200531187 '九、發明說明： 【發明所屬之技術領域】 —本發明是有關於-種樹脂封裝裝置，且特別是有關於一種 將女裝在導線架（leadframe)等上之電子零件（元件）做樹脂 封裝用的樹脂封裝裝置。 【先前技術】 舊有的樹脂封裝裝置是抽出凹腔（cavity)的空氣與瓶子 /pot)内的空氣降低凹腔（cavity)與瓶子（㈧〖）的壓力，然 後啟動活塞將瓶子（pot)内的融化樹脂填充到凹腔内。 但是在舊有的樹脂封裝裝置中，由於活塞與彈射用驅動桿 透過氣密性很差的密封零件來回動作，因此無法大幅減少凹腔 内的壓力，例如只能減少凹腔内約10Torr的壓力而已。因此在 做樹脂成形時凹腔内殘餘的空氣會混到樹脂内，可能在成形體 中產生縫隙。 而且一般透過與凹腔相連的微小排氣孔降低凹腔内的壓 力，所以在注入樹脂時透過排氣孔從瓶子（pot)與活塞的間隙 等會洩漏空氣產生很大的氣流，或者會加速注入樹脂的流速， Tk成電子零件的鐵線（wire)彎曲，相互接觸。 【發明内容】 有鑑於此’本發明的目的就是在提供一種氣密性高、減壓 中田度大且迅速的樹脂封裝裝置。透過設計精巧的多個元件相互 配合來維持凹腔的氣密性，解決於封裝時電子零件鐵線相互接 觸的問題。此外，由於能短時間的大幅減壓，本發明之實施例 可大量生產無縫隙的樹脂成形品。 200531187 根據本發明的目的，提出一種樹脂封裝裝置，具有相互靠 近可關模的上模具與下模具，以及在上模具與下模具對面容納 要做樹脂封裝之電子零件的凹腔，以及將配置在前述上模具與 下模具的收谷空間的彈射栓（eject pin )突出於前述凹腔的彈出 部。且此樹脂封裝裝置具有以下特徵：在此樹脂封裝裝置中， 相連的兩模具的側壁上有分別開口的真空抽取通道，上模具與 下模具由擁有收容空間的上凹腔半邊模室與下半邊模室構成， 虽上杈具與下模具靠近以及關模時，會形成氣密密封的密閉空 間，也就是真空抽取凹腔，在真空抽取凹腔内能作真空抽取。 為讓本發明之上述目的、特徵、和優點能更明顯易懂，下 文特舉一較佳實施例，並配合所附圖式，作詳細說明如下： 【實施方式】 % 一實施例 請參照第3圖，其繪示依照本發明一第一實施例之樹脂封 裝裝置的整體結構圖。 树脂封裝裝置擁有4支支柱10以及固定支樓在這些支柱 10上端的m定塊（blGek) u，以及安裝在固定塊n上的上模 具 12 〇 、 在上模具12下方有下模具相對配置。此下模具安裝在 可動塊14 i面，可動塊則安裝在各支柱㈣上可作上下動;乍。 、各支柱10的下端由基座（baSe)24支撐。在基座24上裝 有連結機構25。連結機構25擁有透過軸27與連結零件％連 結在-起、可搖動的一對連結零件以，Μ ;以及 件28, 28相同，連处扃下古的、击从& 一逆、、口令 連…在下方的連結零件29,以及在連結零件Μ 上透過加壓用連結軸4G連結在—起的—對連結零件3G，3〇;: 200531187 及透過減速機構可迴轉驅動軸27的 取上方的一對連結機構3〇, 3〇 …俊 面。 方則固疋在可動塊14的下 因此當驅動馬達時，一對連結零 心迴轉’連結零件26,28,28,29與3〇, 3 曰,27為中 成-直線，可動塊14會往上動 D下方向伸長形 下輕且nm 動所以當可動塊14往上動時， 下杈/、13就會與上模具12隔著小小 隔與上模具12對向（請參照第μ )。日μ，例如心m的間 始抽直第二：K物之第—實施例之上模具與下模具開 抽真二％ (〇.2mm)之狀態的截面圖。 如第1圖所示，下模具13擁有 # 14： 雠百固疋在可動塊14上的中空 二=’以及固定在支撐體15上的彈射用區塊“。在支擇 體5内有從可動區塊14伸展出的螺絲桿η突出螺 上端連結在連結部18可任音迴轉 ” ” 塞20的下端。 π』轉，連結部㈣透過連結到活 螺:糸桿Π受到馬達（未顯示於圖中）驅動迴轉後會往上 動，因此活塞20會透過桿子21往上動。 在安裝板19上，伸縮性敕營” μ _ ^ 的下端框架22a氣密地固 Γ6的：性軟管22的上端桓架22b則氣密固定在彈射用區塊 η的凹處。因此伸縮性軟管22就能氣密地包住活塞2G的桿子 彈射用區塊16上有一個卜古^ k ’ 1固上方開口的收容空間31。收容空 上的检板（Ρ1Π咖〇 32與固定器（st0PPe〇 33相接。 = UinP㈣32上裝有往上延伸的彈躲（咖咖）34, =彈性零件35栓板（Pinplate)32能隨時對下方產生掛壓的 力置。然後在彈射用區塊16上有一個與收容空間31相連的直 200531187 空抽取通道36。真空抽取通道36在區塊部16的壁上有開口。 攸栓板（pin plate) 32往下，上動桿37貫穿區塊部16伸 長。上動桿37也由伸縮性軟管38氣密地包住。換言之，伸縮 性軚官38的上端框架38b氣密地固定在區塊部16下面，其下 端的框架38固定在安裝板39上。安裝板39有擠屡桿4〇。因 此當擠壓桿40往上推動安裝板39時，就會一起帶動上動桿37 和栓板（pm plate) 32。因此彈射栓34就會突出到後述的凹腔 45内。 在彈射用區塊16上方隔著隔熱材料41有加熱板42。加熱 板42内埋有加熱器43。在加熱板42裝有模具板44。在模具板 44上由於有凹腔45,所以形成凹部與溝部用的溝與閘門（科仏）。 在模具板44與加熱板42的中央有瓶子47，在瓶子〇上 有樹脂板48。 另外，上模具12在下模具13與模具板料的對面有一個 模具板5〇。在模具板50的下面有形成前述凹腔45的凹部盥溝 用的溝。 如第1圖所示，當上模具12與下模具13靠近時，兩模具 板44的相對空間中會形成隔間空間51。職在模具板％ 上没有與隔間空間51相連的真空抽取通道52。真空抽取通道 52在模具板50的側壁上有開口。 上模具12為了加熱模具板5〇,因此設有加熱板53。加教 :53内有加熱器54。在加熱板53上方隔著隔熱材料μ配置 有每射用區塊56。彈射用區塊56上有下方開口收容空間〜 在收容空間57上栓板（pin plate) 58與固定器％相連接。检 广8上裝有往下延伸的彈射检6〇，透 令件61栓板（pmplate) 58能隨時對下方產生擠壓的力 200531187 量。然後在彈射用區堍％ μ 士 , t 抽取通道62。直空抽取、帛—間57相連的真空 ”二抽取通逼62在區塊 此外，在栓板58下面有_個^^ ^上有開口。 與模具板50連接到下模且二S'子63延伸穿過加… Γ俱昇13的杈具板44上。 第2圖繪示依照本發明之上模具與下模具在抽直 時的截面圖。如第1圖及第2圖所示，上模呈12盘/ 被上半邊模室70Α與下半邊模t 7Q 、，、’、下杈具13 下嫂而盍住。上半邊模室70A的 有形的凹處，在凹處嵌入橡膠製的密封零件46。在 下半邊模室70B的下端面κ古如_山 了令件46在 下柒面上有-個可嵌入密封零件46的凹處。 η Ά至7〇Α上與真空抽取通道52, 62對面的位置 吸引口 71，72。各吸引口 71，72透過接頭與吸引管73, 相連。在下半邊模室卿的真空抽取通道％的對面上也設有吸 引:74’吸引口 74也透過接頭與吸引f 73相連。紐這些吸 引官73會與抽真空泵浦（未顯示於圖中）相連結。 如第1圖所示，當上模具12與下模具13靠近，上半邊模 室7, A與下半邊模室也會靠近，所以透過密封零件牝構 成形成氣密密封空間的抽真空用模室7〇。此外，上下移動的活 塞2〇j桿子21)與上動桿37與伸縮性軟管22, 38會形成氣密 的覆蓋，所以能使上模具12與下模具13的兩收容空間31， 都保持在氣密狀態。 ’ 在本實施例中，在此氣密狀態下幾個吸引管73與真空泵 浦相連，泵浦一動作就會使真空抽取模室7〇大幅減壓1〇_4〜 1〇-61\)汀。