1343082 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種樹脂封裝裝置，且特別是有關於一種 將安裝在導線架（lead frame )等上之電子零件（元件）做樹脂 封裝用的樹脂封裝裝置。 【先前技術】 舊有的樹脂封裝裝置是抽出凹腔（cav丨ty )的空氣與航子 (pOt)内的空氣降低凹腔（0^7)與瓶子（p〇t)的壓力，然 後啟動活塞將瓶子（p〇t )内的融化樹脂填充到凹腔内。 但是在舊有的樹脂封裝裝置中，由於活塞與彈射用驅動桿 透過氣密性报差的密封零件來回動作，因此無法大幅減少凹腔 内的壓力’例如只能減少凹腔内約丨0T〇rr的壓力而已。因此在 做樹脂成形時凹腔内殘餘的空氣會混到樹脂内，可能在成形體 中產生縫隙。 而且一般透過與凹腔相連的微小排氣孔降低凹腔内的壓 力所以在/主入樹脂時透過排氣孔從瓶子（pot )與活塞的間隙 等會洩漏空氣產生很大的氣流，或者會加速注入樹脂的流速， 可造成電子零件的鐵線（wire )弯曲，相互接觸。 【發明内容】 有鑑於此，本發明的目的就是在提供一種氣密性高、減壓 幅度大且迅速的樹脂封裝裝置。透過設計精巧的多個元件相互 配合來維持凹腔的氣密性，解決於封裝時電子零件鐵線相互接 觸的問題。此外，由於能短時間的大幅減壓，本發明之實施例 可大量生產無縫隙的樹脂成形品。 1343082 根據本發明的目的’提出一種樹脂封裝裝置，具有相互靠 近可關模的上模具與下模具，以及在上模具與下模具對面容納 要做樹脂封裝之電子零件的凹腔，以及將配置在前述上模具與 下模具的收容空間的彈射栓（eject pin )突出於前述凹腔的彈出 部。且此樹脂封裝裝置具有以下特徵：在此樹脂封裝裝置中， 相連的兩模具的側壁上有分別開口的真空抽取通道，上模具與 下模具由擁有收容空間的上凹腔半邊模室與下半邊模室構成， δ上模具與下模具在近以及關模時，會形成氣密密封的密閉空 間，也就是真空抽取凹腔，在真空抽取凹腔内能作真空抽取。 為讓本發明之上述目的、特徵、和優點能更明顯易懂，下 文特舉一較佳實施例，並配合所附圖式，作詳細說明如下： 【實施方式】 弟一實施你丨 請參照第3圖，其繪示依照本發明一第一實施例之樹脂封 裝裝置的整體結構圖。 樹脂封裝裝置擁有4支支柱1〇以及固定支揮在這些支枝 10上端的固定塊（b丨。ck) u，以及安裝在固定塊η上：上模 具 12。 、 在上模具12下方有下模具相對配置。此下模具 可動塊Η上面’可動塊則安裝在各支柱丨。的上可作上下二在 各支柱1〇的下端由基座（base) 24支撐。在基座24上步 f士 =機構25。連結機構^擁有透過轴27與連結零件％連 :28 ^、可搖動的—對連結零件28, 28 ;以及與這些連々士零 上透過加制連㈣4G連結在—起的—對連結零件 1343082 及透過減速機構可迴轉驅動軸27的馬達（圖中未標示）。然後 最上方的一對連結機構30, 30的上方則固定在可動塊丨4的下 面。 因此當驅動馬達時，一對連結零件28, 28會以轴27為中 心迴轉，連結零件26, 28, 28, 29與30, 3〇可在上下方向伸長形 成一直線，可動塊14會往上動。所以當可動塊14往上動時， 下杈具13就會與上模具12隔著小小的間隙’例如〇 2mm的間 隔與上模具12對向（請參照第1圖）。 第1圖繪示依照本發明之第一實施例之上模具與下模具開 始柚真空時（〇.2mm)之狀態的裁面圖。 如第1圖所示，下模具丨3擁有固定在可動塊14上的中空 支撑體15’以及固定在支撑體15上的彈射用區塊16。在支撑 體15内有從可動區塊14伸展出的螺絲桿17突出螺絲桿口 上端連結在連結部18可任意迴轉，連結部18料過連結到活 塞20的下端。 螺絲桿17文到馬達（未顯示於圖中）驅動迴轉後會往上 動’因此活塞20會透過桿子21往上動。 —在安裝板19上，伸縮性軟管22的下端框架22a氣密地固 疋住伸縮性軟官22 0上端框架22b則氣密固定在彈射用區塊 Μ的凹處。因此伸縮性軟管22就能氣密地包住活塞的桿子 彈射用區塊16上有—個上方開口的收容空_。收容空 ^上的检板（pin plate) 32與固定器（st〇p㈣Μ相接。 = =_e)32上裝有往上延仲的彈射栓(_ριη)34, ^彈性零们5栓板（ρ1ηρ_)32能隨時對下方產生擠壓的 里…、後在彈射用區塊16上有—個與收容空間Μ相連的真 JW〇82 二插取通道36。真空抽取通道36在區塊部16的壁上有開口。 攸栓板（pm plate) 32往下，上動桿37貫穿區塊部16伸 長。上動桿37也由伸縮性軟管38氣密地包住。換言之伸縮 山軟s 38的上端框架38b氣密地固定在區塊部丨6下面，其下 端的框架38固定在安裝板39 i。安裝板39有擠壓桿40。因 此當擠壓桿40往上推動安裝板39時，就會—起帶動上動桿37 和栓板（pin plate) 32。因此彈射栓Μ就會突出到後述的凹腔 在彈射用區塊16上方隔著隔熱材料41有加熱板42。加熱 42内埋有加熱$ 43。在加熱板42裝有模具板料。在模具板 44上由於有凹腔45,所以形成凹部與溝部用的溝與閘門（gate)。 在模具板44與加熱板42的中央有瓶子47，在瓶子”上 有樹脂板48。 ▲另外，上模具12在下模具13與模具板44的對面有一個 杈具板50。在模具板5〇的下面有形成前述凹腔45的凹部與溝 如第1圖所示’當上模具12與下模具13靠近時兩模具 :〇古44的相對空間中會形成隔間空間51。然後在模具板刈 關空間51相連的真空抽取通道52。真空抽取通道 52在棋具板50的側壁上有開口。 拓”上” 了加熱模具板5〇 ’因此設有加熱板53。加熱 有彈射内用Λ熱^ Μ。在加熱板53上方隔著隔熱材料55配置 板（pin plate) 58上裝有往下延伸的彈射栓 · 過彈性零件61检板(pinplate) 58能隨時對下:二：力 1343082 量。然後在彈射用區塊56上有—個與收容空間57相連的真空 抽取通道62。真空抽取通道62在區塊部兄的壁上有開口。 此外，在栓板58下面有-個桿子63延伸穿過加熱板^ 與模具板50連接到下模具13的模具板料上。 第2圖緣示依照本發明之上模具與下模具在抽真空狀態下 時的截面圖。如第！圖及第2圖所示，上模具丨2與下模具Η 被上半邊模室7GA與下半邊模室蓋住。上半邊模室7〇a的 下端面上有矩形的凹處’在凹處嵌入橡膠製的密封零件牝。在 下半邊模室70B的下端面上有一個可嵌入密封零件_凹處。 此外，在上半邊模室7(^上與真空抽取通道52 62對面的位置 上設有吸引口 71，72。各吸引σ 71，72透過接頭與吸引管乃 相連。在下半邊模室爾的真空抽取通道36的對面上也設有吸 引:74 ’吸引口 74也透過接頭與吸引管73相連。然後這些吸 引官73會與抽真空泵浦（未顯示於圖中）相連結。 如第1圖所示，當上模具12與下模具13靠近上半邊模 至：0 Α與下半邊換室7GB也會靠近所以透過㈣零件从構 成形成氣密密封空間的抽真空用模室7Qt>此外上下移動的活 塞20/桿子21)與上動桿37與伸縮性軟管& 38會形成氣密 的覆蓋，戶斤以月b使上模具12與下模具13的兩收容空間W 都保持在氣密狀態。 ’ 在本實施例中，在此氣密狀態下幾個吸引管73與真空栗 浦相連’泵浦-動作就會使真空抽取模室7〇大幅減壓1〇_4〜 10-6T〇rr。換5之，隔間空間51與兩收容空間μ，透過真空 抽取通道36, 52, 62在一瞬間就能減壓1〇4〜1〇_6T〇rr。 