1342390 24430pif.doc 九、發明說明： 【發明所屬之技術領域】 本發明是關於一種基板檢查裝置，特別是關於一種用 於基板檢查中的治具的探測器框（pr〇berframe)的更換， 適用於在LCD的製造時所利用的TFT陣列（a )檢杳 裝置。 〜 【先前技術】 作為將TFT (薄膜電晶體）呈陣列狀排列的構成，可 列舉液晶基板的例子，其在液晶顯示器等平 (FPD)等中使用。 时 利用TF T所構成的液晶顯示_基本構成是—種液晶 面板〃在幵/成有TF丁及透明像素（ 基板和形成有對向電極的另一玻璃基板之間流入1曰曰璃 TFT及透明像素電極的玻璃基板（以下稱作 查中’已知有一種藉由利用電子射線 狀而非接觸地對基板上的各透明像素的 仃*’疋的方法（例如參照專利文獻】在 對比度技術的TF丁踭列柃志壯^ 电土 藉由運送㈣衫^ ^查 =巾1㈣TFT基板可 &於魯:、+至内，亚在被配置於載臺上的狀態下施 欢、:號’且在此時檢測電壓狀態而進行丁F T陣列檢查。 足種丁FT陣列檢查裝置包括 子檢測器及數據處理⑦ 以生々— 人電 各透明像素照射f心t = A :源對TFT基板的 板的各透明像素ss 子檢測器對向TFT基 ”射电子射線所產生的二次電子進行檢 6 1342390 24430pif.do, 電子檢測器是根據二次電子的檢測量而向 數據處乙衣置（電腦系統等）輸 二次電子檢測帅對應的波形。數據處理裝置對 狀態，特別是透明號進行解析’並檢查透明像素的 基板檢查是藉由^陷或魏的内容。 檢查對象的基板，並阿一空的主室内的載臺上運送作為 和探測器框的各電权f該基板上載置探測器框，且使基板 查信號而進行。目接觸，以從探測器框向基板施加檢 圖15⑻〜15(d)為用 概略圖。基板檢查筆Γ說明基板檢查裝置的習知構成的 在主室102㈣入^ 101為了將作為檢查對象的基板30 (load lock)室1〇3。g，而與主室1〇2鄰接配置負載固定 如專利文獻2中有所』日^室和負載固定室的配置’在例 作為檢查對象的基 的面板的圖案的形狀 ，/、土反尺寸、在基板上所形成 等各規格有時並不〜二尺寸、在面板上所設置的電極配置 需要與各規格對應的各種規格的基板， 各種基板相對應的之絲重知、，心框°因此’要準備與這些 儲料器104中，且彳“彳:測态框，並預先儲存在探測器框 對象的基板相對應“框儲料器104中取出與檢查 在這裏，是藉由态框，導入到主室令。 料器104與主t】〇2^館^多個探測器框的探測器框儲 和主室102之間更換探配且，亚在探測器框儲料器】〇4 為框2〇,而將與檢查對象相稱的 2443Upif.doc 探測器框20向主室内進行導入。 另外，在負載固定室103中，可在與大氣側之間設置 門閥111，並在該負載固定室]和主室]〇2之間設置門 112另外，在主至】〇2和探測器框儲料器】之間設置門 閥】1)而且，在主至！〇2、負載固定室】内可設置用於 運送基板的運送機構，並在探測器框儲料器1〇4内設置用 於運送探測器框20的運送機構。 θ 15 ( a)〜圖15 ( d )所示為探測器框更換的動作例。 ^外加在這裏’所7^為將導人到主室内的探測器框，與在 扭測器框健料器内所儲存的其它的探測器框進行更換的例 子。圖15(a)所示為在主室]〇2内設置探測器框施，並 在探測器框儲料器104中儲存探測器框2〇卜2此的狀態。 —至〗02通系處於真空狀態，所以在向主室]〇2内導 入氮氣並形成大氣壓後，打開⑽113，使探測器框遍 罙測器儲料器叫圖15(b))。接著，使探測器框 健科益104移動’而使儲存有使用的探測器框爲的層和 2室】02側位置對合（圖ι5 (〇)。在使探測器框2卯移 到主室】02内後，關閉門閥】Π，然後將主室】02内抽 成真空而形成可檢查的狀態（圖15⑷）。 〔專利文獻I〕美國專利第5,982，]90號說明書 〔專利文獻2〕日本專利早期公開之特開 2002〜252155 么報（段落0017、〇〇〗8、圖〇 。。_^述構成為一種將儲存有探測器框的探測器框儲料 »。，人主至配置在同一平面上且並列設置的構成，所以存 24430pif.doc 在基板檢查裝置 面積的量之問題。 、曰大出h測裔樞儲料器的設置 【發明内容】 於志5 ’本發明的目的是提供-種解、Ή、+' 其藉由彻 的上部或主室的上:科器配置在負載固定室 框館料器之間進行探測器框的=该負載固定室和探測器 器框的更換簡單化。 ，、，而使對主室内的探測 本舍明的基板檢杳裝 r對基板施加檢-二為—齡真空狀 置，包括：主室，A丁基板核查的基板檢查裝 室，其在與大氣側的檢查;負載 f檢查信號的探測器框;而且，該電性接觸並施 探測器框儲料器配置在負載固定室置採用使其 如利用本發明的基板檢查裝置的; 測器框儲料器配置在負載; 能夠防止佔據面積的增大。知而使佔據面積增加， 該負上部配置探測器框儲料器的構成中， 疋至具有室的上方的開口部分，且在該開口部分 24430pif.doc 上開關自如地安裝有頂板。 在頂的上部設置有探測器框儲料器，另-方面， 此’該頂板起到負載固定室的m ::對輸框儲料器及運送機構進 機構=如3 料器及運送機構是利用升降 頂板上升而打開負_定室行上升動作，可使 器框錯料器的高度方向的位置量„，且猎由使探測 固定室中的探測器框被儲存^可進灯使導入到負載 固定室所取出的探：=儲存位置的選擇，及從負載 存位置的選擇。’、a 1在棟㈣框儲料器中被儲存的儲 機 構的升的頂板、探測器框儲料器及運送 :的:在負载固定;和== 框的更換。 蝻枓裔之間，進行探測器 的上:i有基板檢查裝置的第1形態，是在主室 探測_料=行:= 置對合，且選擇器框儲料器的高度方向的位 在n、框儲料器中進行健存的儲存位 1342390 24430pif.doc 置，而且，臨時保持從探測器框儲料器所取出的探測哭框， 且在此期間利用升降機構進行探測器框儲料器的#方向 的位置對合，並使頂板的下部所設置的運 : 與臨時置放部的高度相對合。 構的问度 如利用本發明的基板檢查裝置的第】形態，則 用於儲存探測器框的探測器框儲料器設置在負载^ & 上部，可減小佔據面積。另外，藉由使負載固定室的丁^板 和该頂板上所固定的探測器框儲料器及運送機構、、一 構而自如升降’可進行探測器框對負載固定室： =¥出，和探測雜對探測器框儲料器的儲存位置的^ 而且’藉由形成在主室上設置臨時置放部的形能 =和探測器框儲料器之間所進行的“二 本發明的基板檢查裝置的第2形態為-種在直t 下對基板施加檢查信號並進行基板檢查的基板檢查^恕 〇括主至，其在真空狀態下進行基板的檢查^ 出至大氣側之間及與主室之間進行基板的it ί杳==儲料器’其错存與基板進行電性接觸並施加 測器框儲料器配置在主㈣上部的構成。*用使私 如利用本發明的基板檢查裝置的第2形態的構 框儲料器配置在主室上的構成，所以探J °。王：續需的佔據面積可直接利用主室的佔據面積。、 1342390 24430pif.doc 因此’不會因探測器，料 佔據面積的增大。 據面積增加，能夠防止 上開關自如地安裝有頂板。。刀，且在該開口部分 在該頂板的下部安裝有用、 構。因此，該頂板起到負栽固定送探測器框的運送機 且起到對運送機構進行支 =口部分的蓋部的作用， 另外，頂板及運送檣^基底部分的作用。 藉由使該升降機構進行上升=用料機構而自如升降。 載固定室，形成一種使自恭 可使頂板上升而打開負 探測器框可搬出的狀態，、^室=由運送機構所支持的 方向的位置對合，可進行使^對‘測益框儲料器使高度 框被儲存的健存位置的選擇、到負糾定室中的探測器 測器框在探測器框儲料哭祐^負載固定室所取出的探 藉由利用該升降轉的儲存位置的選擇。 和在頂板上所安裝及運送機構的升降動作， 室和探測器框儲科器幾，的運送動作，可在負载固定 如利用本發日月的基板檢探測器框的更換。而且， 】形態的臨時置敌部，2形態’則可不需要第 之間進行探測器框的更換。、栽固定室和探測器框儲料器 如利用本發两的 '八 用於儲存探_樞土 置的第2形態，則藉由將 可減小佔據面積。、°°匡儲料器設置在主室的上部， 、另外，藉由使負戴固定室的頂极和運送 24430pif.doc 機構，利用一個升降機構而自如升降，可進行探測器框對 負載固定室的導入導出，和探測器框對探測器框儲料器的 儲存位置的選擇。 如利用本發明的基板檢查裝置的各形態，則是在負載 固定室和探測器框儲料器之間進行探測器框的更換，且探 測器框對主室的導入導出是在與負載固定室之間進行，所 以可使負載固定室為真空狀態，並在與主室之間進行探測 器框的更換。藉此，主室可在使室内保持真空狀態的情況 下，進行探測器框的更換。 另外，因為沒有必要返回大氣壓狀態，所以不需要為 了形成大氣壓狀態而停止電子搶等的電源，且不需要因停 止電源而再從初期狀態到驅動狀態所需的所謂熱機時間， 能夠防止檢查時間的長時間化。 如利用本發明的基板檢查裝置，則在基板檢查裝置 中，可防止因設置探測器框儲料器而導致的佔據面積的增 大。 為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 【實施方式】 以下，對本發明的實施形態參照圖示詳細地進行說 明。另外，作為基板檢查裝置的檢查對象的基板，除了液 晶基板等TFT基板以外，還可應用於有機EL的基板、半 導體基板等各種基板。 1^42390 24430pif.doc 二的形態利用圖1(a)、 進行說明。這裏，第切ϋ利用圖9⑷、9(b)〜圖14 載固定室的上部的^形悲為將探測器框儲料器配置在負 置在主室的上部:第2形態為將咖 裝置之第丨形態的概略說(=用：^月本發明的基板檢查 本發明的基板檢查震置的第^ 圖1 (a)所示為在 儲料器上升的狀態，圖:二：使頂板及探測器抵 料器下降的狀態。而且 為使頂板及探測器_ 器和臨時置放部之圖U)所不為在探測器框儲料 ⑻所示為在頂板^^了的探測馳的移動狀態，圖2 進行的探測器送機構和臨時置放部之間所 器框2二月:反(檢查裝置1_是在真空狀態下，利用探測 〇 ](a) ^σ^- 固定室3 ’其在與大氣側之間,包::負戟 板檢查的主室2之門〃在一工狀恶下進行基 料器4，其用一於儲丁基板的搬入搬出；探測器樞儲 主用於錯存對基板施加檢查信號的探測器框如。 如電子射绩^具空狀態下進行基板檢查的室部，包括例 電子檢測二二 =未圖示電子射線產生源、二次 14 24430pif.doc 對主室2内的載台（未進行圖示），通過負載固定室3 運送作為檢查對象的基板及探測器框20，並利用探測器框 20而對基板施加檢查信號，且從電子射線產生源照射電子 射線。利用電子射線的照射，而從基板發出與其電壓狀態 相對應的二次電子。二次電子檢測器對該二次電子進行檢 刺。因為二次電子量和電壓狀悲具有關聯性^所以從所檢 測的二次電子量求取電壓波形，並對所檢測的電壓波形， 和在正常狀態下施加檢查信號時所檢測到的電壓波形進行 比較。藉由比較該電壓波形，可進行基板的缺陷檢查。 負載固定室3除了在與大氣側之間以及在與主室2之 間，進行基板的負載及卸載以外，還在與主室2之間進行 探測器框的更換。這些基板及探測器框的室部間的移動， 可藉由在各室部中所設置的運送機構而進行。另外，在負 載固定室3和大氣側之間設置有第1門閥11，而且，在負 載固定室3和主室2之間設置有第2門閥12,且藉由控制 這些門閥的開關，而利用在各室部的真空抽吸或氮等的導 入以進行向大氣壓的壓力控制。 另外，在圖1(a)、1(b)、圖2(a)、2(b)所示的用於對主 室2及負載固定室3進行真空抽吸的真空泵等中，省略了 排氣機構或用於向各室部内導入氮氣以返回大氣壓的氣體 導入機構而未進行圖示。 探測器框儲料器4為用於儲存並支持多種探測器框20 的部分，並利用第2運送機構6而進行探測器框20的搬入 搬出。 1342390 24430pif.doc 定室在基板檢查裝置1中，是將主室2和負載固 产Π 1在同—平面上，並在負載固定室3的上部配置 ti ff料器4’且在主室2的上部配置臨時置放部8。 。％置放部δ是在負載固定室2和探 \之間，以探測器框20進行更換時，使探測 3于保持，並在該期間使探測器框儲料器4沿高度 而進行位置對合。 4本發明的負载固定室3的上端具有開口部，且 =巧3 a而自如開關。另外，在利用頂板3 a而關閉 負L二I;if開口部的情況T ’該7_頁板允作為關閉 ί探測器框錯料器4,另-方面，在頂板如的下 用於運祕g框2D㈣！運送機構 ==室3嶋下，— 上，且利__構（未被絲在頂板3a 仃圖不）而一體進行升降動作。 圖巧所示為利用升降機構（未進行圖示 圖1㈦所示為利用升降機構上升的狀態， 探測器框儲躺及第而使頂板知、 而關閉負載固定室3的狀態D €亚利用頂板3a 在圖1⑷所示的狀態下，頂板3a是利用未圖示的升 16 1342390 24430pif.doc 降機構而從負載固定室3脫離並上升，使負載固定室3打 開，且使在頂板3a的下部所設置的第〗運送機構5，於負 載固定室3的上方露出。另外，在負載固定室3内處於真 空狀悲的情況下，在使頂板3a上升之前，預先向負載固定 至3内導入氮氣等，使負載固定室3内的壓力形成大氣壓。