1342250 九、發明說明： 【發明所屬之技術領域】 本發明，係關於適於：照射雷射光以進行去除及修正 產生於液晶面板、半導體基板、印刷配線基板等之電子電 路基板上的各種缺陷部的加工等的雷射加工方法及雷射加 工裝置。 【先前技術】 泰該種習知之雷射加工裝置（雷射照射裝置），係揭示於 專利文獻1。該雷射加工裝置，係利用在外圍具有多面之 反射面之多面鏡（p〇lyg〇n mirr〇r)使雷射光源所輸出之雷射 光反射。雷射加工裝置，之後，在藉由透鏡使反射光 集光並照射於電子電路基板上而進行必要之加工時，會使 前述多面鏡旋轉而使照射於前述電子電路基板的雷射光往 一定方向進行掃描，並使之朝著與上述掃描方向正交的方 向與前述多面鏡形成同步以移動電子電路基板。 #操作，可進行電子電路基板之一定範圍内的必要加工。 [專利文獻1]曰本特開2002-86288號公報 【發明内容】 發明所欲解決之課題 —但是’在前述雷射加工裝置’該透鏡的性能係限 疋在15“ m之光束光點尺寸，因此無法進行微細加工。此 外’藉由前述多面鏡的連續旋轉可使各反射面的反射角度 反覆變化，因此雷射光照射於電子電路基板的位置會一直 在-定的範圍内反覆變化。因此，由前述雷射光所加工的 317417 5 1342250 最小加工範圍，係形成：與根據前述多面鏡之反射面之反 射角度的變化而決定之一定方向之雷射光的掃描範圍相對 應的一定長度的直線狀部份。因&，對於複雜形狀或細微 加工部分’會使雷射光甚至照射到不需要照射的部份，而 導致無法正確進行預定加工部分之加工的問題。 本發明，係鏗於上述問題而創作，其目的在提供一種 雷射力α方法及雷射加卫裝置’可正確地對電子電路基板 中的複雜形狀或微細的加工部分進行加工。 解決課題之手段 為解決上述課題，本發明之雷射加工方法，係一種使 雷射震虚器所輸出之雷射光通過具有成像透鏡與物鏡之光 學糸而照射在工件以進行預定被加卫部之加工的雷射加工 方法，係藉由使前述物鏡在與前述光學系之光轴垂直的面 内移動’使通過該物鏡而成像於前述工件之前述雷射光的 光點位置移動而進行加工。 在上述田射加工方法中’使前述雷射震盪器所輸出之 雷射光通過具有成像透鏡與物鏡之光料㈣射在工件 二==述物鏡對前述光學系的光軸往垂直橫切該光 軸的方向移動’而根據物鏡之對應光學系光軸的移動位 置’使照射於工件的雷射光的光點位置微幅移動 該雷射光之光點位置的料，丨、狡ϋ y 曰 移動進行工件之預定被加工部 中的細部加工。 本發明之雷射加工裝置’係使雷射震盡器所輸… 射光通過具有成像透鏡與物鏡之光學㈣照射在卫件並: 317417 6 1342250 之移動方向平行的直角座標軸有關之位於前述物鏡之待機 位置的光軸的座標值預先予以登錄，再根據前述直角座標 軸中的物鏡的光軸的座標值使前述第1、第2移動裝置產 生動作並控制前述物鏡的移動。 在本發明之雷射加工裝置中，前述基座體係藉由以前 述控制裝置控制動作的第3移動裝置朝著與前述光學系之1342250 IX. EMBODIMENT OF THE INVENTION [Technical Field] The present invention relates to various defects suitable for irradiating laser light to remove and correct an electronic circuit board produced on a liquid crystal panel, a semiconductor substrate, a printed wiring board, or the like. Laser processing methods such as processing and laser processing equipment. [Prior Art] A laser processing apparatus (laser irradiation apparatus) of the prior art is disclosed in Patent Document 1. In the laser processing apparatus, the laser beam output from the laser light source is reflected by a polygon mirror having a multi-faceted reflecting surface on the periphery. In the laser processing apparatus, when the reflected light is collected by the lens and irradiated onto the electronic circuit board to perform necessary processing, the polygon mirror is rotated to cause the laser light irradiated onto the electronic circuit board to be oriented in a certain direction. Scanning is performed and synchronized with the aforementioned polygon mirror in a direction orthogonal to the above-described scanning direction to move the electronic circuit substrate. #操作, the necessary processing within a certain range of the electronic circuit board can be performed. [Patent Document 1] JP-A-2002-86288 SUMMARY OF THE INVENTION The problem to be solved by the invention is that the performance of the lens in the laser processing apparatus described above is limited to a beam spot size of 15 m. Therefore, microfabrication cannot be performed. Further, the continuous rotation of the polygon mirror can change the reflection angle of each reflection surface repeatedly, and therefore the position of the laser light irradiated on the electronic circuit board is constantly changed within a predetermined range. The minimum processing range of 317417 5 1342250 processed by the aforementioned laser light is formed by a linear length of a certain length corresponding to the scanning range of the laser light in a certain direction determined by the change of the reflection angle of the reflecting surface of the polygon mirror. In part, due to &, for complex shapes or finely processed parts, the laser light may be irradiated even to a portion that does not need to be irradiated, resulting in a problem that the processing of the predetermined processing portion cannot be performed correctly. The present invention is based on the above problems. And the purpose of creation is to provide a laser alpha method and a laser-assisting device that can correctly be used in an electronic circuit substrate. The problem is solved by the method of solving the above problems. The laser processing method of the present invention is a method in which a laser beam outputted by a laser oscillating device passes through an optical 具有 having an imaging lens and an objective lens. a laser processing method of irradiating a workpiece to perform processing of a predetermined to-be-received portion by moving the objective lens in a plane perpendicular to an optical axis of the optical system to image the thunder of the workpiece through the objective lens The spot position of the light is moved and processed. In the above field processing method, 'the laser light outputted by the laser oscillator is passed through the light material having the imaging lens and the objective lens (4), and the objective lens is applied to the workpiece. The optical axis of the system moves in a direction perpendicular to the optical axis, and the position of the light spot of the laser light irradiated to the workpiece is slightly shifted according to the position of the optical axis of the corresponding optical system of the objective lens. The material, 丨, 狡ϋ y 曰 move to perform the detailed processing in the predetermined processed portion of the workpiece. The laser processing device of the present invention enables the laser shock absorber to be... The light is transmitted through the optical axis having the imaging lens and the objective lens (4), and the coordinate value of the optical axis at the standby position of the objective lens related to the moving direction parallel to the moving direction of the 317417 6 1342250 is registered in advance, and then according to the aforementioned rectangular coordinate axis The coordinate value of the optical axis of the objective lens causes the first and second moving devices to operate and controls the movement of the objective lens. In the laser processing apparatus of the present invention, the pedestal system is controlled by the control device. 3 mobile device towards the optical system
