TWI345294B - Multi-window ball grid array package and method for fabricating the same - Google Patents

Multi-window ball grid array package and method for fabricating the same Download PDF

Info

Publication number
TWI345294B
TWI345294B TW096148328A TW96148328A TWI345294B TW I345294 B TWI345294 B TW I345294B TW 096148328 A TW096148328 A TW 096148328A TW 96148328 A TW96148328 A TW 96148328A TW I345294 B TWI345294 B TW I345294B
Authority
TW
Taiwan
Prior art keywords
window
substrate
corner
grid array
ball grid
Prior art date
Application number
TW096148328A
Other languages
Chinese (zh)
Other versions
TW200929499A (en
Inventor
Kuo Yuan Lee
Original Assignee
Walton Advanced Eng Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Walton Advanced Eng Inc filed Critical Walton Advanced Eng Inc
Priority to TW096148328A priority Critical patent/TWI345294B/en
Publication of TW200929499A publication Critical patent/TW200929499A/en
Application granted granted Critical
Publication of TWI345294B publication Critical patent/TWI345294B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061—Disposition
    • H01L2224/0612—Layout
    • H01L2224/0615—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
    • H01L2224/06154—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry covering only portions of the surface to be connected
    • H01L2224/06155—Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061—Disposition
    • H01L2224/0612—Layout
    • H01L2224/0615—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
    • H01L2224/06154—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry covering only portions of the surface to be connected
    • H01L2224/06156—Covering only the central area of the surface to be connected, i.e. central arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73215—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/183—Connection portion, e.g. seal
    • H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A multi-window BGA package primarily comprises a substrate having a plurality of corner windows, a chip on the substrate, a molding compound encapsulating the chip, a plurality of conductive balls and collision beams below the substrate. The collision beams are protrusively formed on two symmetric sides and each connects an easy-to-moldflash window with a normal window in series and connects with the molding compound. Accordingly, the packing times of the molding compound in the easy-to-moldflash window and the normal window are synchronous to avoid mold flash happened around the windows. Additionally, the collision beams can protect the conductive balls free from impact to cause damage or ball-dropping. Also, a method for fabricating the multi-window BGA package is disclosed.

Description

imm 九、發明說明： 【發明所屬之技術領域】 本發明係有關於半導體裝置及其製造技術， 有關於〆種多窗口球格陣列封裝構造及其製造；5 【先前技術】 在幕多半導體裝置之封裝類型中，窗口型球 封裝構造（WBGA，Window Ball Grid Array)是將 載晶片之基板開設有一貫通之窗口，以便於銲線 口’以電性連接基板與在其上方之晶片，並將導 合至基板之下方，以使窗口型球格陣列封裝構造 電性接合。然而，由於不當的外力或摔落至地面 力’皆可能會造成導電球接合處產生斷裂，造成 可靠度不良或元件失效等問題。故目前會在基板 增設複數個角隅窗口，使在基板上方的封膠體可 角隅窗口’以在基板下方形成絕緣性防撞凸塊。 製造上會有嚴重的模封溢膠。 如第1圖所示’ 一種習知多窗口球格陣列封 100主要包含一基板110、一晶片120、一模封揭 以及複數個導電球1 4 0。該基板11 〇係具有一 111、一外表面112、一貫穿該内表面11丨與該 1 1 2之中央槽孔丨丨8以及複數個形成於該外表面 外接墊119。如第2圖所示’依形成該模封膠體 模流方向1 3 1，該基板1 1 〇係具有一入膠側i i 3 應側之出膠側1 14。再如第1與2圖所示，該基 特別係 •法。 格陣列 用以承 穿過窗 電球接 可對外 的撞擊 嚴重的 之角隅 以通過 然而在 裝構造 體 130 内表面 外表面 1 12之 130之 與一對 板110 5 Ι3*452$4 更具有複數個位於該基板110之四個角隅之角隅窗口 115與116,其中一些角隅窗口 115係鄰近於該基板u〇 之入膠側113,而其餘角隅窗口 116則鄰近於該基板110 % 之出膠側1 1 4。該晶片1 20係設置於該基板1 1 〇之該内 « 表面111，並使該晶片120之中央銲墊122對準於該基 板1 1 〇之該中央槽孔1 1 8，以供複數個銲線1 6 1以電性 連接該些中央銲墊122至該基板110。該模封膠體130 係形成於該基板110之該内表面111上並填入該中央槽 •孔1 1 8，以密封該晶片1 2 0與該些銲線1 6 1。此外，該 模封膠體130係更填入該些角隅窗口 115與116，並於 該基板 1 1 0之該外表面1 1 2形成複數個凸塊1 3 2與 1 3 3，以避免因受外力或摔落的撞擊力造成之損傷。該 些導電球1 40係設置於該基板1 1 0之該外表面丨丨2，使 該多窗口球格陣列封裝構造1 00可對外接合。 雖然可藉由該些凸塊1 3 2與1 3 3保護位在其之間之 Φ 該些導電球1 4 0 ’使該多窗口球格陣列封裝構造1 〇 〇具 有防撞之功效。然’如第2圖所示，在模封形成該封膠 體1 3 0的過程中’該模封膠體1 3 0之模流方向1 3丨係由 該入膠側1 1 3流到該出膠側1 1 4，而該模封谬體丨3 〇係 先填滿鄰近該入膠側11 3之該些角隅窗口 u 5 |形成該 些凸塊132’使形成該些凸塊132預先到達「膠填充」 (packing)的狀態。但整個模封膠體13〇仍在「流動」 (filling)狀態’會流向鄰近該出膠側U4之該些角隅窗 口 1 1 6以形成該些凸塊1 3 3，完成整個注膠過程後進行 6 I34452$4 「膠填充」，持續加壓加熱直到該模封膠體丨3 〇與該此 凸塊13 3成形。然而’在此情況下，相對於該棱私棚 、对跟體 130與鄰近該出膠側Η4的凸塊133的膠填充眛„ π间，鄰 近該入膠側1 1 3的凸塊1 32會有較長的膠填充日4 τ間，所 產生的時間差會導致鄰近該入膠側1 1 3的凸塊】^ 1 μ 在該 些角隅窗口 U5產生模封溢膠13 2Α，甚至覆 基·至該些 外接塾1 19，使得部份導電球140接合不良（如坌，a 乐1與2 圖所示）。Imm IX. Description of the Invention: [Technical Field] The present invention relates to a semiconductor device and a manufacturing technique thereof, and relates to a multi-window ball grid array package structure and its manufacture; 5 [Prior Art] In a multi-semiconductor device In the package type, the window ball Grid Array (WBGA) is a window through which the substrate of the carrier wafer is opened, so that the wire bonding port 'electrically connects the substrate and the wafer above it, and Leading to the underside of the substrate to electrically bond the window-type ball grid array package structure. However, due to improper external force or falling to the ground force, it may cause breakage at the joint of the conductive ball, resulting in problems such as poor reliability or component failure. Therefore, a plurality of corners are added to the substrate so that the encapsulant above the substrate can be angled to form an insulating bump bump under the substrate. There will be a serious mold overfill on the manufacturing. As shown in Fig. 1, a conventional multi-window ball grid array 100 mainly comprises a substrate 110, a wafer 120, a die-cut and a plurality of conductive balls 140. The substrate 11 has a 111, an outer surface 112, a central slot 8 extending through the inner surface 11 and the 112, and a plurality of outer pads 119 formed on the outer surface. As shown in Fig. 2, the substrate 1 1 has a glue side 1 14 on the side of the glue side i i 3 in accordance with the mold flow direction of the mold seal. As shown in Figures 1 and 2, the base is specially designed. The grid array is adapted to pass through the window ball to connect to a severely impactful corner 隅 to pass through, however, the outer surface of the inner surface of the structure 130 is spaced from the pair of plates 110 5 Ι 3*452$4. The corners 115 and 116 of the corners of the substrate 110 are adjacent to the glue side 113 of the substrate u, and the remaining corner windows 116 are adjacent to the substrate 110%. The glue side 1 1 4 . The wafer 1 20 is disposed on the inner surface 111 of the substrate 1 1 , and the central pad 122 of the wafer 120 is aligned with the central slot 1 1 8 of the substrate 1 1 以 for a plurality of The bonding wires 116 are electrically connected to the central pads 122 to the substrate 110. The mold sealing body 130 is formed on the inner surface 111 of the substrate 110 and fills the central slot hole 81 to seal the wafer 110 and the bonding wires 116. In addition, the molding compound 130 is further filled into the corner windows 115 and 116, and a plurality of bumps 1 3 2 and 1 3 3 are formed on the outer surface 1 1 2 of the substrate 110 to avoid Damage caused by external force or falling impact. The conductive balls 144 are disposed on the outer surface 丨丨2 of the substrate 110, such that the multi-window ball grid package structure 100 can be externally bonded. Although the bumps 1 3 2 and 1 3 3 can be protected by the Φ between the conductive strips 1 4 0 ', the multi-window ball grid array package structure 1 has an anti-collision effect. However, as shown in FIG. 2, in the process of molding the sealant 130, the mold flow direction of the mold seal 130 is flowing from the glue side 1 1 3 to the outlet. The glue side 1 14 4, and the mold body 丨 3 先 first fills the corner 隅 window u 5 adjacent to the glue side 11 3 | forming the bumps 132 ′ to form the bumps 132 in advance Go to the state of "packing". However, the entire molding compound 13 is still in a "filling state", and flows to the corners 1 1 6 adjacent to the dispensing side U4 to form the bumps 1 3 3, after the entire injection process is completed. Perform 6 I34452$4 "glue filling" and continue to pressurize and heat until the molding compound 丨3 〇 is formed with the bump 13 3 . However, in this case, the bump 1 32 adjacent to the glue side 1 1 3 is opposite to the rubber filling of the ribs 130, the pair of body 130 and the protrusion 133 adjacent to the glue side Η 4 There will be a long glue filling time between 4 τ, and the resulting time difference will cause the bumps adjacent to the glue side 1 1 3 to be ^ 1 μ in the corners of the window U5 to produce a seal over 13 2 , or even The bases to the external ports 1 19 cause some of the conductive balls 140 to be poorly bonded (eg, a, a music shown in Figures 1 and 2).

