1337839 099年08月10日修正替換頁 六、發明說明： 【發明所屬之技術領域】 [麵1] 本發明關於一種電路板之防護方法，尤其係應用於數位 相機等電子裝置上之電路板之電磁干擾防護方法及電路 板組件。 【先前技林ί】 [0002] 隨著電子科技不斷發展與進步，各式各樣的電子產品均 朝著數位化發展。並且，為了符合輕便性與實用性之需 要，在電子產品之設計規格上，都趨向輕薄短小、功能 多、且處理速度快發展，以利於製作之產品能更容易攜 帶；且更符合現代之生活需求。特别係在多媒體電腦大 行其道後，強大的運算能力，可輕:易地處理各種音效、 影像、圖樣等數位化資料。連帶之使與影像有關之周邊 設備，亦受到廣泛發展與運用。例如，個人數位處理器 、數位音響、掃描器以及數位相機等。 [0003] 例如，以目前極為流行的個人數位助理系統來說，便由 於其方便攜帶，可處理大量數位資訊，並可通過相關的 通訊裝置取得即時關鍵字因此受到社會大眾普遍喜愛與 使用。特徵係隨著積體電路技術之發展個人數位助理系 統具有更強大的運算功能，且記憶體容量不斷增加係以 愈來愈多的謀劃應用軟體、資料庫等皆被存放於小巧的 個人數位助理系統中，並籍著結合網際網路與通訊系統 ，而使個人數位助理器具有多媒體播放之功能。 [0004] 然而，隨著積體電路越趨密集，電子元器件之間之組裝 也要求更高的可靠度，同時隨著人力成本的提高，人力 096111598 表單編號Α0101 第4頁/共20頁 0993285913-0 1337839 099年08月10日後正替换頁 之要求之降低以及成本之降低也越來越受到人們的重視 [0005] 先前一種降低電路板電磁干擾之裝置，如圖1及圖2所示 ，該裝置包括一電路板本體1，至少一與電路板本體電連 接之地線接口 2以及一遮罩3。該遮罩3用來收容所述電路 板本體1，在該遮罩3朝向電路板本體1之底部設置有至少 一與地線接口 2電氣連接之導電泡棉4。 [0006] 上述防護電路板電磁干擾裝置係通過遮罩3底部設置之導 φ 電泡棉4與相應的地線接口 2電氣連接，即導電泡棉4與地 線接口2的相應貼合，以導除靜電，同時利用遮罩3對電 子元件所產生的電磁波加以阻截以達到電磁遮罩之作用 。惟，該種方法往往多耗材料，增加成本及人力，而且 因導電泡棉4與地線接口 2的公差尺寸之原因會導致接觸 不良，影響電磁遮罩效果。 【發明内容】 [0007] 有鑒於此，有必要提供一種能降低成本而且可提高電磁 Φ 遮罩效果之電路板之電磁干擾防護方法及電路板組件。 [0008] 一種電路板之電磁干擾防護方法，所述方法包括以下步 驟： [0009] 提供一電路板，該電路板包括一印刷有電路之電路板基 板，至少一與該電路板之電路電連接之地線接口； [0010] 從電路板基板邊緣延伸出至少一與所述電路板之地線接 口電連接之導電片，導電片包括導電片基板與貼附於導 電片基板上之金屬片，導電片基板由絕緣隔熱易彎之材 096111598 表單編號 A0I01 第 5 頁/共 20 頁 0993285913-0 1337839 [0011] [0012] [0013] [0014] [0015] [0016] 096111598 099年〇8月10日後正替换 料製成； 提供一金屬防護裝置，將所述電路板及導電片收容於該 金屬防護裝置，並使所述金屬片緊貼該金屬防護裝置並 與該金屬防護裝置電氣連接。 —種電路板之電磁干擾防護方法，所述方法包括以下步 驟·· k供一電路板，該電路板包括—印刷有電路的電路板基 板’至少一與該電路板基板之電路電連接的地線介面； 從電路板基板邊緣相接至少一所述電路板之地線接口電 連接之導電片，導電片包括導電片墓板為貼附於導電片 基板上之金屬片，導電片基板之一端適過至少一彈性件 基板之邊緣，導電片基板之另一端從電路板基板之邊緣 延伸而出； 提供一金屬防護裝置，將所述電路板及導電片收容於該 金屬防護裝置，並使所述金屬片緊貼該金屬防護裝置並 與該金屬防護裝置電氣連接。 一種防護電磁干擾的電路板組件，包括一電路板、該電 路板包括一印刷有電路之電路板基板’至少一與該電路 板基板之電路電連接的地線接口。該電路板組件還包括 至少一導電片以及一金屬防護裝置，該導電片與電路枝 之地線接口電連接，且從電路板基板邊緣延伸而出： 金屬防護裝置用來收容所述電路板及導電片，導電片^ 括導電片基板與貼附於導電片基板上之金屬片，導電片 基板由絕缘隔熱易彎之材料製成’且所述金屬片緊貼該 表單编號A0101 第6頁/共20頁 〇993285913-〇 099年08月10日梭正替换頁 金屬防護裝置並與該金屬防護裝置電氣連接。 [0017] 上述電路板之電磁干擾防護方法利用與電路板上的地線 接口電連接的導電片與金屬防護罩電氣連接，因該導電 片在設置及製作電路板的同時便可製作而成，因此節省 了人力。而且，由於導電片之可撓性及彈性，使得導電 片緊貼金屬防護罩，進一步避免了接觸不良之現象。 【實施方式】 [0018] 為了對本發明作更進一步的說明，舉一較佳實施例並配 合圖式詳細描述如下。 [0019] 請參閱圖3及圖4，本發明實施例所提供之電路板防電磁 干擾之方法，包括以下步驟。 [0020] 步驟一：提供一電路板11。 [0021] 所述電路板11包括一電路板基板12，至少一貼附於基板 12上之地線接口 13，至少一用於傳輸資料之數據線14以 及至少一固接於該電路板基板12上之複數焊盤15。 [0022] 所述電路板11可以為印刷線電路板（Printed Circuit Board，簡稱PCB板）。該電路板可將具有特定功能之電 子元器件，都鑲在該PCB板上。而且除了固定各種小的電 子元器件外，PCB板還用於為上述電子元器件提供相互的 電連接。本實施例中印刷電路板係指用於數位相機之鏡 頭模組之影像感測器之電路板。 [0023] 所述電路板基板12為一絕緣層，其材料可以為由絕緣隔 熱、並易彎之材質所製作成，且所述電路板基板12為撓 性基板。在該基板11上可利用印刷技術將電路印刷在其 表單編號A010丨 第7頁/共20頁 0993285913-0 1337839 099年08月10日梭正替換頁 上，再設置積體電路、電阻等電子元件（圖未示）。 [0024] 所述地線接口 13貼附於電路板基板12上，用於導除電路 板11内各電子元器件中存在的靜電。所述地線接口 13與 電路板11之印刷電路（圖未示）電連接。 [0025] 所述複數焊盤15設置在電路板基板12之相對於設置地線 接口 13表面之另一面上，且該複數焊盤15暴露於基板11 之表面，該複數焊盤15用於焊接電子元器件。 [0026] 所述數據線14與電路板11之焊盤15電氣連接，其所佔用 焊盤15之數量根據需要而定。 [0027] 步驟二：該電路板基板12彈悻連接至少一導電片16，該 導電片16與所述電路板之地線接口 13電連接。 . · · [0028] 該導電片16包括導電片基板161與貼附於導電片基板161 上之金屬片162。 [0029] 該導電片基板161可以與基板12—體成型且從基板12邊緣 延伸而出，並且延伸出基板11之外側。該導電片基板161 與基板12材料相同，即由絕緣隔熱易彎之材料製成，且 該導電片基板161為撓性基板。 [0030] 該金屬片162可以與所述地線接口 13 —體成型，也可以通 過焊接等方法與所述地線接口 13電氣連接在一起，在本 實施例中，所述金屬片162與所述地線接口 13—體成型， 其材料可以為銅。 ♦ [0031] 步驟三：提供一金屬防護裝置17，並將所述電路板11及 導電片16收容於該金屬防護裝置17中。 096111598 表單編號A0101 第8頁/共20頁 0993285913-0 1337839 099年08月10日修正替換頁 [0032] 如圖4所示’所述金屬防護裝置1 7可以為一無蓋槽形結構 ，包括側壁171和一與側壁171 —體成型之底部172。所 述側壁1 71之高度根據需要而定。 [0033] 該側壁1 Π之任一側設置有一開口 1 7 3，用於引出電路板 11之數據線14 ’優選地，該開口 173之寬度與數據線14 之寬度相當。 [0034] 該底部172之面積與電路板基板12之面積相當。 [0035] 將所述電路板11及導電片16組裝入金屬防護裝置17時， 在電路板11之數據線14與金屬防護裝置17之開口 173之 尺寸配合下，將限定電路板基板12裝入金屬防護裝置η 之底部172之位置，並在裝入電路板基板12之同時，導電 片16之導電片基板161與金屬片162將彎折並由於其本身 所具有的韌性而緊靠在側壁171上，使得地線接口 13通過 導電片16與金屬防護裝置17導通。 [0036] 當然’可以理解，該導電片基板161還可以通過其他方法 彈性連接於電路板基板12之邊緣，例如，導電片基板161 為撓性基板’而電路板基板12為非撓性基板，導電片基 板161之一端利用鉚接等方法固接於電路板基板π之邊緣 ，該導電片基板161之另一端從電路板基板12之邊緣延伸 而出，利用導電片基板161之彈性使得導電片16之金屬片 162緊靠於金屬防護裝置17之侧壁171上。甚至導電片基 板161與電路板基板12都為非換性材料，導電片基板丨61 之一端通過至少一彈性件（圖未示）例如彈簧彈性相連於 電路板基板12之邊緣，該導電月基板161之另—端從電路 0993285913-0 096111598 表單編號A0101 第9頁/共20頁 1337839 099年08月10日 板基板12之邊緣延伸而出，也可以使得導電片16之金屬 片162緊靠在金屬防護裝置17之側壁171上。 闕請參閱圖5，為所述電路板u、導電片16與金屬防護裝置 17裝配在一起之結構剖視圖，由於導電片丨6由易彎材料 製成而在彎折時具有彈性，且金屬防護裝置17之底部172 之面積與電路板11之面積相當，所述將該電路板u置入 金屬防護裝置17中時，由於導電片基板161之彈力，導電 片16將彎折緊貼於金屬防護裝置17之侧壁171上，此時導 電片16之金屬片162與金屬防護裝置17將導通。 [0038] 至此，以上步驟則形成一防護電磁干擾之電路板組件， 如果，還需增加其他元件，如影像缘測.晶片，繼續組裝 其即可。 [0039] 當然，由於電路板11上還可設置有其他元件，如鏡頭模 組，所以電路板11不會由於導電片16之彈力而發生脊曲 。本發明利用導電片基板161之彈力將導電片16之金屬片 162壓在金屬防護裝置17之側壁171上，從而將電路板“ 之地線接口 13與金屬防護裝置17導通，從而完成消除靜 電，而且由於導電片16之可撓性及彈性，使得導電片16 緊貼金屬防護罩17，避免了接觸不良之現象。同時，導 電片16之導電片基板161與金屬片162在電路板11成形時 同時製作而成，省去了貼附導電泡棉之工時與人力，降 低了成本。 [0040] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，本發 096111598 表單蝙號A0101 第10頁/共20頁 0993285913-0 099年08月10日修正替換頁 1.337839 明之範圍並不以上述實施例為限，舉凡熟習本案技藝之 人士援依本發明之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 • [〇〇41] 圖1係先前降低電路板電磁干擾之裝置所提供之電路板之 結構分解示意圖； [0042] 圖2係為圖1降低電路板電磁干擾之裝置之遮罩之結構示 意圖； • [0043] 圖3係本發明實施例之電路板結構示意圖； [0044] 圖4係本發明實施例之電路板與金屬防護裝置之組裝結構 示意圖； [0045] 圖5係圖4之組裝示意圖沿V-V線的剖視圖。 【主要元件符號說明】 [0046] 電路板本體：1 [0047] 地線接口 ： 2、13 [0048] 遮罩：3 [0049] 導電泡棉：4 [0050] 電路板：11 [0051] 電路板基板：12 [0052] 數據線：14 [0053] 焊盤：15 096111598 表單編號A0101 第11頁/共20頁 0993285913-0 1337839 099年08月10日修正替换頁 [0054] 導電片：1 6 [0055] 導電片基板：161 [0056] 金屬片：1 6 2 [0057] 金屬防護裝置：17 · [0058] 側壁：171 [0059] 底部：172 [0060] 開口 ： 1 7 31337839 Revision of page 10, August 10, 1999. Description of the invention: [Technical field of the invention] [Face 1] The present invention relates to a method for protecting a circuit board, particularly to a circuit board on an electronic device such as a digital camera. Electromagnetic interference protection method and circuit board assembly. [Previous Tech Lin] [0002] With the continuous development and advancement of electronic technology, all kinds of electronic products are moving towards digitalization. Moreover, in order to meet the needs of portability and practicability, the design specifications of electronic products tend to be light, thin, short, functional, and processing speed, so that the products can be more easily carried; and more in line with modern life. demand. Especially after the multimedia computer is popular, the powerful computing power can easily handle various digital data such as sound effects, images and patterns. The accompanying imaging equipment is also widely used and used. For example, personal digital processors, digital audio, scanners, and digital cameras. [0003] For example, in the currently popular personal digital assistant system, it is easy to carry, can process a large amount of digital information, and can obtain instant keywords through related communication devices, and thus is widely loved and used by the public. Features With the development of integrated circuit technology, the personal digital assistant system has more powerful computing functions, and the memory capacity is increasing. More and more planning applications, databases, etc. are stored in small personal digital assistants. In the system, combined with the Internet and communication system, the personal digital assistant has the function of multimedia playback. [0004] However, as integrated circuits become denser, assembly between electronic components requires higher reliability, and as labor costs increase, human 096111598 form number Α0101 4th page/total 20 pages 0993285913 -0 1337839 The reduction in the requirements for replacement pages after