換言之，隔間空間51與兩收容空間3157透過真空 抽取通道36, 52, 62在一瞬間就能減壓 104〜10-6Torr 〇 如第2圖所示，在這樣減壓的同時，上模具ι2與下模具 13會關模，活塞20會將瓶子47内融化的樹脂板擠壓出去，將 200531187 * 樹脂填充到放置有電子零件的凹腔45内。 然後當下模具13往下動，上模具12的栓板（pin plate) 58因為彈性零件61的關係往下動，彈射栓⑼就會突出到凹腔 45内。因此樹脂成形品就會跑到下模具13的凹腔45上。 然後下模具13的上動桿37會往上動使栓板32往上，彈 射栓34就會突出到凹腔45内，於是能將樹脂成形品從下模具 13中取出。 、^ 如上所述，將兩收容空間31，57減壓，且伸縮性軟管22 緊緊氣密地覆蓋住活塞，因此隔間空間5丨就會變大，且能在瞬 間減壓，因此當凹腔45填充樹脂時就不會有空氣殘餘，樹脂成 形品就不會產生縫隙。 - 而且由於排氣溝的結構，所以活塞20周圍也被伸縮性軟 官22緊緊蓋住不會漏氣，因此能保持樹脂的流速固定，也就能 防止電子零件的鐵線相接觸。此外，即使不設排氣溝也能防止 過去排氣溝造成毛邊發生的問題。 在本實施例中，由於收容空間31，57的減壓，不涉及真空 抽取通道52，而單單將真空抽取模室7〇内抽真空即可充分降 低隔間空間5 1及凹腔45内的壓力。 一第二實施你丨 第4圖繪示依照本發明之第二實施例的樹脂封裝裝置主要 部份載面圖。第5圖繪示依照為本發明之第二實施例的樹脂封 裝裝置全體構成圖。 如第4圖所示，在本實施例中，固定、支撐住上半邊模室 70A與上模具的冠狀物（crown)75上有與抽真空室7〇内的氣密 空間相連的抽氣口 76, 76。這些抽氣口 76, 76與抽真空泵浦（未 11 200531187 顯示於圖中）相連結。 在此實施例中，在上、下模具接近的狀態（G2_)時， 透過抽孔76, 76與抽氣管73, 73開始抽真空時，在關模 腔45内可以獲得充分的減壓。 第6圖繪示依照第4圖之第二實施例之變形例的截面圖。 在此艾开y例中，伸縮性軟管77的上端透過框㈣定在壓擠活塞 20的連結部18上，伸縮性軟管77的下端透過框㈣定在可動 區塊14上面。蓋住桿子21的伸縮性軟管22 (參照第*圖）則 被拿掉。纽變形财，㈣性軟管77產生了氣密效果且能 防止樹脂48的碎屬掉落到桿子21與伸縮性軟管㈣的縫隙 内。 第三實施例 第7圖繪示依照本發明之第三實施例之樹脂封裝裝置的全 體構成®。此龍封裝裝置擁有安裝在上模具12近旁支柱ι〇 上的靠近感應器100’以及讀取感應器i⑽的感應訊號由Mpu 構成的控制部ιοί。控制部1G1上連接了連結機構25的驅動馬 達102、位於吸氣管73近旁連結管子73與真空泵浦的電磁閥 103。 在此實施例中，真空泵浦預先啟動，控制電磁閥1〇3保持 在關閉狀態’因此吸氣管73附近的位置都—直維持在真空狀態 下。 控制部101會控制驅動馬達1〇保持在一般的速度下迴 轉，如此就會啟動連結機構25，讓可動區塊14往上移動。 可動區塊14往上動會使下模具13靠近上模具12，兩個模 具在例如靠近到0.2mm〜〇.3mm時，靠近感應器1〇〇就會感應 12 200531187 • 到下半邊模室70B，輸出感應訊號。 控制部101在接收到感應訊號時，就會與電磁閥1 〇3 一起 進行打開控制，降低驅動馬達102的轉速，降低下模具13的靠 近速度，例如在1秒〜3秒之間關模。 如此一來，在本實施例中模室70就能在短時間内達到真 空狀態，不停止下模具13，即能續往上動關模。因此能縮短關 模所需時間。 在本貫施例中’驅動馬達1 〇2可使用脈衝馬達。此處控制 P 1 〇 1 了透過脈衝馬達所提供的脈衝述，感應到下模具13靠近 到例如0.2mm的距離，所以可以省略感應器ι〇〇。 本發明上述實施例所揭露之樹脂封裝裝置具有氣密性 ^ 減壓幅度大且迅速等優點。首先，讓上模具與下模具靠近 以及在關模時由真空抽取模室覆蓋形成氣密的密封空間，且設 置個與彈射部收容空間相連、在模具側壁有開口的真空抽取 通=。當氣密的密封空間抽真空時能將凹腔内作短時間的大幅 咸[口此就此大量生產無縫隙的樹脂成形品。再者，即使在 t換具與下模具設置排氣溝活塞周圍也能透過氣密用伸縮性軟 t的保護而不會漏氣。因此，樹脂的流速不會加快，也就不會 發生電子零件鐵線相互接觸的問題。如此一來即能生產無縫隙 與鐵線接觸問題、品質優良的樹脂成形品。另外，也可不須排 虱溝，不會發生過去排氣溝殘留樹脂產生毛邊的問題，因而省 卻了去除毛邊的作業。 、纟不、上所述，雖然本發明已以一較佳實施例揭露如上，然其 並非用=P艮定本發明，任何熟習此技藝者，在不脫離本發明之 $神和feffi内，當可作各種之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 13 200531187 【圖式簡單說明】 第1圖繪示依照本發明之上模具與下模具開始抽真空時 (0.2mm)之狀態的截面圖。 第2圖繪示依照本發明之上模具與下模具在抽真空狀態下 時的截面圖。 第3圖繪示依照本發明一第一實施例之樹脂封裝裝置的整 體結構圖。 第4圖繪示依照本發明之第二實施例的樹脂封裝裝置主要 | 部份截面圖。 第5圖繪示依照為本發明之第二實施例的樹脂封裝裝置的 全體構成圖。 第6圖繪示依照第4圖之第二實施例之變形例的截面圖。 第7圖繪不依照本發明之第三實施例之樹脂封裝裝置的全 體構成圖。200531187 'IX. Description of the invention: [Technical field to which the invention belongs] — The present invention relates to a resin packaging device, and more particularly to an electronic part (component) made of a woman's clothing on a leadframe, etc. Resin packaging device for resin packaging. [Prior technology] The old resin packaging device was to extract the air in the cavity and the bottle / pot to reduce the pressure in the cavity and the bottle (㈧ 〖), and then activate the piston to place the bottle in the pot. The molten resin inside is filled into the cavity. However, in the conventional resin packaging device, the piston and the ejection driving rod move back and forth through the sealing member with poor air tightness, so the pressure in the cavity cannot be reduced significantly, for example, the pressure in the cavity can only be reduced by about 10 Torr. That's it. Therefore, the