【發明内容】 本發明之主要目的係在於提供一種多窗口珀 味格陣列 封裝構造及其製造方法，使鄰近於入膠侧與鄰访 <於出膠 侧之角隅窗口異有同步化的膠填充時間，以避冬& 〜：兄鄰近於 入膠側之角隅窗口發生模流溢膠，並能防止該客* 7囪口球 格陣列封裝構造在摔落時電性斷路之問題。此从 外，防揸 護條係具有良好的固著性以及不易脫落，以達$,丨± %到較佳的 保護功效。 球格陣列 摔落保護 ’以降低 本發明之次一目的係在於提供一種多窗〇 封裝構造及其製造方法，藉以增加防撞護條之 角度’將部分的摔落力量分力轉換為旋轉動能 摔洛的直接衝擊。 本發明的目的及解決其技術問題是採用以Τ ^ 卜技術方 案來實現的。依據本發明之一種多窗口球格陵α 份暉列封裝構 造主要包含一基板、一晶片、一模封膠體 '複數個導電 球以及複數個防撞護條。該基板係具有一内矣 〇衣面、一外 7 IJ45294 表面、一入膠側、一出膠側、複數個第一角隅窗口以及 複數個第二角隅窗口 ’其中該些第一角隅窗口係鄰近於 該入膠側，該些第二角隅窗口係鄰近於該出膠側。該晶 片係設置於該基板之該内表面。該模封膠體係形成於該 基板之該内表面上’以密封該晶片之至少一部位。該些 導電球係設置於該基板之該外表面。該些防撞護條係突 出地‘形成於該基板之該外表面之兩對稱側邊，並由該入 膠側之兩端延伸至該出膠側之兩端並為相互平行排 列，該些防撞護條係串連同一側邊之該些第一角隅窗口 與該些第二角隅窗口並與該模封膠體連接。此外，另揭 示前述多窗口球格陣列封裝構造之製造方法。 在前述之多窗口球格陣列封裝構造中，每一防撞護 條係可各具有一切割側面與一支撐表面，其中該些切割 側面係切齊於該基板之對稱側面，該些支撐表面係大致 平行於該基板之該外表面，並且該些防撞護條在該些支 撐表面與該些切割側面相接之邊緣係具有一不大於九 十度之夾角。 在前述之多窗口球格陣列封裝構造中，該些防撞護 條係可與該模封膠體為一體連接並為相同材質。 在前述之多窗口球格陣列封裝構造中，該基板可另 具有複數個側邊窗口，該些防撞護條係更串連並密封該 些側邊窗口。 在前述之多窗口球格陣列封裝構造中，該些側邊窗 口係可與同一側邊之該些第一角隅窗口與該些第二角 8 1345204 隅窗口不位於同一直線，並且該些防撞護條係具有複數 個内延伸指，以串連該些側邊窗口。 在前述之多窗口球格陣列封裝構造中，該基板可另 具有一中央槽孔，其係平行排列於該些防撞護條之間， 並且該中央槽孔係被該模封膠體填充。 在前述之多窗口球格陣列封裝構造中，該晶片係可 具有複數個中央銲墊，其係對準於該中央槽孔内。 在前述之多窗口球格陣列封裝構造中，可另包含有 複數個第一銲線，其係穿過該中央槽孔以電性連接該些 中央銲墊至該基板。 在前述之多窗口球格陣列封裝構造中，可另包含有 複數個第二銲線，並且該晶片係具有複數個周邊銲墊， 其係對準於該些側邊窗口内，而該些第二銲線係穿過該 些側邊窗口以電性連接該些周邊銲墊至該基板。 在前述之多窗口球格陣列封裝構造中，該些側邊窗 口係可連通至該基板之對稱側面，而為缺口狀。 在前述之多窗口球格陣列封裝構造中，該些第一角 隅窗口與該些第二角隅窗口係可連通至該基板之對稱 側面，而為缺口狀。 在前述之多窗口球格陣列封裝構造中，該些第一角 隅窗口係可更連通至該基板之該入膠側，該些第二角隅 窗口係更連通至該基板之該出膠側。 【實施方式】 依本發明之第一具體實施例，如第3及4圖所示， 9SUMMARY OF THE INVENTION The main object of the present invention is to provide a multi-window scent grid array package structure and a manufacturing method thereof, which are synchronized with the adjacent side of the glue-in side and the adjacent corners of the glue-side side. Glue filling time to avoid winter & ~: The brother is adjacent to the corner of the plastic side of the corner of the window to create a mold overflow, and can prevent the passenger * 7 chimney grid array package structure in the event of electrical disconnection when falling. In addition, the tamper-proof strip has good fixation and is not easy to fall off, so as to achieve a better protection effect of $, 丨 ± %. The second object of the present invention is to provide a multi-window encapsulation structure and a manufacturing method thereof, thereby increasing the angle of the anti-collision guard to convert part of the falling force component into rotational kinetic energy. The direct impact of falling Luo. The object of the present invention and solving the technical problems thereof are achieved by using a technical solution. According to the present invention, a multi-window sphere green alpha-column package structure mainly comprises a substrate, a wafer, a mold-molding body, a plurality of conductive balls, and a plurality of anti-collision guard strips. The substrate has an inner lining, an outer 7 IJ45294 surface, a glue side, a glue side, a plurality of first corner 隅 windows, and a plurality of second corner ' windows, wherein the first corners The window is adjacent to the glue side, and the second corner window is adjacent to the glue side. The wafer is disposed on the inner surface of the substrate. The mold encapsulation system is formed on the inner surface of the substrate to seal at least a portion of the wafer. The conductive balls are disposed on the outer surface of the substrate. The anti-collision strips are protrudedly formed on two symmetric sides of the outer surface of the substrate, and extend from the two ends of the glue-in side to the two ends of the stripping side and are arranged in parallel with each other. The collision guard string is coupled to the first corner window and the second corner window of one side and to the molding compound. Further, a method of manufacturing the aforementioned multi-window ball grid array package structure is also disclosed. In the multi-window ball grid array package structure described above, each of the bumper strips may have a cut side and a support surface, wherein the cut sides are aligned with the symmetric sides of the substrate, and the support surfaces are The outer surface of the substrate is substantially parallel to the outer surface of the substrate, and the edges of the anti-collision strips at the edges of the support surfaces that meet the cut sides have an angle of no more than ninety degrees. In the multi-window ball grid array package construction described above, the anti-collision guard strips may be integrally connected to the mold encapsulant and be of the same material. In the multi-window ball grid array package construction described above, the substrate may have a plurality of side windows that are more in series and seal the side windows. In the foregoing multi-window ball grid array package structure, the side windows can be in the same line with the second corners of the same side corners, and the second corners are not in the same line. The bumper strip has a plurality of inner extension fingers to connect the side windows in series. In the above-described multi-window ball grid array package configuration, the substrate may further have a central slot which is arranged in parallel between the anti-collision strips, and the central slot is filled by the molding compound. In the multi-window ball grid array package construction described above, the wafer system can have a plurality of central pads that are aligned within the central slot. In the foregoing multi-window ball grid array package structure, a plurality of first bonding wires may be further disposed through the central slot to electrically connect the central pads to the substrate. In the foregoing multi-window ball grid array package structure, a plurality of second bonding wires may be further included, and the wafer system has a plurality of peripheral pads aligned in the side windows, and the A second bonding wire is passed through the side windows to electrically connect the peripheral pads to the substrate. In the multi-window ball grid array package construction described above, the side windows are connectable to the symmetrical side of the substrate and are notched. In the multi-window ball grid array package structure, the first corner window and the second corner window are connectable to the symmetrical side of the substrate and are notched. In the foregoing multi-window ball grid array package structure, the first corner window can be more connected to the glue side of the substrate, and the second corner window is more connected to the glue side of the substrate. . [Embodiment] According to the first embodiment of the present invention, as shown in Figures 3 and 4, 9