August 10, 099, and the reduction in cost are also receiving more and more attention. [0005] A device for reducing electromagnetic interference of circuit boards, as shown in Figures 1 and 2, The device comprises a circuit board body 1, at least one ground interface 2 electrically connected to the circuit board body, and a mask 3. The mask 3 is for accommodating the circuit board body 1. At the bottom of the mask 3 facing the circuit board body 1, at least one conductive foam 4 electrically connected to the ground interface 2 is disposed. [0006] The above-mentioned protective circuit board electromagnetic interference device is electrically connected to the corresponding ground wire interface 2 through the conductive φ electric foam 4 disposed at the bottom of the mask 3, that is, the corresponding bonding of the conductive foam 4 and the ground wire interface 2, The static electricity is removed, and the electromagnetic wave generated by the electronic component is blocked by the mask 3 to achieve the function of the electromagnetic mask. However, this method tends to consume more material, increase cost and labor, and the contact tolerance of the conductive foam 4 and the ground interface 2 may cause poor contact and affect the electromagnetic shielding effect. SUMMARY OF THE INVENTION [0007] In view of the above, it is necessary to provide an electromagnetic interference protection method and a circuit board assembly of a circuit board capable of reducing cost and improving electromagnetic Φ masking effect. [0008] A method for electromagnetic interference protection of a circuit board, the method comprising the following steps: [0009] providing a circuit board, the circuit board comprising a circuit board substrate printed with a circuit, at least one electrically connected to a circuit of the circuit board a grounding interface; [0010] extending from the edge of the circuit board substrate at least one conductive sheet electrically connected to the grounding interface of the circuit board, the conductive sheet comprising the conductive sheet substrate and the metal piece attached to the conductive sheet substrate, The conductive sheet substrate is made of insulating and heat-insulating material 096111598 Form No. A0I01 Page 5 of 20 0993285913-0 1337839 [0012] [0013] [0015] [0016] 096111598 099 〇 August After 10 days, the replacement material is prepared; a metal protection device is provided to receive the circuit board and the conductive sheet on the metal protection device, and the metal piece is in close contact with the metal protection device and electrically connected to the metal protection device. An electromagnetic interference protection method for a circuit board, the method comprising the steps of: k for a circuit board, the circuit board comprising: a circuit board substrate printed with a circuit at least one ground electrically connected to a circuit of the circuit board substrate a conductive layer electrically connected to the ground interface of the at least one of the circuit boards, the conductive sheet comprising the conductive sheet, the metal sheet attached to the conductive substrate, and one end of the conductive substrate Appropriate at least one edge of the elastic substrate, the other end of the conductive substrate extends from the edge of the circuit board; a metal guard is provided to receive the circuit board and the conductive sheet in the metal protection device The metal piece is in close contact with the metal guard and is electrically connected to the metal guard. A circuit board assembly for protecting against electromagnetic interference, comprising a circuit board comprising