JP3744334B2 - Display device, manufacturing method thereof, and electronic device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a display device including a connection pin that is held by an edge of a display panel and is bonded with a resin, a manufacturing method thereof, and an electronic apparatus.
[0002]
[Background Art and Problems to be Solved by the Invention]
In order to electrically connect a display panel having a terminal portion at one edge along one side to a circuit board or the like, for example, as shown in FIG. 10, a connect having a clip portion 12 and an extending portion 16 Pin 10 may be used. In this connection, as shown in FIG. 10, the terminal portion of the panel substrate of the display panel 30 is held by the clip portion 12 of the connect pin 10, and the clip portion is electrically connected to the electrode terminal provided on the panel substrate. Further, the extending portion 16 of the connect pin 10 is electrically connected to the circuit board 50 or the like. Although not shown in the figure, the clip portion 12 and the terminal portion of the display panel 30 are bonded with resin to increase the bonding strength between the connect pin 10 and the panel substrate, and to suppress the entry of moisture and the like. Increases the reliability of electrical connections.
[0003]
By the way, in such a structure, in order to maintain connection reliability even in various usage environments such as when an impact is applied from the outside, it is required that the mechanical joint strength between the connect pin and the display panel is sufficient. Is done. In particular, the strength against the pulling force acting in the direction of pulling out the clip portion holding the panel substrate may not be sufficient depending on the use environment.
[0004]
The present invention has been made in view of the above points, and an object of the present invention is to provide a display device in which a connect pin and a display panel are connected with high bonding strength, a manufacturing method thereof, and an electronic apparatus. is there.
[0005]
[Means for Solving the Problems]
A display device according to the present invention includes a panel substrate, a display panel including an electrode terminal at an edge portion along one side of the panel substrate, a conductive material applied to the electrode terminal, and an edge portion of the panel substrate. A clip having a clip pin that is held and electrically connected to the electrode terminal via the conductive material; and a resin portion that bonds the clip portion to an edge of the panel substrate. Is a terminal side clip piece located on the side where the electrode terminal is arranged on the panel substrate, and a back side clip piece arranged on the side opposite to the side where the electrode terminal is arranged on the panel substrate. And the resin portion includes an inner layer formed by curing a low-viscosity resin and an outer layer formed by curing a high-viscosity resin.
[0006]
According to the present invention, since the clip portion is bonded to the edge of the panel substrate by the resin portion in a state where the resin portion covers the back-side clip piece of the clip portion, the resin is in the vicinity of the back-side clip piece. And the panel substrate can be bonded to the edge of the panel substrate with higher strength than when the panel substrate is disposed only in the adjacent region.
[0008]
First, if the inner layer is formed of a low-viscosity resin, the region adjacent to the clip portion and the edge portion of the panel substrate can be reliably spread by capillarity. And if the outer layer is made of high-viscosity resin, the back side clip piece can be covered with resin without the resin flowing to unnecessary parts, and in order to obtain sufficient bonding strength between the connect pin and the display panel A resin portion having a necessary thickness can be formed. In this way, the bonding strength can be increased compared to the case where the resin portion is composed of only one layer.
[0013]
The display device according to the present invention further includes a circuit board, and the connection pin includes an extension part extending from the clip part, and the extension part and the circuit board are electrically connected. It is characterized by.
[0014]
According to the present invention, as described above, it is possible to obtain a display device in which the display panel and the circuit board are electrically connected via the connection pins joined to the display panel with high strength.
[0015]
An electronic apparatus according to the present invention is characterized by using any of the display devices described above as a display unit.
[0016]
A display device manufacturing method according to the present invention includes a panel substrate, a display panel including an electrode terminal at an edge along one side of the panel substrate, a conductive material applied to the electrode terminal, and the panel substrate. A connecting pin that includes a clip portion that holds the edge portion and is electrically connected to the electrode terminal via the conductive material, and a resin portion that adheres the clip portion to the edge portion of the panel substrate, The clip portion includes a terminal-side clip piece positioned on the side of the panel substrate on which the electrode terminal is disposed, and a back-side clip disposed on the opposite side of the panel substrate on which the electrode terminal is disposed. A method of manufacturing a display device including a piece, wherein the resin portion includes an inner layer and an outer layer, and a step of curing the low-viscosity resin to form the inner layer; Hard high viscosity resin And having a step of forming a layer of the outer by.
