Γ333403 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種觸控面板之負片印刷蝕刻製 程，尤指一種可縮短濕式姓刻之生產時間、製程設備 及減少原物料用量，且達到不需因酸鹼液的氣體揮發 而刻.¾ 離工作區域之功效者。 【先前技術】 按，一般觸控面板製造過程中針對透明導電層 (ITO Layer)之蝕刻方法有乾式蝕刻與濕式蝕刻之分， 如下所述。 一、乾式钱刻： 1 ·採用單頭雷射機方式，目前業界大多使用C〇2 雷射機以及YAG雷射機。原理均利用雷射光源將基材 表面之透明導電層（ITO Layer)去除； 實施方法為將所須之Pattern輸入至雷射機，調整 功率及速度’雷射光束會依照所須之Pattern路徑-- 刻畫出來’再以C〇2雷射之雷射光源係·利用聚焦鏡凝 聚光能量，並且使用數面聚焦鏡將光束由發源處導引 至所需的路徑上，故在距離雷射發源處較遠之處會有 能量損耗以及Pattern放大之問題。因此，對於玻璃之 透明導電層（ITO Layer)蝕刻以及精度要求較高之產品 大多使用C〇2以外的雷射機；由於C02雷射機是以放 電方式激發的高功率雷射，故較容易造成玻璃基材的 5 1333403 破裂以及塑膠基材（PET、PC)的斷裂、焦黑，且雷射光 源照射於基板上，去除透明導電層（IT0 Layer)，但使 去除之透明導電層（ITO Layer)產生ITO Powder，容易 造成無塵室之污染，故需隔離工作區域。而導致下列 .· 缺點：（A)生產製造時間較長、（B)產能較低、（C) 容易產生粉屑、（D)YAG雷射機設備金額較高、（E) C〇2雷射機整體功能性欠佳、（F)需隔離工作區域。 目前業界只有少數選擇此種餘刻方式，但針對塑膠基 • 板（PET、PC)之透明導電層（ITO Layer)蝕刻大多選擇 此種方式。 2 ·採用印刷絕緣層方式，於基板上不需要導電 區域印刷不導電絕緣層，隔絕上層導電銀膠與下層透 明導電層（ITO Layer)接觸，以達成絕緣的效果；由於 其下層不導電絕緣層材質大多為環氧壓克力樹脂，其 印刷物較容易出現孔洞，上層之導電銀漿於未固化較 容易滲入下層不導電絕緣層之孔洞與基材之透明導電 • 層（IT〇 LaKr)接觸而造成短路現象，為避免此現象， 會於絕緣層上再加印一層絕緣層； 且印刷物本身的膜厚會增加觸控面板整體的厚 度，比較一般觸控面板之疊構厚度更厚，故對於目前 -輕薄短小的產品，並不適用；再者為防止電磁波的干 • 擾’需搭配使用單頭雷射機刻晝Pattern，解決電磁波 的干擾，由於印刷物本身的膜厚造成高低差現象，故 覆蓋在此段差之導電膠較容易|生斷裂而造成線路無 6 1333403 導通及導通不良，造成下層不導電絕緣層於基板上之 附著力不佳的情況下會造成peel Off的現象，因而使 導電膠較發生斷裂。目前業界大多淘汰此種蝕刻方 式，只有少數仍繼續使用。 二、濕式姓刻： 使用酸液（鹽酸、王水）將基板上之透明導電層 (ITO Layer)蝕刻；其實施方法如第6圖所示，需要經 過清洗4 0、防钱刻油墨印刷4 1、uv固化4 2、濕 式钱刻4 3、酸液清洗4 4、剝墨4 5及鹼液清洗4 6· ··等製程。其詳細步驟如下（配合請參閱第7 圖）： 1 .基板5必須先經過清洗製程，使用鹼液、毛 刷、純水’將表面之粉塵、髒污、油潰清除。 2 .在基板5上印刷防蝕刻油墨6，覆蓋所需要 之透明導電層5 1上，以保護酸液之侵蝕。 3 ·經過乾燥的過程’將防蝕刻油墨6固化。 4 ·酸液蝕刻製程，透明導電層5 1於未覆蓋防 姓刻油墨之透明導電層5 1區域，經過酸液的浸泡、 侵姓而將透明導電層5 1去除；此時需控制酸液濃 度’濃度過低則無法將透明導電層5 1去除；反之濃 度過而則破會基材表面’若此製程因有揮發性氣體， 長時間會對人體造成傷害’故需隔離工作區域。 5 ·/胃洗製程’將基板5表面之酸液清洗乾淨。 6 ·驗液剝墨4 5流程’經過鹼液浸泡之剝墨4 7 1333403 5流程，去除覆蓋於基板5上之防蝕刻油墨；需控制 鹼液濃度，濃度過低則無法將覆蓋於基板上之防^刻 油墨去除；此製程因有揮發性氣體，長時間會對人體 造成傷害，故需隔離工作區域。 7 .進一步清洗基板5，將基材5表面清洗乾淨。 而上述習用之濕式蝕刻缺點：至少包含（A)製程較 繁瑣、（B)需處理排放之化學藥品、（c)需控制化學藥 品濃度以達成其特性、（D)設備所佔工作空間較大、（E、) • 需隔離蝕刻以及剝墨工作區域、（F)機台保養較複 雜· •·等缺點；使蝕刻製程繁瑣較難控制’製程較 長且需要花費的製程設備金額較大，以及需要不斷控 制酸液及驗液的濃度已保持其功能性，且必須因為酸 驗液的揮發氣體而刻意隔離工作區域。 【發明内容】 本發明之主要目的係在於，可縮短濕式钱刻之生 產時間、S程設備及減少原物料用f，且達到不需因 酸鹼液的t體揮發而刻意'隔離工作區域之功效。 為達上述之目的，本發明係一種觸控面板之負片 印刷㈣製程，至少包含有印刷、供烤及清洗等步驟； :提供—具有透明導電層之基板，使該基 板配合印刷網版於透明導電層上印刷m墨層， 且使絲心墨層覆蓋於欲偏彳之透”電層區域； 並將上述印刷刻油墨層之基板經過供烤，讓钱刻 s Γ333403 油墨層產生反應進而侵蝕該基板上之透明導電層；之 後以純水清洗基材表面之蝕刻油墨層殘膜，即可完成 所需之蝕刻製程。 【實施方式】 請參閱『第1〜第5圖』所示，係分別為係本發 明之製造流程圖示意圖、本發明之印刷步驟示意圖、 本發明印刷後之蝕刻油墨範圍示意圖、本發明之烘烤 步驟示意圖、本發明之清洗示意圖。如圖所示：本發 明係一種觸控面板之負片印刷蝕刻製程，其至少包含 下列步驟： 印刷1 :係提供一具有透明導.電層（IT〇 Layer)1 1之基板1 〇，使該基板i 〇配合印刷網版丄2於透 明導電層1 1上印刷一蝕刻油墨層丄3，該蝕刻油墨 層1 3之材質係可為磷酸油墨，而該印刷網版^ 2之 網目1 2 1開孔區域僅於基板i 〇欲侵蝕透明導電層 1 1之位置處，使該蝕刻油墨層丄3覆蓋於欲蝕刻之 透明導電層1 1區域’《中該印刷網版工2之網目工 2 1係可為單一排版或為多數排版。 供烤2:將上述印刷一蝕刻油墨層13之基板1 0 Ik過100 C以上之溫度進行烘烤2，讓蝕刻油墨層 1 3之鱗酸成分產生反應進而侵㈣基板1 〇上之透 明導電層1 1。 /月洗3 ·以純水3 0清洗基材1 〇表面之蝕刻油 9 1333403 ‘墨層1 3之磷酸殘膜’即可完成所需之蝕刻製程。 藉由上述之步驟可使本發明改變習用防蝕刻油墨 之大面積正片印刷製程模式，利用負片小面積印刷製 私，且使用網印機印刷，將蝕刻油墨網印刷於不需要 導電區域，並僅經過烘烤及清洗兩道製程，可直接將 姓玄！'由墨去除同時清洗基材表面；如此，簡單之製程 即可將不需要之透明導電層（ITO Layer)去除，而改善 傳統濕式蝕刻與乾式蝕刻之缺點，而達到：（A)產能較 • 大、（B)設備總金額較低、（C)不需控制化學藥品濃度、 (D)不需處理所排放之化學藥品、（幻製程較習用之濕 式蝕刻簡單、（F)機台也較容易保養、（G)不需刻意隔 離工作區域、（Η)原物料耗用量較習用之濕式钱刻 優點。 综上所述，本發明觸控面板之負片印刷蝕刻製程 可有效改善習用之種種缺點，可縮短濕式钱刻之生產 8寺間、製程設備及減少原物料用量，且達到不需因酸 鹼液的氣體揮發而刻意隔離工作區域之功效進而使 本發明之産生能更進步、更實用、更符合使用者之所 須’確已符合發明專利申請之要件，差依法提出專利 申請。 ，惟以上所述者，僅為本發明之較佳實施例而已， 當不能以此限定本發明實施之範H，凡依本發明 _請專利㈣及發明說明書内容所作之簡單的等_ 化與修飾，皆應仍屬本發明專利涵蓋之範圍内。 1333403 【圖式簡單說明】 第1圖，係本發明之製造流程圖示意圖。 第2圖，係本發明之印刷步驟示意圖。 第3圖，係本發明印刷後之蝕刻油墨範圍示意圖。 第4圖，係本發明之烘烤步驟示意圖。 第5圖，係本發明之清洗示意圖。 第6圖，係習用濕式蝕刻製造流程示意圖。 第7圖，係習用之防蝕刻油墨範圍示意圖。 【主要元件符號說明】 (本發明部分） 印刷1 基板1 0 透明導電層1 1 印刷網版1 2 網目1 2 1 蝕刻油墨層1 3 烘烤2 清洗3 純水3 0 1333403 (習用部分） 清洗4 0 防蝕刻油墨印刷4 1 UV固化4 2 濕式蝕刻4 3 酸液清洗4 4 剝墨4 5 φ 驗液清洗4 6 基板5 透明導電層5 1 防蝕刻油墨6Γ333403 IX. Description of the Invention: [Technical Field] The present invention relates to a negative printing process for a touch panel, and more particularly to a method for shortening the production time of a wet type, manufacturing process equipment, and reducing the amount of raw materials. It can achieve the effect of not leaving the working area without the volatilization of the acid and alkali gas. [Prior Art] According to the general etch method for the transparent conductive layer (ITO layer) in the manufacturing process of the touch panel, there are dry etching and wet etching, as described below. First, dry money engraving: 1 · Single-head laser machine, currently the industry mostly uses C〇2 laser and YAG laser. The principle is to use a laser light source to remove the transparent conductive layer (ITO Layer) on the surface of the substrate; the method is to input the required pattern to the laser to adjust the power and speed 'the laser beam will follow the required pattern path- - Characterize the laser light source with 'C〇2 laser. · Use the focusing mirror to condense the light energy, and use the surface-focusing mirror to guide the beam from the source to the desired path, so the source of the laser is at a distance. At a distance, there is a problem of energy loss and Pattern amplification. Therefore, most of the products with high ITO layer etching and precision requirements are lasers other than C〇2; since the C02 laser is a high-power laser excited by discharge, it is easier. The 5 1333403 of the glass substrate is broken and the plastic substrate (PET, PC) is broken and burnt black, and the laser light source is irradiated on the substrate to remove the transparent conductive layer (IT0 Layer), but the transparent conductive layer (ITO layer) is removed. ) The production of ITO Powder is likely to cause contamination of the clean room, so it is necessary to isolate the work area. And the following. · Disadvantages: (A) long manufacturing time, (B) low productivity, (C) easy to produce dust, (D) YAG laser equipment, a higher amount, (E) C〇2 Lei The overall functionality of the shooter is poor, and (F) the work area needs to be isolated. At present, there are only a few choices in the industry for this type of remnant, but most of these methods are used for the etching of transparent conductive layers (ITO layers) for plastic substrates (PET, PC). 