residual air in the cavity will be mixed into the resin during resin molding, which may cause gaps in the molded body. In addition, the pressure in the cavity is generally reduced through a small exhaust hole connected to the cavity. Therefore, when the resin is injected, the air leaks from the gap between the bottle and the piston through the exhaust hole to generate a large airflow, or it will accelerate. The flow rate of the injected resin causes Tk to bend into the wires of the electronic parts and make contact with each other. [Summary of the Invention] In view of this, an object of the present invention is to provide a resin sealing device with high airtightness, a large degree of rapidity in decompression. Through the intricate design of multiple components to cooperate with each other to maintain the airtightness of the cavity, the problem of the iron parts of the electronic parts contacting each other during packaging is solved. In addition, the embodiment of the present invention can mass-produce a seamless resin molded product because it can be greatly decompressed in a short period of time. 200531187 According to the purpose of the present invention, a resin encapsulation device is provided, which has an upper mold and a lower mold which are close to each other and can be closed, and a cavity for accommodating electronic parts to be resin-encapsulated opposite the upper mold and the lower mold, and configured in An eject pin of the trough space of the upper mold and the lower mold protrudes from the ejection portion of the cavity. And this resin encapsulation device has the following characteristics: In this resin encapsulation device, the side walls of the two connected molds have separate vacuum extraction channels, and the upper mold and the lower mold are formed by an upper cavity half-sided mold chamber and a lower half with a receiving space. The mold chamber is formed. Although the upper fork is close to the lower mold and the mold is closed, a hermetically sealed space is formed, that is, a vacuum extraction cavity, and vacuum extraction can be performed in the vacuum extraction cavity. In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is given below in conjunction with the accompanying drawings to describe in detail as follows: [Embodiment]% For an embodiment, please refer to the first 3 is a diagram showing the overall structure of a resin packaging device according to a first embodiment of the present invention. The resin encapsulation device has four pillars 10 and m fixed blocks (blGek) u on the upper ends of the fixed pillars 10, and an upper mold 12o mounted on the fixed block n, and a lower mold is arranged opposite the lower mold 12. The lower mold is installed on the 14 i side of the movable block, and the movable block is installed on each pillar ㈣ for up and down movement; The lower end of each pillar 10 is supported by a base (baSe) 24. The base 24 is provided with a coupling mechanism 25. The linking mechanism 25 has a pair of swingable linking parts connected to the linking part through the shaft 27, and M, and parts 28 and 28 are the same. Connected to the lower connecting part 29, and the connecting part M is connected