_ (c)將該至少-凹槽抽真空，使得該封裝件被該真空塾吸 I25639.doc 住，及（d)切割該封裝件之基板條。 藉此’在-抽真空步驟中，該真空墊係緊密吸附於該基 板條之底面，以提升切割該封裝件之良率。 【實施方式】 參考圖2,顯示本發明用於抵靠一封裝件之真空墊之第 -實施例之使用狀態圖，其中該真空墊尚未抵靠於該封裝 件。參考圖3，顯示圖2之局部放大示意圖。該封裝件3包 括—基板條（Substrate Strip)31、複數個晶粒32及複數個銲 球33。 該基板條31具有一頂面31丨及一底面312。在本實施例 中，該基板條31更包括複數條切割線3丨3，定義出複數個 封裳單元314，每一封裝單元314包括一基板單元315、一 晶粒32及複數個銲球33。該等晶粒32係位於該基板條3丨之 頂面3 11。在本實施例中’該等晶粒32係位於該等切割線 313所定義出之區域，並以覆晶方式接合於該基板條31之 頂面311。該等銲球33係位於該基板條31之底面312。 同時’參考圖4，顯示本發明用於抵靠一封裝件之真空 墊之第一實施例之俯視示意圖。參考圖5，顯示圖4之局部 放大示意圖。該真空墊4包括一第一表面41及至少一凹槽 42。在本實施例中，該真空墊4更包括至少一第一連通孔 43 ° 該第一表面41用以抵靠該基板條31之底面312(如圖6及 圖7所示）。在本實施例中，該第一表面41更包括複數個切 割槽道411，定義出複數個切割單元412，每一切割單元 125639.doc 1355025 412包括至少一凹槽42，該等切割線係對應該等切割槽 • 道411，每一封裝單元314係對應每一切割單元412。 該凹槽42用以容納該等銲球33(如圖6及圖7所示），且位 於該第-表面41並連通至一真空源（圖中未示）。在本實施 例中，該凹槽42包括至少一第一凹槽421及複數個第二凹 槽422。該第一凹槽42丨係容納部分該等銲球33(如圖6及圖 7所示），該等第二凹槽422係環繞該第一凹槽421，且每一 • 第二凹槽422係容納一銲球33(如圖6及圖7所示）。在本實施 例中每一第一連通孔43係連通每一第一凹槽42丨至該真 空源（圖中未示）。 、 參考圖6,顯示本發明用於抵靠一封裝件之真空墊之第 -實施例之使用狀態圖’其中該真空墊抵靠於該封裝件。 參考圖7，顯示圖6之局部放大示意圖。在使用狀態時該 等第一凹槽421及該等第二凹槽422係容納該封裝件]之底 面312之該等輝球33，巾使得該真空塾4之該第一表面㈣ • 冑貼合於該封裝件3之底面312，即使該封裝件3之頂面311 產生溢膠也不受影響。 本發明另外關於一種切割封裝件之方法。以下係應用該 第一實施例之真空墊4以切割封裝件之方法。首先，提供 一封裝件3及一真空塾4，如圖2至圖5所示。該封裝件3包 括一基板條（Substrate Strip)3丨 '複數個晶粒％及複數 球33。該基板條31具有—頂面311及—底面312。較佳地， =基板條3丨更包括複數條㈣線313，定義出複數個封裝 單元314，每一封裝單元314包括一基板單元⑴、—、 125639.doc -9- 1355025 32及複數個球33。該等晶粒32係位於該基板條31之頂面 ' 311。較佳地，該等晶粒32係位於該等切割線313所定義出 之區域’且該等晶粒32係以覆晶方式接合於該基板條η之 頂面311。該等銲球33係位於該基板條31之底面312。 該真空塾4包括一第一表面41及至少一凹槽42。較佳 地，該真空墊4更包括至少一第一連通孔43。較佳地，該 第一表面41更包括複數條切割槽道411，定義出複數個切 φ 割單元412，每一切割單元412包括至少一凹槽42。該凹槽 42係位於該第一表面41。較佳地，該凹槽42包括至少一第 一凹槽421及複數個第二凹槽422。該第一凹槽421係容納 部分該等銲球33。該等第二凹槽422係環繞該第一凹槽 421，且每一第二凹槽422係容納一銲球33。較佳地，每一 第一連通孔43係連通至每一第一凹槽42ι。 接著，參考圖6及圖7，將該封裝件3置於該真空墊4之 上，使得該真空墊4之該第一表面41抵靠該基板條31之底 鲁 面312，且該等銲球33容納於該至少一凹槽42中。較佳 地，該基板條31之該等切割線313係對應該真空墊4之該等 切割槽道411，使每一封裝單元314係對應每一切割單元 412 ° 接著，將該至少一凹槽42抽真空。在本實施例中，係將 該等第一連通孔43抽真空，以降低該等第一凹槽421之壓 ， 力，使得該封裝件3被該真空墊4吸住。最後，沿著該等切 割線313切割該封裝件3之該基板條31。 • 參考圖8，顯示本發明用於抵靠一封裝件之真空墊之第 125639.doc -10· 1355025 —實轭例之使用狀態圖，其中該真空墊尚未抵靠於該封裝 件。參考圖9,顯示圖8之局部放大示意圖。本實施例之真 空墊5與第一實施例之真空墊4大致相同，其中相同之元件 賦予相同之編號。本實施例與第一實施例之不同處，僅在 於該真空墊5更包括複數個第二連通孔44、一第二表面45 及至少一第三凹槽46。The vacuum crucible includes a first surface and at least one recess. The first surface is adapted to abut the bottom surface of the substrate strip. The at least "groove" is adapted to receive the phosphor balls and is located on the first surface and is connected to a vacuum source. The invention further provides a method for cutting a package, comprising the following steps: (4) providing a package and a vacuum pad, the package comprising a substrate strip, a plurality of crystal grains and a plurality of solder balls, the substrate strip The top surface and the bottom surface are located on the top surface of the substrate strip, and the solder balls are located on the bottom surface of the substrate strip. The vacuum pad includes a first surface and at least a groove. The at least one groove system Located on the first surface; (8) placing the package on the vacuum pad such that the first surface of the vacuum is against the bottom surface of the substrate strip and the ball is received in the at least groove; _ (c) evacuating the at least-groove such that the package is held by the vacuum suction I25639.doc, and (d) cutting the substrate strip of the