200841812 九、發明說明： .【發明所屬之技術領域】 本發明關於一種電路板之防護方法，尤其係應用於數 位相機等電子裝置上之電路板之電磁干擾防護方法及電路 板組件。 【先前技術】 隨著電子科技不斷發展與進步，各式各樣的電子產品 • 均朝著數位化發展。並且，為了符合輕便性與實用性之需 要，在電子產品之設計規格上，都趨向輕薄短小、功能多、 且處理速度快發展，以利於製作之產品能更容易攜帶；且 更符合現代之生活需求。特別係在多媒體電腦大行其道 後，強大的運算能力，可輕易地處理各種音效、影像、圖 樣等數位化資料。連帶之使與影像有關之周邊設備，亦受 到廣泛發展與運用。例如，個人數位處理器、數位音響、 掃描器以及數位相機等。 • 例如，以目前極為流行的個人數位助理系統來說，便 由於其方便攜帶，可處理大量數位資訊，並可通過相關的 通訊裝置取得即時關鍵字因此受到社會大眾普遍喜愛與使 用。特徵係隨著積體電路技術之發展個人數位助理系統具 有更強大的運算功能，且記憶體容量不斷增加係以愈來愈 多的謀劃應用軟體、資料庫等皆被存放於小巧的個人數位 助理系統中，並籍著結合網際網路與通訊系統，而使個人 數位助理器具有多媒體播放之功能。 然而，隨著積體電路越趨密集，電子元器件之間之組 7 200841812 靠度’同時隨著人力成本的提高，人力 二低Μ及成本之降低也越來越受到人們的重視。 所示==電路板電磁干擾之裝置，如圖1及圖2 。亥衣置包括一電路板本體i， 電連接之地線接D 2 mm ^與私路板本體 述電路板本體i，衫二該料3用來收容所 置有至少-盘地路板本體1之底部設 〃地線接π 2電氣連接之導電泡棉心 之導帝Γ方護電路板電磁干擾裝置係通過遮罩3底部設置 、私心棉4與相應的地線接口 塞二 4與地線接口 9沾士广 包虱運接，即導電泡棉 對電子元件所產生除靜電’同時利用遮罩3 用。惟，該種么^二阻截以達到電磁遮罩之作 因導電㈣4 料’增加成本及人力，而且 、 舁地線接口2的公差尺寸之原因备 不良，影響電磁遮罩效果。 ” 1 V致接觸 【發明内容】 磁遮罩支1果之電^板降低成本而且可提高電 甩路板之私磁干擾防護方法及電 步驟，路板之電磁干擾防護方法，所述方法包::； 基板提包括-印刷有〜 … /、该1路板之電路電連接之地線 . 線接口電連接之導電g; 包路坂之地 提供孟屬防護裝置，將所述電路板及導電片收容於 8 200841812 ♦該金屬防護裝置’並使所述導電片與該金屬防— 連接。 衣罝电氣 一種電路板之電磁干擾防護方法，所述方法包括200841812 IX. Description of the Invention: [Technical Field] The present invention relates to a method of protecting a circuit board, and more particularly to an electromagnetic interference protection method and a circuit board assembly for a circuit board on an electronic device such as a digital camera. [Prior Art] With the continuous development and advancement of electronic technology, all kinds of electronic products are all moving toward digitalization. Moreover, in order to meet the needs of portability and practicability, the design specifications of electronic products tend to be light, thin, short, functional, and processing speed, so that the products can be more easily carried; and more in line with modern life. demand. In particular, after the popularity of multimedia computers, the powerful computing power can easily handle digital data such as various sound effects, images, and graphics. The accompanying imaging equipment is also widely developed and used. For example, personal digital processors, digital audio, scanners, and digital cameras. • For example, in the current highly popular personal digital assistant system, it is easy to carry, can process a large amount of digital information, and can obtain instant keywords through related communication devices, so it is widely loved and used by the public. Features With the development of integrated circuit technology, the personal digital assistant system has more powerful computing functions, and the memory capacity is increasing. More and more planning applications, databases, etc. are stored in small personal digital assistants. In the system, combined with the Internet and communication system, the personal digital assistant has the function of multimedia playback. However, as the integrated circuit becomes more dense, the relationship between the electronic components is higher. At the same time, as the labor cost increases, the manpower is lower and the cost is reduced. The device shown in the == circuit board electromagnetic interference, as shown in Figure 1 and Figure 2. The cradle includes a circuit board body i, the ground connection of the electrical connection is D 2 mm ^ and the circuit board body i of the private circuit board body, and the material 2 is used for accommodating the at least one disk board body 1 The bottom of the line is connected to the grounding wire π 2 electrically connected conductive foam core guide Γ 护 Guard circuit board electromagnetic