第2圖所示，在這樣減壓的同時，上模具1 2與下模具 13會關;^ ’活塞2G會將瓶子47内融化的樹脂板擠壓出去，將 1343082 樹脂填充到放置有電子零件的凹腔45内。 然後當下模具13往下動，上模具12的栓板（pin plate) 58因為彈性零件61的關係往下動，彈射栓的就會突出到凹腔 45内。因此樹脂成形品就會跑到下模具13的凹腔45上。 然後下杈具13的上動桿37會往上動使栓板32往上，彈 射栓34就會突出到凹腔45内，於是能將樹脂成形品從下模具 13中取出。1343082 IX. Description of the Invention: The present invention relates to a resin packaging device, and more particularly to an electronic component (component) mounted on a lead frame or the like for resin encapsulation Resin packaging device. [Prior Art] The old resin encapsulation device is the air in the cavity (cav丨ty) and the air in the carrier (pOt) to reduce the pressure of the cavity (0^7) and the bottle (p〇t), and then start up. The piston fills the molten resin in the bottle (p〇t) into the cavity. However, in the conventional resin packaging device, since the piston and the ejection lever are moved back and forth through the hermetic sealing member, the pressure in the cavity cannot be greatly reduced. For example, only about 丨0T in the cavity can be reduced. The pressure of rr is only. Therefore, air remaining in the cavity during the resin molding is mixed into the resin, which may cause a gap in the formed body. Moreover, the pressure in the cavity is generally reduced by the small vent hole connected to the cavity, so that a large airflow is generated from the gap between the bottle and the piston through the vent hole when the resin is introduced into the resin, or Accelerating the flow rate of the injected resin causes the wires of the electronic parts to bend and contact each other. SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide a resin package device having high airtightness, large pressure reduction, and rapidity. The airtightness of the cavity is maintained by the cooperation of a plurality of components which are delicately designed to solve the problem that the wires of the electronic parts are in contact with each other during packaging. Further, the embodiment of the present invention can mass-produce a seamless resin molded article because of a large decompression in a short time. 1343082 According to the object of the present invention, there is proposed a resin encapsulating device having an upper mold and a lower mold which are close to each other capable of closing, and a cavity for accommodating the electronic component to be resin-coated opposite the upper mold and the lower mold, and An eject pin of the accommodating space of the upper mold and the lower mold protrudes from an ejecting portion of the cavity. And the resin packaging device has the following features: in the resin packaging device, the side walls of the two connected molds have respectively opened vacuum extraction channels, and the upper mold and the lower mold are provided by the upper cavity half mold chamber and the lower half having the receiving space. The cavity is formed, and when the δ upper mold and the lower mold are near and closed, a hermetic sealed sealed space is formed, that is, the vacuum extraction cavity can be vacuum-extracted in the vacuum extraction cavity. The above-mentioned objects, features, and