I?452$4 一種多窗口球格陣列封裝構造200係主要包 210、一晶片220、一模封膠體23〇、複數個導 以及複數個防撞護條2 5 〇 ^該基板2丨〇係具有 2 1 1、一外表面2 1 2、一入膠側2 1 3、一出膠側 數個第一角隅窗口 215以及複數個第二角隅窗 該基板210之該内表面211為晶片設置面，而 2 1 2則為導電球設置面。該入膠側2 1 3與該出 之區隔係依據形成形成該模封膠體23 0之； 231(如第9圖所示請再參閱第4圖所示， 些第一角隅窗口 2 1 5係鄰近於該入膠侧2 i 3， 角隅窗口 2 1 6係鄰近於該出膠側2 1 4。該基板 具有複數個外接墊2 1 9 ’例如圓形之接球塾， 於該外表面212，以供接合該些導電球24〇， 外接塾2 1 9係可呈多排排列或是格狀陣列型態 4圖所示，該基板2 1 0可另具有複數個側邊窗 約位於該基板210之該些第一角隅窗口 215與 角隅窗口 216之間。該基板210更可具有一貫 2 1 0之中央槽孔2 1 8 ’其係平行排列於該些防撞 之間。 請參閱第3圖所示，該晶片220係設置於該 之該内表面211。該晶片220係可具有複數個 222，其係對準於該中央槽孔218内，該些中央 係形成於該晶片220之一主動面221。其中， 銲墊222通常是以單排或多排方式排列在該晶 含一基板 電球240 一内表面 2 1 4、複 口 2 1 6 » 該外表面 膠側2 1 4' 模流方向 其中，該 該些第二 2 1 0係可 其係形成 其中該些 。再如第 口 217， 該些第二 穿該基板 護條250 基板2 1 0 中央銲墊 銲墊222 該些中央 片220之 10 045294 該主動面2 21之中心線位置。請參閱第5圖所示 片220之該主動面221更形成有複數個周邊銲塑 其係對準於該基板2 1 0之該些側邊窗口 2 1 7，以 行後續之電性連接。該些周邊銲墊223係排列在 220之該主動面221之兩側邊，且數量可少於該 銲墊222。在黏晶時，利用一黏晶層270黏接該晶 之該主動面221至該基板210之該内表面21 1， 晶片220係以該主動面221朝向該基板210之方 於該基板2 1 0上。 請參閱第5圖所示，具體而言，該多窗口球 封裝構造200係可另包含有複數個打線形成之 線26 1，其係穿過該中央槽孔2 1 8以電性連接該晶 之該些中央銲墊222至該基板21〇之接指（圖 出達到該晶片220與該基板2 1 0之電性互連 體而言’該多窗口球格陣列封裝構造2 0 0係可另 打線形成之複數個第二銲線2 6 2，其係對準於該 窗口 2 1 7内’而該些第二銲線262係穿過該些侧 217以電性連接該晶片22〇之該些周邊銲墊223 板2 1 〇之接指（圖中未繪出）。 該模封膠體230係形成於該基板210之該内表 上’以密封該晶片2 2 0之至少一部位。該模封膠 更填入該中央槽孔218、該些第一角隅窗口 215 第二角隅窗口 216内，以密封該些第一銲線261 適當的封裴保護以防止電性短路與塵埃污染。該 ‘ 223， 便於進 該晶片 些中央 片220 以使該' 式設置 格陣列 第一銲 片220 中未繪 。更具 包含有 些側邊 邊窗口 至該基 -面 2 1 1 體230 與該些 ’提供 模封膠 1345294 體230係可為壓模（或稱轉移成形，transfermolding)的 技術加以形成。該些導電球240係設置於該基板2 1 0之 該外表面212之該些外接墊219’以供作為輸入端及/ 或輸出端以使該多窗口球格陣列封裝構造200與外界 裝置形成電性連接關係’故該多窗口球格陣列封裝構造 2 0 0係可藉由該些導電球2 4 0接合至一外部印刷電路板 (圖中未繪出）。 請參閱第3及4圖所示，該些防撞護條250係突出 地形成於該基板2 1 0之該外表面2 1 2之兩對稱側邊。並 且該些防撞護條2 5 0係由該入膠側2 1 3之兩端延伸至該 出膠側2 1 4之兩端並為相互平行排列，以增加該多窗口 球格陣列封裝構造200之結構強度，並可避免該多窗口 球格陣列封裝構造200受外力碰撞時所造成之損傷。並 且，再如第3及4圖所示，該些防撞護條250係串連同 一側邊之該些第一角隅窗口 215與該些第二角隅窗口 216並與該模封膠體23〇連接，以具有良好之固著性。 於本實施例中，該些防撞護條250係更串連並密封該些 側邊窗口 217(如第4圖所示）。 較佳地，該些防撞護條250係可與該模封膠體230 為一體連接並為相同材質，以降低製造成本。因此，該 模封膠體230形成於該些第一角隅窗口 215内與該些第 二角隅窗口 216内的膠填充時間（packing time)可同步 化，可防止在該些第一角隅窗口 215處產生溢膠。 請參閱第3及6圖所示，每一防撞護條2 5 0係可各 12 13*45294 具有一切割側面251與一支撐表面252，其中I?452$4 A multi-window ball grid array package structure 200 series main package 210, a wafer 220, a molding compound 23 〇, a plurality of guides and a plurality of anti-collision guards 2 5 〇 ^ the substrate 2 2 1 1 , an outer surface 2 1 2 , a plastic side 2 1 3 , a plurality of first corner windows 215 and a plurality of second corner windows. The inner surface 211 of the substrate 210 is set for the wafer Face, while 2 1 2 sets the face for the conductive ball. The adhesive side 2 1 3 and the exiting compartment are formed according to the formation of the molding compound 23 0; 231 (as shown in FIG. 9 , please refer to FIG. 4 , the first corner window 2 1 The 5 series is adjacent to the glue side 2 i 3 , and the corner window 2 16 is adjacent to the glue side 2 14 . The substrate has a plurality of external pads 2 1 9 ', for example, a circular ball 塾, The outer surface 212 is configured to join the conductive balls 24 〇, and the external 塾 2 19 series may be arranged in a plurality of rows or in a lattice array type 4, the substrate 210 may have a plurality of side windows The first corner window 215 of the substrate 210 is located between the corner window 215 and the corner window 216. The substrate 210 further has a central slot 2 1 8 8 which is consistently arranged in parallel with the collision avoidance. Referring to Fig. 3, the wafer 220 is disposed on the inner surface 211. The wafer 220 can have a plurality of 222 aligned in the central slot 218, and the central portions are formed. The active surface 221 of the wafer 220. The solder pads 222 are generally arranged in a single row or multiple rows on the inner surface of the substrate including a substrate ball 240. Port 2 1 6 » The outer surface of the rubber side 2 1 4' mold flow direction, wherein the second 2 1 0 series can form the same therein. Like the first port 217, the second through the substrate protection Strip 250 substrate 2 1 0 central pad pad 222 10 045294 of the central piece 220 The center line position of the active surface 2 21 . Please refer to the active surface 221 of the sheet 220 shown in FIG. 5 to form a plurality of peripheral portions The soldering is aligned with the side windows 2 1 7 of the substrate 2 1 0 for subsequent electrical connection. The peripheral pads 223 are arranged on both sides of the active surface 221 of the 220. The number of the pads 222 may be less than the bonding pad 222. When the bonding is performed, the active surface 221 of the crystal is bonded to the inner surface 21 of the substrate 210 by a bonding layer 270, and the wafer 220 is oriented with the active surface 221 The substrate 210 is formed on the substrate 210. Referring to FIG. 5, specifically, the multi-window ball package structure 200 may further include a plurality of wires 26 formed by a wire. The central slot 2 18 is electrically connected to the central pads 222 of the crystal to the contacts of the substrate 21 (the wafer 220 is reached In the case of the electrical interconnect of the substrate 2 10 , the multi-window ball grid array structure 200 is a plurality of second bonding wires 2 6 2 which can be formed by another wire, which is aligned with the window 2 1 7 The second bonding wires 262 pass through the sides 217 to electrically connect the peripheral pads 223 of the wafer 22 to the contacts of the plates 2 1 (not shown). A colloid 230 is formed on the inner surface of the substrate 210 to seal at least a portion of the wafer 220. The molding compound is further filled into the central slot 218 and the second corner window 215 of the first corner window 215 to seal the first sealing wire 261 to prevent the electrical short circuit and dust. Pollution. The '223' facilitates the advancement of the central wafers 220 of the wafer such that the array of the first pads 220 is not depicted. More includes a side window to the base-face 2 1 1 body 230 and the 'providing molding compound 1345294 body 230 can be formed by a technique of press molding (or transfer molding). The conductive balls 240 are disposed on the outer pads 219 ′ of the outer surface 212 of the substrate 210 for use as an input terminal and/or an output terminal to form the multi-window ball grid array package structure 200 and an external device. The electrical connection relationship is such that the multi-window ball grid array structure 200 can be bonded to an external printed circuit board (not shown) by the conductive balls 240. Referring to Figures 3 and 4, the bumper strips 250 are formed to be prominently formed on the symmetrical sides of the outer surface 2 1 2 of the substrate 2 10 . And the anti-collision protection strips 250 are extended from the two ends of the glue-in side 2 1 3 to the two ends of the glue-discharging side 2 1 4 and arranged in parallel with each other to increase the multi-window ball grid array package structure. The structural strength of 200 can avoid damage caused by the collision of the multi-window ball grid array package structure 200. Moreover, as shown in FIGS. 3 and 4, the anti-collision protection strips 250 are stringed together with the first corner 隅 window 215 and the second corner 隅 window 216 on one side and the molding compound 23 〇 Connected to have good fixation. In the present embodiment, the bumper strips 250 are further connected in series and seal the side windows 217 (as shown in Fig. 4). Preferably, the anti-collision strips 250 are integrally connected to the molding compound 230 and are made of the same material to reduce manufacturing costs. Therefore, the molding encapsulation 230 is formed in the first corner window 215 and the glue filling time in the second corner window 216 can be synchronized to prevent the first corner window in the first corner window 216. An overflow is produced at 215. Referring to Figures 3 and 6, each of the bumper strips 250 can have a cut side 251 and a support surface 252, respectively.