1342390 24430pif.doc IX. Description of the Invention: [Technical Field] The present invention relates to a substrate inspection apparatus, and more particularly to a replacement of a detector frame (pr〇berframe) for a fixture used in substrate inspection, The TFT array (a) inspection device used in the manufacture of the LCD. [Prior Art] As a configuration in which TFTs (thin film transistors) are arranged in an array, a liquid crystal substrate can be cited, and it is used in a flat panel (FPD) or the like. In the case of TF T, the liquid crystal display is basically composed of a liquid crystal panel in which TF is formed and a transparent pixel is formed (a glass TFT is introduced between the substrate and another glass substrate on which the counter electrode is formed). A glass substrate of a transparent pixel electrode (hereinafter referred to as "Zhongzhong" is known as a method of contrasting each transparent pixel on a substrate by using an electron beam instead of a contact (for example, refer to the patent document) in contrast technology TF 踭 踭 踭 柃 壮 壮 ^ Electric ground by transport (four) shirt ^ ^ check = towel 1 (four) TFT substrate can be & Yu Lu:, + to the inside, Ya is placed on the stage in the state of the Huan,: 'And at this time, the voltage state is detected and the FT FT array inspection is performed. The FT FT array inspection device includes a sub-detector and data processing 7 to generate 々 - human electric transparent pixels illuminate f center t = A: source to TFT substrate Each transparent pixel ss sub-detector of the board detects the secondary electrons generated by the TFT-based "electron beam" 6 1342390 24430pif.do, and the electronic detector is placed on the data according to the detection quantity of the secondary electrons ( Computer system, etc.) The sub-detection corresponds to the waveform. The data processing device analyzes the state, especially the transparent number, and checks the substrate inspection of the transparent pixel by the content of the trap or Wei. The substrate of the object is inspected, and the main room of the empty space is loaded. The detectors are placed on the substrate as the powers of the detector frame, and the detector frame is placed on the substrate, and the substrate is inspected for signal. The contact is applied to the substrate from the detector frame to the substrate 15(8)-1515(d). A schematic view of the substrate inspection pen is described in the main chamber 102 (four) in the conventional configuration of the substrate inspection device. In order to connect the substrate 30 (load lock) chamber 1〇3.g to be inspected, it is adjacent to the main chamber 1〇2. The arrangement of the load is fixed as described in Patent Document 2, and the arrangement of the panel and the load-fixing chamber is the shape of the pattern of the panel to be inspected, and the size of the soil is reversed and formed on the substrate. When the electrode arrangement is not two sizes, the electrode arrangement provided on the panel requires various specifications of the substrate corresponding to each specification, and the respective substrates correspond to the wire, and the core frame is thus prepared to be prepared with these stockers 104. in,彳 “彳: Measure the frame and pre-stored in the base of the detector frame object corresponding to the “frame hopper 104 to take out and check here, is by the state frame, imported into the main chamber order. hopper 104 and the main t】〇2^馆^The detector frame of multiple detector frames is replaced with the main chamber 102, and the sub-detector frame hopper 〇4 is box 2〇, and will be commensurate with the inspection object The 2443Upif.doc probe frame 20 is introduced into the main chamber. Further, in the load fixing chamber 103, a gate valve 111 may be provided between the load fixing chamber 103 and the load fixing chamber] and the main chamber] 〇2. In addition, the door 112 is provided between the main to the 〇2 and the detector frame hopper] 1) and, in the main to! 〇2, load-fixing chamber] A transport mechanism for transporting the substrate may be provided, and a transport mechanism for transporting the probe frame 20 may be provided in the probe frame hopper 1〇4. θ 15 ( a) to 15 ( d ) show an example of the operation of replacing the probe frame. ^Additional here is an example of a detector frame that will be guided to the main chamber and replaced with other detector frames stored in the torso frame. Fig. 15(a) shows a state in which the detector frame is placed in the main chamber 〇2, and the detector frame 2 is stored in the detector frame hopper 104. - To - 02 is in a vacuum state, so after introducing nitrogen into the main chamber 〇2 and forming atmospheric pressure, open (10) 113, so that the detector frame is over the detector hopper (Fig. 15(b)). Next, move the detector frame Jiankei 104 to 'the layer where the detector frame stored is used and the 2 room 02 side position (Fig. ι5 (〇). Move the detector frame 2 to the main After the valve 02 is closed, the door valve is closed, and then the main chamber 02 is evacuated to form an inspectable state (Fig. 15 (4)). [Patent Document 1] U.S. Patent No. 5,982,] No. 90 [Patent Document 2] 〕 Japanese patent early disclosure of the special opening 2002~252155 report (paragraph 0017, 〇〇 〗 8, 〇 〇 。 。 。 。 。 。 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 述 探测器 探测器 探测器 探测器 探测器 探测器 探测器 探测器 探测器 探测器 探测器 探测器 探测器 探测器The configuration is arranged on the same plane and arranged side by side, so the problem of the amount of the area of the substrate inspection device is stored in 24430pif.doc. The setting of the stalk storage device of the 测 出 【 【 发明 发明 发明 ' ' ' ' ' ' ' The purpose is to provide - solution, Ή, +' by means of the upper part of the upper or main chamber: the configuration of the detector between the load-fixing room frame finder = the load fixed room and the detector The replacement of the frame is simplified, and the base of the detection of the main room is made. The board inspection armor r applies the inspection to the substrate - the second is an age-old vacuum, including: the main chamber, the substrate inspection chamber of the A butyl plate check, the inspection on the atmosphere side; the detector frame of the load f check signal; Moreover, the electrical contact and detector frame hopper are disposed in the load fixing chamber such that the substrate inspection device of the present invention is used; the detector frame hopper is disposed at the load; and the occupation area can be prevented from increasing In order to increase the occupied area, the negative upper portion of the detector frame hopper is configured to have an opening portion above the chamber, and a top plate is detachably mounted on the opening portion 24430pif.doc. The upper part is provided with a detector frame hopper, and the other side, this 'the top plate serves as a load-fixing chamber m :: on the frame hopper and the transport mechanism into the mechanism = such as 3 feeders and transport mechanisms are used to lift The top plate rises and opens the negative-fixed chamber row ascending action, which can make the position of the height direction of