advantages of the present invention will become more apparent and understood. Fig. 3 is a view showing the entire configuration of a resin encapsulating apparatus in accordance with a first embodiment of the present invention. The resin encapsulating device has four struts 1 〇 and a fixing block (b丨.ck) u fixedly supported at the upper ends of the branches 10, and mounted on the fixed block η: the upper mold 12. There is a lower mold relative arrangement below the upper mold 12. The lower mold movable block Η the upper movable block is mounted on each of the struts. The upper and lower sides can be supported by a base 24 at the lower end of each of the pillars. On the pedestal 24, step f = mechanism 25. The connecting mechanism ^ has a transmission shaft 27 connected to the connecting part %: 28 ^, the rocking-to-joining parts 28, 28; and the connecting parts 1332802 which are connected to the connecting couples through the added joints (4) 4G and The motor of the drive shaft 27 (not shown) can be rotated by the speed reduction mechanism. Then, the upper side of the upper pair of coupling mechanisms 30, 30 is fixed to the lower side of the movable block 4. Therefore, when the motor is driven, the pair of coupling members 28, 28 will rotate about the shaft 27, and the connecting members 26, 28, 28, 29 and 30, 3〇 can be elongated in the up and down direction to form a straight line, and the movable block 14 will move upward. . Therefore, when the movable block 14 is moved upward, the lower cooker 13 faces the upper mold 12 with a small gap ′, for example, a distance of 2 mm (see Fig. 1). Fig. 1 is a plan view showing the state in which the upper mold and the lower mold start the pomelo vacuum (〇. 2 mm) according to the first embodiment of the present invention. As shown in Fig. 1, the lower mold core 3 has a hollow support body 15' fixed to the movable block 14, and an ejection block 16 fixed to the support body 15. In the support body 15, a screw rod 17 extending from the movable block 14 is protruded from the screw rod. The upper end is coupled to the joint portion 18 so as to be rotatable, and the joint portion 18 is fed to the lower end of the piston 20. When the screw rod 17 is driven to the motor (not shown), it will move up after the rotation. Therefore, the piston 20 will move upward through the rod 21. - On the mounting plate 19, the lower end frame 22a of the stretchable hose 22 is airtightly fixed to the upper end frame 22b of the stretchable soft member 22, and is airtightly fixed to the recess of the ejection block. Therefore, the flexible hose 22 can hermetically enclose the rod of the piston. The ejection block 16 has a receiving space _ above the opening. The pin plate 32 on the receiving space is connected to the holder (st〇p(4)Μ. ==_e)32 is provided with a projectile bolt (_ριη) 34, which is upwardly extended, and 5 elastic plates. The ρ1ηρ_)32 can be pressed to the bottom at any time... and then on the ejection block 16 there is a true JW〇82 two insertion channel 36 connected to the receiving space 。. The vacuum extraction passage 36 has an opening in the wall of the