側面25 1係切齊於該基板2 1 〇之對稱側面（即言I 在该入膠側2 1 3之兩端至該出膠側2 1 4之兩端 面）β亥些支樓表面252係大致平行於該基板 外表面212,並且該些防撞護條25〇在該些支指 與遠些切割側面2 5 1相接之邊緣2 5 3係具有一 十度之夾角。 請參閱第7圖所示，當該多窗口球格陣列 2 0 0不慎掉落至地面i 〇時，利用該些防撞護 銳角邊緣2 5 3可以將摔落撞擊力分力轉變 能’以達到較佳的防撞功效，避免因撞擊造成 因此’該些防撞護條2 5 0係具有良好的固 易脫落’以保護在該些防撞護條2 5 〇之間的該 240 ’即使該多窗口球格陣列封裝構造2〇〇不 可藉由該些防撞護條2 5 0之邊緣2 5 3將掉落的 變成旋轉動能另可分散因撞擊所產生的應力， 擊而造成該些導電球240與該些外接墊219之 裂’藉此提高該多窗口球格陣列封裝構造2 〇 〇 接可靠性。此外，由於每一防撞護條25〇係串 邊之第一角隅窗口 215與第二角隅窗口 216, 膠時，位於5亥些第一角隅窗口 2 1 5内之該模封 會不斷流向位在同一側之該些第二角隅窗口 到該模封膠體2 3 0填滿該些第二角隅窗口 2 i 6 第一角隅窗口 215則不會有預先填滿而發 該些切割 i基板2 1 0 的側邊表 2 1 0之該 ?表面252 不大於九 .r 封裝構造 條25 0之 成旋轉動 之損害。 著性，不 些導電球 慎掉落仍 撞擊力轉 避免因撞 接合處斷 之電性連 皆同一側 使得在封 '膠體23〇 2 1 6内直 1，而該些 生模流溢 13 U452h 膠。故該些導電球240可與該基板210之外接墊219接 合良好，進而提昇該多窗口球格陣列封裝構造200之電 性連接與傳輸品質。 第8A至8F圖係用以說明前述多窗口球格陣列封裝 構造之一具體製造方法。首先，請參閱第4及8A圖所 示’提供一基板210,該基板210係具有一内表面211、 一外·表面2 1 2、一入膠側2 1 3、一出膠侧2 1 4、複數個' 第一角隅窗口 215以及複數個第二角隅窗口 216，其中 該些第一角隅窗口 2 1 5係鄰近於該入膠側2 1 3，該些第 二角隅窗口 2 1 6係鄰近於該出膠側2 1 4。該基板2 1 0之 該外表面2 12係形成有複數個外接墊2 1 9。請參閱第4 圊所示，具體而言，該基板210可另具有複數個貫穿該 基板2 1 0之側邊窗口 2 1 7，其係位於該基板2 1 0之兩側 邊，該基板210更可另具有一貫穿該基板210之中央槽 孔2 1 8，其係位於該基板2 1 0之中央區域。在本實施例 中，該基板21 0係可形成於一基板條20，該基板條20 係具有複數個切割道2 1，其係用以定義出複數個基板 210 ° 接著，請參閱第8B圖所示，設置一晶片220於該基 板210之該内表面2Π。該晶片220係具有一主動面221 以及複數個形成於該主動面22 1之中央銲墊22 2與周邊 銲墊223。請參閱第4及8B圖所示’利用一黏晶層270 黏貼該晶片220之該主動面221至該基板210之該内表 面21 1，並使得該晶片220之該些中央銲墊222與該些 14 Ι3·452$4 參 周邊銲墊223分別對準在該中央槽孔218内 窗口 2 1 7内’以便於進行後續之電性連接。 之後’請參閱第5及8C圖所示，該多窗 封裝構造200之製造方法係可另包含之步驟 術形成複數個第一銲線26 1與複數個第二辑 第一銲線26 1係穿過該中央槽孔2丨8以電性 央銲塑* 222至該基板210，而該些第二銲線 過該些側邊窗口 2 1 7以電性連接該些周邊銲 參基板2 1 〇，達到該晶片22〇與該基板2 i 〇之 接。 在電性連接後’請參閱第8 D圖所示，利 技術形成一模封膠體23 0於該基板2 1 0之該 上’以密封該晶片220之至少一部位，並同 成複數個防撞護條2 5 0於該基板2 1 0之該外 兩對稱側邊。該模封膠體23〇係更填入Ί 鲁 218，以松封該些第一銲線26丨，其中該中 係平行排列於該些防撞護條2 5 〇之間，而 230係不覆蓋該些外接墊219。請參閱第9 些防撞護條2 5 0係由該入膠側2丨3之兩端延 側2 1 4之兩端並為相互平行排列於該模封膠 流方向2 3 1 ’該些防撞護條2 5 〇係串連同一 第一角隅窗口 215與該些第二角隅窗口 216 膠體230連接（如第sd圖所示）。該些防撞 可延伸至該基板條2 0之該些個切割道2 1， 與該些側邊 口球格陣列 【有：打線技 L線2 6 2，該 連接該些中 262則係穿" 墊223至該 間之電性連 用壓模成形 :内表面21 1 時突出地形 表面2 1 2之 该中央槽孔 央槽孔2 1 8 該模封膠體 圖所示，該 伸至該出膠 體2 3 0之模 側邊之該些 並與該模封 護條2 5 〇係、 而該些防撞 15 丄舛5的4 護條2 5 0係可更串連並密封該些側邊窗口 2 1 7。再如第 9圖所示，該模封膠體230會經由該些第一角隅窗口 215 持續往同一側邊之第二角隅窗口 2 1 6流動，因此該些第 一角隅窗口 215不會預先到達膠填充的狀態，進而解決 了習知角隅窗口模封溢膠The side surface 25 1 is cut out on the symmetrical side of the substrate 2 1 ( (ie, at the two ends of the glue side 2 1 3 to the two sides of the glue side 2 1 4) The anti-collision strips 25 are substantially parallel to the edge of the substrate. Please refer to Fig. 7. When the multi-window ball grid array 200 is accidentally dropped to the ground i ,, the edge of the collision protection sharp edge 2 5 3 can be used to transform the impact force of the fall impact force' In order to achieve better anti-collision effect, avoiding the impact caused by the impact, so that the anti-collision protection strips 250 have a good solid fall off to protect the 240' between the anti-collision guards 2 5 〇 Even if the multi-window ball grid array package structure 2 can not be turned into rotational kinetic energy by the edge 2 5 3 of the anti-collision strips 250, the stress generated by the impact can be dispersed, causing the impact The conductive balls 240 are split with the external pads 219 to thereby improve the reliability of the multi-window ball array package structure 2 . In addition, since each of the anti-collision protection strips 25 is the first corner 隅 window 215 and the second corner 隅 window 216 of the string, the molding will be located in the first corner 2 window 2 1 5 Continuing to flow to the second corner 隅 window on the same side to the molding compound 2 3 0 to fill the second corner 2 window 2 i 6 The first corner 隅 window 215 is not pre-filled The surface 252 of the side surface 2 1 0 of the i-substrate 2 1 0 is not larger than the damage of the rotation of the 9.r package structure strip 25 0 . Sexuality, no conductive ball is carefully dropped, but the impact force is turned to avoid the electrical connection of the broken joint is the same side, so that the seal is in the colloid 23〇2 16 straight, and the green mold overflows 13 U452h . Therefore, the conductive balls 240 can be well joined to the external pads 219 of the substrate 210, thereby improving the electrical connection and transmission quality of the multi-window ball grid array package structure 200. Figs. 8A to 8F are diagrams for explaining a specific manufacturing method of the aforementioned multi-window ball grid array package configuration. First, please refer to FIGS. 4 and 8A to provide a substrate 210 having an inner surface 211, an outer surface 2 1 2, a glue side 2 1 3, and a glue side 2 1 4 a plurality of first corner windows 215 and a plurality of second corner windows 216, wherein the first corner windows 2 1 5 are adjacent to the glue side 2 1 3, and the second corner windows 2 The 1 6 series is adjacent to the dispensing side 2 1 4 . The outer surface 2 12 of the substrate 2 1 0 is formed with a plurality of external pads 2 1 9 . For example, the substrate 210 may further have a plurality of side windows 127 extending through the substrate 210, which are located on opposite sides of the substrate 210, the substrate 210. Further, a central slot 2 1 8 penetrating through the substrate 210 is further disposed in a central region of the substrate 210. In this embodiment, the substrate 210 can be formed on a substrate strip 20 having a plurality of dicing streets 2 1 for defining a plurality of substrates 210 °. Referring to FIG. 8B As shown, a wafer 220 is disposed on the inner surface 2 of the substrate 210. The wafer 220 has an active surface 221 and a plurality of central pads 22 2 and peripheral pads 223 formed on the active surface 22 1 . Referring to FIGS. 4 and 8B, the active surface 221 of the wafer 220 is adhered to the inner surface 21 1 of the substrate 210 by a bonding layer 270, and the central pads 222 of the wafer 220 are The 14 Ι3·452$4 reference pads 223 are respectively aligned in the window 2 177 in the central slot 218 to facilitate subsequent electrical connections. Thereafter, as shown in FIGS. 5 and 8C, the manufacturing method of the multi-window package structure 200 may further include a step of forming a plurality of first bonding wires 26 1 and a plurality of second bonding first bonding wires 26 1 . Passing through the central slot 2丨8 to electrically solder the metal 222 to the substrate 210, and the second bonding wires pass through the side windows 2 17 to electrically connect the peripheral soldering substrate 2 1 That is, the wafer 22 is connected to the substrate 2 i. After the electrical connection, please refer to FIG. 8D, the technology forms a mold encapsulant 230 on the substrate 2 10 to seal at least one portion of the wafer 220, and is formed into a plurality of anti-defense The bumper strip 250 is on the outer two symmetric sides of the substrate 2 1 0. The mold sealing body 23 is further filled with the ruthenium 218 to loosen the first bonding wires 26 丨, wherein the middle series is arranged in parallel between the anti-collision protection strips 25 5 , and the 230 series is not covered. The external pads 219. Please refer to the ninth anti-collision protection strips 2 5 0 from the two ends of the rubber-injection side 2丨3 to the two ends of the 2 1 4 and are arranged parallel to each other in the direction of the molding glue flow 2 3 1 ' The bumper strips 2 5 are connected in series with the first corner window 215 and the second corner window 216 colloid 230 (as shown in Figure sd). The collision avoidance may extend to the plurality of cutting lanes 2 1 of the substrate strip 20 and the side edge ball grid arrays [there are: the wire bonding technology L line 2 6 2, the connection 262 of which is threaded " pad 223 to the electrical connection between the compression molding: the inner surface 21 1 protrudes the top surface 2 1 2 of the central slot hole slot 2 1 8 The sides of the mold of the colloid 2300 are spliced with the mold strip 25, and the 4 strips 250 of the anti-collision 15 丄舛5 can be connected in series and seal the sides Window 2 1 7. As shown in FIG. 9, the molding compound 230 will continue to flow through the first corner window 215 to the second corner window 2 16 of the same side, so the first corner window 215 will not Reaching the state of glue filling in advance, and solving the problem of the traditional corner 隅 window molding