interference device is set through the bottom of the mask 3, the private cotton 4 and the corresponding ground interface plug 2 4 and ground The interface 9 is widely used for transportation, that is, the conductive foam generates static electricity generated by the electronic components, and the mask 3 is used at the same time. However, this kind of resistance is used to achieve the electromagnetic shielding. The conductive (4) 4 materials increase the cost and manpower, and the tolerance size of the grounding interface 2 is poor, which affects the electromagnetic shielding effect. 1 V-induced contact [Summary of the invention] The magnetic mask is used to reduce the cost and can improve the private magnetic interference protection method and electrical steps of the electric circuit board, the electromagnetic interference protection method of the road board, the method package ::; The substrate includes - printed with ~ ... /, the ground circuit of the circuit of the one-way board is electrically connected. The electrical connection of the line interface is electrically connected; the ground of the road is provided with the protection device, the circuit board and The conductive sheet is received in 8 200841812 ♦ the metal protection device 'connects the conductive sheet to the metal. - The method for electromagnetic interference protection of a circuit board, the method comprises
步驟·. T 提供-電路板，該電路板包括一印刷有電路的電 基板，至少-與該電路板基板之電路電連接的地線介面^ 從電路板基板邊緣相#至少_所述電路板拉 D電連接之導電片； 、、泉接 ^供-金屬防魏置，將所述電路板及導電 该金屬防護裝置，並使所沭邕帝 谷於 連接。 I便所述片與該金屬防護裝置電氣 -^護電軒擾的電路板組件，包括—電路板、兮 i路板。括-印刷有電路之電路板基板，至少—舆該带路 ，基板之Ί路電連接的地線接σ。該電路板組Step T. provides a circuit board, the circuit board includes an electric circuit printed with a circuit, at least - a ground interface electrically connected to the circuit of the circuit board substrate ^ from the edge of the circuit board substrate # at least - the circuit board The conductive sheet of the D electric connection is connected; the spring is connected to the metal, and the metal board is electrically connected to the circuit board, and the metal protection device is electrically connected. The board and the metal guard are electrically-electrically shielded, including a circuit board and a circuit board. Including - a circuit board substrate printed with a circuit, at least - the path of the circuit, the ground connection of the circuit of the substrate is connected to σ. The board set
:-導：片以及-金屬防護裝置，該導電片與電路 詈：t接丄且電路板基板邊緣延伸而出。該金屬防 二衣“收谷所述電路板及導電片，且所 金屬防護裴置電氣連接。 …該 上迟兒路板之電磁干擾防護方法利用與電路板上的 畲線接Γ電連接的導電片與金屬防護罩電氣連接，因該導 。片在叹置及製作電路板的同時便可製作而成，因此節省 力而且，由於導電片之可撓性及彈性，使得導電片 緊貼金屬防鳟1，1 月 74罩進一步避免了接觸不良之現象。 9 200841812 【實施方式】 為了對本發明作 配合圖式詳細描述如下進一步的說明，舉一較佳實施例並 請参閱圖3及圖4 電磁干擾之方法，包’本發明實施例所提供之電路板防 步驟〜：提供：電:下步驟。 所述電路板^包:」反n。 基板12上之地線接口 電路板基板12，至少一貼附於 14以及至少一固接於—3，至少一用於傳輸資料之數據線 所述電路板U :電路板基板12上之複數焊盤15。 Βπ Η咏 可从為印刷線電路板（Printed Circuit 元:Γ-咖板）。該電路板可將具有特定功能之電子 -Γ/土 1/鑲在④PCB板上。而且除了固定各種小的電子 夕PCBfe3^於為上述電子元器件提供相互的電 連接。本實施例中印刷電路板係指用於數位相機之鏡頭模 繞之影像感測器之電路板。 所述電路板基板12為-絕緣層，其材料可以為由絕 緣隔熱、並易彎之材質所製作成，且所述電路板基板Η 為撓性基板。在該基板U上可利用印刷技術將電路印刷在 其上，再設置積體電路、電阻等電子元件（圖未示）。 所述地線接口 13貼附於電路板基板12上，用於導除 電路板11内各電子元器件中存在的靜電。所述地線接口 13與電路板11之印刷電路（圖未示）電連接。 所述複數焊盤15設置在電路板基板12之相對於設置 地線接口 13表面之另-面上’且該複數焊盤^暴露於基 200841812 板11之表面，該複數焊盤15用於焊接電子元器件。 所述數據線14與電路板11之焊盤15 所佔用焊缝十如曰α 兒I連接，其 < 15之數量根據需要而定。 步驟〜.》 〜·该電路板基板12彈性連接$ ^ 16,該導電Η κ t 芝少一導電片 %片16與所述電路板之地線接口] • 該導電H k 3電連接。 兔片包括導電片基板161與貼 板161上< 金屬片162。 咐於導電片基 舌亥導曹1 ϊ 兒片基板161可以與基板12—體由 12邊緣延^出，並且延伸出基板11之外例且從基板 基板161與基板12材料相同，即由絕緣隔:該導電片 成，且該導電片基板161為撓性基板。 今、之材料製 。