package. By this, in the vacuuming step, the vacuum pad is closely adhered to the bottom surface of the substrate strip to improve the yield of cutting the package. [Embodiment] Referring to Fig. 2, there is shown a use state diagram of a vacuum pad of the present invention for abutting against a package, wherein the vacuum pad has not yet been abutted against the package. Referring to Figure 3, a partial enlarged view of Figure 2 is shown. The package 3 includes a Substrate Strip 31, a plurality of dies 32, and a plurality of solder balls 33. The substrate strip 31 has a top surface 31丨 and a bottom surface 312. In this embodiment, the substrate strip 31 further includes a plurality of cutting lines 3丨3, and defines a plurality of sealing units 314. Each of the packaging units 314 includes a substrate unit 315, a die 32, and a plurality of solder balls 33. . The dies 32 are located on the top surface 31 of the substrate strip 3丨. In the present embodiment, the dies 32 are located in the regions defined by the dicing lines 313 and are flip-chip bonded to the top surface 311 of the substrate strip 31. The solder balls 33 are located on the bottom surface 312 of the substrate strip 31. Meanwhile, referring to Fig. 4, there is shown a top plan view of a first embodiment of the vacuum pad of the present invention for abutting a package. Referring to Figure 5, a partial enlarged view of Figure 4 is shown. The vacuum pad 4 includes a first surface 41 and at least one recess 42. In this embodiment, the vacuum pad 4 further includes at least one first communication hole 43. The first surface 41 is for abutting against the bottom surface 312 of the substrate strip 31 (as shown in FIGS. 6 and 7). In this embodiment, the first surface 41 further includes a plurality of cutting channels 411, and a plurality of cutting units 412 are defined. Each cutting unit 125639.doc 1355025 412 includes at least one groove 42, and the cutting lines are paired. The groove/lane 411 should be waited for, and each package unit 314 corresponds to each of the cutting units 412. The recess 42 is adapted to receive the solder balls 33 (shown in Figures 6 and 7) and is located on the first surface 41 and is connected to a vacuum source (not shown). In this embodiment, the recess 42 includes at least one first recess 421 and a plurality of second recesses 422. The first recess 42 is configured to receive a portion of the solder balls 33 (as shown in FIGS. 6 and 7), the second recesses 422 surround the first recess 421, and each of the second recesses The 422 system houses a solder ball 33 (as shown in Figures 6 and 7). In the embodiment, each of the first communication holes 43 communicates with each of the first grooves 42 to the vacuum source (not shown). Referring to Figure 6, there is shown a state of use of the first embodiment of the vacuum pad of the present invention for abutting a package, wherein the vacuum pad abuts the package. Referring to Figure 7, a partial enlarged view of Figure 6 is shown. In the state of use, the first recess 421 and the second recess 422 receive the globules 33 of the bottom surface 312 of the package, and the towel causes the first surface (4) of the vacuum raft 4 to be attached. In conjunction with the bottom surface 312 of the package 3, even if the top surface 