光轴平行的方向調節移動，而前述可動體亦可支樓倍率相 異之複數個物鏡。 發明之效果 、與根據本發明之雷射加工方法，可使物鏡朝著垂直橫切 光學系之光軸的方向移動，並根據前述物鏡之對應光學系 光軸的移動位置，使玉件上之雷射光的光點位置微幅移 動。因此，藉由該雷射光之光點位置的移動，即使工件的 被加工部分係電子電路基板中的複雜形狀或微細的加工部 正確地進行加工’並確實避免對沒必要照射的 光：二：：。此外’在加工工件時，無需對著雷射光的 移動工件側或支撐前述光學系之雷射加工頭側， 順利工而ΐ之雷射光的絲的微幅移動將變得更為容易且 由:無：=:利、迅速地進行工件的雷射加工。此外， 裙：太雜β透鏡’而得以縮小雷射光的光點徑。 明之雷射加工裝置，係藉由控制裝置使移動 裝置產生作動’並藉由該 橫切光學系之光轴的方向往支持肢传以朝者垂直 撐於前述可動體㈣…支持導移動，因此可使支 動粗的物鏡朝著前述光學系的光轴正確移動。 317417 8 !342250 因此’可適當地進行上述雷射加工方法。 根據與本發明實施態樣相關之雷射加工裝置，係^^由 •利用第1、第2移動裝置而分別往垂直橫切光學系之光軸 的直角的二方向移動的可動支撐體與可動體來移動物鏡。 因此’可提升物鏡對前述光學系之光軸的移動位置的自由 度’並適度地對應工件複雜的被加工部的形狀而進行雷射 加工0 φ 根據本發明之另一實施態樣的雷射加工裝置，係以光 學系的光軸的位置為原點並根據關於與可動體及可動支持 體^移動方向平行之直角座標軸的物鏡的光轴的座標值控 制前述物鏡的移動。因此，可使物鏡對準前述光學系的光 轴正破料、定位，並纟良好精確度下進行工件之微細之 被加工部的雷射加工。 根據本發明之又一其他實施態樣的雷射加工裝置，除 了可使支樓於可動體之複數個倍率相異的物鏡選擇性地交 鲁換移動至光學㈣光軸的位置來進行雷射加工之外，亦可 根據前述選擇之物鏡的倍率，利用第3移動裝置使基座體 往前述光學系之光軸方向調節移動。因此，可使經由所選 擇之物鏡形成的雷射光的光點正辞地成像於工件上。 【實施方式】 以下，參照附加圖式，說明本發明之-實施例之雷射 加工裝置。 在苐1圖至第4圖中，丨係親+士八〜 1 肩不本發明之一貫施例之 雷射加工裝置。該雷射加 裝置1如具備：連接雷射電源 3)7417 9 1342250 2之雷射震盈器3 ;且右一科如· /1 〃、有對反射鏡4a、仆之雷射光軸調The movement of the optical axis in parallel is adjusted, and the movable body may also be a plurality of objective lenses having different magnifications. According to the invention, the laser processing method according to the present invention can move the objective lens in a direction perpendicular to the optical axis of the optical system, and make the jade member according to the moving position of the optical axis of the corresponding optical system of the objective lens. The position of the spot of the laser light moves slightly. Therefore, by the movement of the position of the spot light of the laser light, even if the processed portion of the workpiece is processed in a complicated shape or a fine processed portion in the electronic circuit substrate, it is sure to avoid light that is not necessary to be irradiated: :. In addition, when machining a workpiece, there is no need to move the workpiece side against the laser light or support the laser processing head side of the optical system. The slight movement of the smooth laser light will be easier and by: None: =: The laser processing of the workpiece is performed quickly and profitably. In addition, the skirt: too heterozygous beta lens' to reduce the spot diameter of the laser light. The laser processing device of the present invention activates the mobile device by the control device, and supports the guided movement by the direction of the optical axis of the transverse optical system to the supporting limb, and the supporting body (4) is supported vertically. The objective lens with coarse support can be moved correctly toward the optical axis of the aforementioned optical system. 317417 8 !342250 Therefore, the above laser processing method can be suitably performed. According to a laser processing apparatus according to an embodiment of the present invention, a movable support body that moves in two directions perpendicular to a right angle of an optical axis of the optical system by the first and second moving means is movable and movable The body moves the objective lens. Therefore, 'the degree of freedom of the objective lens with respect to the moving position of the optical axis of the optical system' can be improved and the laser processing can be performed in accordance with the shape of the workpiece to be processed in a complicated manner. 0 φ Laser according to another embodiment of the present invention The processing device controls the movement of the objective lens based on the coordinate value of the optical axis of the objective lens with respect to the rectangular coordinate axis parallel to the moving direction of the movable body and the movable supporting body, with the position of the optical axis of the optical system as the origin. Therefore, the objective lens can be aligned with the optical axis of the optical system to be broken and positioned, and the laser processing of the finely processed portion of the workpiece can be performed with good precision. According to still another embodiment of the present invention, in addition to the laser processing apparatus, the objective lens of the plurality of magnifications of the movable body can be selectively moved to the position of the optical (four) optical axis to perform laser irradiation. In addition to the processing, the base body may be adjusted to move in the optical axis direction of the optical system by the third moving means according to the magnification of the objective lens selected as described above. Therefore, the spot of the laser light formed through the selected objective lens can be imaged on the workpiece. [Embodiment] Hereinafter, a laser processing apparatus according to an embodiment of the present invention will be described with reference to additional drawings. In the drawings from Fig. 1 to Fig. 4, the laser processing device is not consistent with the invention of the invention. The laser adding device 1 has: a laser shock absorber 3 connected to a laser power source 3) 7417 9 1342250 2; and a right-hand side such as · /1 〃, with a mirror 4a, a laser light axis adjustment
玉反射鏡4 4雷射震鹽器3輸出，用以整形以雷射光轴 調整反射鏡4調整過光軸之雷射光R的光束形狀的光圈 (ape_e)機構5 ;具有成像透鏡6與物鏡7使通過前述光 圈機構5之雷射光R成像於電子電路基板（工件）w上的 光學系8。前述光圈機構5，係如日本特願2〇〇3_43〇〇7〗號 說明書所記載之光圈機構所示一 & ’係設成：使自由調整 縫隙（sm)5C、5d之間隔的一組縫隙板5a、5b與雷射光軸l 正交，並錯開配置於雷射光軸L的方向（z軸方向Z，在 第1圖中為上下方向）之位置，纟以可調節交叉角之方式 使上下之縫隙5c、5d的方向交又。而藉由重疊上下縫隙 5c、5d所得之合成縫隙的形狀來進行前述雷射光r之光束 形狀的整形。 在配置於前述雷射光軸L上的光學系8中，位於前記 下側（雷射光R的下游側）之縫隙板5b與前記成像透鏡6 魯之間，以及成像透鏡6與物鏡7之間，分別設置第1、第2 半反射鏡（half mirron)9、1〇。在面向第1半反射鏡9設置 之第3半反射鏡11的光軸的上方位置，配置CCD相機（照 相裝置）12，而在前述第3半反射鏡η的後方配置 CCD 1 3。此外’又設置之間隔有透鏡丨4而與前述第2半反 射鏡10相對的反射鏡15。照明器18，係使連絡未圖示之 照明用投光器之照明用光纖16所發出的照明光，通過透鏡 17、前述反射鏡15以及前述透鏡η而入射於前述第2半 反射鏡10。此外，工作台19,係配置於前述物鏡7的下方， 317417 10 1342250 ：並藉由χ、Y轴驅動裝置（未圖示），使對於物鏡7成在垂 、.直於雷射光軸（光學系的光軸）L之方向（z軸方向z)之 •面相互呈直角地於X軸方向X與Y軸方向y相對性地移 載置於前述工作台19,藉由前述照明器18透過物鏡？ .·照明的1件w，係透過前述光學系8與前述半反射鏡]J .· 而以前述CCD相機12進行攝影。 *前述雷射震盛器3、光學系8、CCD相機13、照明器 18等係組裝成雷射加工頭2〇而適切的支撐於支撐構造體 Μ。 亦即’如第2圖至第4圖所示，在設有前述成像透鏡 6與半反射鏡10之上部鏡體21的上方，係由下方依序配 置.设有光圈機構5的光束形狀整形器22以及設有雷射光 軸調：鏡4的光軸調節器23。在上述上部鏡體21的下部， 設有前述半反射鏡1〇,而其下端則連接設有支樓前述物鏡 7之透鏡移動裝置24的下部鏡體25。此外，在前述上部鏡 #體21的Χ軸方向Χ的一側部，係連接設有前述第3半反 射鏡^CCD相機12與CCDn之τ字狀的攝像鏡體％。 而在前述下部鏡體25之前述攝像鏡體26之相反側的側 部’係連接設有前述透鏡】4，】7、反射鏡15、照明用光纖 ' 16之L·字狀的照明鏡體2 7。 ㈣輸體Μ’具備有：以可自由移動於χ，γ 軸方向X，y之方式去p # y <刀叭叉棕刖述工作台丨9的台架（未圖示）. 兩端支撐於固定在該台架之χ轴方向χ兩端部之一對支杈 (未圖示）而往X細太a、c 万向X延長且設在前述工作台19上 317417 1342250 =X轴樑構件（beam)28。在前述χ軸樑構件 水=長於X轴方向X而設置之上下一對導轨29、29。有用 以支樓引導破料部3G於該導執29、29的滑座 (:addle)31 ’係以可自由移動於χ軸方向X之方式設 前述X軸樑構件28。在前述X軸樑構件28之導軌29、29 32b 之線：馬气32係沿著χ軸方向配置， /32 ""長在Χ軸樑構件28上方並安裝於前述滑 ^的平板狀支撐構件33上’並利用前述線性馬 達32的作動使前述滑座3】纟回移動於χ轴方向X。在 述支樓構件33上係支#與前述雷射光軸調整器μ連络之 前述雷射震盡器3。在前述滑座31的¥軸 面 2圖的左側面）安裝有朝前方突出之支#具34，前述上(: 鏡體21的上端係利用該支撐具34支樓於前述滑座Μ。 在前述滑座3!的前面下部固定有具有沿著〜 而設的一對Ζ軸導軌35,35(參照第4圖）的滑動基 b㈣36。Ζ軸滑板⑽der)37係以可介由前述ζ轴導， 35>自由移動於Ζ軸方向ζ的方式支撐在該滑動基座％。 在前述Ζ袖滑板37的前面固定有朝前方突出之支 =述:了…袖方向y的後部係切;該支 撐片38，别述上、下部鏡體2〗，25，係利用該支 ％ 與前述支揮具34,而與前述光學系8的光細以 Z呈-致的狀態下支撐於前述滑座3】。固定於前 滑 07f__M@(_nui)39’ 係螺合於 317417 12 1342250 轉動之方式支撐在前述滑動基座36之上、下部 40a，40b的滾珠螺桿（BaH㈣认)4】，而藉由 ::r:r的z轴伺服馬達42,使該滚珠螺：s 動错此使前述Z軸滑板37朝2軸方向义 述下部鏡體25的上部25a係以可在之袖方向2呈^月 之方式嵌合於上部鏡體21 #下端部21 •夕動 滑板-藉由前述词服馬達…軸方向二：袖 成像透鏡46，係固定於上Λ 此外， 體25》… U疋於上㈣體21的下部’利用下部鏡 于H Z之相對移動而避免抵接下部鏡體25。 25下：：朝:移:裝置24 ’係具傷:固定於前述下部鏡體 接”導Γ : X的長矩形導板(基座體)4 3 ;滑 妾於δ亥導板43下面以可自由移動 =平一軸滑板(可動支持體)44 = 轴方Γ5、45引導至該χ軸滑板44並以可自由移動" 轴方向y的方式支撐的丫軸滑板、 • 46 ’係略小於X轴滑板44 L46° Y轴滑板 44,係由沿著X軸方向、反狀°别述Χ轴滑板 軌47所支樓，並安裝於經弓丨“;2轴滑板3 7之Χ軸導 48。 可動構件（可動支持體） 在則述Ζ軸滑板3 7的下端，、吞 .在位…方向χ之兩端側的 桿軸50係由配置 遠滾珠螺桿轴50係與固定 49a 4外所支樓。 螺合，並藉由固定在前述一方^二動體48之球形螺㈣ 馬達使前述滾珠螺絲桿50=承構件携之X車由飼服 轉’而使前述X軸滑板44 η 317417 1342250 :方向X移動。前述x抽滑板…輪方向X的位 置知由線性編碼器（nnear encoder)62檢測。此外， .:軸滑板4 4的-端側（在第3圖、第4圖的左端側::滾 珠螺桿54係由設在丫轴方向r兩端側（在第4圖中的 上、下端幻的軸承構件53a、说戶斤支擇。而該 ·· 54係與固定在前述丫轴滑板46的球形螺母^螺合，並 由固定於-方的轴承構件53a&Y轴伺服馬達％使前/ 鲁滚珠螺桿5 4旋轉’而使前述γ軸滑板4 6季月γ輪方向乂移 動。Y軸滑板4 6的Υ軸方向y的位置係由線性編碼器6 3 檢測。 預備組合複數個透鏡且具有不同倍率的複數個 例中為4個）物鏡7am，做為前述物鏡7。物 鏡7a 7b、7c、7d，係支樓於前述γ轴滑板46。