亥至屬片162可以與所述地線接口 a〜 可以通過悍接等方法與所述地線接口 13 成型，也 起’在本實施例中，所述金屬片162與所連接在-一體成型，其材料可以為鋼。 也線接口 13 步驟三：提供一金屬防護裝置17，並將… 11及導電片16收容於該金屬防護裝置17中。斤述電路板 如圖4所示，所述金屬防護裝置17可γ、 形結構，包括側壁171和—與側，171 —^為―無蓋槽 172。所述侧壁171之高度板據需要而定。、成型之底部 該側壁171之任一侧毁置有一開口 173， 路板11之數據線14，優選地，該開口 173用於引出電 線14之寬度相當。 之見度與數據 該底部172之面積與電路板基板12之 W積相當。 11 200841812 將所述電路板u及導電片16組裝入金屬防護骏置i7 時，在電路板11之數據線14與金屬防護裝置17之開口 173之尺寸配合下，將限定電路板基板12裝入金屬防護裝 置17之底部172之位置’並在裝入電路板基板12之同時， 導電片16之導電片基板161與金屬片162將彎折並由於其 本身所具有的韌性而緊靠在側壁171上，使得地線接口 U 通過導電片16與金屬防護裝置17導通。:- Guide: sheet and - metal guard, the conductive sheet and circuit 詈: t and the edge of the board substrate extends out. The metal anti-clothing device "receives the circuit board and the conductive sheet, and the metal protection device is electrically connected. ... The electromagnetic interference protection method of the upper delay board is electrically connected with the 畲 line connection on the circuit board. The conductive sheet is electrically connected to the metal shield, and the sheet can be fabricated while being slanted and fabricated, thereby saving power and, due to the flexibility and elasticity of the conductive sheet, the conductive sheet is in close contact with the metal. The anti-smashing, January, 74 cover further avoids the phenomenon of poor contact. 9 200841812 [Embodiment] In order to explain the present invention in detail, the following further description will be given, and a preferred embodiment will be described with reference to FIG. 3 and FIG. 4 electromagnetic interference method, package 'the circuit board defense step provided by the embodiment of the invention~: provide: electricity: the next step. The circuit board ^ package: "reverse n. The ground interface board substrate 12 on the substrate 12 is at least one attached to 14 and at least one fixed to -3, at least one data line for transmitting data, the circuit board U: the plurality of pads on the circuit board substrate 12 Disk 15. Βπ Η咏 can be used as a printed circuit board (Printed Circuit yuan: Γ-coffee board). The board can be equipped with a specific function of the electronic - Γ / soil 1 / set on the 4 PCB board. Moreover, in addition to fixing various small electronic circuits, the electronic components are provided with electrical interconnections. The printed circuit board in this embodiment refers to a circuit board of an image sensor for a lens of a digital camera. The circuit board substrate 12 is an insulating layer, and the material thereof may be made of a material that is insulated and bendable, and the circuit board substrate Η is a flexible substrate. On the substrate U, a circuit can be printed thereon by a printing technique, and electronic components such as integrated circuits and resistors (not shown) are disposed. The grounding interface 13 is attached to the circuit board substrate 12 for discharging static electricity present in the electronic components in the circuit board 11. The ground interface 13 is electrically connected to a printed circuit (not shown) of the circuit board 11. The plurality of pads 15 are disposed on the other surface of the circuit board substrate 12 opposite to the surface of the grounding interface 13 and the plurality of pads are exposed on the surface of the substrate 200841812. The plurality of pads 15 are used for soldering. Electronic Component. The data line 14 is connected to the solder joint occupied by the pad 15 of the circuit board 11, such as the number of <15, as needed. Step ~." ~ · The circuit board substrate 12 is elastically connected to $ ^ 16, the conductive Η