to the connecting part 4G by pressing the connecting shaft 4G. The connecting part 3G, 30; 200531187 and the drive shaft 27 can be taken up through the reduction mechanism A pair of connecting mechanisms 3, 30, ... handsome. The rule is fixed under the movable block 14. Therefore, when the motor is driven, a pair of connecting zero-centered revolutions' connecting parts 26, 28, 28, 29 and 30, 3, 27 is a medium-straight line, and the movable block 14 will Move up and down and stretch down and down and move in nm, so when the movable block 14 moves up, the lower branch /, 13 will be opposed to the upper mold 12 and the upper mold 12 with a small gap (refer to section μ). ). Day µ, for example, the center m is drawn straight. Second: the first object of the K object-the cross-sectional view of the state where the upper mold and the lower mold are drawn by 2% (0.2 mm). As shown in FIG. 1, the lower mold 13 has # 14: 雠 百 固 疋 's hollow two on the movable block 14 =' and the ejection block fixed on the support body 15. The upper end of the protruding screw rod η extending from the movable block 14 is connected to the lower end of the plug 20 which can be rotated at any position. The “20” turns, and the connecting portion ㈣ is connected to the live screw: the rod Π receives a motor (not shown) (In the figure) After driving, it will move upwards, so the piston 20 will move upwards through the rod 21. On the mounting plate 19, the lower end frame 22a of the telescopically anchored μ μ ^ is hermetically fixed to the Γ6: soft The upper end bracket 22b of the tube 22 is air-tightly fixed to the recess of the ejection block η. Therefore, the stretchable hose 22 can air-tightly enclose the rod ejection block 16 of the piston 2G, and there is a storage space 31 which is open at the top. The inspection board on the containment space (P1Π カ 〇32 is connected to the holder (st0PPe〇33. = UinP㈣32 is equipped with an upwardly extending bullet dome (Caffe) 34, = Elastic part 35 Pinplate) 32 can be at any time A pressure force is generated on the lower side. Then on the ejection block 16 there is a straight 200531187 empty extraction channel 36 connected to the containing space 31. The vacuum extraction channel 36 has an opening in the wall of the block portion 16. (Pin plate) 32 downwards, the upper movable rod 37 extends through the block portion 16. The upper movable rod 37 is also air-tightly covered by the stretchable hose 38. In other words, the upper frame 38b of the stretchable eunuch 38 is air-tightly It is fixed under the block portion 16, and the lower frame 38 is fixed on the mounting plate 39. The mounting plate 39 has a squeeze lever 40. Therefore, when the squeeze lever 40 pushes the mounting plate 39 upward, it will drive the upward movement together. The rod 37 and the pm plate 32. Therefore, the ejection bolt 34 protrudes into a cavity 45 described later. A heating plate 42 is disposed above the ejection block 16 with a heat insulating material 41 interposed therebetween. Heater 43. A mold plate 44 is mounted on the heating plate 42. A recess 45 is formed in the mold plate 44 so that a recess is formed. A groove and a gate for the groove part. A bottle 47 is provided in