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Application filed by Boardtek Electronics CorpfiledCriticalBoardtek Electronics Corp
Priority to TW96116987ApriorityCriticalpatent/TW200844269A/zh
Publication of TW200844269ApublicationCriticalpatent/TW200844269A/zh
Application grantedgrantedCritical
Publication of TWI352134BpublicationCriticalpatent/TWI352134B/zh
Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method