κ t 芝 less one conductive sheet % of the chip 16 and the ground connection of the circuit board] • The conductive H k 3 is electrically connected. The rabbit piece includes a conductive sheet substrate 161 and a <metal piece 162 on the plate 161. The substrate 161 can be extended from the edge of the substrate 12 and extends out of the substrate 11 and is the same material as the substrate 12 from the substrate substrate 161, that is, insulated by the substrate. The spacer: the conductive sheet is formed, and the conductive sheet substrate 161 is a flexible substrate. Today, the material system. The ground piece 162 can be formed with the ground wire interface a~ and the ground wire interface 13 by means of splicing, etc., and also in the present embodiment, the metal piece 162 is connected to the integrally formed The material can be steel. Also, the line interface 13 Step 3: A metal guard 17 is provided, and the 11 and the conductive sheets 16 are housed in the metal guard 17. As shown in FIG. 4, the metal guard 17 can be γ-shaped, including the side wall 171 and the side, and the 171-- is a coverless slot 172. The height plate of the side wall 171 is as needed. Bottom of the molding The side of the side wall 171 is ruined with an opening 173, the data line 14 of the road board 11, preferably, the opening 173 is used for the width of the lead-out wire 14. Visibility and Data The area of the bottom 172 is comparable to the W product of the board substrate 12. 11 200841812 When the circuit board u and the conductive sheet 16 are assembled into the metal protection device i7, the circuit board substrate 12 is mounted under the size of the data line 14 of the circuit board 11 and the opening 173 of the metal protection device 17. The position of the bottom 172 of the metal guard 17 is 'and the magnetic sheet substrate 161 and the metal piece 162 of the conductive sheet 16 will be bent and abut against the side wall 171 due to its own toughness. The grounding interface U is electrically connected to the metal guard 17 through the conductive sheet 16.
當然，可以理解，該導電片基板161還可以通 方法彈性連接於電路板基板12之邊緣，例如，導° 161為撓性基板，而電路板基板12為非撓性基板，導^片 ^娜卩接等方法固接於電路板基板邊 他而山飞片基板161之另一端從電路板基板12之邊緣延 =用導電片基板161之彈性使得導電片〜 ^62緊罪於金屬防護裝置17之側壁i7i上 與電路板基板12都為非撓性材料 = 二二通?至少一彈性件(圖未示)例如彈簧彈= :::板基板12之邊緣’該導電片基板i6i之另二 屬片反it t邊緣延伸而出’也可以使得導電片16 :: 屬片脱緊#在金屬防護裝置17之側辟⑺上 至 衣配在起之結構剖視圖，由於導雷 彎材料製成而在彎折時具有彈性，力=片16由易 部⑺之面積與電路板η之面積= 金屬防護裝置17中時’由於導電片基板二彈 200841812 將穹折緊貼於金屬防護裝置1 上，此時導電片k U之側壁171 5 16之金屬片162與金屬防讀裝罢n 通。 又衣罝17將導 至此，以p屮 .,.^步驟則形成一防護電磁干擾 件，如果，逛愛你， a』 兒略扳組 而曰加其他元件，如影像感择|日Η 裝其即可。 _片，繼績組 當然，由於電路板η上還可設置有其他 ‘ 煤组，所以帝1 凡1千如鏡頭 、、 私板11不會由於導電片16之彈力而笋夺線 曲。本發明利用導電片基板161之彈力將導電片16二人二 片162壓在金屬防護裝置17之侧壁171上，從而將電ς = 11之地線接口 13與金屬防護裝置17導通，從而6 静私而且由於^電片16之可撓性及彈性 16緊貼今屬P六，$ 使^于‘電片 16緊、j屬防5又罩17’避免了接觸不良之 雷片16之導雷ti甘』 凡豕 Η日寸’導 私片之寺包片基板101與金屬片162在奮故批n 4 時同時製作而成，省去了目$ 兔路板11成形 低了成本。 工％與人力，降 綜上所述，本發明符合發明 利申請。惟，以上所述者僅 指件’麦依法提出專 明之範圍並不以上述實施例為限μ之較佳實施例，本發 士援依本發明之精神所作之等i 舉凡熟習本案技藝之人 以下申請專利範圍内。 、攻修飾或變化，皆應涵蓋於 【圖式簡單說明】 圖1係先前降低電路板電、 板之結構分解示意圖； a礙干擾之裝置所提供之電路 13 200841812 圖2係為圖1降低電路板電磁干擾之裝置之遮罩之結 構+意圖， • 圖3係本發明實施例之電路板結構示意圖； 圖4係本發明實施例之電路板與金屬防護裝置之組裝 結構不意圖； 圖5係圖4之組裝示意圖沿V-V線的剖視圖。 