1354883 100年01月1'2日核iE替换頁 、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱模組及用於該散熱模組之散熱器， 尤係涉及一種對發熱電子元件散熱之散熱模組及用於該 散熱模組之散熱器。 【先前技術】 [0002] 在散熱領域内，散熱模組常被用於筆記本電腦内，對其 内部之發熱元件散熱。該散熱模組包括一離心風扇，設 於離心風扇出風口處之散熱器及在散熱器與二發熱元件 如VGA和CPU間傳遞熱量之二熱管。 [0003] 當該二發熱元件同時工作時，其產生之熱量通過熱管傳 遞至散熱器之不同位置處，惟，由於ΐ二發無元件之工 作頻率不同，使其工作時產生之熱量不同，從而使傳遞 至散熱器不同部分之熱量也不相同，故可能會造成散熱 器之一部分因吸熱較多而溫度較高之情況，此時，溫度 較高之鰭片部分之熱量將傳遞給溫度較低之鰭片部分， 以達到整個散熱器上熱量之均勻分佈，這樣，散熱器上 · 原來溫度較低之那一部分之溫度可能會高於與其相連之 發熱元件之工作溫度，進而會造成熱量之回流至該發熱 元件處，使該發熱元件因溫度過高而損壞。 【發明内容】 [0004] 有鑒於此，有必要提供一種不會使熱量回流之散熱模組 以及一種用於該散熱模組之散熱器。 [0005] 一種散熱模組，包括一散熱器及與散熱器相接觸之至少 二熱管，該散熱器包括複數散熱鰭片，該散熱鰭片包括 096132566 表單編號Α0101 第4頁/共21頁 1003011439-0 1354883 - 100年01月12日按正替換頁 ' 一本體及設於本體一側之至少一突出部，該本體之另一 側對應該突出部形成有凹陷，該突出部之至少一側開設 有與該凹陷相連通之開槽，該至少一突出部位於該至少 二熱管之間，該本體之凹陷及開槽隔斷該至少二熱管之 ‘ 傳熱路徑。 [0006] 一種散熱器，包括複數散熱鰭片，該散熱鰭片具有一本 體及設於本體一側之一突出部，該突出部位於接近散熱 鰭片中央之位置，由接近散熱鰭片之一端之位置延伸至 φ 靠近散熱鰭片相對之另一端之位置，該本體之另一側對 應該突出部形成有凹陷，該突出部之至少一侧開設有與 該凹陷相連通之開槽，該開槽與凹陷將散熱鰭片分隔為 兩部分，並隔斷該兩部分之間之傳熱路徑。 [0007] 與習知技術相比，該散熱模組中，該開槽及凹陷之設置 隔斷了熱管之間之部分傳熱路徑，降低了熱管之間之熱 量傳遞，從而使散熱鰭片之左右兩部分間受對方之溫度 影響較小，避免了由於VGA晶片及CPU工作速率之不同出 ® 現之散熱器處溫度高於發熱元件處溫度而弓丨起之熱量倒 流現象，使VGA晶片及CPU均可在正常範圍内工作。另外 ，該突出部之設置可增加單個氣流通道内氣體之擾流及 相鄰氣流通道間氣體之交換，從而提高散熱模組之散熱 效率。 【實施方式】 [0008] 如圖1及圖2所示為一用於對二發熱電子元件即一 VGA晶片 及一CPU散熱之散熱模組。該散熱模組包括吸熱元件50、 60、離心風扇10、散熱器20以及扁平熱管30、40。 096132566 表單編號A0101 第5頁/共21頁 1003011439-0 1354883 100年01月i2日核;正替換頁 [0009] 吸熱元件50、60分別與VGA晶片及CPU相貼合，由VGA晶 片及CPU處吸收熱量。熱管30、40之蒸發段310、410分 別與吸熱元件50、60相貼合，其冷凝段320、420則並排 貼設於散熱器20底部，將吸熱元件50、60處之熱量傳遞 至散熱器20處。散熱器20設於離心風扇10之出風口 124 處，通過離心風扇10產生之氣流將其由吸熱元件50、60 處吸收之熱量散發出去。1354883 January 1st, 1st, 2nd, nuclear iE replacement page, invention description: [Technical Field] [0001] The present invention relates to a heat dissipation module and a heat sink for the same, particularly A heat dissipation module for heat-dissipating electronic components and a heat sink for the heat dissipation module. [Prior Art] [0002] In the field of heat dissipation, a heat dissipation module is often used in a notebook computer to dissipate heat from its internal heating elements. The heat dissipation module comprises a centrifugal fan, a heat sink disposed at the air outlet of the centrifugal fan, and two heat pipes for transferring heat between the heat sink and the two heat generating components such as the VGA and the CPU. [0003] When the two heating elements work at the same time, the heat generated by the two heat generating elements is transmitted to different positions of the heat sink through the heat pipe, but since the operating frequency of the second light emitting element is different, the heat generated during operation is different, thereby The heat transferred to different parts of the heat sink is different, so it may cause a higher temperature of one part of the heat sink due to more heat absorption. At this time, the heat of the higher temperature fin portion will be transmitted to the lower temperature. The fin portion is used to achieve an even distribution of heat on the entire heat sink, so that the temperature of the portion of the heat sink where the original temperature is lower may be higher than the operating temperature of the heat generating component connected thereto, thereby causing the heat to flow back. To the heat generating component, the heat generating component is damaged due to excessive temperature. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide a heat dissipation module that does not return heat, and a heat sink for the heat dissipation module. [0005] A heat dissipation module includes a heat sink and at least two heat pipes in contact with the heat sink, the heat sink includes a plurality of heat dissipation fins, and the heat dissipation fins include 096132566 Form No. 1010101 Page 4 / Total 21 Page 1003011439- 0 1354883 - January 12, 100, according to the replacement page 'a body and at least one protruding portion provided on one side of the body, the other side of the body is formed with a recess corresponding to the protruding portion, and at least