[0017]
According to the present invention, first, a low-viscosity resin can be spread over a region close to the clip portion and the panel substrate by capillary action. And after curing the low clay resin, it is placed in close contact with the resin layer so that the high viscosity resin covers the back side clip piece. A resin portion having a thickness necessary for obtaining sufficient bonding strength with the panel can be formed.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described more specifically with reference to the drawings.
[0019]
1. <First Embodiment>
FIG. 1 is a schematic perspective view of a connect pin 10 used in the present embodiment. As shown in this figure, the connect pin 10 includes a clip portion 12 formed in a clip shape that is electrically connected to the electrode terminal of the terminal portion of the display panel, and a solder connection to the circuit board extending from the clip portion 12. The extended part 16 is provided. The clip portion 12 includes two clip pieces, that is, a terminal-side clip piece 13 and a back-side clip piece 14. A plurality of connect pins 10 are usually arranged at a predetermined pitch, for example, a predetermined pitch of about 1.5 to 3.0 mm. Further, the connect pins are adapted not only to the predetermined pitch but also to random arrangement or single-unit mounting. In this figure, the connection part 20 which connects the edge parts of the extension part 16 is shown. The connecting portion 20 is for preventing the extension portion 16 from being deformed in the connecting process of the connect pins 10 and keeping the plurality of connect pins 10 at a predetermined pitch. The connect pins 10 are used as terminal portions of the display panel. Disconnected after being connected. The connecting pin 10 has an F-shaped side surface, is called an F type or a DIP type, and is formed so as to hold the liquid crystal panel in a state substantially perpendicular to the extending portion. For the connection pin 10, a material such as phosphor bronze for spring (PBSR-1 / 2H, PBSR-H), special aluminum brass (TSB), cold-rolled steel (SPCC), etc., which is solder-plated is used. It has been.
[0020]
FIG. 2 is a schematic diagram showing the display device 6 in which the connect pins 10 are connected and fixed to a liquid crystal panel 30 as a display panel. As shown in this figure, the liquid crystal panel 30 is bonded to each other through a spacer in a state where one of the two panel substrates 34 protrudes from the other panel substrate 34 along one side thereof. The edge portion is a terminal portion 32. For example, the display device 6 is electrically connected to the circuit board 50 by solder in a state in which the extending portion 16 of the connect pin is inserted into the through hole 52 of the circuit board 50 as shown in a schematic diagram of FIG. The The electrical connection between the connect pin 10 and the circuit board 50 may be performed by providing a socket on the circuit board 50 and inserting the extending portion 16 of the connect pin 10 into the socket.
[0021]
FIG. 3 is an enlarged schematic view showing the vicinity of the region where the connection pin 10 and the terminal portion 32 of the liquid crystal panel 30 are connected in the display device 6 shown in FIG. As shown in this figure, the terminal portion 32 of the liquid crystal panel 30 is provided with electrode terminals 33. The clip portion 12 of the connect pin 10 is located on the side of the panel substrate 34 where the electrode terminal 33 is disposed, and on the side of the panel substrate 34 opposite to the side where the electrode terminal 33 is disposed. In the state where the back side clip piece 14 is positioned, the terminal portion 32 coated with the conductive material 35 is held. As a result, the terminal-side clip piece 13 positioned on the side where the electrode terminal 33 is disposed is electrically connected to the electrode terminal 33 of the terminal portion 32. As the conductive material 35, a carbon-based paste, a silver-based paste, or a copper-based paste is used.
[0022]
Further, the clip portion 12 connected to the terminal portion 32 is adhered and covered to the terminal portion 32 by a resin portion 37, for example, an ultraviolet curable resin. Thereby, the joining force between the terminal portion 32 and the clip portion 12 is strengthened / improved. The resin part 37 also plays a role of improving the moisture resistance of the display device 6. In particular, in the present embodiment, the resin portion 37 is in a state of covering the back-side clip piece 14 and bonds the clip portion 12 to the edge portion of the panel substrate, that is, the terminal portion 32. As a material of the resin part 37, a methacrylate resin, an epoxy resin, or the like can be used.