2 · Printed insulation layer is used, no conductive layer is printed on the substrate, and the upper conductive silver paste is in contact with the underlying transparent conductive layer (ITO Layer) to achieve the insulating effect; due to the lower conductive non-conductive insulating layer Most of the materials are epoxy acrylic resin, and the printed matter is more prone to holes. The upper conductive silver paste is in contact with the transparent conductive layer (IT〇LaKr) of the substrate which is uncured and easily penetrates into the underlying non-conductive insulating layer. In order to avoid this phenomenon, an insulating layer is additionally printed on the insulating layer; and the film thickness of the printed matter itself increases the thickness of the entire touch panel, which is thicker than the thickness of the general touch panel. At present, the product is light and short, and it is not suitable. In addition, in order to prevent the interference of electromagnetic waves, it is necessary to use a single-head laser to engrave the pattern to solve the interference of electromagnetic waves, which is caused by the film thickness of the printed matter itself. The conductive adhesive covering this step is easier to break, causing the line to be free of 6 1333403 conduction and poor conduction, resulting in the lower layer is not conductive Phenomenon will cause peel Off case where the adhesion layer on the substrate is poor, thereby making the conductive paste more breakage. At present, most of the etching methods are eliminated in the industry, and only a few continue to use them. Second, wet type engraving: The acid layer (hydrochloric acid, aqua regia) is used to etch the transparent conductive layer (ITO layer) on the substrate; the implementation method is as shown in Fig. 6, it needs to be cleaned 40, anti-money ink printing 4 1, uv curing 4 2, wet money engraving 4 3, acid cleaning 4 4, stripping 4 5 and lye cleaning 4 6 · · · and other processes. The detailed steps are as follows (refer to Figure 7 for the fit): 1. The substrate 5 must be cleaned first, using lye, brush, and pure water to remove dust, dirt, and oil from the surface. 2. An anti-etching ink 6 is printed on the substrate 5 to cover the desired transparent conductive layer 51 to protect the acid from attack. 3. The dried process 'cures the anti-etching ink 6'. 4 · The acid etching process, the transparent conductive layer 51 is not covered with the transparent conductive layer 51 of the anti-scratch ink, and the transparent conductive layer 51 is removed by soaking the acid solution and invading the surname; If the concentration is too low, the transparent conductive layer 51 cannot be removed; if the concentration is too high, the surface of the substrate will be broken. If the process is volatile due to volatile gases, it will cause harm to the human body for a long time. Therefore, it is necessary to isolate the working area. 5 ·/gastric washing process 'The acid on the surface of the substrate 5 is cleaned. 6 ·Inspection and stripping of ink 4 5 process 'Aqueous immersion stripping 4 7 1333403 5 process, remove the anti-etching ink covering the substrate 5; need to control the concentration of lye, if the concentration is too low, it will not cover the substrate The anti-etching ink is removed; this process is harmful to the human body due to the volatile gas, so it is necessary to isolate the working area. 7. Further cleaning the substrate 5 to clean the surface of the substrate 5. The disadvantages of the above-mentioned wet etching include: at least (A) the process