藉由 述Χ軸伺服馬達52使Χ軸滑板44朝X軸方向χ移動， 可使上述物鏡7^7d中的其中一個，選擇性地移動至前 述先，系8的光軸L的位置以進行物鏡7倍率的交換。此 外’藉由前述X軸伺服馬達52使乂轴滑板料朝乂軸方 向X微幅移動’或藉由前述Y軸伺服馬達56使Y軸滑板 46朝Y轴方向以幅移動，即可使所選擇之物鏡7的光轴 位置朝X’ Y軸方向x，y微幅移動、定位於前述光學系8 之光軸L的位置。 在前述X轴滑板44中，與前述物鏡7a至7d之各光 軸對應的位置，設有使雷射光R通過的洞孔。該洞孔且有 略大於物鏡7之π徑的尺寸。該隸之尺寸最好大於物鏡 317417 14 1342250 7之口徑的2倍，但其大小未受此限。在前述導板a的中 央部分，開有與前述光學系8之光轴[的位置—致，可使 雷射光R與照明光的光束在不受孔壁干擾的情況下通過之 具預定大小的貫通孔。 此外’各物鏡73、7卜7卜7(1的倍率，例如，係分別 依序设定為5倍、20倍、50倍、1〇〇倍。 此外’由前述導軌29與被引導部3〇構成之引導機構、 導執MW滑板37構成之引導機構、由前 = 軸滑板46構成之引導機構、以及由前 :用二動體48構成之引導機構，分別，係可 來進行引導的機構’但是，為了能夠圓滑 線引導檣槿,.. 取子做成使用驅動體的直 j引導機構。此外，可取代前述線性馬㈣，藉 達的旋轉’並經由將球形螺母螺合於滾珠螺 : 線運動機構使前述滑座31對χ '、于 直 又蕻…”對軸#構件28移動。此外， :=Γ55 ζ㈣服馬達52、56、仏·以及將球 形螺母5〗、55 ' 39螺合於滾珠螺桿5〇、54、 滾珠螺桿機構，構成：使前述X、Υ、 37，八 >* 2 轴;月板 44、4ό、 爾回移動於前述Χ、γ、ζ 轴移動裝置（第！移動裝置）57 :之Χ 動裝置以及Ζ轴移動裝置』移動裝置（第2移 其構成形態並未受此限制，前述：二=但 亦了疋利用線性馬達的移動 ^ 動機構的構造。此 冑構’或利用其他移 了將别4Χ、γ、2軸伺服 317417 15 1342250 56、42替換為步進馬達。 前述雷射加工裝置1係具備有：前述雷射光源2 ;前 述⑽相冑】2，·前述照明器】8;以及用以控制馬達驅動 器60等之動作的控制電腦（控制裝置“卜該馬 哭 I令用以使前述X、丫、2轴飼服馬達52、56、4 4 工作台朝軸方向x、y移動的工作台 ;;服 馬達（未圖示）個別產生作動。 V ”服 前述控制電腦61，如第1圖所示，係罝 物鏡移動控制部61a;影像處理部训，·顯㈣6 制部鍵盤等輸入裝置61e;及主記憶體等（，: 雷射/物鏡移動控制部61传 ’ θ不） 馬達驅動卷60… 雷射電源2與前述 並運^ Κ象處理部61b’連接料咖相機12, 並運异處理該CCD相機12藉由來自箭、+、 拍攝工件W表面之缺陷部等（被加工^ %之反射光 =，所要的影_。顯示器…= 二等。，部：= 根據該運之影像資料進行必要運算，並 52、二if60使前述X、Y、Z㈣服馬達 控制部叫,將前述影像處理二動r此外主 未圖示)，並將影像顯示於前:二 寺的輪入裝置61e，係為口一 a np61c。鍵盤 主記憶體等（未gj _彳士 °又疋、’ A入必要指令而設。而 (未圖不）中’則登錄有前述咖相機12的 317417 16 1342250 動作知式、以及利用前述輸入裝置61 e輸入之各種設定數 值或前述主控制部61 d所得之資料等。 接著’參照第5圖至第9圖說明前述構成之雷射加工 裝置1的作用以及本發明之一實施例的雷射加工方法。 在進行利用雷射加工裝置1之物鏡7的倍率變換及雷 射R之光點移動的加工時，係進行以前述光軸L的位置為 原點而取得與沿著前述X、γ軸方向X、y形成之直角座標 軸（X、γ座標軸）相關之位於前述待機位置中的物鏡7 的光轴的座標值的指示（teaching)動作。該指示動作，係使 各物鏡7a至7d，得以正確往返移動於各物鏡之光轴與前 述光學系8之光軸l完全一致的位置，以及由該位置朝X、 Y轴方向X、y之一方離開之待機位置間，並使之定位。 首先’使前述X、Y軸祠服馬達5 2、5 6回歸原點（步 驟s 1 )。接著’利用前述X、γ軲伺服馬達5 2、5 6使任意 之物鏡（最好是低倍率的物鏡）移動於成像物鏡6的光軸 L附近，並在前述工作台〗9的上方，取代工件w，而載置 如第8圖所示之指示用十字標記基板（以下，簡稱為「標 5己基板」）Μ。由照明器用投光器經由光纖μ、透鏡π、 ，射鏡15、透鏡14、半反射鏡10以及任意之物鏡（最好 义低倍率的物鏡）7使照明光照射於前述標記基板Μ。利 用邊反射光標記於標記基板Μ之十字標記m的角部的基 2點ml係以前述CCD相機12拍攝。測定者，一面觀察 、迷CCD相機1 2所拍攝顯示之影像，一面將前述工作台 19上的前述標記基板Μ，設定在前述基準點ml的影像最 317417 丄：> 仔 ζζ：)υ ^晰可見之光學系8的光軸L下（成像透鏡6的光軸下） 的位置（步驟S2 )。 接著，預先登錄於前述雷射/物鏡移動控制部6U之記 體，例如，對應倍♦ 100倍之物鏡7d的初始X、Y座標 f會破下載到主控制部61d (步驟S3)。之後，對前述馬 f動器60下指令（步驟⑷，使χ、γ轴词服馬達& 6 ’得以藉由根據設在χ轴滑板〇以及γ轴滑板牝之線 ’:碼器（位置檢測器）6 2、6 3的檢測值的位置反饋控制 作動，而使前述物鏡7d，能夠藉由前述X轴滑板44 以及Y軸滑板46由待機位置移動至χ 驟S5)。當前述物鏡7(1僅 係透過物鏡7“以前述始X、Y座標值時，a jade mirror 4 4 laser shaker 3 output for shaping an aperture (ape_e) mechanism 5 for adjusting the beam shape of the laser beam R of the optical axis by the laser optical axis adjustment mirror 4; having the imaging lens 6 and the objective lens 7 The optical system 8 that images the laser light R of the aperture mechanism 5 on the electronic circuit board (workpiece) w is formed. The aperture mechanism 5 is a group of the aperture mechanism described in the specification of Japanese Patent Application No. 2〇〇3_43〇〇7, which is set as a group of intervals between the freely adjustable slits (sm) 5C and 5d. The slot plates 5a and 5b are orthogonal to the laser beam axis 1 and are shifted from the direction of the laser beam axis L (the z-axis direction Z, which is the up-and-down direction in FIG. 1), so that the angle can be adjusted by the cross angle. The direction of the upper and lower gaps 5c, 5d is again. The shape of the beam of the laser light r is shaped by superimposing the shape of the combined slit obtained by the upper and lower slits 5c, 5d. In the optical system 8 disposed on the aforementioned laser optical axis L, between the slit plate 5b on the lower side (the downstream side of the laser light R) and the front imaging lens 6b, and between the imaging lens 6 and the objective lens 7, The first and second half mirrors (half mirron) 9 and 1 are respectively set. A CCD camera (photographing device) 12 is disposed above the optical axis of the third half mirror 11 provided to the first half mirror 9, and a CCD 13 is disposed behind the third half mirror n. Further, a mirror 15 having a lens 丨 4 and opposed to the second half mirror 10 is disposed. The illuminator 18 is incident on the second half mirror 10 through the lens 17, the mirror 15, and the lens η by the illumination light emitted from the illumination fiber 16 for the illumination projector (not shown). Further, the table 19 is disposed below the objective lens 7, 317417 10 1342250: and is mounted on the objective lens 7 by the χ and Y-axis driving means (not shown), which is perpendicular to the laser optical axis (optical The optical axis of the system, the direction of the L (the z-axis direction z), is placed at a right angle to the X-axis direction X and the Y-axis direction y, and is placed on the table 19 in the opposite direction, and is transmitted through the illuminator 18. Objective lens? The one w of the illumination is imaged by the CCD camera 12 through the optical system 8 and the half mirror]J. * The laser shaker 3, the optical system 8, the CCD camera 13, the illuminator 18, and the like are assembled into a laser processing head 2, and are appropriately supported by the support structure. That is, as shown in Figs. 2 to 4, above the above-mentioned imaging lens 6 and the upper mirror body 21 of the half mirror 10 are arranged in order from below. The shape of the beam provided with the aperture mechanism 5 is shaped. The device 22 and the optical axis adjuster 23 provided with the laser optical axis adjustment: the mirror 4. The lower mirror 1 is provided at a lower portion of the upper mirror body 21, and the lower mirror body 25 of the lens moving device 24 for supporting the objective lens 7 is attached to a lower end thereof. Further, in a side portion of the upper mirror body 21 in the x-axis direction, a camera body % of the τ-shape of the third half mirror CCD camera 12 and CCD n is connected. On the other hand, the side portion 'of the opposite side of the image pickup body 26 of the lower mirror body 25 is provided with the L-shaped illumination lens body of the lens 4, 7, the mirror 15 and the illumination optical fiber '16. 