one side of the protruding portion is opened There is a slot communicating with the recess, the at least one protrusion being located between the at least two heat pipes, the recess and the slot of the body blocking a heat transfer path of the at least two heat pipes. [0006] A heat sink includes a plurality of heat dissipating fins, and the heat dissipating fin has a body and a protruding portion disposed on one side of the body, the protruding portion is located near a center of the heat dissipating fin, and is close to one end of the heat dissipating fin The position extends to a position where φ is adjacent to the opposite end of the heat dissipation fin, and the other side of the body is formed with a recess corresponding to the protrusion, and at least one side of the protrusion is provided with a slot communicating with the recess, the opening The grooves and depressions divide the heat sink fin into two parts and block the heat transfer path between the two parts. [0007] Compared with the prior art, in the heat dissipation module, the slot and the recess are arranged to block a part of the heat transfer path between the heat pipes, thereby reducing the heat transfer between the heat pipes, thereby making the heat dissipation fins The temperature difference between the two parts is small, which avoids the difference between the working speed of the VGA chip and the CPU. The current temperature of the heat sink is higher than the temperature of the heating element, and the heat is reversed, so that the VGA chip and the CPU Can work in the normal range. In addition, the protrusion portion is arranged to increase the gas turbulence in the single air flow channel and the gas exchange between the adjacent air flow channels, thereby improving the heat dissipation efficiency of the heat dissipation module. [Embodiment] [0008] As shown in FIG. 1 and FIG. 2, a heat dissipation module for dissipating two heat-generating electronic components, that is, a VGA chip and a CPU. The heat dissipation module includes heat absorbing elements 50, 60, a centrifugal fan 10, a heat sink 20, and flat heat pipes 30, 40. 096132566 Form No. A0101 Page 5 / Total 21 Page 1003011439-0 1354883 100 January 01 i2 core; replacement page [0009] The heat absorbing elements 50, 60 are respectively affixed to the VGA chip and the CPU, by the VGA chip and the CPU Absorb heat. The evaporation sections 310, 410 of the heat pipes 30, 40 are respectively attached to the heat absorbing elements 50, 60, and the condensation sections 320, 420 are disposed side by side at the bottom of the heat sink 20, and the heat at the heat absorbing elements 50, 60 is transferred to the heat sink. 20 places. The radiator 20 is disposed at the air outlet 124 of the centrifugal fan 10, and the air generated by the centrifugal fan 10 dissipates the heat absorbed by the heat absorbing members 50, 60.
[0010] 請參閱圖3至圖5，該散熱器20包括複數堆疊在一起之散 熱鰭片21。各散熱鰭片21包括一矩形之本體210及由本體 210之上下兩端214、215垂直於本體210延伸之二翼片 216。該等散熱鰭片21堆疊在一起時，後一散熱鰭片21之 翼片216與前一散熱鰭片2H本體ΓΠ^抵言，在散熱器 20之上下兩侧由相互連接之翼片216形成上接觸面24a及 下接觸面24b，並在各相鄰散熱鰭片21間形成氣流通道26 ，使氣流由散熱器20之一側（左側）吹向另一側（右側）， 將散熱鰭片21處之熱量帶走。Referring to FIGS. 3 through 5, the heat sink 20 includes a plurality of heat radiating fins 21 stacked together. Each of the heat dissipation fins 21 includes a rectangular body 210 and two fins 216 extending from the upper and lower ends 214, 215 of the body 210 perpendicular to the body 210. When the heat dissipation fins 21 are stacked together, the fins 216 of the rear heat dissipation fins 21 and the front heat dissipation fins 2H are reinforced, and the upper and lower sides of the heat sink 20 are formed by the interconnected fins 216. The upper contact surface 24a and the lower contact surface 24b form an air flow passage 26 between the adjacent heat dissipation fins 21, so that the airflow is blown from one side (left side) of the heat sink 20 to the other side (right side), and the heat dissipation fins are The heat of 21 is taken away.