之後，請參閱第8 Ε圖所不’設置複數個導電球2 4 〇 於該‘基板2 1 0之該外表面2 1 2 ’藉以組成多窗口球格陣， 列封裝構造，並使載設於該基板2 1 0之該晶片220得與 該些導電球240達成電性連接關係，以供對外接合置一 印刷電路板（圖中未繪出）。在本實施例中，請參閱第8 F 圖所示，該多窗口球格陣列封裝構造之製造方法係可另 包含有一基板條切割步驟，利用一切割刀具3 〇沿著該 些切割道2 1切割並同時切割該基板條20與該些防撞護 條250 ’以單體化分離出複數個多窗口球格陣列封裝構 造°在上述基板條20切割步驟中之切割方向係可由由 I方揸。蔓條250切入，再穿過該基板條20與該模封膠體 230 ’以同時形成該些防撞護條25〇之銳角邊緣253。在 上述基板條20切割步驟之後，每-防撞護條250係可 切割側面251與一支撐表面252’其中該些切 割側面2 5 1及， 係切齊於該基板2丨〇之對稱側面，1些支樓 平行於該基板210之該外表二並 面川相接25G在該些支樓表面252與該些切割側 利用上邊緣253係具有一不大於九十度之夾角。 述之方法所製成之該多窗口球格陣列封裝構 16 13452^4 造20〇，可低成本形成該些防撞護條250以保護位於其 之間的該些導電球240，另可藉由該些防揸護條25〇之 銳角邊緣253將掉落的撞擊力轉變成旋轉動能以避免 該些導電球240與該些外接墊219之接合處產生斷裂， 並可避免該些第一角隅窗口 215發生模封溢膠。 在本發明之第.二具體實施例中，揭示另一多窗口球 格陣·列封裝構造，請參閱第10及U圖所示，該多窗口 球格陣列封裝構造3〇〇主要包含一基一曰 B曰乃 3 20、一模封膠體33〇、、複數個導電球34〇以及複數個 防撞護條3 5 0。該基板3 1 0係具有一内表面3丨丨、一外 表面3 1 2、一入膠側3 1 3、一出膠側3 1 4、複數個第一 角隅窗口 315以及複數個第二角隅窗口 316，其中該些 第一角隅窗口 315係鄰近於該入膠側313，該些第二角 隅窗口 3 1 6係鄰近於該出膠側3丨4 ^請參閱第i i圖所 示，在本實施例中，該基板3 1 0可另具有複數個側邊窗 口 3 1 7，其係可與同一側邊之該些第一角隅窗口 3丨5與 或些第二角隅窗口 316不位於同一直線。請參閱第 圖所示’該晶片3 2 0係設置於該基板3 1 0之該内表面 3 1 1 ’而該晶片3 2 0係具有複數個中央銲墊3 2 2以及周 邊銲墊323。利用複數個第一銲線361與複數個第二銲 線3 62分別電性連接該些中央銲墊322與該些周邊銲墊 323至該基板310’達到該晶片32〇與該基板310之電 性互連。該模封膠體3 3 0係形成於該基板3 1 0之該内表 面3 1 1上’以密封該晶片3 2〇之至少一部位。該些導電 17 ^*452^4 球3 4 0係設置於該基板3 1 0之該外表面3 1 2。 請參閱第1 〇及1 1圖所示’該些防撞護條3 5 〇係突 • 出地形成於該基板3 1 0之該外表面3 1 2之兩對稱側邊， • 並由該入膠側3 1 3之兩端延伸至該出膠側3丨4之兩端並 為相互平行排列，該些防撞護條3 5 0係串連同一側邊之 該些第一角隅窗口 315與該些第二角隅窗口 316並與該 棋封·膠體3 3 0連接。每一防撞護條3 5 〇係可各具有—切 鲁 割側面351與一支樓表面352，其中該些切割側面35ι 係切齊於該基板3 1 0之對稱側面，該些支撐表面352係 大致平行於該基板310之該外表面312，並且該些防撞 幾條3 50在該些支撐表面352與該些切割側面351相接 之邊緣353係具有一不大於九十度之夾角。請參閱第 12圖所示，在本實施例中，該些防撞護條3 5 〇係具有 複數個内延伸指3 54，以串連該些側邊窗口 3丨7 β 本發明之第三具體實施例揭示另一多窗口球格陣列 • 封裝構造。請參閱第13及1 4圖所示，該多窗口球格陣 列封裝構造400主要包含一基板41〇、一晶片42〇、— 模封膠體430、複數個導電球44〇以及複數個防撞護條 4 5 0。該基板4 1 0係具有一入膠側4 i 3、一出膠側4 i 4、 複數個第一角隅窗口 415以及複數個第二角隅窗〇 4 1 6 ’其中該些第一角隅窗口 4丨5係鄰近於該入膠側 413，該些第二角隅窗口 416係鄰近於該出膠側414。 請參閱第1 4圖所示’在本實施例中，該基板4 1 〇可另 具有複數個側邊窗口 4 1 7，其係可連通至該基板4 1 0之 18 13452^4 對稱側面，而為缺口狀。而在製程中’複數個基板4 1 〇 係一體連接於一基板條，該些側邊窗口 4 1 7係延伸過該 基板條（圖中未繪出）之對應切割道，以使相鄰基板4 1 0 之側邊窗口 4 1 7為相連通’可以減少在基板條型態的側 邊窗口 417數量，並有助於該模封膠體430之密封。在 本實施例中，該些第一角隅窗口 4 1 5與該些第二角隅窗 口 4 1 6係可連通至該基板4 1 0之對稱侧面，而為缺口. 狀。而在製桎中，該些第一角隅窗口 415係延伸過該基 板條之對應切割道，以使相鄰基板4 1 0之該些第一角隅 窗口 415為相連通。在不同實施例中，如第16圖所示， 複數個第一角隅窗口 415’係可更連通至該基板410之 該入膠側4 1 3，複數個第二角隅窗口 4 1 6，係更連通至該 基板410之該出膠側414。而在製程中，該些第一角隅 窗口 4 1 5 ’係更延伸過該基板4丨0之該入膠側4丨3與該基 板條之對應切割道，並與相鄰基板4 1 0之該些第二角隅 窗口 4 1 6 ’為相連通，可令該模封膠體4 3 0之流動較為順 暢。 請參閱苐1 5圖所示’該晶片420係設置於該基板 4 1 0之内表面4 1 1。利用複數個第一銲線46 1與複數個 第二鲜線462分別電性連接該晶片420之中央鲜墊422 與該晶片420之周邊銲墊423至該基板4丨〇。該模封膠 體4 3 0係用以密封該晶片4 2 0。該些導電球4 4 0係設置 於該基板410之外表面412。 請參閱第1 3及1 4圖所示，該些防撞護條4 5 0係突 19 13452^4 出地形成於該基板4 1 0之該外表面4 1 2之兩對稱側邊， 並由該入膠側4 1 3之兩端延伸至該出膠側4 1 4之兩端並 為相互平行排列，該些防撞護條4 5 0係串連同一側邊之 該些第一角隅窗口 415與該些第二角隅窗口 416並與該 模封膠體4 3 0連接。每一防撞護條4 5 〇係可各具有—切 割側面45 1與一支樓表面452，其中該些切割側面45 i 係切·齊於該基板410之對稱側面，該些支撐表面452係 大致平行於該基板410之該外表面412，並且該些防撞 護條450在該些支撐表面452與該些切割侧面45ι相接 之邊緣453係具有一不大於九十度之夾角。因此該些 第一角隅窗口 415與該些第二角隅窗口 416具有同步: 的膠填充時間，以避免鄰近於該入膠側4 i 3之第—角 窗口川發生模流溢膠’並能防止該多窗口球格 裝構造400在摔落時發生電性斷路之問題。 以上戶斤述，僅县士 & 董疋本發明的較佳實施例而已，並 本發明作任何形式上沾 對 的限制’本發明技術方案範圍去 所附申請專利範圍* I 田依 … + 4 圍為準。任何熟悉本專業的技術人員可 利用上述揭示的枯淋咖— 八貝可 變化的等效實施例 更動Μ飾為專同 容，依據本發明的技術=脫離本發明技術方案的内 單修改、等同變化與依質對以上實施例所作的任何簡 範圍内。 、> 飾，均仍屬於本發明技術方案的 【圖式續卓說明】 第1圖·習知多衆 口球格陣列封裝構造沿著第2圖K1線剖 20After that, please refer to Figure 8 to set a plurality of conductive balls 2 4 to the outer surface 2 1 2 of the 'substrate 2 1 0 to form a multi-window ball grid array, column package structure, and to carry The wafer 220 of the substrate 210 is electrically connected to the conductive balls 240 for externally bonding a printed circuit board (not shown). In this embodiment, as shown in FIG. 8F, the manufacturing method of the multi-window ball grid array package structure may further include a substrate strip cutting step, using a cutting tool 3 along the cutting streets 2 1 Cutting and simultaneously cutting the substrate strip 20 and the anti-collision guard strips 250' to separate a plurality of multi-window ball grid array package structures by singulation. The cutting direction in the cutting step of the substrate strip 20 can be performed by the I-square . The vine strip 250 is cut into and passed through the substrate strip 20 and the molding compound 230' to simultaneously form the acute-angled edges 253 of the crash guard strips 25'. After the cutting step of the substrate strip 20, each of the anti-collision strips 250 is a cuttable side surface 251 and a support surface 252', wherein the cut side surfaces 2 5 1 and are tangential to the symmetric side of the substrate 2 A plurality of branches parallel to the outer surface of the substrate 210 are connected to each other. 25G is disposed at an angle of not more than ninety degrees with the upper edges 253 of the branch surfaces 252. The multi-window ball grid array package made by the method described above can be formed at a low cost to form the anti-collision guard strips 250 at low cost to protect the conductive balls 240 located therebetween. The sharp edge 253 of the tamper-proof strip 25 turns the falling impact force into rotational kinetic energy to avoid breakage of the joint between the conductive balls 240 and the external pads 219, and can avoid the first corners. The 隅 window 215 is overmolded. In the second embodiment of the present invention, another multi-window ball grid array packing structure is disclosed. Referring to FIGS. 10 and U, the multi-window ball grid array package structure 3 mainly includes a base. A B曰 is 3 20, a mold sealing body 33〇, a plurality of conductive balls 34〇, and a plurality of anti-collision bars 350. The substrate 310 has an inner surface 3丨丨, an outer surface 3 1 2, a glue side 3 1 3 , a glue side 3 1 4 , a plurality of first corner windows 315 and a plurality of second The corner window 316, wherein the first corner window 315 is adjacent to the glue side 313, and the second corner window 3 16 is adjacent to the glue side 3丨4 ^ Please refer to the figure ii In this embodiment, the substrate 310 may additionally have a plurality of side windows 317, which may be associated with the first corners of the same side window 3丨5 or some second corners Window 316 is not in the same line. Referring to the figure, the wafer 306 is disposed on the inner surface 3 1 1 ' of the substrate 310 and the wafer 306 has a plurality of central pads 3 2 2 and a peripheral pad 323. The plurality of first bonding wires 361 and the plurality of second bonding wires 362 are electrically connected to the central bonding pads 322 and the peripheral bonding pads 323 to the substrate 310 ′ to reach the wafer 32 〇 and the substrate 310 Sexual interconnection. The molding compound 305 is formed on the inner surface 31 of the substrate 310 to seal at least a portion of the wafer 32. The conductive 17 ^ * 452 ^ 4 balls 340 are disposed on the outer surface 3 1 2 of the substrate 310. Please refer to the first 〇 and 1 1 'the anti-collision strips 3 5 〇 突 • 出 出 出 出 出 出 出 出 出 出 出 • • • • • • • • • • • • • • The two ends of the glue side 3 1 3 extend to the two ends of the glue side 3丨4 and are arranged in parallel with each other, and the collision protection strips 350 mark the string together with the first corner window of one side 315 is connected to the second corner window 316 and to the chess seal colloid 3 30. Each of the bumper strips 5 5 can have a cut-off side 351 and a floor surface 352, wherein the cut sides 35 ι are aligned with the symmetrical sides of the substrate 310, the support surfaces 352 The outer surface 312 of the substrate 310 is substantially parallel to the outer surface 312 of the substrate 310, and the edges 503 of the plurality of anti-collision surfaces 352 and the cutting side surfaces 351 have an angle of no more than ninety degrees. Referring to FIG. 12, in the embodiment, the anti-collision protection strips 5 5 have a plurality of inner extension fingers 3 54 to connect the side windows 3丨7 β to the third aspect of the invention. Particular embodiments disclose another multi-window ball grid array • package construction. Referring to FIGS. 13 and 14 , the multi-window ball grid array package structure 400 mainly includes a substrate 41 , a wafer 42 , a mold encapsulant 430 , a plurality of conductive balls 44 , and a plurality of bumpers . Article 4 5 0. The substrate 410 has a glue side 4 i 3 , a glue side 4 i 4 , a plurality of first corner windows 415 , and a plurality of second corners 〇 4 1 6 ' The 隅 window 4丨5 is adjacent to the glue side 413, and the second corner window 416 is adjacent to the glue side 414. Referring to FIG. 14 , in the embodiment, the substrate 4 1 〇 can further have a plurality of side windows 411 , which can be connected to the symmetrical side of the substrate 13 1 0 18 452 ^ 4 It is notched. In the process, a plurality of substrates 4 1 are integrally connected to a substrate strip, and the side windows 411 extend through corresponding scribe lines of the substrate strip (not shown) to make adjacent substrates The side window 4 1 7 of 4 1 0 is in communication' can reduce the number of side windows 417 in the strip pattern of the substrate and contribute to the sealing of the molding compound 430. In this embodiment, the first corner window 4 1 5 and the second corner window 4 16 are connected to the symmetrical side of the substrate 410 and are notched. In the manufacturing process, the first corners 415 are extended over the corresponding scribe lines of the substrate strips such that the first corners 415 of the adjacent substrates 410 are in communication. In various embodiments, as shown in FIG. 16, a plurality of first corner turns 415' are more connectable to the glue side 4 1 3 of the substrate 410, and a plurality of second corner windows 4 1 6 It is more connected to the dispensing side 414 of the substrate 410. In the process, the first corners of the window 4 1 5 ' extend more than the corresponding cutting lane of the bonding side 4丨3 of the substrate 4丨0 and the substrate strip, and the adjacent substrate 4 1 0 The second corners of the window 4 1 6 ' are connected to each other, so that the flow of the mold sealing body 410 is smoother. Referring to Figure 1, the wafer 420 is disposed on the inner surface 4 1 1 of the substrate 410. A plurality of first bonding wires 46 1 and a plurality of second fresh wires 462 are electrically connected to the central fresh pad 422 of the wafer 420 and the peripheral pads 423 of the wafer 420 to the substrate 4 . The molding compound 430 is used to seal the wafer 420. The conductive balls 404 are disposed on the outer surface 412 of the substrate 410. Referring to FIGS. 13 and 14 , the bumper strips 450 5 are formed on the symmetrical sides of the outer surface 4 1 2 of the substrate 4 10 , and The two ends of the rubber-injecting side 4 1 3 extend to the two ends of the rubber-extracting side 4 1 4 and are arranged in parallel with each other, and the anti-collision strips 450 0 are stringed together with the first corners of one side The 隅 window 415 is connected to the second corner 隅 window 416 and to the molding compound 430. Each of the anti-collision strips 5 5 can have a cutting side 45 1 and a floor surface 452 , wherein the cutting sides 45 i are tangent to the symmetrical sides of the substrate 410, and the supporting surfaces 452 are The outer surface 412 of the substrate 410 is substantially parallel to the edge 453 of the support surface 452 and the cutting surface 45 ι has an angle of no more than ninety degrees. Therefore, the first corner 隅 window 415 and the second corner 隅 window 416 have the glue filling time: to avoid the mold flow overflowing adjacent to the first corner window of the glue side 4 i 3 and can The problem of the electrical breakage of the multi-window ball-packing structure 400 when it is dropped is prevented. The above description is only for the preferred embodiment of the present invention, and the present invention is not limited in any form. The scope of the technical solution of the present invention is attached to the scope of the attached patent* I Tian Yi... + 4 is bounded. Anyone skilled in the art can use the above-mentioned disclosed equivalent embodiment to change the equivalent embodiment, and the technology according to the present invention = the modification and equivalent of the internal modification of the technical solution of the present invention. Variations and affiliations are within the scope of any of the above embodiments. And > Decorations, still belong to the technical solution of the present invention. [Illustration of the Continuation of the Drawings] Fig. 1 · A well-known multi-piece grid array package structure is cut along line K1 of Figure 2