2 7. (4) The transport body Μ 'has: there is a gantry that can move freely in the χ, γ axis direction X, y to p # y < knife 叉 刖 刖 刖 刖 ( ( (not shown). Supported in one of the opposite ends of the gantry direction of the gantry, a pair of supports (not shown), extended to X, a, c, and X, and provided on the table 19, 317417 1342250 = X axis Beam member 28. The pair of upper and lower guide rails 29, 29 are provided in the above-described stern-beam member water = longer than the X-axis direction X. It is useful to provide the X-axis beam member 28 so that the slide guide portion 3G of the branch guides 3G is freely movable in the x-axis direction X at the carriages 31' of the guides 29 and 29. The line of the guide rails 29 and 29 32b of the X-axis beam member 28 is arranged such that the horse gas 32 is arranged along the y-axis direction, and /32 "" is formed above the y-axis beam member 28 and attached to the sliding plate shape. The support member 33 is moved on the support member 33 by the operation of the linear motor 32 to move the carriage 3 back in the x-axis direction X. The aforementioned laser damper 3 is connected to the aforementioned laser beam adjuster μ on the branch member 33. A support member 34 projecting forward is attached to the left side surface of the slide shaft 31 of the slide shaft 31, and the upper portion (the upper end of the mirror body 21 is supported by the support member 34 on the slide seat Μ. A sliding base b (four) 36 having a pair of yoke guides 35, 35 (see Fig. 4) provided along the yoke is fixed to the front lower portion of the slider 3! The yoke slide (10) der 37 is slidable through the aforementioned yoke Guide, 35> freely moves in the direction of the x-axis to support the sliding base %. A support that protrudes forward is fixed to the front of the crotch slide 37; a rear cut of the sleeve direction y is described; the support piece 38, which is described above, is used for the upper and lower mirror bodies 2, 25 The slider 34 is supported by the slider 34 in a state in which the light of the optical system 8 is thinned by Z. The ball screw (BaH (4)) 4] supported by the front slide 07f__M@(_nui) 39' screwing on the sliding base 36 and the lower portion 40a, 40b is rotated by means of: ??? r: r z-axis servo motor 42 causes the ball screw: s to be erroneous, so that the Z-axis slide plate 37 is oriented in the two-axis direction to the upper portion 25a of the lower mirror body 25 so as to be in the sleeve direction 2 The method is fitted to the upper mirror body 21 #lower end portion 21 • the outer slide plate - by the aforementioned word service motor ... the axial direction two: the sleeve imaging lens 46 is fixed to the upper jaw. In addition, the body 25"... U is on the upper (four) body The lower portion 21 of 21 avoids abutting the lower mirror body 25 by the relative movement of the lower mirror to the HZ. 25下::向:移:装置24's injury: fixed to the lower mirror body" guide: X long rectangular guide (base body) 4 3; slide under the δ海 guide 43 Freely movable = flat one-axis slide (movable support) 44 = shaft guides 5, 45 are guided to the x-axis slide 44 and supported by a freely movable "axis direction y", • 46 ' is slightly smaller X-axis slide plate 44 L46 ° Y-axis slide plate 44, which is connected to the shaft of the y-axis slide rail 47 along the X-axis direction, and is mounted on the 经 丨"; 48. Movable member (movable support) At the lower end of the yaw slide 37, the rod shaft 50 on both end sides of the yaw direction is arranged by the outer ball screw shaft 50 and the fixed 49a 4 floor. Screwing and arranging the X-axis slide plate 44 η 317417 1342250 by the ball screw (50) motor fixed to the one of the two movable bodies 48 X moves. The position of the x-slide plate in the wheel direction X is known to be detected by a nnear encoder 62. Further, the end side of the shaft slide plate 44 (the left end side of the third figure and the fourth figure: the ball screw 54 is provided on both end sides of the x-axis direction r (the upper and lower ends in Fig. 4) The phantom bearing member 53a is stipulated, and the 54 is screwed to the ball nut fixed to the yoke slide 46, and is fixed by the bearing member 53a & Y-axis servo motor % The front/lu ball screw 5 4 rotates to move the γ-axis slide 4 6 month γ wheel direction 。. The position of the y-axis slide y of the Y-axis slide 46 is detected by the linear encoder 63. The lens and the plurality of objective lenses 7am having a plurality of magnifications are used as the objective lens 7. The objective lenses 7a 7b, 7c, and 7d are attached to the γ-axis slide plate 46. The yaw-axis servo motor 52 is used. The x-axis slide 44 is moved in the X-axis direction, and one of the objective lenses 7^7d can be selectively moved to the position of the optical axis L of the first system 8 to exchange the objective lens 7 magnification. The X-axis servo motor 52 causes the x-axis slide material to move slightly in the x-axis direction X or the Y-axis is slid by the aforementioned Y-axis servo motor 56. The plate 46 is moved in the Y-axis direction so that the optical axis position of the selected objective lens 7 is slightly moved in the X'-axis direction x, y and positioned at the position of the optical axis L of the optical system 8. In the X-axis slide plate 44, a hole for passing the laser light R is provided at a position corresponding to each of the optical axes of the objective lenses 7a to 7d. The hole has a size slightly larger than the π diameter of the objective lens 7. Preferably, it is larger than twice the aperture of the objective lens 317417 14 1342250 7 , but the size thereof is not limited thereto. In the central portion of the aforementioned guide plate a, the optical axis of the optical system 8 is opened. The light beam R and the light beam of the illumination light pass through the through hole having a predetermined size without being interfered by the hole wall. Further, each of the objective lenses 73, 7 and 7 (7 magnifications, for example, are sequentially set to 5 times, 20 times, 50 times, 1 time. Further, 'the guide mechanism composed of the guide rail 29 and the guided portion 3〇, the guide mechanism constituted by the guide MW slide 37, and the guide constituted by the front = shaft slide 46 The mechanism, and the former: the guiding mechanism composed of the two-moving body 48, respectively, is a mechanism that can be guided. Yes, in order to be able to guide the cymbal, the plucking is made into a straight j guiding mechanism using the driving body. In addition, instead of the aforementioned linear horse (four), the borrowed rotation 'and screwing the ball nut to the ball screw: The linear motion mechanism moves the aforementioned slider 31 to the 'right, 蕻...' to the shaft # member 28. In addition, :=Γ55 ζ(4) the motor 52, 56, 仏· and the spherical nut 5, 55' 39 screw The ball screw 5〇, 54 and the ball screw mechanism are configured to move the X, Υ, 37, 八>* 2 axes; the moon plates 44, 4 ό, and the yaw back to the Χ, γ, ζ axis moving device ( The first! (moving device) 57: the moving device and the pivoting device "moving device" (the second configuration is not limited by the configuration, the second: but also the structure of the moving mechanism using the linear motor. The structure of the structure is replaced with a stepping motor by using another 移, γ, and 2-axis servos 317417 15 1342250 56, 42. The laser processing apparatus 1 includes the laser light source 2; (10) 2, the aforementioned illuminator 8; and a control computer for controlling the operation of the motor driver 60 and the like (the control device "Is the horse crying I to make the aforementioned X, 丫, 2 shaft feeding motor 52, 56, 4 4 The table that moves in the axial