a circuit board substrate printed with a circuit at least one ground connection electrically connected to a circuit of the circuit board substrate. The circuit board assembly further includes at least one conductive sheet and a metal shield electrically connected to the ground connection of the circuit board and extending from the edge of the circuit board substrate: the metal protection device is used to receive the circuit board and The conductive sheet, the conductive sheet comprises a conductive sheet substrate and a metal sheet attached to the conductive sheet substrate, the conductive sheet substrate is made of an insulating and heat-insulating material, and the metal sheet is closely attached to the form No. A0101. Page / Total 20 pages 〇 993285913 - 08 August 10, 2008, the shuttle is replacing the metal guard and is electrically connected to the metal guard. [0017] The electromagnetic interference protection method of the circuit board is electrically connected to the metal shield by using a conductive sheet electrically connected to a ground interface on the circuit board, and the conductive sheet can be fabricated at the same time as the circuit board is disposed and fabricated. This saves manpower. Moreover, due to the flexibility and elasticity of the conductive sheet, the conductive sheet is in close contact with the metal shield, further avoiding the phenomenon of poor contact. [Embodiment] [0018] In order to further illustrate the present invention, a preferred embodiment will be described in detail below with reference to the drawings. [0019] Referring to FIG. 3 and FIG. 4, a method for preventing electromagnetic interference of a circuit board according to an embodiment of the present invention includes the following steps. [0020] Step 1: A circuit board 11 is provided. [0021] The circuit board 11 includes a circuit board substrate 12, at least one ground interface 13 attached to the substrate 12, at least one data line 14 for transmitting data, and at least one fixed to the circuit board substrate 12. The upper number of pads 15 on the top. [0022] The circuit board 11 may be a printed circuit board (PCB). The board is equipped with electronic components with specific functions on the PCB. Moreover, in addition to fixing various small electronic components, the PCB board is also used to provide electrical interconnections for the above electronic components. The printed circuit board in this embodiment refers to a circuit board of an image sensor used for a lens module of a digital camera. [0023] The circuit board substrate 12 is an insulating layer, and the material thereof may be made of a material that is insulated and easily bent, and the circuit board substrate 12 is a flexible substrate. On the substrate 11, the circuit can be printed on the form number A010丨7/20 pages 0993285913-0 1337839 on August 10th, the shuttle replacement page, and then the integrated circuit, resistor, etc. Component (not shown). [0024] The ground interface 13 is attached to the circuit board substrate 12 for discharging static electricity existing in each electronic component in the circuit board 11. The ground interface 13 is electrically connected to a printed circuit (not shown) of the circuit board 11. [0025] The plurality of pads 15 are disposed on the other surface of the circuit board substrate 12 opposite to the surface of the grounding interface 13, and the plurality of pads 15 are exposed on the surface of the substrate 11, and the plurality of pads 15 are used for soldering Electronic Component. The data line 14 is electrically connected to the pad 15 of the circuit board 11, and the number of pads 15 