TWI343225B - - Google Patents

Description

1343225 IX. Description of the invention: [Technical field to which the invention pertains] The process is based on a wafer-type surface-adhesive component insulation /, ‘,. Structure, especially a process for fabricating a process structure with good insulation and protection. Ί Only the best! [Prior Art] The b (four) type component (10) is extremely versatile. Surface point type: After the parts are not assembled, the line board must be completed by the splicing process. The characteristics of the terminal electrodes used are naturally required: 2: 2 is easy: - Solder 2:: Usually used after the process The wiring board of the electric wheel forming part is used for floating connection and uses the surface bonding layer of the recording interface layer and the outer surface of the body material to have poor insulation resistance, because the body material is mixed under the condition that the electricity money is made. It becomes complicated and difficult. Poor · Special plating conditions can be set and the material can be made by ^ 凡 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , °The quality and level of the required structure. In the white knowing technology coffee, special materials and processes can be used to improve the insulation of the body 1343225 material, such as the complete coating on the body - the protective insulating layer based on the glass component, and then the high temperature sintering using the terminal electrode structure The process is completed by the burning of the terminal electrode conductor and the connection of the internal electrode of the functional main structure. However, since the glass material is processed by coating, sintering, etc., in addition to the alkali resistance, the insulation effect of the glass is caused by The problem that the formed structure thickness and the glass density are not uniform causes poor insulation. Rest assured that only insulated / ~ '丨 xu difficult W brain will be covered

The problem of this process is that the protection of the insulating material;: white, the temperature of the coating is low, so the end electrode material of the post-carrying must be used, the temperature type 'but the end electrode of the low temperature process causes the component characteristics Adverse shadow

Lit, because the appearance of the surface-adhesive component is generally a rectangular parallelepiped structure, and the ambiguous corners are (4), the process must be carried out in a one-by-one manner, so that the overall production capacity cannot be further improved. In addition, for the wound-type inductor component, the structure is such that the coil lead is exposed on the body substrate, and the special structure of the component is added, and the fabrication of the insulating layer is very difficult; in addition, some functional applications are more special~3 The laminated surface is sensitive to the surface varistor and the laminated surface is viscous. The two must be additionally considered for the actual use of the circuit board. The adsorption of impurities and coordinates on the surface of the body will cause excessive The leakage current causes the component to fail. On the contrary, the present inventors have felt that the above-mentioned deficiency can be improved, and proposes a present invention which is reasonable and effective in improving the above-mentioned deficiency. SUMMARY OF THE INVENTION 7 1343225 component insulation spoon; 楗 ― 种 种 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片^ Capacity. Further, it is a further object of the present invention to provide a process, a process and a structure thereof, such that the wafer type watch is coated with an insulating structure which is resistant to acid and alkali and has good moisture resistance. In order to achieve the above-mentioned purpose, the present invention provides an adhesive component insulating process, the steps are as follows: "Step": "surface wafer type surface-adhesive component, wherein the at least = to >, one component has a - body portion, a The first adhesive portion is disposed on the side of the main body portion at the side of the other end portion 2 and the two side portions are respectively provided with a first conductive side portion and the first portion

Electrode; Step 2: Providing an uncured barrier; 2: a second conductive end-single-end soaking step to at least the third step: providing the uncured insulating material for a predetermined time two::: adhesive type Insulating H 乂咏 · 去除 去除 去除 去除 去除 去除 去除 ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML ML Er-: and: a younger-side portion of the first conductive end of the Leito. # - 盍 is disposed on the first side Μ a cover disposed on the second side center g electrode, and a cover of the body portion The conductive terminal is electrically conductive to the first conductive terminal electrode and the second; the insulating layer is formed to a predetermined thickness. Electric and between the electrodes and having an 8 343225 This invention has the following beneficial effects: two-way, can use the insulation effect and the insulation structure proposed by the slave, and the insulation structure has a thick material manufacturing-insulation The insulating structure made by the junction can make the component more versatile, so the present invention is to enable further treatment of the characteristics of the hair. The following detailed description of the present invention and the technical contents of the temple are for reference and description, and are not intended to be used for the present invention:::: The drawing only mentions the f embodiment.桴 妒 妒 四 四 四 四 四 四 四 四 四 四 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片Anti-acid and alkali type capacitors, the surface of 70 pieces of soil, such as the surface of the surface, or the surface-adhesive film winding type

As shown in the third figure), the invention is not limited to the above. Second A