direction x, y of the table; the motor (not shown) is operated separately. V "wears the control computer 61, as shown in Fig. 1, the objective lens movement control unit 61a; image Processing unit, display (4) 6-part keyboard and other input devices 61e; and main memory, etc. (:: laser/objective movement control unit 61 transmits 'θ not) Motor drive volume 60... Laser power supply 2 and the above-mentioned parallel operation ^ The image processing unit 61b' connects the coffee bean camera 12 and processes the CCD phase 12 By taking the defect from the surface of the workpiece W from the arrow, +, etc. (the reflected light of the processed ^ is = the desired shadow _. The display... = second., part: = necessary calculation based on the image data of the image And 52, two if60 so that the X, Y, Z (four) service motor control unit called, the image processing two motion r (main not shown), and the image is displayed in front: the second temple wheeling device 61e, is Port a np61c. Keyboard main memory, etc. (not gj _ gentleman ° 疋, 'A is set to the necessary command. And (not shown) ', then 317417 16 1342250 action knowledge of the aforementioned coffee camera 12 is registered. And various setting values input by the input device 61 e or data obtained by the main control unit 61 d. Next, the operation of the laser processing apparatus 1 configured as described above and the present invention will be described with reference to FIGS. 5 to 9 . In the laser processing method of the embodiment, when the magnification conversion of the objective lens 7 of the laser processing apparatus 1 and the movement of the spot of the laser light R are performed, the position of the optical axis L is obtained as the origin. a right angle seat formed along the X, γ axis directions X, y A teaching operation of the coordinate value of the optical axis of the objective lens 7 in the standby position associated with the axis (X, γ coordinate axis). The pointing operation enables the objective lenses 7a to 7d to be correctly moved back and forth to the respective objective lenses. The position where the optical axis completely coincides with the optical axis l of the optical system 8 and the standby position where the position is away from one of the X and Y directions in the X and Y directions, and is positioned. First, the X and Y axes are set. The motor 5 2, 5 6 returns to the origin (step s 1 ). Then, using the X, γ 轱 servo motor 5 2, 5 6 to move any objective lens (preferably a low magnification objective lens) to the imaging objective lens 6 In the vicinity of the optical axis L, in place of the workpiece w, the indication cross mark substrate (hereinafter simply referred to as "standard 5 substrate") shown in Fig. 8 is placed on the upper side of the table 9. Illumination light is applied to the mark substrate 由 by the illuminator emitter through the optical fiber μ, the lens π, the mirror 15, the lens 14, the half mirror 10, and an arbitrary objective lens (preferably a low magnification objective lens) 7. The base 2 dots ml which are marked with the side reflection light at the corners of the cross mark m of the mark substrate 拍摄 are taken by the CCD camera 12. The measurementer, while observing the image displayed by the CCD camera 12, sets the mark substrate on the table 19 to the image of the reference point ml 317417 &: > ζζ:) υ ^ The position of the optical axis 8 under the optical axis L (under the optical axis of the imaging lens 6) is clearly visible (step S2). Then, the log of the above-described laser/objective lens movement control unit 6U is registered in advance. For example, the initial X and Y coordinates f of the objective lens 7d corresponding to the magnification of 100 times are broken and downloaded to the main control unit 61d (step S3). After that, the above-mentioned horse-fighter 60 is commanded (step (4), so that the χ, γ-axis vocal motor & 6 ' can be obtained by the line according to the yoke slide 〇 and the γ-axis slide ': position The position feedback control of the detected values of the detectors 6 2, 6 3 is activated, so that the objective lens 7d can be moved from the standby position to the step S5) by the X-axis slide 44 and the Y-axis slide 46. When the objective lens 7 (1 is only transmitted through the objective lens 7) with the aforementioned initial X, Y coordinate values,
^CCD相機12拍攝前述標記基板M 干二Ί二再根據經由前述影像處理部6lb顯示於顯 吏前述X轴滑板44以及Y轴滑板46分 >置得以盘1、+ ?”微幅移動，而使物鏡7d的焦點位 合物/:隹 的基準點ml —致（步驟S6)。 ;置與前述十字標記_基準點ml -致 ’做為對應前述光轴L之位於前述 物見d之待機位置的光轴的正確的χ、γ座桿值 1㈣始Χ、Υ座標值登錄於前述f㈣移 代 61a的記憶體（步驟S7)。 夕助控帝" ^ 5〇 ?C' 之動作相同的步驟％至SU的動作，而 317417 18 Ύ “厶 :將對應前述光M之位於前 ν的正確的w座標值登錄於前述4=寺機位置之光麵 ._的記憶體。接著，例如，針對供田竟移動控制部 與前述步驟S3至步驟S7之。0的物鏡7b，進行 動作，將對肩舴H r 乍相问的步驟Sl3至sn 的先轴的正確的Χ、γ座標值登錄於J::b之待機位置 制部6U的記憶體/迷辑射/物鏡移動控 進行盘前 / #對所剩之㈣5的物鏡7a， 步驟S7之動作相同的步_至 S22的動作’而將對應料綠l之位 機位置的光軸的正確的χ、γ 、"，兄乃之待 移動栌制邱61 軚值丘錄於前述雷射/物鏡 == 並結束指示―)動作。 错由上述方式’可針對所 對應前述X、Υ座標軸之原點之位 c、7d，將 ^ λα γ ν十M m y、得械位置的光軸的正 ^ * ‘払值預先登錄在前述雷射/物鏡移動控制邙 6〗a的記憶趙。之後，進行載置於前述工作台The CCD camera 12 captures the mark substrate M and then moves it according to the X-axis slide plate 44 and the Y-axis slide plate 46 displayed by the image processing unit 6lb. And the reference point ml of the focal position of the objective lens 7d/: — is obtained (step S6); and the cross mark_reference point ml is made to correspond to the optical axis L located at the foregoing object. The correct χ of the optical axis at the standby position, the γ-seat value of 1 (four), and the Υ coordinate value are registered in the memory of the f(4)-transfer 61a (step S7). 夕助控帝" ^ 5〇?C' The same steps from % to SU, and 317417 18 Ύ "厶: The correct w coordinate value corresponding to the aforementioned light M is registered in the memory of the aforementioned 4 = temple surface position. Next, for example, the supply control unit and the aforementioned steps S3 to S7 are applied. The objective lens 7b of 0 is operated, and the correct Χ and γ coordinate values of the preceding axes of the steps S13 to sn of the shoulder 舴H r 登录 are registered in the memory/fan of the standby position portion 6U of J::b. The shot/objective movement control is performed before the disc/# the remaining objective lens 7a of the (4) 5, the action of step S7 is the same as the action of step S_ to S22, and the optical axis corresponding to the position of the green l position is correct. , γ, ", brother is waiting to move the system Qiu 61 軚 value hill recorded in the aforementioned laser / objective lens == and end instructions -) action. In the above-described manner, the positive ^* '払 value of the optical axis of the mechanical position can be registered in advance in the above-mentioned thunder for the positions c and 7d of the origin of the X and Υ coordinate axes corresponding thereto. Shooting / objective lens movement control 邙 6〗 A memory Zhao. After that, it is placed on the aforementioned workbench.