occupied by it is determined as needed. [0027] Step 2: The circuit board substrate 12 is elastically connected to at least one conductive sheet 16, and the conductive sheet 16 is electrically connected to the ground interface 13 of the circuit board. [0028] The conductive sheet 16 includes a conductive sheet substrate 161 and a metal piece 162 attached to the conductive sheet substrate 161. [0029] The conductive sheet substrate 161 may be integrally molded with the substrate 12 and extended from the edge of the substrate 12, and extended out of the outer side of the substrate 11. The conductive sheet substrate 161 is made of the same material as the substrate 12, that is, a material which is made of an insulating and heat-insulating material, and the conductive sheet substrate 161 is a flexible substrate. [0030] The metal piece 162 may be integrally formed with the grounding interface 13 or may be electrically connected to the grounding interface 13 by soldering or the like. In this embodiment, the metal piece 162 and the The ground wire interface 13 is formed by a body, and the material thereof may be copper. ♦ [0031] Step 3: A metal guard 17 is provided, and the circuit board 11 and the conductive sheet 16 are received in the metal guard 17. 096111598 Form No. A0101 Page 8 / Total 20 Page 0993285913-0 1337839 Correction Replacement Page [August 10, 2010] [0032] As shown in FIG. 4, the metal guard device 17 can be a coverless trough structure including side walls. 171 and a bottom portion 172 formed integrally with the side wall 171. The height of the side wall 171 is determined as needed. [0033] An opening 17 3 is provided on either side of the side wall 1 , for drawing the data line 14 ′ of the circuit board 11 . Preferably, the width of the opening 173 is equivalent to the width of the data line 14 . [0034] The area of the bottom 172 is equivalent to the area of the circuit board substrate 12. [0035] When the circuit board 11 and the conductive sheet 16 are assembled into the metal protection device 17, the circuit board substrate 12 is mounted with the data line 14 of the circuit board 11 and the opening 173 of the metal protection device 17 being sized. The position of the bottom 172 of the metal guard η, and while being mounted in the circuit board substrate 12, the conductive sheet substrate 161 and the metal piece 162 of the conductive sheet 16 will be bent and abut against the side wall 171 due to its own toughness. The grounding interface 13 is electrically connected to the metal guard 17 through the conductive sheet 16. [0036] Of course, it can be understood that the conductive sheet substrate 161 can be elastically connected to the edge of the circuit board substrate 12 by other methods, for example, the conductive sheet substrate 161 is a flexible substrate ', and the circuit board substrate 12 is a non-flexible substrate. One end of the conductive sheet substrate 161 is fixed to the edge of the circuit board substrate π by means of riveting or the like, and the other end of the conductive sheet substrate 161 extends from the edge of the circuit board substrate 12, and the conductive sheet 16 is made by the elasticity of the conductive sheet substrate 161. The metal piece 162 abuts against the side wall 171 of the metal guard 17. Even the conductive substrate 161 and the circuit board 12 are non-replaceable materials, and one end of the conductive substrate 丨 61 is elastically connected to the edge of the circuit board 12 by at least one elastic member (not shown), for example, a spring. The other end of the 161 circuit 0993285913-0 096111598 Form No. A0101 Page 9 / Total 20 pages 1337839 The edge of the