A β-graph shows a first embodiment of the insulating process proposed by the present invention, which comprises the following steps: Step U) Providing at least one wafer-type surface-adhesive element, the bean is two: surface-adhesive capacitive element i Wherein the at least one surface-adhesive capacitor 70 has a body portion 1 1 , a first side portion i 2 at the body end of the body portion, and a second side portion 13 at the end of the body portion And the first side work 2 and the second side work 3 are respectively provided with a first conductive end electrode 2 〇 and a second conductive end electrode 2 1 . The surface-adhesive capacitive element is internally provided with an internal electrode, and the first conductive terminal electrode 2 and the second conductive terminal electrode 2 are electrically connected to the internal electrode 11 of the 9 1343225. In the present invention, the first conductive terminal electrode 2 〇 and the first electrode 2 1 are formed on the surface-adhesive capacitor element, and an insulating layer structure is formed by using the insulating process proposed in this month; The first conductive member m20 and the second conductive terminal electrode 2 i and the internal electrode i apply a higher temperature process 'to improve the characteristics of the device. 10 and the first conductive terminal electrode 2 〇 = electrical = connection technology and the first A conductive terminal electrode 2: The forming technology of the pole 21 is familiar to the person in the field: "Technology Street" is not described here in detail. Order 2 provides an uncured insulating material 3 (see the fourth figure). = a few materials 3 can be liquid epoxy resin,

L is not limited to the above. In the present embodiment, the uncured H 2 material 3 is placed in the tank body 6 and the uncured insulating material 3 has a predetermined viscosity and a predetermined composition concentration to facilitate the next step. Referring to the fourth "), the marginal material/capacity capacitive element 1 is immersed in the uncured absolute = 枓3: predetermined time. The present invention performs the batch M M for the process efficiency. The end capping process. For example, the fourth a-hai at least one surface-adhesive capacitive element 1 of the first-conductor 3 = fixed device 5' and immersing each of the shackles-type capacitors in the erect manner into the uncured The depth of the insulating material 3 can be adjusted according to the type of the wafer type surface-bonding component 10 1343225; in the present embodiment, the second conductive terminal electrode 2 of each surface-mounting capacitive component 1 And the body portion is immersed in the cured insulating material 3. Since the electrode of the only end (the second conductive terminal electrode ^) is immersed in the uncured insulating material 3, it is called a single-cover (or early-end immersion) step, and at the second conductive terminal electrode 2 After the body portion 11 is immersed for a period of time, the surface-adhesive capacitors 1 are taken out of the uncured insulating material 3, and since the material has a predetermined viscosity of 3, the uncured insulating material 3 can be == The second conductive terminal electrode 2 i forms a soldering layer 30 with the surface of the body portion; the wafer surface-mounting component is immersed in the thickness of the insulating structure to be referred to as step (c): removing The insulating layer 30 which is cured by the second conductive terminal electrode 2 is disposed. In this step, the uncured insulating layer 3 () on the first pole 21 is removed. The use of the agent and the step (1) In the case of the insulating material in the case, in the second step (1), the photoresist is used for the coating, then the step can be made; the corresponding photoresist cleaning agent ^ uses M)b, °, °Zid a conductive terminal electrode 2 1 upper, bar, and bismuth material (photoresist) are removed* and the fault is one step, the insulation is 堇 堇 专 专 专 专 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 Bu conducting terminal electrode 2 and removing uncured "4" coated on the L conductive terminal electrode 2 i After the insulating layer 30 of 3225, a curing step, an uncured insulating layer on the body 11 is further provided. 〇加 , ^ § haiben 〃 has a pre-twisting W insulation layer 30,. The wafer-type surface-adhesive element of the predetermined thickness R type is changed, for example, the general insulation thickness is 3-5", π; and the thickness of the high-piece piece is about $〇-5 〇 In addition, this step (four) is not limited (4) The method 2 for heating the insulating material uses heating or ultraviolet ray to make the insulating material 匕. The insulating layer 3 该 formed after the curing is the present invention and has pH, high insulation and moisture resistance. The excellent insulating structure, but the second, due to the adsorption of impurities and humidity on the surface of the body, the production process of the MU Ming's insulation process has a smooth surface, and The thickness and uniformity of the film are uniform, which can meet the requirements of high-voltage capacitors. In addition, after step (c), a molding step is further included, such as an electroplating process to separately form a --welding interface layer 4 The first and second soldering interface layers 41 are disposed on the first conductive terminal electrode 2 and the second second terminal electrode 21. The present invention is formed by a single-end immersion process, and has excellent acid resistance and high insulation. And moisture resistant insulation The structure of the body of the wafer-type surface-adhesive component is such that the 曰a-plate surface-adhesive member having the insulating layer can be used to make the soldering interface layer required for the welding by the subsequent molding step. From the second to the third]3, and in conjunction with the fourth and fourth A, the second embodiment of the present invention applies the insulating process to a surface-adhesive phase wound inductor element 1, and - The difference in the embodiment is that the 12*4J225 has a body portion 1 1 on the surface-adhesive thin-wound wire-wound inductor element, and a wider portion in the H-section 1 ! 2 and - the second side portion 13, and the first =