^ IS/ ο 2圖:在:知多窗，陣，構造 不意圖。 巫攸<外表面 :依據本發明之第一具體實施例 列封裝構造沿著第4圖 多由口球格陣 3線剖切第一角隅脔 截面示意圖。 由之 依據本發明之第-具體實 封裝構造之基板之外表面該多由口球格陣列 r衣面不意圖。 依據本發明之第一具體實 Μ P vu - ^ 及夕由口球格陣列 =構…第4圖5·5線剖切側邊窗口之截面示 忍圖。 依據本發明之第一具體實施例，該多窗口球格陣列 封裝構造之局部立體示意圖。 依據本發明之第一具體實施例，緣示該多窗口球格 陣列封裝構造從高處落下撞擊地面而旋轉之示意 圖0 第3 g| 第4圓 第5圖 第6圖 第7圖 第8A至8F圖：依據本發明之第一具體實施例，該多窗口球 格陣列封裝構造在製程中剖切該基板之第一角隅 囪口之截面示意圖。 第圖依據本發明之第一具體實施例，在模封製造該多窗 口球格陣列封裝構造時所使用一基板條之外表面 示意圖。 第10圖.依據本發明之第二具體實施例，另一種多窗口球 格陣列封裝構造沿著第11圖10-10線剖切第一角 21 1345294 啤窗口之截面示意圖。 第11圖：# u 又據本發明之第二具體實施例，該多窗口球格陣 列封裝構造之基板之外表面示意圖。 第12圖· / 圓.依據本發明之第二具體實施例，該多窗口球格陣 歹j封裝構造沿著第11圖1 2- 1 2線剖切側邊窗口之 截面示意圖。 第13圖.γ^ IS/ ο 2 Figure: In: Know multi-window, array, structure Not intended. Witch<outer surface: According to the first embodiment of the present invention, the package structure is shown in Fig. 4, which is a cross-sectional view of the first corner 3 by a 3-line line. The outer surface of the substrate according to the first embodiment of the present invention is not intended to be a mask. According to the first embodiment of the present invention, P vu - ^ and the spheroidal lattice array = structure ... Fig. 4, Fig. 5, Fig. 5 is a cross-sectional view of the side window. In accordance with a first embodiment of the present invention, a partial perspective view of the multi-window ball grid array package configuration. According to a first embodiment of the present invention, the multi-window ball grid array package structure is rotated from a height and hits the ground and rotated. FIG. 3 g | 4th, 5th, 6th, 7th, 8th, 8th 8F: According to a first embodiment of the present invention, the multi-window ball grid array package is configured to cut a cross-sectional view of a first corner of the substrate in the process. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic illustration of the outer surface of a substrate strip used in the molding of the multi-window ball grid array package structure in accordance with a first embodiment of the present invention. Figure 10 is a cross-sectional view of the first window 21 1345294 of the beer window taken along line 10-10 of Figure 11 in accordance with a second embodiment of the present invention. Fig. 11 is a schematic view showing the outer surface of the substrate of the multi-window ball array package structure according to the second embodiment of the present invention. Fig. 12 is a cross-sectional view of the side window taken along line 2 - 1 2 of Fig. 11 in accordance with a second embodiment of the present invention. Figure 13. γ

.依據本發明之第三具體實施例，另一種多窗口球 格陣列封裝構造沿著第14圓13_13線剖切第一角 隅窗口之截面示意圖。 依據本發明之第二具體實施例，該多窗口球格陣 列封裝構造之基板之外表面示意圖。 依據本發明之第二具體實施例，該多窗口球格陣 列封裝構造沿著第丨4圖15_15線剖切側邊窗口之 戴面示意圖。 第16圖：依據本發明之第三具體實施例，繪示該多窗口球 格陣列封裝構造中另-變化之第一與第二角㈣ 口之基板之外表面示意圖 【主要元件符號說明】 21 切割道 112外表面 115角隅窗口 119外接墊 1〇地面 20基板條 30 切割刀具 100多窗口球格陣列封裝構造 110基板 111内表面 11 3入膠側 114出膠側 116角隅窗口 Π8中央槽孔 22According to a third embodiment of the present invention, another multi-window ball grid array package is shown in cross section along the line 14-13 of the 14th circle. According to a second embodiment of the present invention, a schematic view of the outer surface of the substrate of the multi-window ball array package construction. According to a second embodiment of the present invention, the multi-window ball array package structure is a schematic view of the side window cut along line 15-15 of Figure 4. Figure 16 is a schematic view showing the outer surface of the substrate of the first and second corners (four) of the multi-window ball grid array package structure according to the third embodiment of the present invention. Cutting surface 112 outer surface 115 corner 隅 window 119 external pad 1 〇 ground 20 substrate strip 30 cutting tool 100 multi-window grid array structure 110 substrate 111 inner surface 11 3 rubber side 114 glue side 116 angle 隅 window Π 8 central slot Hole 22