[0023]
Thus, in the display device 6 of the present embodiment, the clip portion 12 is bonded to the terminal portion 32 of the panel substrate 34 with the resin portion 37 covering the back-side clip piece 14 of the clip portion 12. The clip portion 12 can be bonded to the terminal portion 32 with a greater strength than in the case where the resin is disposed only in the vicinity of the back-side clip piece 14 and the panel substrate 34 in the vicinity of the back-side clip piece 14. According to the experiment by the present inventor, the tensile strength in the direction of pulling out the clip portion 12 holding the panel substrate 34 is such that the resin is close to the rear side clip piece 14 and the panel substrate 34 in the vicinity of the rear side clip piece 14. In the case where it is arranged only in the region, it was 0.8 kg · G per one connect pin, whereas in this embodiment, it was 3.0 kg · G per one connect pin.
[0024]
2. Second Embodiment
The second embodiment is different from the first embodiment in the structure of the resin part that bonds the clip part to the panel substrate. Only the parts different from the first embodiment will be described below. Otherwise, the present embodiment is configured in the same manner as in the first embodiment. In addition, the same code | symbol as 1st Embodiment is used for the corresponding part in a figure.
[0025]
FIG. 4B is an enlarged schematic view showing the vicinity of a region where the connection pin 10 and the terminal portion 32 of the liquid crystal panel 30 are connected in the display device 6 according to the present embodiment. As shown in this figure, in this embodiment, the resin portion 37 covers the first layer 38 disposed in the proximity region between the terminal portion 32 and the connect pin 10, the first layer 38 and the back-side clip piece 14. The second layer 39 and the second layer 39 are arranged in this manner.
[0026]
In the formation of the resin portion 37, first, a low-viscosity resin is positioned and cured in a region where the terminal portion 32, which is an edge portion of the panel substrate 34, and the clip portion 12 are close to each other, as shown in FIG. As shown, a first layer 38 is formed. The low-viscosity resin can be spread through the region where the clip portion 12 and the terminal portion 32 of the panel substrate 34 are close by capillarity, so that the resin is surely applied to the region where the clip portion 12 and the terminal portion 32 are close. Can be positioned. As the low-viscosity resin, a resin having a viscosity of about 1000 to 7000 cP (centipoise) can be used.
[0027]
Next, a second layer 39 is formed by positioning and curing a high-viscosity resin so as to be in close contact with the first layer 38 formed of the cured resin and to cover the back-side clip piece 14, thereby forming the second layer 39. As shown in B), a resin part 37 composed of two layers is obtained. As described above, the second layer 39 is formed so as to be in close contact with the first layer 38 so that the high-viscosity resin covers the back-side clip piece 14, so that the low-viscosity resin is used. The resin portion 37 having a thickness necessary for obtaining a sufficient bonding strength between the connect pin 10 and the display panel 30 can be formed without the resin flowing to an unnecessary region, for example, a region where the polarizing plate 45 is attached. it can. As the high viscosity resin, a resin having a viscosity of about 7000 cP (centipoise) or more can be used.
[0028]
Thus, by forming the resin part 37 with the two layers 38 and 39, compared with the case where the resin part 37 is formed with only one layer (even if the resin layer is formed thick using a high-viscosity resin). The inventor of the present application confirmed that the bonding strength was increased.
[0029]
3. <Third Embodiment>
The third embodiment differs somewhat from the first embodiment in the shape of the clip portion. Only the parts different from the first embodiment will be described below. Otherwise, the present embodiment is configured in the same manner as in the first embodiment. In addition, the same code | symbol as 1st Embodiment is used for the corresponding part in a figure.