And the first side portion 13 is respectively covered with a first conductive terminal electrode 2 and a second conductive terminal electrode 21. On the other hand, the body portion ιι is covered with a coil conductor 14 and the coil conductor 14 is formed with a spiral pattern by laser processing or other mechanical processing to form a surface-adhesive film wound inductor. Element 2,. Similarly, a plurality of surface-adhesive film-wound wire-wound inductor elements are immersed in an early manner to form an insulating structure; that is, the surface-adhesive-type ruthenium-wound wire-wound inductor element i, the end (for example, Conductive terminal electrode 2 0) @定定-心装置 5' and immersing each watch in an upright manner: the adhesive film wound inductor element 1' is immersed in the uncured insulation = 枓 3 ' and will be approved in the first The uncured seven-edge layer 30 on the second conductive terminal electrode 2 is removed. < Thereafter, the uncured insulating layer 3 coated on the body portion is cured to form an insulating layer 30. In this embodiment, since the coil conductor 4 has a first thickness [, the second thickness W2 of the insulating layer 3 Q' must be greater than the thickness W1 to provide good insulation after the step. . The present invention also provides a sa-plate surface-adhesive component formed by the above-mentioned insulating process, comprising: a body portion 1 1 having a first side portion 1 at the end of the moon bean 4 1 1 - 2 And a first side portion i 3 is disposed at one end of the main body portion g1; a first conductive end electrode 20 that is disposed on the first side portion ;; a 13 1334325 that is disposed on the second side portion 13 The conductive:: pole 21; and a coating between the body portion ik and the second conductive terminal electrode 21 and having a pre-red color, the present invention has the following advantages: After the fabrication of the terminal electrode is completed, the process of the low temperature insulation structure at the rear end does not limit the range of the temperature of the electrode I; it is also possible to use a higher temperature process electrode or a connection electrode and an internal electrode. The response should be: the surface-adhesive component is more resistant to surges in function... 2. On the other hand, the process can use the batch's side to greatly improve the overall efficiency of the insulation structure, and return to the daily slice. The productivity of surface-adhesive components.疋 3. The present invention utilizes an insulating structure with good insulation effect and wide application to provide a high insulation, _ inspectability and good protection insulation structure. The above description is only a preferred embodiment of the present invention, and it is not intended to limit the scope of the present invention. Therefore, all of the same applies to the use of the specification and the surrounding of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing the flow of a wafer-type surface-adhesive element in accordance with the present invention. FIG. 2 is a schematic view of a surface-adhesive capacitive element of the present invention. The flow chart of the first embodiment of the wafer-type surface-adhesive element insulating process of the invention is shown in the enlarged view of the second part of the second drawing. The third figure is the winding-type intention of the surface-adhesive film of the present invention. The dry process of the i-type surface-adhesive component is inconsistent with the process of the example. 乂The third B-picture is a magnified view of the β-part of the third A-picture. The fourth picture is the wafer of the present invention. Schematic diagram of the surface process. The fourth section of the invention is a schematic diagram of the single-end soaking step of the present invention. [Main component symbol description] Surface-adhesive capacitive component surface-adhesive film wound-type inductor component 〇 internal electrode 1 1, 1 2 1 4 2 0 3 3 0 4 〇 5 6 body portion 1 ^ second side second conductive end electrode insulating layer second soldering interface layer first side portion 13 coil conductor first conductive Terminal electrode 2 j uncured insulating material uncured insulating layer 3 〇 first splicing interface layer 41 fixed sump groove 1343225 W predetermined thickness W1 first thickness W2 second thickness

Claims (1)

J^225 X. Applying for a patent garden: 1. A wafer-type surface-adhesive element step--providing at least, including: the at least-wafer-type surface-adhesive==-type component, wherein the first end of the body portion a cow/, a body portion, a second side portion at the other end of the portion, and a body portion; respectively; a first-conducting terminal is provided; and a portion is electrically connected; Insulating material; surface pill: for the early-stage soaking step, to immerse the at least 曰:弋:: 粘: r immersion in the uncured insulating material 274: removing the insulation coated on the second conductive end electrode The wafer-type surface-adhesive-component wax of the material, wherein the uncured edge material is a liquid epoxy smear or a liquid photoresist. Absolute IS, the second type of wafer-type surface-adhesive component described by the staff. The insulating material having the undefined insulating material has a predetermined adhesion. The wafer-type surface-adhesive member according to the first aspect of the patent is characterized in that the single-end immersion (four) is the first of each wafer-type surface-mounting component. The conductive terminal electrode is fixed to a fixed device and immersed in each of the wafer surface adhesive components in an upright manner.