board substrate 12 extends from August 10, 099, and the metal piece 162 of the conductive sheet 16 can also be abutted On the side wall 171 of the metal guard 17. Referring to FIG. 5, a structural cross-sectional view of the circuit board u, the conductive sheet 16 and the metal guard 17 is assembled. Since the conductive sheet 6 is made of a pliable material, it has elasticity when bent, and metal protection. The area of the bottom 172 of the device 17 is equivalent to the area of the circuit board 11. When the circuit board u is placed in the metal protection device 17, the conductive piece 16 will be bent against the metal protection due to the elastic force of the conductive substrate 161. On the side wall 171 of the device 17, the metal piece 162 of the conductive sheet 16 and the metal guard 17 will be turned on. [0038] So far, the above steps form a circuit board assembly for shielding electromagnetic interference. If it is necessary to add other components, such as image edge detection, the wafer, continue to assemble it. [0039] Of course, since other components such as a lens module can be disposed on the circuit board 11, the circuit board 11 does not become curved due to the elastic force of the conductive sheet 16. The invention uses the elastic force of the conductive sheet substrate 161 to press the metal piece 162 of the conductive sheet 16 against the side wall 171 of the metal protection device 17, thereby electrically connecting the ground interface 13 of the circuit board and the metal protection device 17, thereby completing the elimination of static electricity. Moreover, due to the flexibility and elasticity of the conductive sheet 16, the conductive sheet 16 is in close contact with the metal shield 17, thereby avoiding the phenomenon of poor contact. Meanwhile, the conductive sheet substrate 161 and the metal sheet 162 of the conductive sheet 16 are formed when the circuit board 11 is formed. At the same time, the labor and manpower of the conductive foam are omitted, and the cost is reduced. [0040] In summary, the invention complies with the invention patent requirements, and the patent application is filed according to law. For the preferred embodiment of the present invention, the present invention 096111598 Form bat number A0101 Page 10 / Total 20 page 0993285913-0 099 August 10 Revision Replacement Page 1.337839 The scope of the disclosure is not limited to the above embodiment, Equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are intended to be included in the scope of the following claims. [Simple description of the drawings] • [〇〇41] Figure 1 is the previous FIG. 2 is a schematic structural view of a mask of the device for reducing electromagnetic interference of the circuit board of FIG. 1; [0043] FIG. 3 is an embodiment of the present invention. [0044] FIG. 4 is a schematic view showing the assembly structure of the circuit board and the metal protection device according to the embodiment of the present invention; [0045] FIG. 5 is a cross-sectional view of the assembly diagram of FIG. 4 taken along the line VV. Description] [0046] Board body: 1 [0047] Ground interface: 2, 13 [0048] Mask: 3 [0049] Conductive foam: 4 [0050] Board: 11 [0051] Board substrate: 12 [0052] Data Line: 14 [0053] Pad: 15 096111598 Form No. A0101 Page 11 / Total 20 Page 0993285913-0 1337839 Correction Replacement Page of August 10, 099 [0054] Conductive Sheet: 1 6 [0055] Conductive Sheet substrate: 161 [0056] Metal sheet: 1 6 2 [0057] Metal guard: 17 · [0058] Side wall: 171 [0059] Bottom: 172 [0060] Opening: 1 7 3
0993285913-0 096111598 表單編號A0101 第12頁/共20頁0993285913-0 096111598 Form No. A0101 Page 12 of 20