[0030]
FIG. 6 is an enlarged schematic view showing the vicinity of the region where the connection pin 10 and the terminal portion 32 of the liquid crystal panel 30 are connected in the display device 6 according to the present embodiment. FIG. 5 is a schematic perspective view showing the connect pin 10 used in the present embodiment. FIG. 6 shows a state in which a plurality of connect pins 10 are connected by the connecting portion 20, and the connecting portion 20 is cut and removed after the connect pins 10 are attached to the liquid crystal panel 30. As shown in these drawings, the back-side clip piece 14 of the clip portion 12 includes an opening 60 in the present embodiment. The opening 60 may be formed in the terminal side clip piece 13 or may be formed in both the terminal side clip piece 13 and the back side clip piece 14.
[0031]
Thus, in this embodiment, since at least one of the terminal-side clip piece 13 and the back-side clip piece 14 includes the opening 60, the resin portion 37 is connected to the clip portion 12 and the panel substrate via the opening 60. 34 can be reliably disposed in a region close to the terminal portion 32, and a sufficient bonding strength between the connect pin 10 and the liquid crystal panel 30 can be obtained with certainty. Further, since the frictional force between the clip portion 12 and the panel substrate 34 with respect to the pulling force acting in the direction of pulling out the clip portion 12 holding the panel substrate 34 is increased by the presence of the opening 60, Strength against working tensile force increases.
[0032]
4). <Fourth embodiment>
The fourth embodiment is somewhat different from the first embodiment in the shape of the clip portion. Only the parts different from the first embodiment will be described below. Otherwise, the present embodiment is configured in the same manner as in the first embodiment. In addition, the same code | symbol as 1st Embodiment is used for the corresponding part in a figure.
[0033]
FIG. 7 is a schematic enlarged bottom view of the display device 6 according to the present embodiment as viewed from the back side clip piece 14 in the vicinity of the region where the connect pin 10 and the terminal portion 32 of the liquid crystal panel 30 are connected. . In the drawing, the resin portion 37 is omitted, but the resin portion 37 is formed in the same manner as in the first embodiment. As shown in FIG. 7, in this embodiment, the back-side clip piece 14 of the clip portion 12 includes a protrusion 65 that protrudes in a direction substantially parallel to one side of the panel substrate 34 where the terminal portion 32 is formed. . The protrusion 65 may be formed on the terminal-side clip piece 13, or may be formed on both the terminal-side clip piece 13 and the back-side clip piece 14.
[0034]
As described above, in the present embodiment, at least one of the back-side clip piece 14 and the terminal-side clip piece 13 protrudes in a direction substantially parallel to one side where the terminal portion 32 is formed on the panel substrate 34. Therefore, the frictional force between the clip part 12 and the resin part 37 with respect to the pulling force acting in the direction of pulling out the clip part 12 holding the panel substrate 34 is increased by the presence of the protrusion 65, Strength against tensile force acting in the direction increases.
[0035]
5. <Electronic device using display device>
FIGS. 8A, 8 </ b> B, and 8 </ b> C are external views illustrating examples of electronic devices using the display device 6 of the first embodiment as a display unit. The display device is not limited to that of the first embodiment, and display devices of other embodiments can be used. FIG. 8A shows a mobile phone 88, which includes a display device 6 above the front surface thereof. FIG. 8B shows a wristwatch 92 in which a display unit using the display device 6 is provided in the center of the front surface of the main body. FIG. 8C illustrates a portable information device 96 that includes a display unit including the display device 6 and an input unit 98. In addition to the display device 6, these electronic devices include various circuits such as a display information output source, a display information processing circuit, a clock generation circuit, and a power supply circuit that supplies power to these circuits, although not shown. A display signal generation unit is included. In the case of the portable information device 96, for example, in the case of the portable information device 96, a display image is formed by supplying a display signal generated by the display signal generation unit based on information input from the input unit 98 or the like.
[0036]
Note that the electronic device in which the display device 6 of the present embodiment is incorporated is not limited to a mobile phone, a wristwatch, and a portable information device, but a notebook personal computer, electronic notebook, pager, calculator, POS terminal, IC card, mini-disc player. Various electronic devices can be considered.