[0011] 本體210上設有一由本體210之背面213向前面212衝壓形 成之突出部218，本體210之背面213對應突出部21 8之位 置形成一凹陷219,該凹陷219將本體210分隔為左右兩 部分20a、20b，熱管30、40分別位於該左右兩部分20a 、20b之下方，與散熱器20之下接觸面24b相貼合，亦即 該突出部218沿熱管30、40之排列方向之投影位於熱管 30、40沿該方向之投影之間。 [0012] 該突出部218由其側面看大致呈“匚”形，包括一平行於 本體210且沿本體210之高度方向延伸之縱長片體2182以 096132566 表單编號A0101 第6頁/共21頁 1003011439-0 1354883 100年01月12日修正替換頁 及位於片體2182上下兩端並一體連接片體2182與本體 210之二連接片2184。該片體2182與本體210間間隔一定 距離，在本體210、片體2182左右兩側及該二連接片 2184間形成位於片體2182左右兩側之二縱長開槽2183，[0011] The body 210 is provided with a protrusion 218 formed by the back surface 213 of the body 210 toward the front surface 212. The back surface 213 of the body 210 is formed with a recess 219 corresponding to the position of the protrusion portion 218. The recess 219 separates the body 210 into left and right. The two portions 20a, 20b, the heat pipes 30, 40 are respectively located below the left and right portions 20a, 20b, and are in contact with the lower contact surface 24b of the heat sink 20, that is, the protruding portion 218 is arranged along the direction of the heat pipes 30, 40. The projection is between the projections of the heat pipes 30, 40 in that direction. [0012] The protruding portion 218 has a substantially "匚" shape when viewed from the side thereof, and includes an elongated piece 2182 extending parallel to the body 210 and extending along the height direction of the body 210 to 096132566. Form No. A0101 Page 6 of 21 Page 1003011439-0 1354883 On January 12, 100, the replacement page and the two upper and lower ends of the sheet 2182 are integrally connected and the two connecting pieces 2184 of the body 2182 and the body 210 are integrally connected. The body 2182 is spaced apart from the body 210 by a distance between the body 210, the left and right sides of the body 2182, and the two connecting pieces 2184, and two longitudinal slots 2183 are formed on the left and right sides of the body 2182.
該二開槽2183沿熱管30、40之排列方向之投影位於熱管 30、40沿該方向之投影之間，其延伸方向與熱管30、40 之排列方向相交。該二開槽2183與本體210背面之凹陷 219相連通，配合本體210背面之凹陷219在本體210中部 隔斷了本體210左右兩部分20a、20b間之連接，降低了 本體210左右兩部分20a、2Ob間熱量之傳遞，同時隔斷 了熱管30、40之間之部分傳熱路徑。另外，該二開槽 2183中之至少一個面向氣流之行進方向，連接相鄰散熱 鰭片21前後兩側之二氣流通道26，增強了相鄰氣流通道 26内氣體之流動，加強了散熱模組之散熱效果。 [0013] 本散熱模組中，該開槽2183及凹陷219之設置隔斷了熱管 30、40之間之部分傳熱路徑，降低了熱管30、40之間之 熱量傳遞，從而使散熱鰭片21之左右兩部分20a、20b間 受對方之溫度影響較小，避免了由於VGA晶片及CPU工作 速率之不同出現之散熱器20處溫度高於發熱元件處溫度 而引起之熱量倒流現象，使VGA晶片及CPU均可在正常範 圍内工作。另外，該突出部218之設置可增加單個氣流通 道26内氣體之擾流及相鄰氣流通道26間氣體之交換，從 而提高散熱模組之散熱效率。 [0014] 本散熱模組中，熱管30、40並排貼設於散熱器20之下接 觸面24b。可以理解地，熱管30、40也可並排穿設於散熱 096132566 表單编號A0101 第7頁/共21頁 1003011439-0 1354883 100年01月Ϊ2日被正替換頁 器20内。同樣地，熱管30、40也可左右錯開（如圖6)、The projection of the two slots 2183 along the direction in which the heat pipes 30, 40 are arranged is located between the projections of the heat pipes 30, 40 in the direction, and the extending direction thereof intersects with the arrangement direction of the heat pipes 30, 40. The two slots 2183 are in communication with the recess 219 on the back of the body 210. The recess 219 on the back of the body 210 partitions the connection between the left and right portions 20a, 20b of the body 210 in the middle of the body 210, reducing the left and right portions 20a, 20b of the body 210. The transfer of heat between them simultaneously blocks part of the heat transfer path between the heat pipes 30, 40. In addition, at least one of the two slots 2183 faces the traveling direction of the airflow, and connects the two airflow passages 26 on the front