block portion 16. The pm plate 32 is lowered, and the upper lever 37 extends through the block portion 16. The upper lever 37 is also hermetically wrapped by the stretchable hose 38. In other words, the upper end frame 38b of the telescopic mountain soft s 38 is airtightly fixed under the block portion 6 and the frame 38 at the lower end thereof is fixed to the mounting plate 39 i. The mounting plate 39 has a squeeze rod 40. Therefore, when the squeeze rod 40 pushes up the mounting plate 39, the upper lever 37 and the pin plate 32 are brought up. Therefore, the ejection plug protrudes to a cavity to be described later. The heating plate 42 is placed above the ejection block 16 via the heat insulating material 41. Heating 42 is buried within heating 42. A mold sheet is placed on the heating plate 42. Since the cavity 45 has a cavity 45, a groove and a gate for the groove and the groove are formed. There is a bottle 47 in the center of the mold plate 44 and the heating plate 42, and a resin plate 48 on the bottle. ▲ In addition, the upper mold 12 has a cookware plate 50 on the opposite side of the lower mold 13 and the mold plate 44. The lower surface of the concave cavity 45 is formed with a recessed portion and a groove as shown in Fig. 1. When the upper mold 12 and the lower mold 13 are close to each other, the two spaces are formed in the opposite space of the mold 44. The space is formed in the opposite space. A vacuum extraction passage 52 connected to the space 51 is provided. The vacuum extraction passage 52 has an opening in the side wall of the board 50. The upper portion is heated to form a heating plate 53. The heating plate 53 is provided with heat. ^ Μ. Above the heating plate 53, a pin plate 58 is placed on the pin plate 58 with a heat insulating material 55. The pin plate 58 of the elastic member 61 can be placed at any time: two: force 1343082 Then, on the ejection block 56, there is a vacuum extraction passage 62 connected to the accommodating space 57. The vacuum extraction passage 62 has an opening in the wall of the block portion. In addition, there is a rod under the tying plate 58. 63 extends through the heating plate ^ and the mold plate 50 is connected to the lower mold 13 Fig. 2 is a cross-sectional view showing the upper mold and the lower mold in a vacuum state according to the present invention. As shown in Fig. 2 and Fig. 2, the upper mold 丨2 and the lower mold Η are The half mold chamber 7GA is covered with the lower mold chamber. The lower end mold chamber 7a has a rectangular recess on the lower end surface of the upper mold chamber 7', and a rubber seal member is embedded in the recess. On the lower end surface of the lower mold chamber 70B One can be embedded in the sealing part_recess. Further, in the upper mold chamber 7 (the opposite side of the vacuum extraction passage 52 62 is provided with suction ports 71, 72. The respective attraction σ 71, 72 through the joint and the suction tube Connected. On the opposite side of the vacuum extraction channel 36 of the lower half of the mold chamber is also provided with suction: 74 'the suction port 74 