IM5294 120晶片 130模封膠體 13 2 A模封溢膠 140導電球 200多窗口球格陣 210基板 2 1 3入膠側 216第二角隅窗口 2 1 9外接塾 220晶片 223周邊鮮塾 2 3 0模封膠體 2 5 0防撞護條 2 5 3邊緣 2 6 1第一銲線 3 00多窗口球格陣 310基板 313入膠側 316第二角隅窗口 320晶片 330模封膠體 350防撞護條 3 5 3邊緣 3 6 1第一銲線 122 中央銲墊 131 模流方向 132 凸塊 133 凸塊 161 銲線 叫封裝構造 211 内表面 212 外表面 214 出膠側 215 第一角隅窗 217 側邊窗口 218 中央槽孔 221 主動面 222 中央銲墊 231 模流方向 240 導電球 251 切割側面 252 支撐表面 262 第二銲·線 270 黏晶層 列封裝構造 311 内表面 312 外表面 314 出膠側 315 第一角隅窗 317 側邊窗口 322 中央銲墊 323 周邊銲墊 340 導電球 351 切割側面 352 支撲表面 354 内延伸指 362 第一鲜線 23 多窗口球格陣列封裝構造 基板 411内表面 412外表面 入膠側 41 4出膠側 第一角隅窗口 415，第一角隅窗口 第二角隅窗口 416，第二角隅窗口 側邊窗口 423周邊銲4* 452支撐表面 462第二銲線 晶片 422中央銲墊 模封膠體 440導電球 防撞護條 451切割側面 邊緣 461第一銲線 24IM5294 120 wafer 130 mold seal colloid 13 2 A mold seal overflow glue 140 conductive ball 200 multi-window ball grid 210 substrate 2 1 3 rubber side 216 second corner 隅 window 2 1 9 external 塾 220 wafer 223 around fresh 塾 2 3 0 mold seal colloid 2 5 0 anti-collision guard strip 2 5 3 edge 2 6 1 first weld line 3 00 multi-window ball grid 310 substrate 313 into the glue side 316 second corner 隅 window 320 wafer 330 mold seal colloid 350 anti-collision Guard strip 3 5 3 edge 3 6 1 first bond wire 122 center pad 131 mold flow direction 132 bump 133 bump 161 wire bond structure 211 inner surface 212 outer surface 214 glue side 215 first corner 217 window 217 Side window 218 Center slot 221 Active surface 222 Center pad 231 Mold flow direction 240 Conductive ball 251 Cut side 252 Support surface 262 Second solder wire 270 Adhesive layer column Package structure 311 Inner surface 312 Outer surface 314 Glue side 315 first corner window 317 side window 322 central pad 323 peripheral pad 340 conductive ball 351 cut side 352 baffle surface 354 inner extension finger 362 first fresh line 23 multi-window ball grid array package structure substrate 411 inner surface 412 outer The face-in side 41 4 the glue side first corner window 415, the first corner window second corner window 416, the second corner window side window 423 perimeter weld 4* 452 support surface 462 second wire wafer 422 central pad molding gel 440 conductive ball bumper strip 451 cutting side edge 461 first bonding wire 24

Claims (1)