的缺陷部等的加工。 ^之工件W :士，在前述控制電腦61開始作動後，即利用前述馬 達驅動益60使前述工作台驅動裝置（未圖示）產生作動， 而使工件W與雷射加工頭2G相對地往χ、γ轴方向 移動。雷射加工頭20 ’其光學系8之光軸L的位置，係移 動至預先由檢查裳置找出並測定之例如如第9Α圖所示之 工件w之配線wl的缺陷部（短路部）wia的中央位置。 接著’再根據前述缺陷部wla的形狀、大小，選擇並交換 其加工所需倍率的物鏡7。 、 317417 19 1342250 :此時，例如’如第3圖、第4圖所示’將位於前述光 ’. 之位置的5倍的物鏡&換成位於其右側第2個位置 .的50倍的物鏡7c時，如第7圖所示，將登錄於前述雷射/ 物鏡移動控制部61a之記憶體的物鏡7c # χ、γ座標^下 -載=前述主控制部61d (步驟51〇1)。再由該主控制二川 •對剛述伺服驅動器60輸出僅以對應物鏡7c之X、γ座標 ，的移動量使前述\軸舰馬達52與丫㈣服馬達 籲時進行作動的指令（步驟sl〇2)。根據該指令，χ軸伺服 馬達^與Υ軸伺服馬達％會藉由根據線性編碼器62、63 之各檢測值的位置反饋控制進行作動，而使前述X軸滑板 44與Υ軸滑板46分別朝X、Υ軸方向x、y僅移動對應X、 標值的移動量（步驟s】〇3)。藉此，前述物鏡π會朝 者W述光軸L，沿著連接位於該待機位置之光軸的位置與 光軸L的直線上移動，並在物鏡7c之光軸與前述光轴l 之位置一致時停止而定位。係依照上述方式結束將5倍物 鲁鏡7a換成50倍物鏡7c的物鏡交換處理。 接著，為根據$述檢查裝置所測定之缺陷部w丨&的形 狀尺寸，使雷射光R的光點p位於由前述主控制部6! d 所求得之前述χ、γ座標軸上的加工開始位置（短路部wU 之切斷開始位置的X、γ座標值）ρι，乃根據前述雷射/ 物鏡移動控制部61a的指令使前述X軸伺服馬達52與γ 轴祠服馬達56進行作動（步驟S104)。藉此，可使前述X、 Y袖滑板44、46產生移動，並使固定於γ軸滑板46的物 鏡7c朝Χ、γ轴方向x、y合成移動，而前述選擇之5〇倍 20 3J7417 丄〜250 的物鏡7c的光軸位置，係由前述光轴l的位置，如第9 b 二=士形成到達朝χ、γ轴方向的一方（在第9B . 方）僅移動預定距離的加工開始光軸位置S1 (座 士 y 1)因此，當雷射光源2在該狀態下產生作動 二=雷射震盛器3所輪出的雷射光尺，會由前述物鏡 =轴通過朝χ、Υ轴方向x、y僅偏移預定距離如、 y、/置，並错由對應距離Sxl、Syl之物鏡7c的折射 ^的^化使前述#射光R的光點p成像於㈣加工開始位 置p 1 〇 因此，係在前述加工開始位置pl f子工件w之缺陷部 二射光R的同0寺，使前述x、γ轴词服馬達5 2、 6進仃作動’再藉由前述χ、γ轴滑板44、46，使物鏡 =光㈣位置移動至加1完成位置哎座標Sx2'Sy2)。 二：鏡7c之折射角的變化，使雷射光r 丨先f P的位置由前述加工開始位置pi朝X、Y轴方向x、 =反側移動至加工完成位置ρ2，而進行前述缺陷部之 私路部wla的切斷加工（步驟S105)。 以下，同樣地可在將必要之倍率的物鏡 二加。此外，進仃物鏡7交換時之工件〜表 可稭由使前述Z軸伺服馬達42 于…、 如上所述’根據本實施例之雷射加工方 射震盈器3繼之雷射U，通蝴蝴鏡6與: 317417 21 1342250 鏡7之光學系8後照射於工件W而進行預定之被加工部之 加工的雷射加工方法，係形成：藉由使前述物鏡7在與前 光予系8之光軸L呈垂直之面内移動，而使通過該物鏡 7成像於前述工㈣之前述雷射光R的光點p的位置移動 以進行加工的構成。因此，可使照射在工件〜之雷射光rProcessing of defective parts, etc. After the control computer 61 starts to operate, the workpiece drive device (not shown) is actuated by the motor drive benefit 60, and the workpiece W is opposed to the laser processing head 2G. χ, γ axis direction movement. The position of the optical axis L of the optical system 8 of the laser processing head 20' is moved to a defect portion (short-circuit portion) of the wiring w1 of the workpiece w which is found and measured in advance by the inspection skirt, for example, as shown in Fig. 9 The central location of the wia. Then, based on the shape and size of the defect portion w1a, the objective lens 7 having the required magnification for processing is selected and exchanged. 317417 19 1342250 : At this time, for example, 'as shown in Fig. 3 and Fig. 4', the objective lens & at 5 times the position of the aforementioned light '. is replaced by 50 times the second position on the right side thereof. In the case of the objective lens 7c, as shown in Fig. 7, the objective lens 7c # χ, γ coordinate of the memory of the laser/object movement control unit 61a is input to the main control unit 61d (step 51〇1). . Further, the main control unit 2 outputs a command for the servo drive 60 to output the X-axis ship motor 52 and the 四(4) service motor only when the X and γ coordinates of the objective lens 7c are outputted (step sl1〇). 2). According to the command, the x-axis servo motor and the x-axis servo motor % are actuated by the position feedback control according to the detected values of the linear encoders 62, 63, and the X-axis slide plate 44 and the x-axis slide plate 46 are respectively turned toward X, the x-axis direction x, y only moves the amount of movement corresponding to X, the value (step s) 〇 3). Thereby, the objective lens π is moved toward the optical axis L, along a line connecting the position of the optical axis at the standby position with the optical axis L, and at the position of the optical axis of the objective lens 7c and the optical axis 1 Stop and position when consistent. The objective lens exchange process of replacing the 5x object mirror 7a with the 50x objective lens 7c is terminated as described above. Next, the spot p of the laser light R is placed on the aforementioned χ and γ coordinate axes obtained by the main control unit 6 ! d in accordance with the shape and size of the defective portion w 丨 & The start position (X, γ coordinate value of the cutting start position of the short-circuit portion wU) ρι is activated by the X-axis servo motor 52 and the γ-axis servo motor 56 in accordance with an instruction from the laser/object movement control unit 61a ( Step S104). Thereby, the X, Y-sleeve sliders 44, 46 can be moved, and the objective lens 7c fixed to the γ-axis slide plate 46 can be combined and moved in the Χ, γ-axis directions x, y, and the aforementioned selection is 5 times 20 3J7417 丄The optical axis position of the objective lens 7c of ～250 is determined by the position of the optical axis 1 described above, and the processing of the ninth direction of the ninth direction (in the ninth direction) is only a predetermined distance. The optical axis position S1 (seat y 1) Therefore, when the laser light source 2 generates the laser light ray which is rotated by the laser illuminator 3 in this state, the objective lens = the axis passes through the χ, Υ axis The directions x, y are only shifted by a predetermined distance such as y, /, and are offset by the refraction of the objective lens 7c corresponding to the distances Sx1, Syl, so that the spot p of the aforementioned #light R is imaged at the (four) processing start position p 1 Therefore, at the same processing start position pl f, the defect portion of the workpiece w is the same as the temple of the light R, so that the x, γ axis of the motor 5 2, 6 is activated, and then by the aforementioned χ, γ axis The sliders 44, 46 move the objective lens = light (four) position to the plus 1 completion position 哎 coordinate Sx2'Sy2). Second, the change of the refraction angle of the mirror 7c causes the position of the laser light r 丨 first f P to move from the processing start position pi toward the X and Y axis directions x, = the reverse side to the processing completion position ρ2, and the defective portion is performed. The cutting process of the private road portion wla (step S105). Hereinafter, the objective lens of the necessary magnification can be added in the same manner. In addition, the workpiece-to-table when the entrance objective lens 7 is exchanged can be made by the aforementioned Z-axis servo motor 42, as described above, the laser processing according to the present embodiment is followed by the laser striker 3, followed by the laser U. Butterfly mirror 6 and: 317417 21 1342250 A laser processing method in which the optical system 8 of the mirror 7 is irradiated onto the workpiece W to perform processing of a predetermined processed portion is formed by causing the objective lens 7 to be in contact with the front light The optical axis L of 8 is moved in a vertical plane, and is moved by the objective lens 7 to be imaged at the position of the spot p of the aforementioned laser light R of the above-mentioned work (4) for processing. Therefore, it is possible to irradiate the laser light to the workpiece ~