is also connected to the suction tube 73 through the joint. Then these suction officials 73 will be pumped with vacuum pump (not shown in the figure) As shown in Fig. 1, when the upper mold 12 and the lower mold 13 are close to the upper half mold to: 0 Α and the lower half of the change chamber 7GB is also close, so that the (four) parts are formed from the vacuum forming the airtight sealed space. Using the mold chamber 7Qt> In addition, the piston 20/rod 2 moving up and down 1) The upper moving rod 37 and the stretchable hose & 38 form an airtight cover, and the households hold the two receiving spaces W of the upper mold 12 and the lower mold 13 in an airtight state by the month b. In the embodiment, in the airtight state, a plurality of suction pipes 73 are connected to the vacuum pumping pump, and the pump-action causes the vacuum pumping chamber 7 to be greatly decompressed by 1 〇 4 to 10-6 T rr. The compartment space 51 and the two accommodating spaces μ are decompressed by the vacuum extraction passages 36, 52, 62 in an instant by 1〇4~1〇_6T〇rr. As shown in Fig. 2, the pressure is reduced in this way. At the same time, the upper mold 12 and the lower mold 13 are closed; ^ 'the piston 2G squeezes out the resin sheet melted in the bottle 47, and fills the 1343082 resin into the cavity 45 in which the electronic parts are placed. Then, when the lower mold 13 is moved downward, the pin plate 58 of the upper mold 12 is moved downward due to the elastic member 61, and the ejection plug protrudes into the cavity 45. Therefore, the resin molded article runs to the cavity 45 of the lower mold 13. Then, the upper lever 37 of the lower cooker 13 is moved upward to move the plug plate 32 upward, and the bullet 34 is projected into the cavity 45, so that the resin molded article can be taken out from the lower mold 13.
如上所述，將兩收容空間3157減壓，且伸縮性軟管D 緊緊氣密地覆蓋住活塞，因此隔間空間5丨就會變大，且能在瞬 間減壓’因此當凹腔45填充樹脂時就不會有空氣殘餘，樹脂成 形品就不會產生縫隙。 而且由於排氣溝的結構，所以活塞2〇周圍也被伸縮性軟 管22緊緊蓋住不會漏氣，因此能保持樹脂的流速固定也就能 防止電子零件的鐵線相接觸。此外，即使不設排氣溝也能防止 過去排氣溝造成毛邊發生的問題。 在本實施例中，由於收容空間31，57的減壓，不涉及真空 抽取通道52，而單單將真空抽取模室7〇内抽真空即可充分降 低隔間空間5 1及凹腔45内的壓力。 第二實施例 第4圖繪示依照本發明之第二實施例的樹脂封裝裝置主要 部份載面圖。帛5料示依照為本發明之第二實施例的樹脂封 裝裝置全體構成圖。 如第4圖所示，在本實施例中，固定、支撐住上半邊模室 7〇八與上模具的冠狀師_)75上有與抽真空室7()内的氣密 空間相連的抽氣口 76, 76。這些抽氣口 76, 76與抽真空泵浦（未 1343082 顯示於圖中）相連結。 在此實施例中’在上、下模具接近的狀態（〇 2_ )時’ 透過抽氣口 76, 76與抽氣管73,73開始抽真空時，在關模時凹 腔45内可以獲得充分的減壓。 第6圖繪不依照第4圖之第二實施例之變形例的裁面圖。 在此變㈣巾，伸縮.H軟管77的上端透過框㈣定在壓擠活塞 20的連結部m，伸㈣軟管77的下端透過框㈣定在可動 區塊14上面蓋住杯子2 i的伸縮性軟管(參照第1圖）則 被拿掉。在此變形财，伸縮性軟f77產生了氣密效果，且能 防止秘月曰板48的碎屑掉落到桿子2 i與伸縮性軟管22間的縫隙 内。 12 1 第三實施例 第7圖繪不依照本發明之第三實施例之樹脂封裝裝置的全 '體構成圖。此樹脂封裝裝置擁有安褒在上模具12近旁支柱10 上的靠近感應器100 ’以及讀取感應器100的感應訊號由Mpu 構成的控制部101。控制部1〇1上連接了連結機構25的驅動馬 達102、位於吸氣管73近旁連結管子73與真空果浦的電磁閥 φ 103 ° 在此貫把例中，真空泵浦預先啟動，控制電磁閥1 保持 在關閉狀態，因此吸氣管73附近的位置都一直維持在真空狀態 下。 工〜、 控制部101會控制驅動馬達丨〇保持在一般的速度下迴 轉，如此就會啟動連結機構25，讓可動區塊丨4往上移動。 可動區塊14往上動會使下模具13靠近上模具12，兩個模 • 具在例如靠近到0.2mm〜0.3mm時’靠近感應器1〇〇就會成應 1343082 到下半邊模室70B，輪出感應訊號。 …控制部ιοί在接收到感應訊號時，京尤會與電磁間1〇3—起 進行打開控制，降低驅動馬達⑻的轉速，降 近速度，例如在！秒〜3秒之間關模。 心 * =此-來’在本實施例中模室70就能在短時間内達到真 :狀悲’不停止下模具13，即能續往上動關模。因此能縮短關 棋所需時間。 ^在本實施例中，驅動馬達1〇2可使用脈衝馬達。此處控制 郤101可透過脈衝馬達所提供的脈衝述，感應到下模具门靠近 f 到例如0·2_的距離，所以可以省略感應器1〇〇。 