the center of the mold plate 44 and the heating plate 42 and a resin plate 48 is provided on the bottle 0. In addition, the upper mold 12 is provided on the opposite side of the lower mold 13 and the mold sheet. One mold plate 50. A groove is formed on the lower surface of the mold plate 50 to form the recessed groove of the cavity 45. As shown in FIG. 1, when the upper mold 12 and the lower mold 13 are close to each other, the two mold plates 44 face each other. A compartment space 51 will be formed in the space. There is no vacuum extraction channel 52 connected to the compartment space 51 on the mold plate%. The vacuum extraction channel 52 has an opening in the side wall of the mold plate 50. The upper mold 12 is for heating the mold plate 5 〇Therefore, a heating plate 53 is provided. Plus teaching: 53 has a heater 54. Above the heating plate 53 is disposed a block 56 for each shot with a heat insulation material μ. A block for receiving the space below the ejection block 56 ~ A pin plate 58 is connected to the fixture% in the storage space 57. The inspection board 8 is equipped with a downward ejection test 60, and a penetration plate 61 pmplate 58 can be generated at any time below. The amount of squeezing force 200531187. Then in the ejection area 堍% μ ± t Take channel 62. Straight air extraction, vacuum connected to 帛 -room 57. The second extraction through force 62 is in the block. In addition, there are _ ^^^ openings below the bolt plate 58. It is connected to the mold plate 50 and the lower mold and The two S's 63 extend through the fork plate 44 of the Γ 升 13. Figure 2 shows a cross-sectional view of the upper mold and the lower mold when they are straightened according to the present invention. Figures 1 and 2 As shown in the figure, the upper mold is 12 disks and is held by the upper half mold chamber 70A and the lower half mold t 7Q. A visible recess in the upper mold cavity 70A is fitted with a rubber sealing member 46 in the recess. On the lower end surface κ of the lower half mold chamber 70B, there is a recess on the lower surface where the sealing member 46 can be inserted. The suction ports 71, 72 are located at positions η to 70A opposite to the vacuum extraction channels 52, 62. Each suction port 71, 72 is connected to a suction pipe 73, through a joint. A suction is also provided on the opposite side of the vacuum extraction channel% of the lower mold chamber: 74 'suction port 74 is also connected to the suction f 73 through a joint. These suction units 73 are connected to a vacuum pump (not shown). As shown in Figure 1, when the upper mold 12 and the lower mold 13 are close to each other, the upper half mold chamber 7, A and the lower half mold chamber are also close to each other. Therefore, the vacuum mold chamber that forms an air-tight sealed space is formed by the sealing member 牝. 70. In addition, the up and down piston 20j rod 21), the upper moving rod 37, and the flexible hoses 22 and 38 form an air-tight cover, so that the two housing spaces 31 of the upper mold 12 and the lower mold 13 can be maintained. In an airtight state. '' In this embodiment, in this air-tight state, several suction tubes 73 are connected to a vacuum