311 of the package 3 is overfilled, it is not affected. The invention further relates to a method of cutting a package. The following is a method of applying the vacuum pad 4 of the first embodiment to cut the package. First, a package 3 and a vacuum port 4 are provided, as shown in Figs. 2 to 5. The package 3 includes a substrate strip 3 丨 'plural number of dies % and a plurality of balls 33 . The substrate strip 31 has a top surface 311 and a bottom surface 312. Preferably, the = substrate strip 3 丨 further comprises a plurality of (four) lines 313 defining a plurality of package units 314, each package unit 314 comprising a substrate unit (1), —, 125639.doc -9- 1355025 32 and a plurality of balls 33. The dies 32 are located on the top surface 311 of the substrate strip 31. Preferably, the crystal grains 32 are located in a region defined by the dicing lines 313 and the crystal grains 32 are bonded to the top surface 311 of the substrate strip η in a flip-chip manner. The solder balls 33 are located on the bottom surface 312 of the substrate strip 31. The vacuum crucible 4 includes a first surface 41 and at least one recess 42. Preferably, the vacuum pad 4 further includes at least one first communication hole 43. Preferably, the first surface 41 further includes a plurality of cutting channels 411 defining a plurality of cutting units 412, each cutting unit 412 including at least one groove 42. The groove 42 is located on the first surface 41. Preferably, the recess 42 includes at least a first recess 421 and a plurality of second recesses 422. The first recess 421 receives a portion of the solder balls 33. The second recesses 422 surround the first recess 421, and each of the second recesses 422 receives a solder ball 33. Preferably, each of the first communication holes 43 is connected to each of the first grooves 42ι. Next, referring to FIG. 6 and FIG. 7, the package member 3 is placed on the vacuum pad 4 such that the first surface 41 of the vacuum pad 4 abuts against the bottom surface 312 of the substrate strip 31, and the soldering is performed. The ball 33 is received in the at least one recess 42. Preferably, the cutting lines 313 of the substrate strip 31 correspond to the cutting channels 411 of the vacuum pad 4, such that each of the packaging units 314 corresponds to each cutting unit 412 °, and then the at least one groove 42 vacuum. In the present embodiment, the first communication holes 43 are evacuated to reduce the pressure and force of the first grooves 421, so that the package 3 is sucked by the vacuum pad 4. Finally, the substrate strip 31 of the package 3 is cut along the cutting lines 313. Referring to Figure 8, there is shown a state of use of the 127th embodiment of the present invention for a vacuum pad against a package in which the vacuum pad has not yet been placed against the package. Referring to Figure 9, a partial enlarged view of Figure 8 is shown. The vacuum pad 5 of this embodiment is substantially the same as the vacuum pad 4 of the first embodiment, wherein the same elements are given the same reference numerals. The difference between the embodiment and the first embodiment is that the vacuum pad 5 further includes a plurality of second communication holes 44, a second surface 45 and at least a third groove 46.