and rear sides of the adjacent heat dissipation fins 21, thereby enhancing the flow of the gas in the adjacent airflow passages 26, and strengthening the heat dissipation module. The heat dissipation effect. [0013] In the heat dissipation module, the arrangement of the slot 2183 and the recess 219 blocks a part of the heat transfer path between the heat pipes 30 and 40, and reduces the heat transfer between the heat pipes 30 and 40, thereby causing the heat dissipation fins 21 The left and right parts 20a, 20b are less affected by the temperature of the other party, avoiding the heat backflow caused by the temperature of the heat sink 20 being higher than the temperature of the heat generating component due to the difference in the working speed of the VGA chip and the CPU, so that the VGA chip And the CPU can work in the normal range. In addition, the protrusion 218 is arranged to increase the gas turbulence in the single air flow passage 26 and the gas exchange between the adjacent air flow passages 26, thereby improving the heat dissipation efficiency of the heat dissipation module. [0014] In the heat dissipation module, the heat pipes 30 and 40 are arranged side by side on the contact surface 24b of the heat sink 20. It can be understood that the heat pipes 30, 40 can also be arranged side by side in the heat dissipation 096132566 Form No. A0101 Page 7 / 21 pages 1003011439-0 1354883 100 years January Ϊ 2 is being replaced in the page 20. Similarly, the heat pipes 30, 40 can also be staggered left and right (as shown in Figure 6).
上下錯開（如圖7)或上下左右同時錯開（如圖8和圖9)穿設 於散熱器20内，只需使開槽2183沿熱管30、40之排列方 向之投影位於熱管30、40沿該方向之投影之間，且開槽 2183之延伸方向與熱管30、40之排列方向相交。當熱管 30、40上下錯開穿設於散熱器20内時，該開槽218 3設置 於突出部218之上下兩側，將熱管30、40沿上下方向之傳 熱路徑隔斷。當熱管30、40左右錯開穿設於散熱器20内 時，該開槽2183設置於突出部218之左右兩側，將熱管 30、40沿左右方向之傳熱路徑隔斷。當熱管30、40上下 左右同時錯開穿設於散熱器20内時，該突出部218可傾斜 地設于熱管3 0、4 0之間，也瓦 >”上惠豎变方向設于熱 管30、40之間，該開槽2183可僅設置於突出部21 8之上 下或左右兩侧，將熱管30、40沿上下或左右方向之傳熱 路徑隔斷，或同時設置於突出部218之上下及左右兩側， 將熱管30、40沿上下及左右方向之傳熱路徑同時隔斷。 [0015] 本散熱模組包括二熱管30、40，當然，該散熱模組中可 根據發熱元件之數量及散熱器20之尺寸設置兩根以上熱 管。本散熱模組中，突出部218上設有開槽2183，可以理 解地，該突出部218上也可設置一個開槽或多個開槽。 [0016] 綜上所述，本發明符合發明專利之要件，爰依法提出專 利申請。惟以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 096132566 表單編號A0101 第8頁/共21頁 1003011439-0 1354883.. 100年01月12日修正替换頁 • [0017] 圖1為本發明散熱模組一較佳實施例之立體分解圖。 [0018] 圖2為圖1中散熱模組之立體組裝圖。 [0019] 圖3為圖1中一散熱器之立體組裝圖。 ' [0020] 圖4為圖3中一散熱鰭片之側視圖。 [0021] 圖5為圖4中散熱鰭片之主視圖。 [0022] 圖6為該散熱鰭片第二實施例之主視圖。 [0023] • [0024] 圖7為該散熱鰭片第三實施例之主視圖。 圖8為該散熱鰭片第四實施例之主視圖。 [0025] 圖9為該散熱鰭片第五實施例之主視圖。 [0026] 【主要元件符號說明】 離心風扇：10 [0027] 出風口 ： 124 [0028] 散熱器：20 籲[0029] 左右兩部分：20a、20b [0030] 散熱鰭片：21 [0031] 本體：210 [0032] 前面：21 2 [0033] 背面：21 3 [0034] 上下兩端：214、215 [0035] 翼片：216 096132566 表單編號A0101 第9頁/共21頁 1003011439-0 1354883 [0036] 突出部：2 1 8 [0037] 片體：2182 [0038] 開槽：2183 [0039] 連接片：2184 [0040] 上接觸面：24a [0041] 下接觸面：24b [0042] 氣流通道：2 6 [0043] 凹陷：219 [0044] 熱管：30、40 [0045] 蒸發段：310、410 [0046] 冷凝段：320、420 [0047] 吸熱元件：50、60 096132566 表單編號A01O1 第10頁/共21頁 100年01月i2日接正替換頁 1003011439-0The upper and lower staggered (as shown in FIG. 7) or the upper and lower left and right at the same time (as shown in FIG. 8 and FIG. 9) are inserted into the heat sink 20, and only the projection of the slot 2183 along the arrangement direction of the heat pipes 30 and 40 is located along the heat pipes 30 and 40. Between the projections of the directions, the direction in which the slots 2183 extend intersects the direction in which the heat pipes 30, 