the frame erector „, and the finder is used to make the detector frame in the detection fixed room be stored. The probe taken out of the room:= Selection of storage location, and selection from load storage location. ', a 1 in the ridge (four) frame hopper is stored in the storage of the lifting plate, detector frame hopper and transport:: fixed in the load; And the replacement of the == box. Between the descendants, the top of the detector: i has the first form of the substrate inspection device, which is in the main room detection _ material = line: = set, and the selector box is stocked The position of the height direction of the device is set in the storage bin 1342390 24430pif.doc in n, the frame hopper, and the detection crying frame taken out from the detector frame hopper is temporarily held, and the lifting frame is used during this period. The mechanism performs the positional alignment of the detector frame hopper in the # direction, and the operation of the lower portion of the top plate is matched with the height of the temporary placement portion. The degree of construction is as follows. According to the first aspect of the substrate inspection apparatus of the present invention, the detector frame hopper for storing the detector frame is disposed at the upper portion of the load, and the occupied area can be reduced. In addition, the detector frame to the load fixing chamber can be performed by making the dam plate of the load fixing chamber and the detector frame hopper and the transport mechanism fixed on the top plate freely movable. And detecting the storage position of the detector frame hopper and the "two inventions formed by forming a temporary placement portion on the main chamber = and the detector frame hopper" The second aspect of the substrate inspection apparatus is a substrate inspection in which an inspection signal is applied to the substrate under straight t and the substrate inspection is performed, and the substrate is inspected in a vacuum state to the atmosphere side and The substrate between the main chamber and the main chamber is 杳 = 储 储 其 错 错 ' ' ' ' ' ' ' ' ' ' ' 储 储 储 储 储 储 储 储 储 储 储 储 储 储 储 储 储 储 储 储 储 储 储 = = = = = The frame hopper of the second aspect of the substrate inspection device is arranged on the main chamber, so the J °. Wang: The required occupied area can directly utilize the occupied area of the main chamber., 1342390 24430pif.doc Therefore' It will not increase the area occupied by the material due to the detector. The area is increased to prevent the upper switch from being freely mounted with a top plate. The knives are mounted on the lower portion of the top plate in a useful manner. Therefore, the top plate serves as a conveyor for supporting the fixed detector frame and plays The conveying mechanism performs the function of the cover portion of the branch portion, and the top plate and the base portion of the transporting mechanism. The lifting mechanism is raised and lowered by the material feeding mechanism to move up and down. Congratulations that the top plate can be raised to open the state in which the negative detector frame can be moved out, and the room can be moved in the direction supported by the transport mechanism, so that the height of the frame can be saved. The selection of the storage position, the detector detector frame in the negative correction chamber is stored in the detector frame, and the probe taken out of the load fixing chamber is selected by the storage position using the lifting and lowering. The lifting operation of the installation and transport mechanism, the transport operation of the chamber and the detector frame storage device, can be fixed in the load, such as the replacement of the substrate inspection detector frame using the date of the transmission. Moreover, the form of the The enemy part, 2 forms 'can not need to replace the detector frame between the first. The planting fixed room and the detector frame hopper, such as the use of the two of the 'eight for storage probe _ pivoting the second The shape is obtained by reducing the occupied area. The 匡 stocker is disposed at the upper portion of the main chamber, and in addition, by using the pedestal of the negative fixed chamber and transporting the 24430pif.doc mechanism, a lifting mechanism is utilized. And freely lifting, the introduction and derivation of the detector frame to the load fixing chamber, and the selection of the storage position of the detector frame to the detector frame hopper. If various forms of the substrate inspection device of the present invention are used, the load is The replacement of the detector frame between the fixed chamber and the detector frame hopper, and the introduction and the derivation of the detector frame to the main chamber are performed between the load and the fixed chamber, so that the load fixing chamber can be in a vacuum state, and Replace the detector frame with the main room. Thereby, the main chamber can be replaced with the detector frame while keeping the chamber in a vacuum state. Further, since it is not necessary to return to the atmospheric pressure state, it is not necessary to stop the power supply such as the electronic grab in order to form the atmospheric pressure state, and it is not necessary to perform the so-called heat engine time required from the initial state to the drive state by stopping the power supply, and it is possible to prevent the inspection time. Long time. According to the substrate inspecting apparatus of the present invention, in the substrate inspecting apparatus, an increase in the occupied area due to the provision of the detector frame stocker can be prevented. The above and other objects, features and advantages of the present invention will become more <RTIgt; [Embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition to the TFT substrate such as a liquid crystal substrate, the substrate to be inspected by the substrate inspection device can be applied to various substrates such as an organic EL substrate or a semiconductor substrate. The shape of 1^42390 24430pif.doc 2 will be described using FIG. 1(a). Here, the second cutting is performed by using the upper part of the fixing chamber in FIGS. 9(4) and 9(b) to FIG. 14 to arrange the detector frame hopper in the upper portion of the main chamber: the