【主要元件符號說明】 電路板本體 1 地線接口 2、13 遮罩 3 導電泡棉 4 電路板 11 電路板基板 12 數據線 14 焊盤 15 導電片 16 導電片基板 161 金屬片 162 金屬防護裝置 17 側壁 171 底部 172 开口 173 14Of course, it can be understood that the conductive substrate 161 can also be elastically connected to the edge of the circuit board 12 by a method. For example, the conductive substrate 161 is a flexible substrate, and the circuit board substrate 12 is a non-flexible substrate. The method of splicing or the like is fixed to the side of the circuit board substrate, and the other end of the mountain flying sheet substrate 161 is extended from the edge of the circuit board substrate 12. The elasticity of the conductive substrate 161 is used to make the conductive sheet ^ 紧 金属 金属 金属 金属 金属Both the side wall i7i and the circuit board substrate 12 are non-flexible materials=two-two-way? at least one elastic member (not shown) such as spring-loaded = ::: the edge of the board substrate 12 'the other two of the conductive sheet substrate i6i The extension of the slabs can be made to make the conductive sheet 16 :: the detachment of the slabs from the side of the metal guard 17 (7) to the cross-sectional view of the structure, due to the material of the guide bend material. Elastic when bending, the force = the area of the sheet 16 from the easy portion (7) and the area of the circuit board η = when in the metal guard 17 'because the conductive sheet substrate 2, 200841812 will be folded against the metal guard 1 At this time, the side plate 171 5 16 of the conductive sheet k U is a metal piece 162 and gold. Reading means preventing strike through n. The clothes 罝 17 will lead to this, and the steps of p屮.,.^ will form a protective electromagnetic interference component. If you love you, a 』 略 扳 扳 曰 曰 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他It can be. _ film, succession group Of course, because the circuit board η can also be equipped with other ‘ coal group, so the Emperor 1 10,000 as a lens, the private board 11 will not be due to the elastic force of the conductive sheet 16 to shoot the line. The present invention uses the elastic force of the conductive sheet substrate 161 to press the two sheets 162 of the conductive sheet 16 on the side wall 171 of the metal guard 17, thereby electrically connecting the ground interface 13 of the electric ς 11 to the metal guard 17, thereby Quiet and private, because the flexibility and elasticity of the electric film 16 is close to the current P6, $ make the 'electric film 16 tight, j is anti-5 and cover 17' to avoid the contact of the bad lead 16 Lei Ti Gan 』 豕Η 豕Η 寸 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' % of work and manpower, as described above, the present invention is in accordance with the invention. However, the above description refers only to the preferred embodiment in which the scope of the invention is not limited to the above embodiment, and the present invention is based on the spirit of the present invention. The scope of the following patent application. , attack modification or change, should be covered in [simplified description of the diagram] Figure 1 is a schematic diagram of the previous structure reduction of the circuit board and the board; a circuit provided by the device that interferes with interference 13 200841812 Figure 2 is the circuit of Figure 1 FIG. 3 is a schematic structural view of a circuit board according to an embodiment of the present invention; FIG. 4 is a schematic view showing an assembly structure of a circuit board and a metal protection device according to an embodiment of the present invention; Figure 4 is a cross-sectional view of the assembly diagram taken along line VV. [Main component symbol description] Board body 1 Ground wire interface 2, 13 Mask 3 Conductive foam 4 Circuit board 11 Circuit board substrate 12 Data line 14 Pad 15 Conductive sheet 16 Conductive sheet substrate 161 Metal sheet 162 Metal guard 17 Side wall 171 bottom 172 opening 173 14