在本實施例中，該第二表面45係相對於該第一表面41， 該第三凹槽46係位於該第二表面45。此外，每一第一連通 孔43係連通每一第一凹槽421至每一第三凹槽钧，該等第 二連通孔44係連通該等第二凹槽422至每一第三凹槽耗， 每一第二凹槽46係連通至該真空源（圖中未示）。 以下係應用該第二實施例之真空墊5以切割封裝件之方 法。本方法與上述應用該第一實施例之真空墊4以切割封 裝件之方法之不同處在於抽真空之步驟。在本實施例中， 係透過該等第二凹槽46將該等第一連通孔43及該等第二連 通孔44抽真空，以降低該等第一凹槽421及該等第二凹槽 422之塵力，使得該封裝件3被該真空墊$吸住。 惟上述實施例僅為說明本發明之原理及其功效而非用 以限制本發明。因&，習於此技術之人士對上述實施例進 行修改及變化仍不脫本發明之精神。本發明之權利範圍應 如後述之申請專利範圍所列。 " 【圖式簡單說明】 圖1顯示一種習知用於抵靠一封裝件之真空墊之使用狀 圖，其中該真空塾抵靠於該封裝件，且一刀具係對應該 -Π - 125639.doc 1355025 真空墊之切割槽道； 圖2顯示本發明用於抵靠一封萝 可瑕件之真空墊之第一實施 例之使用狀態圖，其中該真空墊尚去 纪向未抵靠於該封裝件； 圖3顯示圖2之局部放大示意圖； 圖4顯示本發明用於抵靠―封萝 可我件之真空墊之第—實施 例之俯視示意圖； 圖5顯示圖4之局部放大示意圖； 圖6顯示本發明用於抵靠一封裝件之真空墊之第—實施 例之使用狀態圖，其中該真空墊抵靠於該封裝件； 圖7顯示圖6之局部放大示意圖； 圖8顯示本發明用於抵靠一封裝件之真空墊之第二實施 例之使用狀態圖，其中該真空塾尚未抵靠於該封裝及 圖9顯示圖8之局部放大示意圖。 【主要元件符號說明】 1 封裝件 2 習知用於抵靠一封裝件之真空塾 3 封裝件 4 本發明第 實施例用於抵靠一封裝件之真空 墊 5 本發明第 二實施例用於抵靠一封裝件之真空 墊 11 基板條 12 晶粒 13 銲球 125639.doc -12- 1355025In the present embodiment, the second surface 45 is opposite to the first surface 41, and the third recess 46 is located on the second surface 45. In addition, each of the first communication holes 43 communicates with each of the first grooves 421 to each of the third grooves 钧, and the second communication holes 44 communicate with the second grooves 422 to each of the third grooves. Slot consumption, each second groove 46 is connected to the vacuum source (not shown). The following is a method of applying the vacuum pad 5 of the second embodiment to cut the package. The difference between the method and the above-described method of applying the vacuum pad 4 of the first embodiment to cut the package is the step of evacuating. In the embodiment, the first communication holes 43 and the second communication holes 44 are evacuated through the second grooves 46 to reduce the first grooves 421 and the second recesses. The dust force of the groove 422 causes the package 3 to be sucked by the vacuum pad $. However, the above-described embodiments are merely illustrative of the principles and effects of the invention and are not intended to limit the invention. Modifications and variations of the above-described embodiments are made by those skilled in the art without departing from the spirit of the invention. The scope of the invention should be as set forth in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a conventional use of a vacuum pad for abutting a package, wherein the vacuum is placed against the package, and a cutter corresponds to -Π - 125639 .doc 1355025 cutting channel for a vacuum pad; FIG. 2 is a view showing a state of use of the first embodiment of the vacuum pad of the present invention for abutting against a dicing device, wherein the vacuum pad is still not biased against Figure 3 shows a partial enlarged view of Figure 2; Figure 4 shows a top view of the first embodiment of the vacuum pad of the present invention for abutting a closure; Figure 5 shows a partial enlarged view of Figure 4 Figure 6 is a view showing the state of use of the vacuum pad of the present invention for abutting against a package, wherein the vacuum pad abuts the package; Figure 7 shows a partial enlarged view of Figure 6; Figure 8 shows The present invention is used in a state of use of a second embodiment of a vacuum pad against a package, wherein the vacuum port has not yet been abutted against the package and FIG. 9 shows a partial enlarged view of FIG. [Main component symbol description] 1 Package 2 A vacuum 塾 3 package 4 for abutting a package. The first embodiment of the present invention is for a vacuum pad 5 against a package. The second embodiment of the present invention is used for Vacuum pad 11 against a package substrate strip 12 die 13 solder ball 125639.doc -12- 1355025
21 第一表面 22 凹槽 23 切割凹槽 24 連通孔 25 刀具 31 基板條 32 晶粒 33 銲球 41 第一表面 42 凹槽 43 第一連通孔 44 第二連通孔 45 第二表面 46 第三凹槽 111 第一表面 112 第二表面 121 底膠 311 頂面 312 底面 313 切割線 314 封裝單元 315 基板單元 411 切割槽道 412 切割單元 125639.doc -13 1355025 421 42221 First surface 22 Groove 23 Cutting groove 24 Connecting hole 25 Tool 31 Substrate strip 32 Grain 33 Solder ball 41 First surface 42 Groove 43 First communication hole 44 Second communication hole 45 Second surface 46 Third Groove 111 First surface 112 Second surface 121 Primer 311 Top surface 312 Bottom surface 313 Cutting line 314 Packaging unit 315 Substrate unit 411 Cutting channel 412 Cutting unit 125639.doc -13 1355025 421 422
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