is cumbersome, (B) chemicals that need to be treated for discharge, (c) the concentration of chemicals to be controlled to achieve its characteristics, and (D) the working space occupied by the equipment. Large, (E,) • need to isolate the etching and stripping work area, (F) machine maintenance is more complicated · · · and other shortcomings; make the etching process cumbersome and difficult to control 'long process and the cost of the process equipment is large , as well as the need to constantly control the concentration of acid and test liquids have maintained their functionality, and must be deliberately isolated from the working area due to the volatile gases of the acid test solution. SUMMARY OF THE INVENTION The main object of the present invention is to shorten the production time of the wet money engraving, the S-process equipment and the reduction of the raw material f, and to achieve the intention of 'isolation of the working area without the evaporation of the t-body of the acid-base liquid. The effect. For the purpose of the above, the present invention is a negative printing process (four) process of a touch panel, comprising at least steps of printing, baking and cleaning; providing: a substrate having a transparent conductive layer, the substrate is matched with a printing screen for transparency The m ink layer is printed on the conductive layer, and the silk ink layer is covered on the electro-optical layer region to be biased; and the substrate of the printing ink layer is subjected to baking, so that the ink layer of the ink layer 333403 reacts and erodes The transparent conductive layer on the substrate; the etched ink layer residual film on the surface of the substrate is cleaned with pure water to complete the etching process required. [Embodiment] Please refer to "1st to 5th" BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a manufacturing process diagram, a schematic diagram of a printing step of the present invention, a schematic diagram of a range of etching inks after printing of the present invention, a schematic diagram of a baking step of the present invention, and a cleaning schematic of the present invention. A negative-printing etching process for a touch panel, comprising at least the following steps: Printing 1: providing a substrate 1 having a transparent conductive layer (IT〇Layer) 1 1 The substrate i 〇 is matched with the printing screen plate 2 to print an etching ink layer 3 on the transparent conductive layer 1 1 , and the material of the etching ink layer 13 can be phosphoric acid ink, and the printing screen 2 mesh 2 2 1 The opening area is only at the position where the substrate i is to erode the transparent conductive layer 1 1 , so that the etching ink layer 丄 3 covers the transparent conductive layer 1 1 to be etched. The work 2 1 series can be a single typesetting or a majority typesetting. For baking 2: baking the substrate 1 0 Ik of the above-mentioned printing ink layer 13 over a temperature of 100 C or more, and etching the ink layer 13 The component reacts and invades (4) the transparent conductive layer 1 on the substrate 1 . / month wash 3 · cleans the substrate 1 with pure water 30 蚀刻 