[0037]
6). <Other variations>
6.1 In each of the above-described embodiments, an example in which a type called F-type or DIP-type is used as the connect pin 10 is shown. However, the connect pin 10 is shown as a schematic perspective view in FIG. The type shown as Y type or SIP type may be used. This type of connect pin 10 is formed so as to hold the terminal portion (edge portion) 32 of the liquid crystal panel 30 in a state substantially parallel to the extending portion 16.
[0038]
6.2 In each of the above-described embodiments, the example in which the display panel to which the connect pin 10 is connected is the liquid crystal panel 30 has been described. However, the display panel to which the connect pins are connected is not limited to the liquid crystal panel 30 but may be another flat panel display panel having a terminal portion along at least one side, for example, a plasma display, an FED (Field Emission Display), or the like. May be.
[0039]
6.3 Furthermore, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the gist of the present invention or the equivalent scope of the claims.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view of a connect pin used in a first embodiment.
FIG. 2 is a schematic view showing a display device formed by connecting and fixing the connect pins shown in FIG. 1 to a liquid crystal panel.
3 is an enlarged schematic view showing the vicinity of a region where a connection pin and a terminal portion of a liquid crystal panel are connected in the display device shown in FIG. 2;
FIGS. 4A and 4B are schematic views showing, in an enlarged manner, the vicinity of a region where a connection pin and a terminal portion of a liquid crystal panel are connected in a manufacturing process of a display device according to a second embodiment.
FIG. 5 is a schematic perspective view showing a connect pin used in the third embodiment.
FIG. 6 is an enlarged schematic view showing the vicinity of a region where a connection pin and a terminal portion of a liquid crystal panel are connected in the display device of the third embodiment.
7 is a schematic enlarged bottom view of the vicinity of a region where a connect pin and a terminal portion of a liquid crystal panel are connected in a display device according to a fourth embodiment, as viewed from the back side clip piece side. FIG.
FIGS. 8A, 8B, and 8C are external views illustrating examples of electronic devices using the display device of the first embodiment. FIGS.
FIG. 9 is a schematic perspective view showing a Y-type connect pin.
FIG. 10 is a schematic diagram showing a display device formed by connecting a display panel and a circuit board with connect pins.
[Explanation of symbols]
6 Display device 10 Connect pin 12 Clip portion 13 Terminal side clip piece 14 Back side clip piece 16 Extension portion 30 Liquid crystal panel (display panel)
32 Terminal (edge)
33 Electrode terminal 34 Panel substrate 37 Resin part 50 Circuit board 60 Opening part 65 Projection part

Claims (4)

A display panel comprising a panel substrate, and having electrode terminals on an edge along one side of the panel substrate;
A conductive material applied to the electrode terminals;
A connect pin that includes a clip portion that holds an edge of the panel substrate and is electrically connected to the electrode terminal via the conductive material;
A resin part for adhering the clip part to an edge of the panel substrate;
Have
The clip portion includes a terminal-side clip piece located on a side of the panel substrate on which the electrode terminal is disposed, and a back-side clip disposed on a side opposite to the side on which the electrode terminal is disposed on the panel substrate. With a piece,
The display device according to claim 1, wherein the resin portion includes an inner layer formed by curing a low-viscosity resin and an outer layer formed by curing a high-viscosity resin. In claim 1,
A circuit board;
The connect pin includes an extending part extending from the clip part,
The display device, wherein the extension portion and the circuit board are electrically connected.   An electronic apparatus using the display device according to claim 1 as a display unit. A display panel comprising a panel substrate, and having electrode terminals on an edge along one side of the panel substrate;
A conductive material applied to the electrode terminals;
A connect pin that includes a clip portion that holds an edge of the panel substrate and is electrically connected to the electrode terminal via the conductive material;
A resin part for adhering the clip part to an edge of the panel substrate;
Have
The clip portion includes a terminal-side clip piece located on a side of the panel substrate on which the electrode terminal is disposed, and a back-side clip disposed on a side opposite to the side on which the electrode terminal is disposed on the panel substrate. A manufacturing method of a display device comprising a piece,
The resin part is composed of an inner layer and an outer layer,
Curing the low viscosity resin to form the inner layer;
Curing the high viscosity resin to form the outer layer;
A method for manufacturing a display device, comprising:

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