40 are arranged. When the heat pipes 30 and 40 are vertically staggered and disposed in the heat sink 20, the grooves 218 3 are disposed on the upper and lower sides of the protruding portion 218 to block the heat pipes 30 and 40 from the heat transfer path in the up and down direction. When the heat pipes 30 and 40 are staggered and disposed in the heat sink 20, the grooves 2183 are provided on the left and right sides of the protruding portion 218 to block the heat pipes 30 and 40 from the heat transfer path in the left-right direction. When the heat pipes 30 and 40 are vertically and horizontally staggered and disposed in the heat sink 20, the protruding portion 218 is obliquely disposed between the heat pipes 30 and 40, and is also disposed on the heat pipe 30 in the vertical direction. Between 40, the slot 2183 can be disposed only above or below the protrusions 21 8 to block the heat pipes 30, 40 in the upper and lower or left and right direction, or at the same time above and below the protrusions 218. On both sides, the heat pipes 30 and 40 are simultaneously blocked in the heat transfer paths of the upper and lower sides and the left and right. [0015] The heat dissipation module includes two heat pipes 30 and 40. Of course, the heat dissipation module can be based on the number of heat generating components and the heat sink. In the heat dissipation module, the protrusion 218 is provided with a slot 2183. It can be understood that the protrusion 218 can also be provided with a slot or a plurality of slots. [0016] As described above, the present invention meets the requirements of the invention patent, and the patent application is filed according to law. However, the above is only a preferred embodiment of the present invention, and those skilled in the art of the present invention are equivalent in the spirit of the present invention. Modifications or changes should be covered In the scope of the patent application. [Simple description of the drawing] 096132566 Form No. A0101 Page 8 of 21 1003011439-0 1354883. Correction replacement page of January 12, 100. [0017] FIG. 2 is an exploded perspective view of the heat dissipation module of FIG. 1. [0019] FIG. 3 is a perspective assembled view of a heat sink of FIG. 1. [0020] 4 is a side view of a heat sink fin in Fig. 3. [0021] Fig. 5 is a front view of the heat sink fin of Fig. 4. [0022] Fig. 6 is a front view of the second embodiment of the heat sink fin. [0024] FIG. 7 is a front view of the third embodiment of the heat dissipating fin. FIG. 8 is a front view of the fourth embodiment of the heat dissipating fin. [0025] FIG. [0026] [Main component symbol description] Centrifugal fan: 10 [0027] Air outlet: 124 [0028] Radiator: 20 yoke [0029] Left and right parts: 20a, 20b [0030] Cooling fins: 21 [0031 Body: 210 [0032] Front: 21 2 [0033] Back: 21 3 [0034] Upper and lower ends: 214, 215 [0035] Wings: 216 09613256 6 Form No. A0101 Page 9 / Total 21 Page 1003011439-0 1354883 [0036] Projection: 2 1 8 [0037] Sheet: 2182 [0038] Slot: 2183 [0039] Connecting piece: 2184 [0040] Upper contact Surface: 24a [0041] Lower contact surface: 24b [0042] Air flow channel: 2 6 [0043] Depression: 219 [0044] Heat pipe: 30, 40 [0045] Evaporation section: 310, 410 [0046] Condensation section: 320, 420 [0047] Heat absorbing element: 50, 60 096132566 Form number A01O1 Page 10 / Total 21 pages 100 years January i2 day replacement page 1003011439-0