本發明上述實施例所揭露之樹脂封裝裝置具有氣密性 高、減壓幅度大且迅速等優點。首先，讓上模具與下模具靠近 以及在關模時由真空抽取模室覆蓋形成氣密的密封空間，且設 置：個與彈射部收容空間相連、在模具側壁有開口的真空抽取 通道。當亂密的密封空間抽真空時能將凹腔内作短時間的大幅 減壓，因此就能大量生產無縫隙的樹脂成形品。再者，即使在 士 k具與下;^具設置排氣溝活塞周圍也能透過氣密用伸縮性軟 官的保護而不會漏氣。因此’樹脂的流速不會加快，也就不t φ 發生電子零件鐵線相互接觸的問題。如此_來即能 ; 與鐵線接觸問題、品質優良的樹脂成形品。另外，也可㈣^ 氣溝，不會發生過去排氣溝殘留樹脂產生毛邊的問題，因而省 卻了去除毛邊的作業》 、综上所述，雖然本發明已以一較佳實施例揭露如上，然其 並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之 精神和範圍内’當可作各種之更動與润飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 13 1343082 【圖式簡單說明】 第1圖繪示依照本發明之上模具與下模具開始抽真空時 (0.2mm)之狀態的截面圖。 第2圖繪示依照本發明之上模具與下模具在抽真空狀態下 時的截面圖。 第3圖繪示依照本發明一第一實施例之樹脂封裝裝置的整 體結構圖。 第4圖繪示依照本發明之第二實施例的樹脂封裝裝置主要 部份截面圖。 第5圖繪示依照為本發明之第二實施例的樹脂封裝裝置的 全體構成圖。 第6圖繪不依照第4圖之第二實施例之變形例的截面圖。 第7圖繪不依照本發明之第三實施例之樹脂封裝裝置的全 體構成圖。 【主要元件符號說明】 10 :支柱 20 :活塞 11 :固定塊 21 :桿子 12 .上模具 22、38 :伸縮性軟管 13 :下模具 14 :可動塊 16 :彈射用區塊 18 :連結部 19 :安裝板 22a、38a:伸縮性軟管之 下端框架 22b、38b :伸縮性軟管之 上端框架 2 5 :連結機構 27 :軸 42 :加熱板 26、28、29、30 :連結零 43 :加熱器 件 44、50 :模具板 31、57 :收容空間 45 :凹腔 32、58 :栓板 46 :隔間密封材料 33、59 :固定器 47 :瓶子 34、60 :彈射栓 4 8 :樹脂板 35、61 :彈性零件 5 1 :隔間空間 36、52、62 :真空抽取通 70Α :上半邊模室 f 道 70B :下半邊模室 37 :上動桿 70 :真空抽取模室 38 ' 63 :桿子 71、72、 74、76 :抽氣 39 :安裝板 口 40 :擠壓桿 41 ·隔熱材料 73 :抽氣管 1343082 Φ 15As described above, the two accommodating spaces 3157 are decompressed, and the stretchable hose D tightly covers the piston tightly, so that the compartment space 5 变 becomes large and can be decompressed instantaneously 'so that when the cavity 45 When the resin is filled, there is no air residue, and the resin molded article does not have a gap. Further, due to the structure of the exhaust groove, the piston 2 is also tightly covered by the stretchable flexible tube 22 so as not to leak air. Therefore, it is possible to prevent the iron wires of the electronic component from coming into contact while maintaining the flow rate of the resin. In addition, even if there is no exhaust groove, it is possible to prevent the occurrence of burrs in the past exhaust groove. In the present embodiment, due to the decompression of the accommodating spaces 31, 57, the vacuum extraction passage 52 is not involved, and the vacuum in the vacuum extraction chamber 7 can be used to sufficiently reduce the space in the compartment 5 1 and the cavity 45. pressure. SECOND EMBODIMENT Fig. 4 is a view showing a principal part of a resin encapsulating apparatus in accordance with a second embodiment of the present invention. Fig. 5 is a view showing the entire configuration of a resin sealing device according to a second embodiment of the present invention. As shown in Fig. 4, in the present embodiment, the crown member _) 75 which fixes and supports the upper mold chamber 7 and the upper mold has a pumping space connected to the airtight space in the vacuum chamber 7 (). Ports 76, 76. These suction ports 76, 76 are connected to an evacuation pump (not shown in Fig. 1343082). In this embodiment, 'when the upper and lower molds are close to each other (〇2_)', when the vacuum is started through the suction ports 76, 76 and the suction pipes 73, 73, a sufficient reduction can be obtained in the cavity 45 when the mold is closed. Pressure. Fig. 6 is a plan view showing