second form is the coffee machine. Outline of the third aspect (=: Use: ^ month) The substrate inspection of the present invention is shown in Fig. 1 (a) of the substrate inspection of the present invention, and the state in which the stocker is raised is shown in Fig. 2: And the state in which the detector is lowered, and in order to make the top plate and the detector _ and the temporary placement part U) not shown in the detector frame storage (8) is the detection of the top plate Moving state, the frame between the detector feeding mechanism and the temporary placement part in Fig. 2 is February 2: reverse (inspection device 1_ is under vacuum, using detection 〇) (a) ^σ^- fixed room 3 'between and the atmosphere side, the package:: the threshold of the main chamber 2 of the negative slab inspection, the hopper 4 is carried out under a work condition, and the hopper plate is moved in and out; the detector pivot The storage device is used for the detector frame in which the inspection signal is applied to the substrate. For example, the chamber portion where the substrate inspection is performed in the state of the electronic projections, including the electronic detection of the second or second The electron beam generating source and the secondary 14 24430 pif.doc are placed on the stage (not shown) in the main chamber 2, and the substrate and the detector frame 20 to be inspected are transported through the load fixing chamber 3, and the detector frame is used. 20, an inspection signal is applied to the substrate, and the electron beam is irradiated from the electron beam generating source. By the irradiation of the electron beam, secondary electrons corresponding to the voltage state thereof are emitted from the substrate. The secondary electron detector checks the secondary electron. Because the secondary electron quantity and the voltage-like sorrow have correlations, the voltage waveform is obtained from the detected secondary electron quantity, and the detected voltage waveform and the detected signal are applied when the inspection signal is applied under normal conditions. The voltage waveforms are compared. By comparing the voltage waveforms, the defects of the substrate can be inspected. The load-fixing chamber 3 is loaded and unloaded between the ground and the main chamber 2, and is also loaded and unloaded. The replacement of the detector frame is performed between the main chambers 2. The movement between the substrates and the chamber portions of the detector frame can be performed by a transport mechanism provided in each of the chamber portions. Further, the first gate valve 11 is provided between the load fixing chamber 3 and the atmosphere side, and the second gate valve 12 is provided between the load fixing chamber 3 and the main chamber 2, and is controlled by controlling the switches of the gate valves. Vacuum suction or introduction of nitrogen or the like in each chamber portion to control the pressure to the atmospheric pressure. Further, it is used in Figs. 1(a), 1(b), 2(a), 2(b). In the vacuum pump or the like that evacuates the main chamber 2 and the load-fixing chamber 3, the exhaust mechanism or the gas introduction mechanism for introducing nitrogen gas into each chamber portion to return to the atmospheric pressure is omitted, and the illustration is not shown. The device 4 is a portion for storing and supporting the plurality of detector frames 20, and carries on and off the probe frame 20 by the second transport mechanism 6. 1342390 24430pif.doc The chamber is in the substrate inspection device 1, and the main chamber is 2 and the load-fixing crucible 1 is disposed on the same plane, and the tidy feeder 4' is disposed on the upper portion of the load-fixing chamber 3, and the temporary placement portion 8 is disposed on the upper portion of the main chamber 2. . The % placement portion δ is between the load fixed chamber 2 and the probe, and when the probe frame 20 is replaced, the probe 3 is held, and during this period, the probe frame hopper 4 is positioned at a height. Hehe. 4 The upper end of the load-fixing chamber 3 of the present invention has an opening portion, and is freely switchable. In addition, in the case of using the top plate 3 a to close the negative L II I; if the opening portion T 'the 7_ page plate is allowed to be closed ί detector frame erector 4, and the other side is used for transporting under the top plate Secret g box 2D (four)! The transport mechanism == chamber 3 ,, - up, and the __ structure (not the wire is not shown in the top plate 3a) and the lifting operation is integrated. The figure shows the state in which the lifting mechanism is used (the state in which the lifting mechanism is raised as shown in Fig. 1 (7), the detector frame is stored, and the top plate is closed, and the load fixing chamber 3 is closed. 3a In the state shown in Fig. 1 (4), the top plate 3a is detached from the load fixing chamber 3 by a rising 16 1342390 24430pif.doc lowering mechanism (not shown), and the load fixing chamber 3 is opened, and is placed in the lower portion of the top plate 3a. The first transport mechanism 5 is exposed above the load-fixing chamber 3. Further, when the load-fixing chamber 3 is in a vacuum, the nitrogen is introduced into the load before the top plate 3a is raised. Etc., the pressure in the load holding chamber 3 is made to form an atmospheric pressure.
而且，利用頂板3a的上升，第丨運送機構5形成一種 在負載固疋室3的上方位置露出的狀態，藉此，可將探測 器框20在負載固定室3内和大氣侧之間進行搬入搬出。Further, by the rise of the top plate 3a, the second transport mechanism 5 is in a state of being exposed at a position above the load fixing chamber 3, whereby the probe frame 20 can be carried in between the load fixed chamber 3 and the atmosphere side. Move out.