pump, and once the pump is actuated, the vacuum extraction mold chamber 70 is greatly decompressed by 10-4 ~ 10-61 \) Ting. In other words, the compartment space 51 and the two containing spaces 3157 can be decompressed by the vacuum extraction channels 36, 52, 62 in an instant by 104 to 10-6 Torr. As shown in FIG. 2, while decompressing in this way, the upper mold ι2 The mold will be closed with the lower mold 13, the piston 20 will squeeze out the melted resin plate in the bottle 47, and fill the 200531187 * resin into the cavity 45 where the electronic parts are placed. Then, when the lower mold 13 moves downward, the pin plate 58 of the upper mold 12 moves downward because of the elastic part 61, and the ejection pin 突出 will protrude into the cavity 45. Therefore, the resin molded product runs on the cavity 45 of the lower mold 13. Then, the upper moving rod 37 of the lower mold 13 moves upward to make the bolt plate 32 upward, and the ejection bolt 34 projects into the cavity 45, so that the resin molded product can be taken out of the lower mold 13. As mentioned above, the two storage spaces 31, 57 are decompressed, and the flexible hose 22 tightly and air-tightly covers the piston, so the compartment space 5 丨 becomes larger and can be decompressed instantly, so When the cavity 45 is filled with resin, no air remains, and no gap is formed in the resin molded product. -Due to the structure of the exhaust groove, the surrounding area of the piston 20 is also tightly covered by the flexible elastic member 22 to prevent air leakage. Therefore, the flow rate of the resin can be kept constant, and the iron wires of the electronic parts can be prevented from coming into contact with each other. In addition, even if no exhaust groove is provided, it is possible to prevent the occurrence of burrs caused by the exhaust groove in the past. In this embodiment, due to the decompression of the storage spaces 31 and 57, the vacuum extraction channel 52 is not involved, and the vacuum in the vacuum extraction mold chamber 70 alone can sufficiently reduce the pressure in the compartment space 51 and the cavity 45. pressure. A Second Implementation You FIG. 4 is a side view of a main part of a resin packaging device according to a second embodiment of the present invention. Fig. 5 is a diagram showing the entire configuration of a resin packaging apparatus according to a second embodiment of the present invention. As shown in FIG. 4, in this embodiment, a crown 75 of the upper mold cavity 70A and the upper mold are fixed and supported, and an exhaust port 76 is connected to the airtight space in the vacuum chamber 70. , 76. These suction ports 76, 76 are connected to a vacuum pump (not shown in 2005 2005187187). In this embodiment, when the upper and lower molds are close to each other (G2_), when the vacuum is started through the suction holes 76, 76 and the suction pipes 73, 73, a sufficient decompression can be obtained in the mold closing cavity 45. Fig. 6 is a sectional view showing a modification of the second embodiment according to Fig. 4. In this example, the upper end of the flexible hose 77 is fixed to the connecting portion 18 of the compression piston 20 through a