a modification of the second embodiment which is not in accordance with Fig. 4. Here, the upper end of the (4) towel, the telescopic.H hose 77 is fixed to the joint portion m of the pressing piston 20 through the frame (4), and the lower end of the extension (4) hose 77 is fixed to the movable block 14 to cover the cup 2i through the frame (4). The flexible hose (see Figure 1) is removed. In this case, the stretchable soft f77 produces an airtight effect, and prevents the debris of the moonboard 48 from falling into the gap between the pole 2i and the stretchable hose 22. 12 1 THIRD EMBODIMENT Fig. 7 is a view showing a full body configuration of a resin package device which is not in accordance with a third embodiment of the present invention. The resin encapsulating device has a control portion 101 which is mounted on the vicinity of the upper mold 10 of the upper mold 12 and which is close to the inductor 100' and the sensing signal of the reading sensor 100 is constituted by Mpu. The control unit 1〇1 is connected to the drive motor 102 of the connection mechanism 25, and the electromagnetic valve φ 103° which is located in the vicinity of the intake pipe 73 and connects the pipe 73 and the vacuum pump. In this example, the vacuum pump is activated in advance, and the solenoid valve is controlled. 1 is kept in the closed state, so the position near the suction pipe 73 is always maintained under vacuum. The control unit 101 controls the drive motor to maintain the rotation at a normal speed, so that the link mechanism 25 is activated to move the movable block 丨4 upward. The upward movement of the movable block 14 causes the lower mold 13 to be close to the upper mold 12, and the two molds are close to the inductor 1 ' when it is close to 0.2 mm to 0.3 mm, and the first mold is 7032082 to the lower mold chamber 70B. , turn out the induction signal. ... When the control unit ιοί receives the sensing signal, Jingyou will open the control with the electromagnetic room 1,3 to reduce the speed of the drive motor (8) and reduce the speed, for example! The mode is closed between seconds and 3 seconds. The heart * = this - come in the present embodiment, the mold chamber 70 can reach true in a short time: the sorrow ' does not stop the lower mold 13, that is, it can continue to move the mold off. Therefore, the time required for the game can be shortened. In the present embodiment, the drive motor 1〇2 can use a pulse motor. Here, the control 101 can sense the distance from the lower mold door to f to, for example, 0·2_, through the pulse description provided by the pulse motor, so the sensor 1〇〇 can be omitted. The resin encapsulating device disclosed in the above embodiments of the present invention has the advantages of high airtightness, large decompression, and rapidity. First, the upper mold is brought close to the lower mold and the vacuum extraction mold chamber is covered to form a hermetic sealing space when the mold is closed, and a vacuum extraction passage is provided which is connected to the ejection portion receiving space and has an opening on the side wall of the