另一方面，在圖1 (b)所示的狀態下，頂板3a是利用 未圖示的升降機構下降，益與負載固定室3的上端開口部 抵接而關閉負載固定室3，且將在頂板3a的下部所設置的 第1運送機構5導人到負載固定室3内。在使該頂板^ 下降而關閉負載固定室3後，藉由對負載固定室3内進行 真空排氣以形成真空狀態，並打開第2門閥12，可在與真 空狀態的主室2之間進行探測器框2〇 @更換。另外，運送 機構可利用例如滾子運送機構。 圖2 (a)所示為在探測器框儲料器和臨時置放部之間 所進行的探測器框的移動狀態。在圖2⑷中，是利 降機構（未進行圖示）而使第〗升降機構 升降，並使第1運送機構5的古谇办+― ^ 的同度，與主室2上所配置的 臨時置放部8在高度方面相斟入 门又乃曲相對合。另外，臨時置放部8可 具有用於使探測為桓移動的第3運送機構。 置放部8的高度對合， 向臨時置放部8，或者 藉由使該第1運送機構5和臨時 可使探測器框20從第]運送機構5 24430pif.doc 24430pif.doc 運送機構5進行移動。另外， 圖示的控制裝置對升降機構實施 相反地從臨時置敌部 該高度對合可 控制而進行。 $ 圖2 (b)所示 放部之間所進行_ 所設置的運送機構和臨時置 在圖2 (b)巾，θ°°框的移動狀態。 與頂板3卜細 $ _升降機構使朗器框儲料器* 度，與主室2上所配框儲料器4的規定層的高 外，所說的探夠器框斗J置放部8的高度相對合。另 框儲料器4所鱗 ^ 4的規定層，在例如從探測器 探測器框的情况 木測器框中選擇取出基板檢查所用的 在使基板檢查所儲存鋪測11框的層，另-方面， 並返回到_器框心=框從負載固定室3進行移動， 所返回的探㈣框健二層的情況下’是該探測器拖2。 的高==:=4的規定層和臨時置放心 層向臨時置放立《 從探測器框儲料^的規定 框健料者相反地從臨時置放部8向探測器 也可二的規疋層進行移動。另外，關於該高度對合， 利用未圖示的控制裝置而對升降機構進行控制。^ ,j用圖3(a)〜3(C)〜圖6(a)、6(b)的動作圖 及圖7、圖8的流程圖進行說明。 ΰ a另外’在這裏，是對主室2處於真空狀態，負栽固 至3處於大氣壓狀態’並將在主室2中所使用的探測器框 1342390 24430pif.doc f在探測器框錯料器令所儲存的其它探測 動作加以說明。在圖示的例子令，是將從：室=換的 探測器框作為探測器框20a (圖中的里^2所取出的 的探測器㈣為探測器框應7圖：::)部= 首先’在圖3 (a)巾，對負載固定 (S”，並打開主室2 二丁 ：排氣 Φ J不使主至2返回大桌厭，+ h 简 測器㈣移動到負載固定L。而將主至2中所使用的探 接著，在圖3 (b)中，向負載固定室 形f大氣璧後⑼，使負載固定室3的一頂板3aJi =並 使第1運廷機構5的高度與臨時置 的 = 7的高度對合（S6)。 ㈣3運适機構 ，圖3 (c)中’利用第】運送機構5 7，使^測器框2〇a移動到臨時置放部8 (S7)。、域構 位置（M j 亚使探測器框儲料器4的空閒 時，乂:：的向度與臨時置放部8的高度相對合。此 態^讀加形成一種在臨時置放部8上被保持的狀 谨6在f 4⑴f ’是利用第3運送機構7及第2運逆栌 構6 ’使叫置放部8上所保持的探測器框咖移動= 19 24430pif.doc :則框儲料器4的空閒位置（空間層）。藉此，將使用的探 測為框20a收納在探測器框儲料器4中（沾）。 在圖4 (c)中，是利用升降機構使探測器 用於儲存接著要使用的探測器框鳥的層與^ τ置放。卩8的高度對合（S]0)。 ’在圖5⑷中，利用第2運送機構6及第3運 部8 (sn)使接者要使用的探測器框鳥移動到臨時置放 二ΐ:第^^料器4升降(在圖5(b) 的高度對合。二 S上被保持的狀態（s】2)。.开4齡_置放部 dr Z圖5 (c)中’利用第3運送機構7，使下一探測哭 框鳥從臨時置放部移動到第！運送機構5 (S13) 接者’在圖6(a)中，你备丧㈤― 將下一探測器框20b導入到負葡=的頂板3a下降， 器框20b是在由第〗運逆機楢疋至3内。此時，探測 入⑸4)。 ^機構5被保持的狀態下而進行導 在圖6(b)中’是在利用了音故^曰曰 對負載峡室3内進行真空^=^載_3後， 的動⑽），然後，打開第2、 g至2内形成相同 框20b移動到主室2内， 1 ；^12 (S16)’使探測器 上(s 17 )，且關閉第2門閥】二:置t於裁臺上的基板 更換了的探測器框細進行基板檢查 20 24430pif.doc (S18)。 下m用其它的探測器框進行基板檢查的情況 二的動作，可取代主室内所設置的探 探測器框刪中所儲存的其它的探 ，則為框，亚利用更換了的其它的探測器框進行基板檢杳。 〜另外’當更換作為檢查對象的基板時，是在使負載固 的頂板3aT降而關閉負載固^室，且關閉第1門閥 二真空排氣’並打開第2門閥12而將基板 二二=載固定室3側移動且取出，並關閉第2門 W使負載固定室3内形成大氣壓，且打開第】門 閥η而將基板3〇向外部輪入取出。 ^著，將作為新的檢查縣的基板從^關u導入 内f二定室3内，並關閉第]門閥u，且對負載固定室 1=1真空排氣，並打開第2門閥⑴將導人到負載固 2門:;基?板再導入到主室2内並載置在載臺上，且關 —Λ 。利用上述動作，可在主室2内更換基板。 接者’對本發明的基板檢查裝置的第2形態進行說明。 9(b)、目10⑷、10(b)為用於說明的本發明的基板 置的第2形態之概略說明圖。另外，圖9(a)所示 ㈣“ t發明的基板檢查裝置的第2形態中的，使頂板上升 〔圖9_(b)所示為使頂板下降的狀態。而且，圖1〇 η战匕)所示為在揼測器框儲料器和頂板3a上設置的運 达化構之間所進行的探·㈣移動狀態。 第2形怨中的基板檢查裝置的構成，與利用圖】⑻、 1342390 30pif.doc Ζ、。圖2(a)、2(b)所說明的第丨形態相同’所以這裡省略 二是將主。和負載 器框儲料器4。另外，在第2开/^f室/的上部配置探測 設置的第1運送機槿·，疋利用頂板3a上所 _ 、摘1構而在與探測器框儲料哭夕ph- ::r°的更換，，可不需要第】卿 部二:=定室3在上端具有開，且· _載^=:::=下’該頂板3a是作為 Arr 现〇丨而發揮作用。在該頂部3a沾it ^設置有用於運送探測器框2〇的第構外 在頂板33關閉負載固定室 ^㈣）另外， :㈣室3内。在頂板;a的下;所 =二升：構(未進行圖示)，一 圖9 (a)所示為利用升降機構（未進行圖示 i = )使頂板％及第】運送機構5下降， 亚利用頂板3a而關閉負载㈣室3的狀態。 她技在圖9 ( 3 )所不的狀態申’頂板3a利用未圖示的升降 =而從負載固定室3稅離並上升，使負載固定室^: 使在頂板知的下部所設置的苐I運送機構5，於負載固 22 1342390 24430pif.doc =室^的上方露出。料，在負_定室3喊於真空狀 恶f L：在使頂板33上升之前，預先向負載固定室3 内V入氮氣等，使負載固定室3内的麼力形成大氣愿。 产且利用頂板3a的上升，第1運送機構5形成一種 tit固/Λ3的上方位置露出的狀態，藉此，可將探測 -王 負載㈣室3内和大氣侧之間進行搬入搬出。 另方面’在圖9⑻所示的狀態下，頂板％是利用 未圖示的升降機構下降，並與 载固定室3,且將在頂板3a的下部= 二=導入到負载固定室3内。在使該細 =而關閉負载固定室3後，藉由對負個以3内進行 以形成真空狀態，並打開第2門閥12，可在與真 :槿=:室2之間進行探測器框2〇的更換。另外，運送 機構可利用例如滾子運送機構。 ^ma)所示為在頂板％上所設置㈣1運送機構 態。=儲料ί Λ之間所進行的探測器框的移動狀 使第i ’是利用升降機構（未進行圖示）而 5的高产，牛盘p M頂板3a_"起升降，並使第1運送機構 声在：ί方:/21所配置的探測器框儲料器4的規定 二在:度方面相對合。另外’探測器框儲料器 ;使楝測器框移動的第2運送機構6。 ’、 藉由使該第！運送機構5和探測器框儲料界 探測^12W 1運送機構5向探測 U的規定層，或者相反地從探測器框儲料器* 23 1342390 24430pif.doc =層向苐】運送機構 可措由利用法 另外，該高度對合 行。 圖不的控制裝置對升降機構實施控制而進 圖】〇 ( h、 _ 與探測器框•料運送機構5 器框的移動狀態。 θ仃位ι對合之探測On the other hand, in the state shown in FIG. 1(b), the top plate 3a is lowered by a lifting mechanism (not shown), and the upper end opening of the load-fixing chamber 3 is brought into contact with the upper end opening portion to close the load fixing chamber 3, and will be closed. The first transport mechanism 5 provided at the lower portion of the top plate 3a is guided into the load fixed chamber 3. After the top plate is lowered to close the load-fixing chamber 3, the inside of the load-fixing chamber 3 is evacuated to form a vacuum state, and the second gate valve 12 is opened, which can be performed between the main chamber 2 and the vacuum chamber. Detector frame 2〇@replace. Further, the transport mechanism can utilize, for example, a roller transport mechanism. Figure 2 (a) shows the movement of the detector frame between the detector frame hopper and the temporary placement section. In Fig. 2 (4), the lower elevating mechanism (not shown) raises and lowers the elevating mechanism, and makes the same degree of the first transport mechanism 5 and the same degree as that of the main room 2 The placement portion 8 is relatively close to each other in terms of height. Further, the temporary placement portion 8 may have a third transport mechanism for causing the detection to move. The height of the placement unit 8 is aligned, and the temporary placement unit 8 is provided, or the first transport mechanism 5 and the probe holder 20 are temporarily allowed to be transported from the first transport mechanism 5 24430pif.doc 24430pif.doc. mobile. Further, the control device shown in the figure performs the control of the elevating mechanism on the contrary, and the height is controlled from the temporary enemy. $ Figure 2 (b) shows the transport mechanism set between the ejector and the movement of the θ°° frame in Figure 2 (b). With the top plate 3, the _ lifting mechanism makes the sturdy frame hopper * degree, and the height of the specified layer of the frame hopper 4 on the main chamber 2, the finder frame The height of 8 is opposite. The specified layer of the scale 4 of the hopper 4 is selected, for example, from the case of the detector detector frame, and the layer for checking the substrate for the inspection of the substrate is selected for the substrate inspection. Aspect, and return to the _box frame = the frame moves from the load fixed chamber 3, and the returned probe (four) box is in the case of the second layer 'is the probe drag 2'. The prescribed layer of the high ==:=4 and the temporary placement of the relief layer are placed in a temporary position. The prescription of the material from the detector frame is opposite to that of the temporary placement part 8 to the detector. The layer moves. Further, regarding the height matching, the elevating mechanism is controlled by a control device (not shown). ^, j will be described with reference to the operation diagrams of Figs. 3(a) to 3(C) to Figs. 6(a) and 6(b) and the flowcharts of Figs. 7 and 8. ΰ a additionally 'here, the main chamber 2 is in a vacuum state, the negative is fixed to 3 at atmospheric pressure' and the detector frame 1342390 24430pif.doc f used in the main chamber 2 is in the detector frame errone Let other stored detection actions be described. In the illustrated example, the detector frame from the room=change is used as the detector frame 20a (the detector (4) taken out from the inside of the figure (4) is the detector frame should be 7:::) part = First of all 'in Figure 3 (a) towel, fixed load (S), and open the main room 2 dibutyl: exhaust Φ J does not return the main to 2 large table, + h simple detector (four) moved to the load fixed L The probe used in the main to the second, in Fig. 3 (b), after the atmosphere is fixed to the load-fixing chamber (9), a top plate 3aJi of the load-fixing chamber 3 is made and the first transport mechanism 5 is The height of the height is matched with the height of the temporarily placed = 7 (S6). (4) The 3-transport mechanism, and the 'Using the first】 transport mechanism 5, in Figure 3 (c), moves the detector frame 2〇a to the temporary placement unit. 8 (S7). The position of the domain structure (M j is made when the detector frame hopper 4 is idle, the dimension of 乂:: is opposite to the height of the temporary placement portion 8. This state is read and added to form a kind of The state in which the temporary placement portion 8 is held 6 is f 4 (1) f ' is the movement of the detector frame held by the third placement mechanism 7 and the second transport mechanism 6' to be held on the call placement portion 8 = 19 24430pif .doc : the idle of the box hopper 4 The space layer is used. Thereby, the probe to be used is housed in the detector frame hopper 4 (dip). In Fig. 4 (c), the detector is used for storage and then used. The layer of the detector frame bird is placed with ^ τ. The height of 卩 8 is aligned (S] 0). In Figure 5 (4), the second transport mechanism 6 and the third transport unit 8 (sn) are used to make the receiver The detector frame used by the bird moves to the temporary placement of the second cymbal: the fourth hopper 4 is raised and lowered (the height is matched in Fig. 5(b). The state is maintained on the second S (s) 2). _ Placement unit dr ZFig. 5 (c) "Using the third transport mechanism 7 to move the next detection crying frame bird from the temporary placement portion to the first delivery mechanism 5 (S13) Receiver' in Fig. 6 (a In the middle, you are prepared to mourn (5) - the next detector frame 20b is introduced to the top plate 3a of the negative lorry = 3a, and the frame 20b is traversed by the ninth retort to 3. In this case, (5) 4) is detected. ^In the state in which the mechanism 5 is held, it is guided in Fig. 6(b), which is the movement (10) after the vacuum ^^^load_3 is applied to the load chamber 3 by the sound, and then , open the second, g to 2 to form the same box 20b to move to the main room 2, 1 ; ^12 (S16) 'Make the detector (s 17 ), and close the 2nd gate valve】 2: Set the substrate on the cutting board to replace the detector frame to perform the substrate inspection 20 24430pif.doc (S18). The operation of the second case in which the substrate inspection is performed by another detector frame can replace the other probes stored in the probe frame set in the main chamber, and the frame is used. The other detector frame performs the substrate inspection. ~ In addition, when the substrate to be inspected is replaced, the load-fixed top plate 3aT is lowered to close the load fixing chamber, and the first valve is closed and the vacuum is turned off and opened. The second gate valve 12 moves the substrate 2 to the fixed chamber 3 side and takes it out, closes the second door W to form an atmospheric pressure in the load-fixing chamber 3, opens the first gate valve η, and turns the substrate 3 to the outside. . ^, the substrate of the new inspection county is introduced from the inside of the inside of the second chamber 3, and the first door valve u is closed, and the load is fixed to the load chamber 1 = 1 and the second valve (1) is opened. The guide is connected to the load-fixing 2 door: the base plate is then introduced into the main chamber 2 and placed on the stage, and is closed. With the above operation, the substrate can be replaced in the main chamber 2. The second embodiment of the substrate inspection apparatus of the present invention will be described. 9(b), 10(4), and 10(b) are schematic explanatory views of a second embodiment of the substrate of the present invention to be described. In addition, in the second aspect of the substrate inspection device of the invention of FIG. 9 (a), the top plate is raised (Fig. 9 (b) shows a state in which the top plate is lowered. Moreover, Fig. 1 匕 匕) shows the probe (four) movement state between the detector frame hopper and the top plate 3a. The structure of the substrate inspection device in the second form of complaints, and the use of the figure (8) , 1342390 30pif.doc Ζ, Fig. 2 (a), 2 (b) described in the same form of the first 所以 ' so the second is omitted here is the main. and the loader frame hopper 4. In addition, in the second open / The first conveyor 探测·, which is located in the upper part of the ^f room/, is replaced by the _ and the 1st structure on the top plate 3a, and the ph-:r° is replaced with the detector frame. The first part of the second part: = the fixed chamber 3 has an open at the upper end, and · _ loading ^ =::: = lower 'the top plate 3a is used as the Arr now. The top 3a is set with the ^ ^ set for The outer frame 33 of the transport detector frame 2 is closed to close the load fixing chamber ^ (4)), (4) inside the chamber 3. Under the top plate; a; = 2 liters: structure (not shown), Figure 9 (a) is shown The top plate % and the first conveying mechanism 5 are lowered by a lifting mechanism (not shown in the figure i = ), and the state of the load (4) chamber 3 is closed by the top plate 3a. The technique is applied to the top plate in the state of Fig. 9 (3). 