frame, and the lower end of the flexible hose 77 is fixed to the movable block 14 through a frame. The flexible hose 22 covering the pole 21 (see figure *) is removed. The flexible hose 77 produces an air-tight effect and prevents the broken resin 48 from falling into the gap between the rod 21 and the flexible hose ㈣. Third Embodiment Fig. 7 shows the overall configuration of a resin packaging device according to a third embodiment of the present invention. This dragon packaging device has a proximity sensor 100 'mounted on a pillar ι〇 near the upper mold 12 and a control unit composed of an Mpu that senses the sensing signal of the reading sensor i⑽. The control unit 1G1 is connected to the drive motor 102 of the connection mechanism 25, the connection pipe 73 and the vacuum pump solenoid valve 103 located near the suction pipe 73. In this embodiment, the vacuum pump is started in advance, and the control solenoid valve 103 is kept in a closed state 'so that the positions near the suction pipe 73 are all kept in a vacuum state. The control unit 101 controls the drive motor 10 to keep rotating at a normal speed, so that the link mechanism 25 is activated, and the movable block 14 is moved upward. Moving the movable block 14 upward will bring the lower mold 13 closer to the upper mold 12, and when two molds are close to 0.2mm ~ 0.3mm, for example, the proximity sensor 100 will sense 12 200531187 • to the lower half mold chamber 70B To output the induction signal. When the control unit 101 receives the induction signal, it performs opening control together with the solenoid valve 103, which reduces the rotational speed of the drive motor 102 and lowers the approach speed of the lower mold 13, for example, the mold is closed between 1 second and 3 seconds. In this way, in this embodiment, the mold chamber 70 can reach the vacuum state in a short time, and the mold 13 can be continuously moved upward to close the mold without stopping the lower mold 13. Therefore, the time required for mold closing can be shortened. In this embodiment, a pulse motor may be used as the 'driving motor 102. Here, the control of P 1 〇 1 is performed by the pulse signal provided by the pulse motor, and the lower mold 13 is sensed to be close to a distance of, for example, 0.2 mm, so the sensor ι〇〇 can be omitted. The resin encapsulation device disclosed in the above embodiments of the present invention has the advantages of air-tightness, large and rapid pressure reduction, and the like. First, close the upper mold to the lower mold and cover it with a vacuum extraction mold chamber to form an air-tight sealed space when closing the mold, and set up a vacuum extraction channel that is connected to the ejection part housing space and has an opening on the mold sidewall. When the airtight sealed space is evacuated, a large amount of salt can be made in the cavity for a short period of time. In this way, seamless resin molded products can be produced in large quantities. In addition, even if an exhaust groove piston is provided around the t-tool changer and the lower mold, the airtight flexible t can be protected without leaking air. Therefore, the flow rate of the resin will not be