的光點P位置，根據對應前述物鏡7之光學系8之光轴L :動位置，進行微幅移動。藉由該雷射光R之光點位置 ，動’即使之被加工部分為電子電路基板中之複 雜形狀或微細的加工部份，亦可進行正確的加工 =多餘的部分加工。此外，在進行工件w之加 不 =工件㈣以及具有前述光學系8之雷射加工頭㈣ 之大型構造體本身斜菩恭 可使工#wp 的光點？微幅移動，因此 順利之雷射Μ的光點的微幅移動更為容易且 外由：：利且迅速地進行工件W的雷射加工。此The position of the light spot P is slightly moved according to the optical axis L of the optical system 8 corresponding to the objective lens 7: the moving position. By the position of the spot of the laser light R, even if the processed portion is a complex shape or a fine processed portion in the electronic circuit substrate, correct processing = redundant partial processing can be performed. In addition, in the addition of the workpiece w, the workpiece (four) and the large-scale structure of the laser processing head (4) having the optical system 8 described above can be used to make the #wp spot. The micro-motion moves, so the slight movement of the spot of the smooth laser is easier and the external:: The laser processing of the workpiece W is performed quickly and smoothly. this
匕，、*使用到先前之f Θ透鏡，故得以縮小 的光點P，進行微細加工。 田射先R ，夕卜’根據上述實施例之雷射加工裝置卜係使雷射 7之先^ ^^之雷射光R’通過具有成像透鏡6與物鏡 九子尔8而照射於工件w 工的雷射加工裳置】’且^進订預疋之破加工部的加 學季8的”備有·以物鏡之光軸可與前述光 心= 二Γ的方式支推前述物鏡轴滑板 迷物鏡7可垂直橫 I46使別 y移動的X缸、、j乙元于系8的先軸L而朝Y軸方向 π反44，將該X軸滑板44往與γ軸方向y呈 317417 22 1342250 ίΓ二ί Γ4方向χ引導的導板43;對應該導板43使前述 '水yU主Χ軸方向Χ移動的Χ軸移動骏置57;使前 :二板…軸方向y移動之γ轴移動裝置58;使 7\二 裝置57,58產生作―控制通過前述物鏡 而，像於工件w之雷射Μ之光點位置的移動的控制裝 置61。 因此，可藉由控制裝置61使χ，γ軸移動裝置57， 58產生作動，並藉由χ，γ軸移動裝置57, μ使γ軸滑 板46朝著垂直橫切光學系8之光軸[的χ, γ軸方向χ， y的二方向引導移動至引導體43 ’如此—來，即可使支撐 於前述Y軸滑板46的物鏡7正確地朝著前述光學系8的 光軸移動。因此，不僅可適當實施上述雷射加工方法，同 時又可提高前述物鏡7之對前述光學系8之光軸L的移動 位置的自由度。其結果，將可適切地對應工件w之複雜的 被加工部的形狀而有效地進行雷射加工。 此外’根據上述實施例之雷射加工裝置1，係形成： 剷述控制裝置61，以前述光學系8之光軸l的位置為原 點、將與前述X軸滑板44與Y軸滑板46之移動方向平行 之直角座標軸（X，Y座標軸）有關之位於前述物鏡7之待機 位置之光軸的座標值預先予以登錄，再根據前述直角座標 軸的物鏡7之光軸的座標值使前述第1、第2移動裝置57, 58產生作動而控制前述物鏡7之移動的構成。因此，可使 前述物鏡7正確地朝前述光學系8的光軸L移動、定位， 並在良好精確度下進行工件之微細之被加工部的雷射加 23 317417 1342250 工。 此外根據上述實施例之雷射加工裝置I，係形成. 利用藉由m述控制裝置6丨控制作動之第3移動裝置μ使 •前述=板43朝著與前述光學系8之光軸L平行的方向移 動調節，而前述Y軸滑板46支撐倍率相異之複數個物^) 的構成。因此，可使支樓於γ轴滑板46之複數個不同倍 率的物鏡7的必要物鏡得以選擇性地交換移動至光學系8 •之光轴L⑴立置以進行雷射加I。此外藉&配合前述 之物鏡J的倍率，並利用第3移動裝置59使導板43往前 述光學系8之光轴l方向移動調節，即可使對應所選擇之 物鏡7的雷射光尺的光點徑（光點ρ)正確地成像於工件^ 此外’由於前述第！、第2、第3移動裝置57、58、 外係做成由伺服馬達52、56、42，以及由該词服馬達$ 56、42所驅動之滚珠螺桿機構構成的構造，因此可介 珠螺桿機構以平滑的直線運動變換舰馬達52、56、^ #的旋轉而順利地進行Υ軸滑板46的移動，並得以進— 正確執行物鏡7的移動、定位。 少 此外’根據上述一實施例之雷射加工裝置丨，係說明 在前述丫㈣板46中，沿著χ軸方向χ延伸之—直線上 的位置配置不同倍率之4個必 個物鏡7a至7d的例子。但是， 本發明未受限於該數量，亦 a 了 δ又置4個以外的複數個物鏡 7 ’且可任意配置在前述γ羞 〆 ^ Υ軸滑板46。此外，在實施例中 係說明了 ：以可自由往X軸 釉方向X移動之方式將X軸滑板 44支撐在前述Z軸滑板3 反 而以可自由往γ軸方向移 317417 24 W2250 動之方式將γ軸滑板46支撐在 是本發明並未渴限於該形式 π ❸例子。但 向V之古4 w 亦可以可自由移動於γ铀古 Π y之方式將Υ軸滑板46支撐 、Y軸方 «，而以可自由移動於板37或導板 切在Υ軸滑板46，朗物鏡7 式將Χ轴滑板44 外，在與f丨士 / #丄 兄7叹置在X軸滑板 卜在只知例中係错由經由^^^料 此 7、’而使前述X軸滑板44間接支據於前述導才反轴'月板 引導移動。但亦可取代上述 以進行匕,,* use the previous f Θ lens, so the reduced spot P can be finely processed. The field is first R, and the laser processing apparatus according to the above embodiment causes the laser light R' of the laser beam 7 to be irradiated to the workpiece by having the imaging lens 6 and the objective lens 九子尔8. The laser processing is set to be ''and the final season of the processing section of the processing section is 8". The optical axis of the objective lens can be used to push the objective lens axis skateboard fan with the aforementioned optical center = two-way method. The objective lens 7 can vertically traverse the angle I46 so that the X cylinder that moves y, the element J of the system 8 is reversed to the front axis L of the system 8 by π in the Y-axis direction, and the X-axis slide plate 44 is 317417 22 1342250 toward the γ-axis direction y.导 ί ί ί χ Γ ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; The device 58; the 7/2 device 57, 58 is generated as a control device 61 for controlling the movement of the spot position of the laser beam of the workpiece w through the objective lens. Therefore, the control device 61 can be used to make the The γ-axis moving devices 57, 58 actuate, and by means of χ, the γ-axis moving device 57, μ causes the γ-axis slide 46 to cross the optical axis of the optical system 8 perpendicularly [[, γ-axis χ, the two directions of y are guided to move to the guiding body 43' such that the objective lens 7 supported by the Y-axis slide 46 can be correctly moved toward the optical axis of the optical system 8. Therefore, not only the above can be appropriately implemented. At the same time, the laser processing method can increase the degree of freedom of the objective lens 7 to the position of movement of the optical axis L of the optical system 8. As a result, the shape of the workpiece to be processed can be effectively matched to the shape of the workpiece to be processed. In addition, the laser processing apparatus 1 according to the above embodiment is formed with a description device 61 that uses the position of the optical axis 1 of the optical system 8 as an origin and will be associated with the X-axis slide 44. The coordinate value of the optical axis of the right angle coordinate axis (X, Y coordinate axis) of the Y-axis slide plate 46 in the standby direction of the objective lens 7 is registered in advance, and the coordinate value of the optical axis of the objective lens 7 according to the orthogonal coordinate axis is further registered. The first and second moving devices 57 and 58 are actuated to control the movement of the objective lens 7. Therefore, the objective lens 7 can be accurately moved and positioned toward the optical axis L of the optical system 8, and is good. With a high degree of precision, the laser of the workpiece to be processed is increased by 23 317 417 1342250. Further, the laser processing apparatus 1 according to the above embodiment is formed. The third control operation is performed by the control unit 6 The moving device μ causes the aforementioned plate 43 to be moved and moved in a direction parallel to the optical axis L of the optical system 8, and the Y-axis slide plate 46 supports a plurality of objects having different magnifications. The necessary objective lens of the objective lens 7 of a plurality of different magnifications of the γ-axis slide plate 