3a is taxed and raised from the load-fixing chamber 3 by the lift-down = not shown, and the load-fixing chamber is made: the 苐I transport mechanism 5 provided in the lower part of the top plate is placed on the load 22 1342390 24430pif.doc = room The upper part of the ^ is exposed. In the negative chamber 3, it is called a vacuum. F L: Before the top plate 33 is raised, nitrogen gas or the like is introduced into the load-fixing chamber 3 in advance, so that the force in the load-fixing chamber 3 is formed. At the same time, the first transport mechanism 5 is in a state in which the upper position of the tit solid/Λ3 is exposed, and the inside of the probe-wang load (four) chamber 3 and the atmosphere side can be carried in and out. On the other hand, in the state shown in Fig. 9 (8), the top plate % is lowered by the elevating mechanism (not shown), and is introduced into the load-fixing chamber 3 with the load-fixing chamber 3 and the lower portion of the top plate 3a = two. After the load is fixed to the load-fixing chamber 3, the negative one is performed within 3 When the vacuum state is formed and the second gate valve 12 is opened, the detection of the probe frame 2〇 can be performed between the true and the 槿=: the chamber 2. Further, the transport mechanism can utilize, for example, a roller transport mechanism. (4) 1 transport mechanism state is set on the top plate %. = The movement of the detector frame between the stocks ί 使 makes the i's use the lifting mechanism (not shown) and the high yield of 5, the tray p M The top plate 3a_" lifts up and down, and makes the first transport mechanism sound: ί方: /21 is configured in the detector frame hopper 4 in accordance with the degree: degrees. Further, the "detector frame stocker" is a second transport mechanism 6 that moves the detector frame. ‘, by making the first! The transport mechanism 5 and the detector frame storage boundary detection ^12W 1 transport mechanism 5 to the specified layer of the probe U, or conversely from the detector frame hopper * 23 1342390 24430pif.doc = layer to the transport mechanism can be used In addition, the height is combined. The control device of the figure does not control the lifting mechanism. Figure 〇 (h, _ and the moving state of the frame of the detector frame and material transport mechanism. 仃 仃 ι ι
與:3】:=Γ、是：糖構使第I運送機構5 層的高度進行對：的其它的規定 定層，在例如從探測心儲錯料器4的規 擇取出美叔认太 抖所儲存的探測器框中選 器框的ί，^：：^的f則器框的情況下，為儲存該探測 載固定室Π ^ 基板檢查所用的探測器框從負 下^丁1 夕動，並返回到探測器框儲料哭4的情況 下’ ^探測器框20所返回的探測器框儲料器;的廣。And: 3]: = Γ, is: the sugar structure makes the height of the fifth layer of the first transport mechanism pair: the other predetermined layer, for example, from the detection of the heart erroneous device 4 In the case of the ί, ^::^ f of the selected detector frame, in order to store the detection load fixed chamber Π ^ The detector frame used for the substrate inspection is from the negative And return to the detector box to store the material crying in the case of '^ detector box 20 returned by the detector frame hopper; wide.
错由該探測器框儲料器4的規定層和第】運送機構5 芦向^可使知、測器框2〇從探測器框儲料器4的規定 mi，機構5，或者相反地從第1運送機構5向探 ^框儲料器4的規定層進行移動。另外，關於該高度對 。’也可利用未圖示的控制裝置而對升降機構進行控制。 下面’在第2形態的基板檢查裝置1中，對探測器櫂 的移動動作例子，利用圖u(a)〜u⑹〜圖13的動作圖及圖 的流程圖進行說明。 ^另外，在這裏，是對主室2處於真空狀態，負載固定 至处於大氣壓狀態，並將在主室2中所使用的探測器榣 24 1342390 24430pif.doc 與在探測器框儲料器中所儲存的其它探測器框進行更換的 ，作以說明。在圖示的例子_，是將Μ室〕所取出的 奴測為框作為探測器框遍（圖中的黑色部分所示），將所 ^奐的探·框作為探卿框勘（財的花紋部分所 百先，，在圖！] (a)尹，對負載固定室3進行真空排 (s:)):?，室2和負載固定室3之間的第2門閥^ ，使㈣為框2 〇 a從主室2向負載固定室 (=)，且關閉第2門間12叫利用這些切〜二 動1 ’可不使主室2返回大氣麼，而將主室2中所使用 的知、測裔框2〇a移動到負載固定室3。 接著，在圖]1 (b)中，向負載固定 =壓後⑽)，使負載固定室3_二= t探㈣框儲料器4的空閒位置 閒廣）之弟2運域構6的高度對合（s26)。 在圖丨Uc)中，利用第1運送機構 6(s=測器框遍移動到探測器框健料器 二：二框儲料器4進行升降 且與用於儲存接^要使用^使弗1升降機構5進行升降， 合⑻8) 使用的板測器框挪的層的高度相對 接著’在圖12 (b)中，利用筮）.富、„ 要使用的探測器框爲移動到第^軍運;^構6而使接著 勒引乐1運达機構5 (S29)。 1342390 24430pif.doc 接著，在圖12 (c)中，使負載固定室3的頂板3a下 降，將下一探測器框20b導入到負載固定室3内。此時， 探測器框20b是在由第1運送機構5被保持的狀態下而進 行導入（S30)。 在圖13中，是在利用頂板3a關閉負載固定室3後， 對負載固定室3内進行真空排氣，以與主室2内形成相同 的壓力（S31 )，然後，打開第2門閥12 (S32)，使探測器 框20b移動到主室2内，並載置在被置放於載臺上的基板 上（S33)，且關閉第2門閥12。藉此，完成探測器框20b 的更換，並可利用更換了的探測器框20b進行基板檢查 (S34)。 另外，在利甩其它的探測器框進行基板檢查的情況 下，藉由反復變換前述的動作，可取代主室内所設置的探 測器框，而更換為在探測器框儲料器中所儲存的其它的探 測器框，並利用更換了的其它的探測器框進行基板檢查。 另外，更換作為檢查對象的基板，可與第〗形態所說 明的動作同樣地進行。 在上述之本發明的探測器框的更換及基板的更換的任 一者中，主室2内都可保持真空狀態，能夠不使電子槍等 的電源停止而維持驅動狀態。因此，可節省因停止電源而 使裝置再度驅動所需要的所謂的熱機時間，能夠縮短探測 器框更換時的裝置的停機時間。 本發明的基板檢查裝置並不限於液晶的TFT基板的檢 查，可應用於在真空下進行的檢查裝置，而且，還可適用 26 1342390 24430pif.doc 于利用電子射線或離子束的曝光裝置，以及電子顯微鏡等 利用真空處理室及負載固定室的裝置。 雖然本發明已以較佳實施例揭露如上，然其並非用以 • 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 • 和範圍内，當可作些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1(a)、圖1(b)所示為用於說明本發明的基板檢查裝 • 置的第1形態之概略圖。 圖2(a)、2(b)所示為用於說明本發明的基板檢查裝置 的第1形態之概略圖。 圖3(a)〜3(c)為用於說明在本發明的基板檢查裝置的第 1形態中的，探測器框的移動動作例子的動作圖。 圖4(a)〜4(c)為用於說明在本發明的基板檢查裝置的第 1形態中的，探測器框的移動動作例子的動作圖。 • 圖5(a)〜5(c)為用於說明在本發明的基板檢查裝置的第 ® 1形態中的，探測器框的移動動作例子的動作圖。 圖6(a)、6(b)為用於說明在本發明的基板檢查裝置的 第1形態中的，探測器框的移動動作例子的動作圖。 圖7為用於說明在本發明的基板檢查裝置的第1形態 中的，探測器框的移動動作例子的流程圖。 圖8為用於說明在本發明的基板檢查裝置的第1形態 中的，探測器框的移動動作例子的流程圖。 27 1342390 24430pif.doc 圖9(a)、9(b)所示為用於說明本發明的基板檢查裝置 的第2形態之概略圖。 圖10(a)、10(b)所示為用於說明本發明的基板檢查裝 置的第2形態之概略圖。 圖11 (a)〜11 (c)為用於說明在本發明的基板檢查裝置的 第2形態中的，探測器框的移動動作例子的動作圖。 圖12(a)〜12(c)為用於說明在本發明的基板檢查裝置的 第2形態中的，探測器框的移動動作例子的動作圖。 圖13為用於說明在本發明的基板檢查裝置的第2形態 中的，探測器框的移動動作例子的動作圖。 圖】4為用於說明在本發明的基板檢查裝置的第2形態 中的，探測器框的移動動作例子的流程圖。 圖15(a)〜15(d)為用於說明基板檢查裝置的習知構成的 概略圖。 【主要元件符號說明】 1 :基板檢查裝置 2 :主室 3、3a :負載固定室 4:探測器儲料器 5:第1運送機構 6 :第2運送機構 7 :第3運送機構 8:臨時置放部 11 :第1門閥 28 1342390 24430pif.doc 12 :第2門閥 20、20a、20b、20c :探測器框 30 :基板 * 101 :基板檢查裝置 • 102 :主室 103 :負載固定室 104 :探測器框儲料器 111 :門閥 • 112 :門 113 :門閥 29The specified layer of the detector frame hopper 4 and the first transport mechanism 5 are erected, and the detector frame 2 is removed from the specified mi of the detector frame hopper 4, the mechanism 5, or vice versa. The first transport mechanism 5 moves to a predetermined layer of the probe hopper 4. Also, about this height pair. The lifting mechanism can also be controlled by a control device not shown. In the substrate inspection device 1 of the second embodiment, an example of the movement operation of the probe 棹 will be described using the flowcharts of Figs. u(a) to u(6) to Fig. 13 and the flowchart of the figure. ^ In addition, here, the main chamber 2 is in a vacuum state, the load is fixed to the atmospheric pressure state, and the detector 榣24 1342390 24430pif.doc used in the main chamber 2 is placed in the detector frame hopper. The other detector frames stored are replaced for explanation. In the illustrated example _, the slave that was taken out of the diverticulum is taken as a frame of the detector (shown in the black part of the figure), and the frame of the probe is taken as a frame of exploration. The pattern part is first, in the picture!] (a) Yin, vacuum discharge (s:) to the load fixed chamber 3: ?, the second door valve between the chamber 2 and the load fixed chamber 3, so that (4) Box 2 〇a from the main chamber 2 to the load-fixing chamber (=), and closing the second door 12, using these cut-to-two-action 1 'can not return the main chamber 2 to the atmosphere, but the knowledge used in the main chamber 2 The measurement frame 2〇a moves to the load fixed chamber 3. Next, in Fig. 1 (b), the load is fixed = pressure (10), so that the load fixed chamber 3_2 = t probe (four) frame hopper 4 idle position is wide) Height is aligned (s26). In Fig. Uc), the first transport mechanism 6 is used (s=the detector frame is moved to the detector frame health device 2: the two-frame hopper 4 is used for lifting and lowering, and is used for storing and connecting 1 Lifting mechanism 5 is used for lifting and lowering, and (8) 8) The height of the layer of the board detector frame used is relatively the same as 'in Figure 12 (b), using 筮). Rich, „The detector frame to be used is moved to the second The military transport; ^ structure 6 and then the Lele 1 transport mechanism 5 (S29). 