the surface of the etching oil 9 1333403 'the ink layer 1 3 phosphoric acid residual film' The etching process required is completed. By the above steps, the invention can change the large-area positive printing process mode of the conventional anti-etching ink, use the negative-small-area printing and private printing, and use the screen printing machine to print the etching ink network. No conductive area is required, and only baked and cleaned The process can directly remove the surname Xuan! 'Removal from the ink while cleaning the surface of the substrate; thus, the simple process can remove the unnecessary transparent conductive layer (ITO Layer), and improve the shortcomings of the conventional wet etching and dry etching. And reach: (A) the production capacity is larger than (large), (b) the total amount of equipment is low, (C) there is no need to control the concentration of chemical substances, (D) the chemical substances discharged are not required to be treated, (the magic process is more conventional than the wet type) Simple etching, (F) machine is also easier to maintain, (G) does not need to intentionally isolate the working area, (Η) raw material consumption is better than the conventional wet money engraving. In summary, the touch panel of the present invention The negative film printing etching process can effectively improve various disadvantages of the conventional use, can shorten the production of wet temples, process equipment and reduce the amount of raw materials, and achieve the deliberate isolation of the working area without the volatilization of acid and alkali liquid. Efficacy, in turn, makes the invention more progressive, more practical, and more in line with the user's requirements. It has indeed met the requirements of the invention patent application, and the patent application has been made according to law. However, the above description is only a preferred embodiment of the present invention, and the simple implementation of the invention is not limited thereto, and the simple equivalent of the invention (please patent) and the description of the invention is Modifications are still within the scope of the invention. 1333403 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the manufacturing flow chart of the present invention. Fig. 2 is a schematic view showing the printing steps of the present invention. Fig. 3 is a schematic view showing the range of etching ink after printing of the present invention. Figure 4 is a schematic view of the baking step of the present invention. Figure 5 is a schematic view of the cleaning of the present invention. Figure 6 is a schematic diagram of a conventional wet etching process. Figure 7 is a schematic diagram of the range of conventional anti-etching inks. [Main component symbol description] (part of the invention) Printing 1 Substrate 10 Transparent conductive layer 1 1 Printing screen 1 2 Mesh 1 2 1 Etching ink layer 1 3 Baking 2 Cleaning 3 Pure water 3 0 1333403 (conventional part) Cleaning 4 0 Anti-etching ink printing 4 1 UV curing 4 2 Wet etching 4 3 Acid cleaning 4 4 Stripping 4 5 φ Liquid cleaning 4 6 Substrate 5 Transparent conductive layer 5 1 Anti-etching ink 6