mold. When the evacuated sealed space is evacuated, the inside of the cavity can be greatly decompressed for a short period of time, so that a seamless resin molded article can be mass-produced. Furthermore, even if it is installed in the vicinity of the exhaust groove piston, it can be protected by the airtight flexible member without leaking. Therefore, the flow rate of the resin does not increase, and the problem that the electronic component wires are in contact with each other does not occur. In this way, it is possible to produce a resin molded article that is in contact with the iron wire and has excellent quality. In addition, it is also possible to (4) the air groove, and the problem that the residual resin of the exhaust groove is generated in the past does not occur, thereby eliminating the operation of removing the burrs. In summary, although the present invention has been disclosed above with reference to a preferred embodiment, However, it is not intended to limit the invention, and any person skilled in the art can make various modifications and refinements without departing from the spirit and scope of the invention. The definition is final. 13 1343082 [Simple description of the drawings] Fig. 1 is a cross-sectional view showing a state in which the upper mold and the lower mold start to evacuate (0.2 mm) according to the present invention. Fig. 2 is a cross-sectional view showing the upper mold and the lower mold in a vacuumed state in accordance with the present invention. Fig. 3 is a view showing the entire configuration of a resin encapsulating apparatus in accordance with a first embodiment of the present invention. Fig. 4 is a cross-sectional view showing the principal part of a resin encapsulating apparatus in accordance with a second embodiment of the present invention. Fig. 5 is a view showing the overall configuration of a resin package device according to a second embodiment of the present invention. Fig. 6 is a cross-sectional view showing a modification of the second embodiment which is not in accordance with Fig. 4. Fig. 7 is a view showing the entire configuration of a resin package device which is not in accordance with the third embodiment of the present invention. [Description of main component symbols] 10: Pillar 20: Piston 11: Fixing block 21: Rod 12 Upper mold 22, 38: Flexible hose 13: Lower mold 14: Movable block 16: Ejection block 18: Connection portion 19 Mounting plates 22a, 38a: Retractable hose lower end frames 22b, 38b: Retractable hose upper end frame 2 5: Connecting mechanism 27: Shaft 42: Heating plates 26, 28, 29, 30: Connecting zero 43: Heating Device 44, 50: mold plate 31, 57: housing space 45: cavity 32, 58: peg plate 46: compartment sealing material 33, 59: holder 47: bottle 34, 60: ejection pin 4 8 : resin plate 35 61: Elastic part 5 1 : Compartment space 36, 52, 62: Vacuum extraction 70 Α: Upper half mold chamber f Road 70B: Lower half mold chamber 37: Upper lever 70: Vacuum extraction chamber 38 ' 63 : Pole 71, 72, 74, 76: Pumping 39: Mounting plate opening 40: Extruding rod 41 · Insulation material 73: Extracting pipe 1343082 Φ 15