1342390 24430pif.doc Next, in Figure 12 (c), the top plate 3a of the load-fixing chamber 3 is lowered, the next detector The frame 20b is introduced into the load-fixing chamber 3. At this time, the probe frame 20b is introduced while being held by the first transport mechanism 5 (S30). In Fig. 13, the load is fixed by the top plate 3a. After the chamber 3, the inside of the load fixing chamber 3 is evacuated to form the same pressure as in the main chamber 2 (S31), and then the second gate valve 12 is opened (S32), and the probe frame 20b is moved to the main chamber 2 And placed on the substrate placed on the stage (S33), and the second gate valve 12 is closed. Thereby, the replacement of the detector frame 20b is completed, and The substrate inspection is performed by the replaced detector frame 20b (S34). When the other detector frame is subjected to the substrate inspection, the detector frame provided in the main chamber can be replaced by repeatedly changing the above operation. And replace it with another detector frame stored in the detector frame hopper, and use the replaced other detector frame for substrate inspection. In addition, replace the substrate to be inspected, and the In the above description, the replacement of the probe frame and the replacement of the substrate of the present invention can maintain a vacuum state in the main chamber 2, and can maintain the driving state without stopping the power supply of the electron gun or the like. Therefore, the so-called heat engine time required for the device to be driven again by stopping the power supply can be saved, and the down time of the device when the probe frame is replaced can be shortened. The substrate inspection device of the present invention is not limited to the inspection of the TFT substrate of the liquid crystal. It can be applied to inspection devices under vacuum, and can also be applied to the exposure of electron beams or ion beams using 26 1342390 24430pif.doc. Apparatus, and apparatus for utilizing a vacuum processing chamber and a load-fixing chamber, such as an electron microscope, etc. Although the invention has been disclosed in the preferred embodiments as above, it is not intended to limit the invention, and those skilled in the art, without departing from the invention In the spirit and scope, the scope of protection of the present invention is subject to the definition of the scope of the appended patent application. [Figure 1 (a), Figure 1 (b) is a schematic view showing a first embodiment of the substrate inspection device according to the present invention. Figs. 2(a) and 2(b) are diagrams showing the first aspect of the substrate inspection device of the present invention. A schematic diagram of the form. 3(a) to 3(c) are operation diagrams for explaining an example of the movement operation of the probe frame in the first embodiment of the substrate inspection device according to the present invention. 4(a) to 4(c) are operation diagrams for explaining an example of the movement operation of the probe frame in the first embodiment of the substrate inspection device of the present invention. 5(a) to 5(c) are operation diagrams for explaining an example of the movement operation of the probe frame in the first embodiment of the substrate inspection device of the present invention. Figs. 6(a) and 6(b) are views for explaining an operation example of the movement operation of the probe frame in the first embodiment of the substrate inspection device of the present invention. Fig. 7 is a flow chart for explaining an example of the movement operation of the probe frame in the first embodiment of the substrate inspection device of the present invention. Fig. 8 is a flow chart for explaining an example of the movement operation of the probe frame in the first embodiment of the substrate inspection device of the present invention. 27 1342390 24430pif.doc Figs. 9(a) and 9(b) are schematic views showing a second embodiment of the substrate inspecting apparatus of the present invention. Figs. 10(a) and 10(b) are schematic views for explaining a second embodiment of the substrate inspecting apparatus of the present invention. (a) to (c) of FIG. 11 are operation diagrams for explaining an example of the movement operation of the probe frame in the second embodiment of the substrate inspection device according to the present invention. 12(a) to 12(c) are operation diagrams for explaining an example of the movement operation of the probe frame in the second embodiment of the substrate inspection device of the present invention. Fig. 13 is an operation diagram for explaining an example of the movement operation of the probe frame in the second embodiment of the substrate inspection device of the present invention. Fig. 4 is a flow chart for explaining an example of the movement operation of the probe frame in the second embodiment of the substrate inspection device of the present invention. 15(a) to 15(d) are schematic diagrams for explaining a conventional configuration of a substrate inspecting apparatus. [Description of main component symbols] 1 : Substrate inspection device 2 : Main chamber 3, 3a : Load fixing chamber 4 : Detector hopper 5 : First transport mechanism 6 : Second transport mechanism 7 : Third transport mechanism 8 : Temporary Placement portion 11: first gate valve 28 1342390 24430pif.doc 12: second gate valve 20, 20a, 20b, 20c: detector frame 30: substrate * 101: substrate inspection device • 102: main chamber 103: load fixing chamber 104: Detector frame hopper 111: Gate valve • 112: Door 113: Gate valve 29