46 is selectively exchanged and moved to the optical system 8 • The optical axis L(1) is placed upright for laser addition I. In addition, the objective lens J is matched with the aforementioned objective lens J. With the magnification of the third moving device 59, the guide plate 43 is moved in the direction of the optical axis 1 of the optical system 8, so that the spot diameter (light point ρ) of the laser light beam corresponding to the selected objective lens 7 is correct. The image is imaged on the workpiece ^ In addition' due to the aforementioned! The second and third moving devices 57 and 58 and the external system are configured by servo motors 52, 56, and 42 and a ball screw mechanism driven by the word motors 56 and 42. Therefore, the bead screw can be used. The mechanism smoothly shifts the movement of the stern slides 46 by the smooth linear motion shifting of the ship motors 52, 56, and #, and advances the movement and positioning of the objective lens 7. In addition, in the laser processing apparatus according to the above-described embodiment, four necessary objective lenses 7a to 7d having different magnifications are disposed in the straight line in the x-axis plate 46 along the z-axis direction. example of. However, the present invention is not limited to this number, and a plurality of objective lenses 7' other than δ are also set to δ and can be arbitrarily arranged in the aforementioned gamma 〆 Υ axis slide plate 46. Further, in the embodiment, it is explained that the X-axis slide plate 44 is supported by the Z-axis slide plate 3 so as to be freely movable in the X-axis glaze direction X, and is moved in a freely γ-axis direction by 317417 24 W2250. The gamma-axis slide 46 is supported in the present invention and is not limited to this form of the π ❸ example. However, it is also possible to move the Υ 滑板 滑板 滑板 46 支撑 支撑 滑板 滑板 滑板 滑板 滑板 滑板 滑板 滑板 滑板 滑板 滑板 滑板 滑板 滑板 滑板 滑板 滑板 滑板 滑板 滑板 滑板 滑板 滑板 滑板 γ γ γ γ γ γ γ γ γ γ γ γ γ γ γ γ The Long Objective Mirror 7 type will be placed on the x-axis skateboard 44, and in the X-axis skateboard with the f gentleman / #丄兄7 sigh, in the only known case, the above X-axis is made by ^^^ The slide plate 44 is indirectly supported by the front guide axis and the moon plate guiding movement. But it can also be replaced by the above
軸導軌47而直接將χ軸滑板4 叹置X 導移動。 以牙万、¥板43而進行引 另外’亦可取代線性編碼器62, 6 :=安裝在舰馬達52，—的二= [產業上之可利用性] 本發明係可適用於照射雷射光以去除及修正電子電路 基板上所產生之各種缺陷部的加工等的雷射加工方法以 雷射加工裝置’可藉由控制裝置使移動農置產生作動，並 藉由該移動裝置，使可動體面向支持體並朝著垂直橫切光 學系之光㈣方向引導移動’而使支樓於前述可動體的物 鏡得以朝著前述光學系的光軸正確移動。 【圖式簡單說明】 第1圖係顯不本發明之一實施例之雷射加工裴置的系 統圖。 ' 第2圖係顯示本發明之一實施例之雷射加工裝置的側 317417 25 1342250 面圖 面圖。 第3圖係顯示本發明 之—實施例之雷射加工裝置的正 卓4圖係由第3 平面圖。 弟3圖之A方向觀察本發明之一實施例的 第®係、说明本發明之—實施例中的物鏡的待機位 座私的指示動作的流程圖。 第6圖係說明本發明之—實施例中的物鏡的待機位置 純的Μ動作（後續）的流程圖。 第7圖係說明本發明之一實施例之雷射加工裝置中的 物鏡的動作的流程圖。 第8圖係顯示本發明之一實施例之指示用十字標記基 板的平面圖。 土 第9 Α圖與第9Β圖係說明本發明之一實施例之雷射加 工裝置所進行之加工方法的側面圖（上圖）以及平面圖（下 圖）。 主要元件符號說明】 1 3 6 8 12 20 24 雷射電源 雷射光轴調整鏡 物鏡 工作台 上部鏡體（鏡體） 下部鏡體（鏡體） 雷射加工裝置 2 雷射震盪器 4 成像透鏡 7 光系學系 CCD相機（照相裝置）α 雷射加工頭 21 透鏡移動裝置 25 317417 26 1342250 '· <· 28 暴 樑構件 35 2轴引導軌道 • 36 • 滑動基座 37 2軸滑板 42 Z轴伺服馬達 43 導板（基座體） 44 X軸滑板（可動支持體） 45 γ輛引導執道 46 •·- Y轴滑板（可動體） 47 X轴引導軌道 ： 52 X軸伺服馬達 56 γ軸伺服馬達 57、 58、59X、Y、z軸移動裝置（第1 、第2、第3的移動裝置 60 馬達驅動器 61 控制電腦（控制裝置） 胃61 a 雷射/物鏡移動控制部 61b 影像處理部 • 61c 顯示部 61d 主控制部 L 雷射光轴 M ^示用標示基板（標示基板） Ml A準點 R 雷射光 W 工件 P 光點 wl 配線 Sxl、 Syl座標 φ Sx2 、座標 Pi 加工開始位置 p2 力0工完成位置 S2 光軸位置 317417The shaft guide 47 directly moves the x-axis slide 4 to the X guide. It is also possible to replace the linear encoder 62, 6 := mounted on the ship motor 52, and the second is replaced by the linear encoder 62. [Industrial Applicability] The present invention is applicable to irradiating laser light. A laser processing method for removing and correcting processing of various defective portions generated on an electronic circuit board, the laser processing device can be actuated by the control device, and the movable device is used to move the movable body The objective lens of the movable body is correctly moved toward the optical axis of the optical system by facing the support and guiding the movement toward the light (four) direction perpendicular to the optical system. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a system diagram showing a laser processing apparatus according to an embodiment of the present invention. Fig. 2 is a side elevational view showing the side 317417 25 1342250 of the laser processing apparatus of one embodiment of the present invention. Fig. 3 is a plan view showing the Fig. 4 of the laser processing apparatus of the embodiment of the present invention. In the direction A of the third embodiment, a flowchart of an indication operation of the standby position of the objective lens in the embodiment of the present invention is observed. Fig. 6 is a flow chart for explaining the standby position of the objective lens in the embodiment of the present invention. Fig. 7 is a flow chart for explaining the operation of the objective lens in the laser processing apparatus according to an embodiment of the present invention. Fig. 8 is a plan view showing a cross mark substrate for indicating an embodiment of the present invention. The ninth and ninth drawings illustrate a side view (top view) and a plan view (bottom view) of a processing method performed by a laser processing apparatus according to an embodiment of the present invention. Main component symbol description] 1 3 6 8 12 20 24 Laser power laser optical axis adjustment mirror objective lens upper mirror body (mirror body) lower mirror body (mirror body) laser processing device 2 laser oscillator 4 imaging lens 7 Department of Light Science CCD Camera (Camera) α Laser Processing Head 21 Lens Moving Device 25 317417 26 1342250 '· <· 28 Beam Member 35 2-axis Guide Track • 36 • Sliding Base 37 2 Axis Slider 42 Z-Axis Servo motor 43 guide (base body) 44 X-axis slide (movable support) 45 γ-guideway 46 •·- Y-axis slide (movable body) 47 X-axis guide rail: 52 X-axis servo motor 56 γ-axis Servo motor 57, 58, 59X, Y, z-axis moving device (first, second, third mobile device 60 motor driver 61 control computer (control device) stomach 61 a laser / objective lens movement control unit 61b image processing unit • 61c Display unit 61d Main control unit L Laser axis M ^ Display label substrate (label substrate) Ml A Exact point R Laser light W Work piece P Spot w1 Wiring Sxl, Syl coordinate φ Sx2, Coordinate Pi Machining start position p2 0 workers complete position S2 axis position 317 417