accelerated, and the problem that the iron wires of the electronic parts are in contact with each other will not occur. In this way, it is possible to produce a resin molded product with excellent quality and seamless contact with iron wires. In addition, it is not necessary to remove lice grooves, and the problem of burrs caused by residual resin in the exhaust ditch in the past does not occur, thereby eliminating the need to remove burrs. , 纟 不, the above, although the present invention has been disclosed as above with a preferred embodiment, but it is not intended to define the present invention. Any person skilled in this art, without departing from the $ 神 and feffi of the present invention, when Various modifications and retouching can be made, so the protection scope of the present invention shall be determined by the scope of the attached patent application. 13 200531187 [Brief description of the drawings] Fig. 1 is a cross-sectional view showing the state of the upper mold and the lower mold (0.2 mm) at the beginning of vacuuming according to the present invention. Fig. 2 is a cross-sectional view of the upper mold and the lower mold according to the present invention when they are under vacuum. Fig. 3 is a diagram showing the overall structure of a resin packaging device according to a first embodiment of the present invention. FIG. 4 is a cross-sectional view of a main part of a resin packaging device according to a second embodiment of the present invention. Fig. 5 is a diagram showing the overall configuration of a resin packaging device according to a second embodiment of the present invention. Fig. 6 is a sectional view showing a modification of the second embodiment according to Fig. 4. Fig. 7 is a diagram showing the overall configuration of a resin packaging device according to a third embodiment of the present invention.
【主要元件符號說明】 22、3 8 :伸縮性軟管 22a、38a :伸縮性軟管之 下端框架 22b、38b:伸縮性軟營之 上端框架 I 〇 :支柱 II :固定塊 12 :上模具 13 :下模具 14 :可動塊 16 :彈射用區塊 18 :連結部 19 :安裝板 20 :活塞 21 :桿子 25 :連結機構 14 200531187 27 ··軸 26、28、29、30 ··連結零 件 31、 57 :收容空間 32、 58 :栓板 33、 59 :固定器 34、 60 :彈射栓 35、 61 :彈性零件 36、 52、62 :真空抽取通 道 37 :上動桿 38、63 ·•桿子 39 :安裝板 40 :擠壓桿 41 :隔熱材料 4 2 :加熱板 43 :加熱器 44、50 :模具板 45 :凹腔 46 :隔間密封材料 47 :瓶子 48 :樹脂板 5 1 :隔間空間 70A :上半邊模室 70B ··下半邊模室 70 :真空抽取模室 71、72、74、76 ··抽氣 π 73 :抽氣管[Description of main component symbols] 22, 38: Flexible hoses 22a, 38a: Lower end frames 22b, 38b: Flexible upper end frames I 〇: Pillars II: Fixing blocks 12: Upper molds 13 : Lower mold 14: Movable block 16: Ejection block 18: Connection part 19: Mounting plate 20: Piston 21: Rod 25: Connection mechanism 14 200531187 27 ········ 26, 28, 29, 30 ··· Connecting parts 31, 57: Containment space 32, 58: Bolt plates 33, 59: Fixtures 34, 60: Ejector bolts 35, 61: Elastic parts 36, 52, 62: Vacuum extraction channel 37: Upper moving rod 38, 63 Mounting plate 40: Extrusion rod 41: Insulation material 4 2: Heating plate 43: Heater 44, 50: Mold plate 45: Cavity 46: Compartment sealing material 47: Bottle 48: Resin plate 5 1: Compartment space 70A: upper half mold chamber 70B ... lower half mold chamber 70: vacuum extraction mold chambers 71, 72, 74, 76
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