13452^4 十、申請專利範圍： 1、一種多窗口球格陣列封裝構造，包含·· -基板’係具有一内表面、一外表面、一入膠側、 膠側、複數個第一角隅窗口以及複數個第二角隅窗口， 其中該些第一角隅窗口係鄰近於該入膠側，該些第二 隅窗口係鄰近於該出.膠側； 角 —晶片，係設置於該基板之該内表面； ，13452^4 X. Patent application scope: 1. A multi-window ball grid array package structure, comprising: - a substrate having an inner surface, an outer surface, a glue side, a glue side, and a plurality of first corners a window and a plurality of second corner 隅 windows, wherein the first corner 隅 window is adjacent to the glue side, the second 隅 window is adjacent to the glue side; the corner wafer is disposed on the substrate The inner surface; 一模封膠體，係形成於該基板之該内表面上， 晶片之至少一部位； 密封该 複數個導電球，係設置於該基板之該外表面；以及 複數個防撞護條，係突出地形成於該基板之該外表面 兩對稱側邊，並由該入膠側之兩端延伸至該出膠側之: 端並為相互平行排列’該些防撞護條係串連同—側邊 該些第一角隅窗口與該些第二角隅窗口並與該模封膠： 連接。a mold sealing body formed on the inner surface of the substrate, at least one portion of the wafer; sealing the plurality of conductive balls, disposed on the outer surface of the substrate; and a plurality of anti-collision guards protrudingly Forming on the two symmetrical sides of the outer surface of the substrate, and extending from the two ends of the glue-in side to the glue-side: the ends are arranged in parallel with each other. The anti-collision strips together with the side edges The first corner 隅 window and the second corner 隅 window are connected to the molding compound: 2, 如申請專利範圍第丨項所述之多窗口球格陣列 造，其中每—防撞護條係各具有__切割側面與—支揮表 面’其中該些切割側面係切齊於該基板之對稱側面，該 些支揮表面係大致平行於該基板之該外表面，並且該^ 防撞護條在該些支撐表面與該些切割側面相接之邊緣係 具有一不大於九十度之夾角。 “ 3、 如申請專利範圍第i項所述之多窗口球格陣列封裝構 造’其巾該些防撞護條係與㈣轉料—體連接並為 相同材質。 25 I3*452^4 範圍第1或2項所述之多窗口球格陣列封裝 过其中§亥基板另具有複數個側邊窗口，該些 條係更串連與密封該些側邊窗口❶ 濩 5,如申請專利範圍第4項所述之多窗口球格陣列 造，其中該些側邊窗口係與同一側邊之 口輿該此笼II田如 ^® 、/二第一角隅由口不位於同一直線，並且該些防 6 護條係具有複數個内延伸指，以串連該些側邊窗口。 # 如申-月專利範圍第！項所述之多窗口球格陣列封裝 造’其中絲㈣具有—巾央槽孔，其係平 7 些防撞護條之間’並且該中央槽孔係被該模封膠體填^ 如申清專利範圍第6項所述之多窗口球格陣列封 造’其中該晶片係具有複數個中央銲塾， 二 中央槽孔内。 丁平於该 8、M請專利範圍第7項所述之多窗口球格陣列封裝構 造’另包含有複數個第一銲線’其係穿過該中：、 電性連接該些中央銲墊至該基板。 、s U 9 如申請專利範圍第8項所述之多窗口球格陣列封 造，另包含有複數個第二鐸線，並且該晶、 個周邊辉塾，其係、對準於該些側邊窗口内，而該^數 銲線係穿過該4b側邊帟„, 一禾一 基板。一 卩電性連接該些周邊銲塾至該 10、如申請專利範圍第4 Jg 因弟4項所述之多窗口球格陣列 造，其中該些側邊窗口传遠涵 為缺口狀。 Μ通至該基板之對_面’而 26 11、如申請專利範圍第2項 所逃之h 口球格陣列封裳構 :’其中該些第-角隅窗口與該些第二角隅窗口係連】 至該基板之對稱側面，而為缺口狀。 、 12了=專利範圍第u項所述之多窗口球格陣列封裝構 1 角隅窗口係、更連通至該基板之該入膠 二该些第二角隅窗口係更連通至該基板之該出膠側。 :一種多窗口球格陣列封裝構造之製造方法，包‘.2. The multi-window ball grid array of claim 2, wherein each of the anti-collision strips has a __cut side and a fulcrum surface, wherein the cut sides are tangent to the substrate a symmetrical side surface, the support surface is substantially parallel to the outer surface of the substrate, and the anti-collision strip has a length of no more than ninety degrees at an edge of the support surface that meets the cut sides Angle. 3. The multi-window ball grid array package structure as described in item i of the patent application's wipes the bumper strips and (4) the material-to-body connection and the same material. 25 I3*452^4 Scope The multi-window ball grid array of 1 or 2 includes a plurality of side windows, and the strips further connect and seal the side windows ❶ , 5, as in the patent application scope 4 The multi-window ball grid array described in the above, wherein the side windows are connected to the same side of the cage, and the cages are not in the same line, and the first corners are not in the same line. The anti-6 guard strip has a plurality of inner extension fingers to connect the side windows in series. # The multi-window ball grid array package as described in the application of the scope of the application of the patent item [the silk (4) has a towel central slot a hole, which is flat between the bump guard strips' and the central slot is filled with the mold sealant. The multi-window ball grid array is described in claim 6 of the patent scope. It has a plurality of central welding borings and two central slots. Ding Ping is in the scope of the 8 and M patents. The multi-window ball grid array package structure of the item 7 further includes a plurality of first bonding wires, which are passed through: electrically connecting the central pads to the substrate. s U 9 The multi-window ball grid array of claim 8 further includes a plurality of second squall lines, and the crystal, the peripheral ridges are aligned with the side windows, and the ^ The number of bonding wires is passed through the side of the 4b, a substrate. A plurality of window grid arrays as described in claim 4, wherein the side window passes are notched. Μ 至 该 该 该 该 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 26 Linked to the symmetrical side of the substrate, but notched. 12, the multi-window ball grid array package 1 of the patent range, the corner window system, the second glue window connected to the substrate, and the second corner window are more connected to the substrate. Glue side. : A manufacturing method of a multi-window ball grid array package structure, package ‘. 提供-基板’係具有一内表面、一外表面、一入膠側、 出膠側、複數個第一角隅窗口以及複數個第二角隅窗 其中忒些第一角隅窗口係鄰近於該入膠側，該些第 一角隅窗口係鄰近於該出勝側； 设置一晶片於該基板之該内表面；The providing substrate has an inner surface, an outer surface, a glue side, a glue side, a plurality of first corner windows, and a plurality of second corner windows, wherein the first corner windows are adjacent to the first corner window a first corner window adjacent to the winning side; a wafer is disposed on the inner surface of the substrate; 形成一模封膠體於該基板之該内表面上，以密封該晶片 之至少一部位，並同時突出地形成複數個防撞護條於該 基板之該外表面之兩對稱側邊，該些防撞護條係由該入 膠側之兩端延伸至該出膠側之兩端並為相互平行排列於 該模封膠體之模流方向，該些防撞護條係串連同一側邊 之該些第一角隅窗口與該些第二角隅窗口並與該模封膠 體連接；以及 設置複數個導電球於該基板之該外表面。 1 4、如申凊專利範圍第1 3項所述之多窗口球格陣列封裝構 k之製is方法’其中§亥基板係形成於一基板條，該些防 撞護條係延伸至該基板條之複數個切割道，另包含有一 基板條切割步驟，並同時切割該基板條與該些防撞護條。 27 、如申-月專利範圍第14項所述之多窗口球格陣列 k之製造方法’其中在上述基板條切割步驟中之、 向係由料防撞護條“，再穿過該 之切割方 體。 丹穿尥及基板條與該棋封膠 '如申π專利圍第i 5項所述之多f σ球格陣 造之製造方法’其中在上述基板條切割步驟之後， 防撞護條係各具有—切割側面與—支撲表面，其^此 切割側面係切齊於該基板之對稱側面，該些支樓二 基板之該外表面’並且該些防撞護條在該 二支撐表面與该些切割側面相接之邊緣係具有 九十度之夾角。 大於 17、：申:广利範圍第13項所述之多窗口球格陣列封裝構 k之法’其中該些防撞護條係與 體連接並為相同材質。 对膠體為— …窗口球格陣列封裝構 & “方去’其中該基板另具有複數個側邊窗口，， 些防撞護條係更串連並密封該些侧邊窗口。- 19、 如中請專利範圍第18項所述之多fD球格陣列封 造之製造方法’其中該些側邊窗口係與同—側邊之；些 第-角隅窗口與該些第二角隅窗口不位於同一直線，： 且該些防撞護條係具有複數個内延伸指，以串連該些側 邊窗口。 20、 如中請專利範圍第13或18項所述之多窗口球格 封裝構造之製造方法’其中該基板另具有—中央槽孔， 28 其係平行排列於該些防撞護條之間，並且該中 被該模封膠體填充。 ’、槽孔係 21、、如中請專利範圍第2G項所述之多窗口球格陣列 造之製造方法，其中該晶片係具有複數個_央録塾、 係對準於該中央槽孔内。 、 造之申二專方到：圍第21項所述之多窗口球格陣列封裝構 其㈣ 包含之步驟有:形成複數個第-銲線， 其係穿過該中央槽孔以電性連接該些令央輝塾至 板。 X 土 2 3 了申^專利範圍第2 2項所述之多窗口球格陣列封裝構 w之製造方法’另包含之步驟有：形成複數個第二銲線， 並^該晶片係具有複數個周邊銲墊，其係對準於該些側 邊由口内，而該此第—Ag Αώ 二弟一如線係穿過該些側邊窗口以電性 連接該些周邊銲墊至該基板。 、止如申叫專利範圍帛i 8項所述之多窗口球格陣列封震構 化之製k方法’其中該些側邊窗口係延伸過該基板條之 對應切割道，以使相鄰基板之側邊窗π為相連通。 25、 、如申請專利範圍第14項所述之多窗口球格陣列封裝構 以之製每方法’其中該些第一角隅窗口係延伸過該基板 條之對應切割道，錢相鄰基板之該些第—角隅窗 相連通。 26、 ：申,請專利範圍第25項所述之多窗口球格陣列封裝構 製&方去’其中該些第一角隅窗口係更延伸過該基 板之該入膠側與該基板條之對應切割道，並與相鄰基板 29 13*45294 之該些第二角隅窗口為相連通。Forming a mold encapsulant on the inner surface of the substrate to seal at least a portion of the wafer, and simultaneously forming a plurality of anti-collision strips on the two symmetrical sides of the outer surface of the substrate, the anti-collision The bumper strip extends from the two ends of the glue-in side to the two ends of the glue-extracting side and is arranged parallel to each other in the mold flow direction of the mold-molding body, and the anti-collision strips are combined with one side of the mold strip. The first corner 隅 window and the second corner 隅 window are connected to the molding compound; and a plurality of conductive balls are disposed on the outer surface of the substrate. 1 . The method of manufacturing a multi-window ball grid array package according to claim 13 of the patent scope of the invention, wherein the substrate is formed on a substrate strip, and the anti-collision protection strips are extended to the substrate The plurality of cutting lanes of the strip further comprise a substrate strip cutting step, and simultaneously cutting the substrate strip and the anti-collision strips. 27. The method of manufacturing a multi-window ball grid array k according to claim 14, wherein in the step of cutting the substrate strip, the anti-collision strip is traversed, and then cut through the strip. a square body. The tantalum strip and the substrate strip and the chess sealant are manufactured according to the multi-f σ ball grid array described in the above-mentioned substrate strip cutting step, wherein after the above-mentioned substrate strip cutting step, the collision protection Each of the strips has a cutting side surface and a bucking surface, wherein the cutting side is tangent to the symmetrical side of the substrate, the outer surface of the two substrates of the plurality of substrates and the anti-collision strips are supported by the two The edge of the surface that meets the side of the cut surface has an angle of ninety degrees. More than 17,: Shen: The method of multi-window ball grid array structure described in item 13 of the wide-ranging range, wherein the anti-collision protection The strips are connected to the body and are of the same material. The colloid is - window lattice array package & "square go" where the substrate has a plurality of side windows, and the anti-collision guards are more series and sealed The side windows. - 19, the method for manufacturing a multi-fD ball grid array package as described in claim 18, wherein the side windows are the same side-side; the first-corner window and the second The corner windows are not in the same line: and the bumper strips have a plurality of inner extension fingers to connect the side windows in series. 20. The method of manufacturing a multi-window ball package structure as described in claim 13 or 18, wherein the substrate further has a central slot, 28 which is arranged in parallel between the anti-collision strips, And the middle is filled with the molding compound. a method for manufacturing a multi-window ball grid array according to the scope of claim 2, wherein the wafer system has a plurality of cymbals, which are aligned in the central slot. . The second application of the second application to the multi-window ball grid array package described in Item 21 includes the steps of: forming a plurality of first-bonding wires, which are electrically connected through the central slot These will make Yang Hui smash to the board. X soil 2 3 The manufacturing method of the multi-window ball grid array package w described in claim 2 of the patent scope includes the steps of: forming a plurality of second bonding wires, and the chip system has a plurality of The peripheral pads are aligned with the side edges from the mouth, and the first Ag- Αώ second brother passes through the side windows to electrically connect the peripheral pads to the substrate. For example, the method for the multi-window ball grid array structure of the invention described in the patent scope 帛i 8 is wherein the side windows extend through the corresponding scribe lines of the substrate strip to make adjacent substrates The side windows π are in phase communication. 25. The multi-window ball grid array package according to claim 14, wherein each of the first corners of the window extends over a corresponding scribe line of the substrate strip, and the adjacent substrate is The first-corner windows are connected. 26: claim, please claim the multi-window ball grid array package described in claim 25, wherein the first corner window extends over the glue side of the substrate and the substrate strip Corresponding to the scribe lines, and communicating with the second corner 隅 windows of the adjacent substrates 29 13*45294.
TW096148328A 2007-12-17 2007-12-17 Multi-window ball grid array package and method for fabricating the same TWI345294B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096148328A TWI345294B (en) 2007-12-17 2007-12-17 Multi-window ball grid array package and method for fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096148328A TWI345294B (en) 2007-12-17 2007-12-17 Multi-window ball grid array package and method for fabricating the same

Publications (2)

Publication Number Publication Date
TW200929499A TW200929499A (en) 2009-07-01
TWI345294B true TWI345294B (en) 2011-07-11

Family

ID=44864507

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096148328A TWI345294B (en) 2007-12-17 2007-12-17 Multi-window ball grid array package and method for fabricating the same

Country Status (1)

Country Link
TW (1) TWI345294B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI552277B (en) * 2014-06-04 2016-10-01 矽品精密工業股份有限公司 Semiconductor package and method of manufacture

Also Published As

Publication number Publication date
TW200929499A (en) 2009-07-01

Similar Documents

Publication Publication Date Title
US8138023B2 (en) Method for forming laminated structure and method for manufacturing semiconductor device using the method thereof
US7589410B2 (en) Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package
TWI524440B (en) Integrated circuit package system with through semiconductor vias and method of manufacture thereof
TWI355061B (en) Stacked-type chip package structure and fabricatio
KR101026488B1 (en) Semiconductor package
KR102506698B1 (en) Method of fabricating semiconductor package including reinforcement top die
US10083937B2 (en) Semiconductor devices and packages and methods of forming semiconductor device packages
US9825002B2 (en) Flipped die stack
CN103050473A (en) Wafer-level chip scale package with re-workable underfill
KR20180112394A (en) Method of fabricating semiconductor package and semiconductor package by the same
US7952181B2 (en) Wiring substrate for a multi-chip semiconductor device
US8338288B2 (en) Method of manufacturing semiconductor device
TW201239998A (en) Method for mold array process to prevent peripheries of substrate exposed
CN111106068A (en) Double-chip structure and manufacturing method thereof
KR100800149B1 (en) Stack package
TWI345294B (en) Multi-window ball grid array package and method for fabricating the same
TWI375310B (en) Semiconductor chip having bumps on chip backside, its manufacturing method and its applications
CN103620771A (en) Semiconductor device
TW201025554A (en) Multiple flip-chip package
CN111554617A (en) Chip packaging method
TWI442522B (en) Cavity chip package structure and package-on-package using the same
TWI302733B (en) Ic stack package having a plurality of encapsulants sharing a same substrate
TW202218099A (en) Semiconductor package including semiconductor chips
TWI473243B (en) Multi stacked-die packaging structure and its process
TWI429351B (en) Memory card package having a small substrate

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees