1331671 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種對液晶顯示裝置用玻璃基板、PDP(電 漿顯示面板）用玻璃基板和半導體晶圓等之薄板狀電子元 件用基板（以下簡稱「基板」）進行燒成處理之基板燒成爐 的供排氣系統。 【先前技術】 於彩色;慮光片之一製造製程中，有對藉由噴墨附著彩色 墨水之玻璃基板進行燒成之製程。此燒成製程藉由在升溫 至預定之燒成溫度的燒成爐中，於大氣環境下，將玻璃基 板保持預定時間而進行。此外，於玻璃基板上形成金屬配 線之情形，於同樣之燒成爐中，於氮氣等惰性氣體環境下 燒成玻璃基板。無論哪種燒成處理製程，均由於包含於玻 璃基板上之彩色墨水等被燒成物中的有機溶劑揮發或氧 化’產生許多有機物並擴散到大氣中。 因此，燒成處理中，於不斷將清潔的熱風傳送至燒成爐 之同時，亦連續進行排氣，以使有機物不滯留於燒成爐 中因不可將自燒成爐排出之含有多量有機物的氣體未經 處理即排放至大氣中，故進行了藉由洗縣器等收集排氣中 之有機物的處理。 另-方面’從節能觀點來看，亦嘗試使自燒成爐排出之 熱風與新供給至燒成爐之氣體之間進行熱交換。即，若用 ,滌：處理燒成爐排出之氣體，被帶走之熱能量變得非常 夕’仗而能源效率惡化，因此，此嘗試係將排出之氣體與 121897.doc io/l 新供給之氣體導入熱交換器中，藉由使其等之間進行熱交 換’回收來自燒成爐之排出熱量。 因若將燒成爐排出之氣體未經處理便導入熱交換器，則 有機物附著於熱交換器内之結構物上而造成網眼堵塞，故 必須於使排出氣體進行觸媒處理且分解有機物之後導入熱 交換器。關於對從爐内排出之排出氣體進行觸媒處理後， 導入熱父換器之技術’揭示於例如專利文獻1。 [專利文獻1]曰本專利特開200 uoim 【發明内容】 [發明所欲解決之問題] …、:而即使對自玻璃基板燒成爐排出之氣體進行觸媒處 理亦無法充分除去有機物，其結果，於較短時間内熱交換 器由於附著物而堵塞，結果因無法長時間連續運轉，因此 裝置運行率變低，經濟性差。 因此，實際上大多藉由洗滌器處理自燒成爐排出之氣 疋因此if形除上述之低能源效率之外，亦必須 理後之廢液進行處理，故存在運行成本變高之問題。、 处本發明㈣於上述問題而進行者，#目的在於提供一種 二、效率π並可長期穩定運行之基板燒成爐之供排氣系 [解決問題之技術手段] 為解決^述問題，請求⑹之發明具備：基板燒成爐， 二具有收容基板並進行燒成處理之爐體1自前述爐體排 之熱風播環並再次供給至前述爐體之循環通道、設置於 121897.doc 此外，若藉由笋來 流入熱交換器之熱風明’：於自觸媒單元排出而 壓力之壓力差遠 、〃自熱交換器排出之熱排氣的 故旁通通道於熱交=二上之時點，使旁通通道動作， 之時點動作，可:::::::造中附著某數量之有機物 側附近具備供觸:單…氣 == 板燒成處理之情形，亦可於觸媒單元發 2機物之熱分解和氧化分解，使觸媒單元之出口側溫度 達到向溫，提高熱交換器之熱交換效率。 【實施方式】 明 以下-邊參照圖式一邊就本發明之實施形態進行詳細說 〇 ^係顯示本發明相關之基板燒成爐之供排氣系統的重 要部位構成之概略圖。此外，圖2係從上方看基板燒成爐 斷面圖基板燒成爐1係燒成搭載有彩色墨水等的方型 破螭基板W(本發明所稱之基板）之熱風爐。基板燒成爐1具 備·收谷玻璃基板W進行燒成處理之爐體使自爐體1〇 排出之熱風循環，再次供給至爐體1 〇之循環通道20 ;設置 於循環通道20上使熱風循環之風扇21 ;和設置於循環通道 20上，使熱風加熱之加熱器22。 爐體10係基板燒成爐1之本體部’可多階段收容玻璃基 板w(於本實施形態中為40階段）之框體。爐體10之内側為 略呈四方體形之熱處理空間19。於爐體1〇之内壁面内設有 12 >897.d〇c 1331671 省略圖示之複數個叉子。各叉子係從爐體1G之内壁面朝向 熱處理空間19沿水平方向延伸設置。沿水平方向並列之複 數個叉子構成1階段之棚架，且該棚架形成為4〇階段。於 各階段棚架上，可以水平姿勢載置-牧玻璃基板W。 於爐體1 0之正面側（圖2之紙面左側）設置隔栅式之百葉 窗11。百葉窗11由多階段積層複數個隔栅所構成。於各隔 柵上附設省略圖示之升降驅動機構’使各隔柵可升降。圖 外之搬運機器人對於基板燒成爐丨搬出搬入玻璃基板w 時，與该棚架高度幾乎相同之位置的隔柵上升，以僅使與 搬出搬入之棚架相對部位做存取用開口。若如此，可將玻 璃基板W之搬出搬入時之開口設為所需最小限度，且可將 伴隨搬出搬入之熱能源洩露控制於最小限度。再者，因在 驅動百葉窗11較下部之隔柵時，亦連動驅動該隔柵上階段 之隔柵，故必須設置可獲得與下部之隔柵相當大小之扭矩 之驅動機構。 於爐體1 0之側面，相對設置有向熱處理空間丨9供給熱風 之吹出口 12及排放熱風之排氣口 14。即，於本實施形態之 基板燒成爐1，從爐體1〇之一側面供給之熱風沿玻璃基板 w表面’水平方向地流向熱處理空間19内，並流向相對側 側面。吹出口 12及排氣口 14設置於爐體10之内壁面中至少 與收容玻璃基板W之整個多階段棚架對應之高度的位置。 故此’可向收容於爐體10内之玻璃基板…均勻供給熱風， 進行均質之熱處理》 於吹出口 12設置對應高溫之耐熱HEPA過濾器13。耐熱 121897.doc 1331671 HEPA過遽器η係去除包含於經由循環通道2G所送執風中 之微粒，形成清潔之熱風。$-方面，於排氣口 14，設置 全面配置複數個通氣孔之沖孔金屬15。流經熱處理空^ 之熱風從沖孔金屬15之通風孔排向循環通道2〇。再者於 爐體i。之内壁面中與百葉窗U相對之壁面係由無排氣孔： 構件形成之爐壁。此外’於爐體1〇之内壁面中，亦可於除 百葉窗"和#之相對之壁面之外之兩方配置與沖孔金二 相同者。[Technical Field] The present invention relates to a glass substrate for a liquid crystal display device, a glass substrate for a PDP (plasma display panel), and a substrate for a thin electronic component such as a semiconductor wafer (hereinafter, The "substrate" is simply referred to as the "exhaust and exhaust system" of the substrate firing furnace in which the firing process is performed. [Prior Art] In the manufacturing process of color and light-sensitive sheets, there is a process of firing a glass substrate on which color ink is attached by inkjet. This firing process is carried out by holding the glass substrate for a predetermined time in an atmosphere in a firing furnace which is heated to a predetermined firing temperature. Further, in the case where a metal wiring is formed on a glass substrate, a glass substrate is fired in an inert gas atmosphere such as nitrogen in the same firing furnace. Regardless of the firing treatment process, many organic substances are generated and diffused into the atmosphere due to volatilization or oxidation of the organic solvent in the fired material such as color ink contained on the glass substrate. Therefore, in the firing process, the clean hot air is continuously sent to the firing furnace, and the exhaust gas is continuously exhausted so that the organic matter does not remain in the firing furnace because the organic matter contained in the self-heating furnace cannot be discharged. Since the gas is discharged to the atmosphere without being treated, the treatment of collecting the organic matter in the exhaust gas by washing the county or the like is performed. On the other hand, from the viewpoint of energy saving, attempts have also been made to exchange heat between the hot air discharged from the firing furnace and the gas newly supplied to the firing furnace. That is, if it is used, the polyester is treated with the gas discharged from the firing furnace, and the heat energy that is carried away becomes very good, and the energy efficiency is deteriorated. Therefore, this attempt is to supply the exhaust gas with a new supply of 121897.doc io/l. The gas is introduced into the heat exchanger, and the heat discharged from the firing furnace is recovered by heat exchange between the gases. If the gas discharged from the firing furnace is introduced into the heat exchanger without being treated, the organic matter adheres to the structure in the heat exchanger and causes clogging of the mesh. Therefore, after the exhaust gas is subjected to catalyst treatment and organic matter is decomposed, Introduce the heat exchanger. The technique of introducing a hot parent converter to the exhaust gas discharged from the furnace is disclosed in, for example, Patent Document 1. [Patent Document 1] Japanese Patent Laid-Open No. 200 uoim [Summary of the Invention] [Problems to be Solved by the Invention]: Even if the catalyst discharged from the glass substrate firing furnace is subjected to catalyst treatment, organic matter cannot be sufficiently removed. As a result, the heat exchanger is clogged by the deposits in a short period of time, and as a result, since the continuous operation cannot be performed for a long time, the apparatus operation rate is low and the economy is poor. Therefore, in practice, most of the gas discharged from the firing furnace is processed by the scrubber. Therefore, in addition to the above-described low energy efficiency, the waste liquid must be treated, which causes a problem of high running cost. The present invention (4) is carried out in accordance with the above problems, and the object of the present invention is to provide a supply and exhaust system for a substrate firing furnace which has an efficiency π and can be stably operated for a long period of time. [Technical means for solving the problem] (6) The invention includes a substrate baking furnace, and a circulation passage for the furnace body 1 that receives the substrate and is subjected to the baking treatment, and is supplied to the furnace body from the hot air circulation ring of the furnace body, and is provided at 121897.doc. If the hot air flows into the heat exchanger by the bamboo shoots': the pressure difference between the pressure is discharged from the catalyst unit, and the bypass passage of the hot exhaust gas discharged from the heat exchanger is at the time of the heat exchange = two To make the bypass channel move, at the time of the action, it can be::::::: There is a contact near the side of a certain amount of organic matter in the build: single...gas== plate burning treatment, also in the catalyst unit The thermal decomposition and oxidative decomposition of the two substances cause the temperature on the outlet side of the catalyst unit to reach the temperature, thereby improving the heat exchange efficiency of the heat exchanger. [Embodiment] The following describes an embodiment of the present invention in detail with reference to the drawings. Fig. 4 is a schematic view showing the configuration of important parts of an air supply and exhaust system of a substrate firing furnace according to the present invention. In addition, Fig. 2 is a view showing a substrate firing furnace. The substrate baking furnace 1 is a hot air furnace in which a square-shaped broken substrate W (a substrate referred to in the present invention) in which color ink or the like is mounted is fired. In the substrate firing furnace 1 , the furnace body that has been subjected to the firing treatment of the grain-receiving glass substrate W is circulated by the hot air discharged from the furnace body 1 , and is again supplied to the circulation passage 20 of the furnace body 1 , and is placed on the circulation passage 20 to make the hot air a circulating fan 21; and a heater 22 disposed on the circulation passage 20 to heat the hot air. The body 10 of the furnace body 10 is a housing body that can accommodate the glass substrate w (in the present embodiment, 40 stages) in multiple stages. The inside of the furnace body 10 is a heat treatment space 19 having a substantially square shape. A plurality of forks (not shown) are provided in the inner wall surface of the furnace body 1 12 gt. 897.d〇c 1331671. Each of the forks extends from the inner wall surface of the furnace body 1G toward the heat treatment space 19 in the horizontal direction. A plurality of forks juxtaposed in the horizontal direction constitute a stage of the scaffold, and the scaffold is formed into a 4-stage stage. On each stage of the scaffolding, the glass substrate W can be placed in a horizontal position. A barrier type louver 11 is provided on the front side of the furnace body 10 (the left side of the paper surface of Fig. 2). The louver 11 is composed of a plurality of barriers stacked in multiple stages. Each of the grids is provided with an elevation drive mechanism (not shown) so that the barriers can be raised and lowered. When the transfer robot carries out the loading and unloading of the glass substrate w in the substrate firing furnace, the barrier is raised at a position substantially the same as the height of the scaffold, and the access opening is made only to the portion opposite to the scaffold that is carried in and out. In this manner, the opening when the glass substrate W is carried in and out can be minimized, and the leakage of the thermal energy accompanying the loading and unloading can be minimized. Further, since the barrier of the upper stage of the barrier is also driven in conjunction with the lower barrier of the shutter 11, it is necessary to provide a drive mechanism that can obtain a torque equivalent to the barrier of the lower portion. On the side of the furnace body 10, an air outlet 12 for supplying hot air to the heat treatment space 丨9 and an exhaust port 14 for discharging hot air are disposed opposite to each other. In the substrate firing furnace 1 of the present embodiment, the hot air supplied from one side of the furnace body 1 flows horizontally in the heat treatment space 19 along the surface of the glass substrate w, and flows to the opposite side surface. The air outlet 12 and the air outlet 14 are provided at positions on the inner wall surface of the furnace body 10 at least at a height corresponding to the entire multi-stage scaffold in which the glass substrate W is housed. Therefore, it is possible to uniformly supply hot air to the glass substrate accommodated in the furnace body 10, and perform heat treatment in a homogeneous manner. A heat-resistant HEPA filter 13 corresponding to a high temperature is provided in the air outlet 12. Heat resistance 121897.doc 1331671 The HEPA filter η system removes particles contained in the wind sent through the circulation passage 2G to form a clean hot air. In the $- aspect, a punching metal 15 for a plurality of vent holes is provided at the exhaust port 14. The hot air flowing through the heat treatment is discharged from the vent hole of the punching metal 15 to the circulation passage 2〇. In addition to the furnace body i. The wall surface of the inner wall opposite to the louver U is composed of a ventless opening: a wall formed by the member. Further, in the inner wall surface of the furnace body 1, the same as the opposite wall surface of the louver " and # may be the same as the punching gold.
循環通道20係連通爐體10之排氣口 14與吹出口 12之氣體 可通過之通道，且其構成具有於爐體1〇之外壁面和覆蓋基 板燒成爐1整體之耐熱壁之内壁面之間形成之空間。於基 板燒成爐1之循環通道20，設置有風扇21和加熱器22。於 本實施形態，於循環通道20之上游側設置風扇21，而於下 游側6又置加熱器22(P4倒數L1 6-1 5)。所謂循環通道2〇之上 游側係靠近爐體10之排氣口 14—侧，相反地，所謂下游側 係靠近吹出口 12—側》風扇21具體如圖2所示，設置於靠 近並與排氣口 14相對之部位。風扇21具備電動機21a和旋 轉葉片21b’藉由電動機21 a使旋轉葉片2lb旋轉，於循環 通道2 0中產生從上游側向下游側流動之氣流（即從排氣口 14向吹出口 12之氣流）。再者’於圖2雖然設置2個風扇 2 1，但是風扇2 1之設置數為任意。 加熱器22設置於與爐體1〇之百葉窗u相對之爐壁與基板 燒成爐1之耐熱壁之間。加熱器22對流經循環通道20之熱 風進行再次加熱。於本實施形態之基板燒成爐1，藉由循 12l897.doc 13 技通道20之上游側之風扇21所送出之氣流藉由下游側之加 熱器加熱後’ #由耐熱HEPA過據器13淨化，從吹出口 U 供給至熱處理空間19。然後’從爐體ι〇之排氣心排出之 熱風再次藉由風扇21送往循環通道2〇之下游側。再者，於 圖2雖然設置3個加熱器22’但是加熱器22之設置數為任 思、0 如以上所述，基板燒成爐丨作為所謂熱風循環型之燒成 爐構成，在加熱玻璃基板辦，不斷再加熱從爐體1〇排出 之熱風後返回。藉由不斷向爐體10供給新的熱風，熱處理 空間19之溫度被維持在預定之燒成溫度（於本實施形態， 於200。(：〜3 0(TC範圍内根據處理進行設定）。 但是，如上所述，若加熱玻璃基板w，則藉由使玻璃基 板W上之被燒成物（彩色墨水等）所含之有機溶劑揮發或氣 化而產生报多有機物。因於熱處理空間19不斷形成熱風 之氣流，故從玻璃基板冒游離出之有機物與氣流同時從排 氣口 Μ流向循環通道20。若使基板燒成爐丨之熱風循環系 統構成完全關閉之系統，則新的有機物的燒成由於大量有 機物而被抑制，以及耐熱HEPA過濾器13網眼急速堵塞、 劣化，故於本實施形態，向循環通道2〇供給新的氣體，並 從循環通道20進行排氣。 作為排氣通道，於循環通道2〇中，於從加熱器22至爐體 10之氣體吹出口 12之加熱後熱風通過領域2〇a與排氣管3〇 連通連接。而且，於排氣管30上配置觸媒單元31。觸媒單 元31内藏有用於分解有機物之白金（Pt)觸媒。此處，於本 121897.doc 1331671 40b 0 此外’於用於向執交換玲$ ^紐 Π…父換线供給新氣體（空氣或 惰性氣體）之供氣通道40〇設有置= ” π 1 —通閥44。此三通闊44The circulation passage 20 is a passage through which the gas passing through the exhaust port 14 of the furnace body 10 and the air outlet 12 can pass, and is configured to have an inner wall surface on the outer wall surface of the furnace body 1 and the heat-resistant wall covering the entire substrate firing furnace 1. The space formed between them. The circulation passage 20 of the substrate firing furnace 1 is provided with a fan 21 and a heater 22. In the present embodiment, the fan 21 is disposed on the upstream side of the circulation passage 20, and the heater 22 is placed on the downstream side 6 (P4 countdown L1 6-1 5). The upstream side of the circulation passage 2 is close to the exhaust port 14 side of the furnace body 10. Conversely, the so-called downstream side is close to the outlet 12 side. The fan 21 is specifically disposed as shown in FIG. The portion of the port 14 is opposite. The fan 21 includes the electric motor 21a and the rotary vane 21b'. The electric motor 21a rotates the rotary vane 21b, and generates an air flow flowing from the upstream side to the downstream side in the circulation passage 20 (i.e., the airflow from the exhaust port 14 to the air outlet 12). ). Further, although two fans 2 1 are provided in Fig. 2, the number of the fans 2 1 is arbitrary. The heater 22 is disposed between the furnace wall opposite to the louver u of the furnace body 1 and the heat-resistant wall of the substrate firing furnace 1. The heater 22 reheats the hot air flowing through the circulation passage 20. In the substrate firing furnace 1 of the present embodiment, the airflow sent by the fan 21 on the upstream side of the technical channel 20 is heated by the heater on the downstream side. ## Purified by the heat-resistant HEPA filter 13 It is supplied from the air outlet U to the heat treatment space 19. Then, the hot air discharged from the exhaust core of the furnace body is again sent to the downstream side of the circulation passage 2 by the fan 21. In addition, in FIG. 2, three heaters 22' are provided, but the number of heaters 22 is set to any, and 0 is as described above, and the substrate firing furnace is constituted by a so-called hot air circulation type firing furnace, and the heating glass is used. The substrate is processed, and the hot air discharged from the furnace body 1 不断 is continuously reheated and returned. By continuously supplying new hot air to the furnace body 10, the temperature of the heat treatment space 19 is maintained at a predetermined firing temperature (in the present embodiment, it is 200. (: 〜3 0 (setting in accordance with processing in the TC range). As described above, when the glass substrate w is heated, the organic solvent contained in the fired material (color ink or the like) on the glass substrate W is volatilized or vaporized to generate a multi-organic material. The hot air is formed, so that the organic matter released from the glass substrate flows from the exhaust port to the circulation passage 20 simultaneously. If the hot air circulation system that heats the substrate into a furnace constitutes a system that is completely closed, the new organic matter is burned. Since a large amount of organic matter is suppressed and the mesh of the heat-resistant HEPA filter 13 is rapidly blocked and deteriorated, in the present embodiment, a new gas is supplied to the circulation passage 2A, and the exhaust gas is exhausted from the circulation passage 20. In the circulation passage 2, after the heating from the heater 22 to the gas outlet 12 of the furnace body 10, the hot air is connected to the exhaust pipe 3〇 through the field 2〇a. The catalyst unit 31 is disposed on the 30. The catalyst unit 31 contains a platinum (Pt) catalyst for decomposing organic matter. Here, in the present 121897.doc 1331671 40b 0 ...the parent line is supplied with a new gas (air or inert gas), and the air supply passage 40 is provided with a = π 1 - valve 44. This three-way wide 44
與旁通管4Gb連接（P5倒數L9卜切換三通閥44以選擇經由 熱交細5〇向供氣管4〇供給新供給之氣體或者不瘦由執六 換器5〇,而經由旁通管40b向供氣管4〇供氣。於新供：之 氣體通過旁通管40b之情形，旁通管杨不經由埶交換器 50,而發揮直接向循環通㈣供氣之旁通通道之作用。、無 論新供給之氣體流過哪―通道，最終都流人供氣管，其供 給流量由流量調節閥42調節。 …、 成熱交換器50進行從觸媒單元31排出之熱風和新供給至循 環通道20之氣體的熱交換。本實施形態之熱交換器係蓄 熱式熱交換器，使自觸媒單元31排出並由排氣㈣供給之 向溫熱風，與自供氣通道4〇c供給之較低溫氣體於蓄熱部It is connected to the bypass pipe 4Gb (P5 countdown L9 switches the three-way valve 44 to selectively supply the newly supplied gas to the air supply pipe 4 through the heat exchange fine 5〇 or the thinner switch 5〇, and via the bypass pipe 40b supplies air to the air supply pipe 4. When the newly supplied gas passes through the bypass pipe 40b, the bypass pipe Yang does not pass through the helium exchanger 50, but functions as a bypass passage for directly supplying the gas to the circulation (four). Regardless of which channel the newly supplied gas flows, the flow of the gas is finally supplied to the human air supply pipe, and the supply flow rate is regulated by the flow regulating valve 42. The heat exchanger 50 performs the hot air discharged from the catalyst unit 31 and the new supply to the circulation. Heat exchange of gas in the passage 20. The heat exchanger according to the present embodiment is a regenerative heat exchanger that discharges the self-catalyst unit 31 and supplies it to the warm air by the exhaust gas (four), and supplies it to the self-supply passage 4c. Lower temperature gas in the heat storage unit
之元件處相互接觸’介以元件’將排出熱風保有之熱量、傳 遞給新供給之氣體。 此外，於本實施形態之供排氣系統設有控制部9〇。作為 控制部90硬體之構成與普通之電腦相同。即，控制部9〇具 備進行各種計算處理之CPU、記憶並讀出基本製程程式之 專用記憶體之ROM'記,隐各種資訊並自由讀‘寫記憶體之 RAM(P6L5-6)及記憶控制用應用及資訊等之磁碟等。栌制 邛9〇與流量調節閥32、42及三通閥44電性連接，控制哕等 之動作。此外，控制部90亦控制基板燒成爐丨之各動作部 (例如風扇2!、加熱器22、百葉窗丨丨之升降驅動機構）之動 »2)897.d〇, 1331671 此’比藉由加熱器22加埶後之馇 周n ‘·，、谈之燒成溫度南數十。C高溫之敎 几的邛y刀將立即流入觸媒單元3 J。 白^加熱器22加熱後之高溫熱風立即流人觸媒單元31盘 =接觸’則白金觸媒亦變成高溫，包含於自循環通 =排出之熱風中的有機物將被高效率地分解。此時，於 月性氣體環境中燒成玻璃基板料，於 機物之熱分解，而於空氣€璜中m 早兀1發生有 轧衣境中燒成時，於觸媒單元31同The components are in contact with each other 'the intervening element' will discharge the heat retained by the hot air and pass it to the newly supplied gas. Further, the air supply and exhaust system of the present embodiment is provided with a control unit 9A. The configuration of the hardware of the control unit 90 is the same as that of a normal computer. In other words, the control unit 9 includes a CPU that performs various calculation processes, a ROM' that memorizes and reads a dedicated memory of the basic process program, hides various information, and freely reads the RAM of the write memory (P6L5-6) and memory control. Use a disk such as applications and information. The 邛9〇 is electrically connected to the flow regulating valves 32 and 42 and the three-way valve 44 to control the operation of the cymbal or the like. Further, the control unit 90 also controls the movement of each of the operation units of the substrate firing furnace (for example, the fan 2!, the heater 22, and the louver lifting mechanism). 2) 897.d〇, 1331671 After the heater 22 is twisted, the circumference of the crucible n '·, and the firing temperature is about tens of degrees south. C high temperature 敎 Several 邛 y knives will immediately flow into the catalyst unit 3 J. The high-temperature hot air heated by the white heater 22 immediately flows into the human-catalyst unit 31 disk = contact', and the platinum catalyst also becomes high temperature, and the organic matter contained in the hot air discharged from the circulation pass = is efficiently decomposed. At this time, the glass substrate material is fired in a monthly gas atmosphere, and the material is thermally decomposed, and when the air is burned in the air in the air, the catalyst unit 31 is the same.
日f發生有機物之埶分解和邀 …、刀解和氧化刀解。其結果，含於從自循 衣^20排放到排氣管3〇之熱風中的有機物幾乎全部被分 解為無害之物質。 、:觸媒早7L 31中有機物大部分被分觸且淨化之熱風通過 流量調節閥32,流入熱交換器5〇β另一方面，於玻璃基板 w上進行通常之燒成處理時，設定三通閥44，以使新供給 ^氣體經過熱交換器5〇。#，關閉旁通管顿。藉此，於 熱交換器5G’ &自觸媒單元31排出之高溫熱風與新供給至 循環通道20之低溫氣體之間進行熱交換，排氣氣體溫度下 降之同時，供氣氣體之溫度上升。此時，因包含於自循環 通道20向排氣管3〇排出之熱風中之有機物幾乎完全被分 解，故熱交換器50内之元件等的有機物附著非常少，可防 止熱父換器5 0之網眼堵塞。 通過熱交換器5〇且溫度降低的排氣氣體經由熱排氣通道 3〇&被排放到外部之排熱管道等。毫無疑問，此排氣氣 现中亦幾乎不包含有機物。另一方面，通過熱交換器50且 概度上升之供氣氣體經由分歧管40a流入供氣管4〇，通過 121897.doc -18- 1331671 流量調節閥42流入循環通道2〇。因新供給之氣體流入循環 通道2〇之風扇21附近（即，加熱器22之上游側，故不會令 吹出至熱處理空間19之熱風溫度下降，而且將藉由加熱器 22加熱後從吹出口丨2供給至熱處理空間19。 右如此，藉由加熱器22加熱後之高溫熱風將立即流入觸 媒單元31，i效率佳地分解熱風中包含之有機&，故有機 物為乎全部被分解。其結果，因於熱交換器5〇之内部構造 附著之有機物被控制在最小限度，故可使熱交換器5〇長時 間穩定地運轉。若能夠使用熱交換器5〇進行供氣氣體與排 氣氣體之間之熱交換，則可提高基板燒成爐1之供排氣系 統之能源效率。 此外，特別是於空氣環境中進行燒成處理之情形，於觸 媒單元3丨上同時發生有機物之熱分解和氧化分解，其結果 顯示觸媒單元31之人口側溫度係近似於燒成溫度之溫度， 但於出口側溫度為上升約20(rc之升溫。通常，於熱交換 器高溫側流體之溫度越高，越可獲得良好之熱效率，若約 400°C以上之高溫的排出氣體流入熱交換器5〇，則可獲得 更佳之能源效率者。毫無疑問，若從基板燒成爐】來看， 藉由於觸媒單7031追加分解熱可藉由供氣獲得藉由排氣自 身排放之熱量以上的熱量。 此外，於基板燒成爐1設置計數收容於爐體1〇内進行燒 成處理之玻璃基板W之枚數的計數器91。作為該計數器 91，可係檢測玻璃基板W是否載置於各個棚架上之光學傳 感器等的硬體計數機構，亦可係識別從處理流程收容於爐 121897.doc 1331671 體10之玻璃基板w之牧數的軟體計數機構。藉由計數器91 計數之處理中的玻璃基板w的枚數以電信號被傳輸至控制 部90。然後，控制部90根據藉由計數器91計數之玻璃基板 W之牧數而控制流量調節閥32及流量調節閥42，調節自循 環通道20之排氣量及向循環通道2〇之供氣量。具體言之， 進行燒成處理之玻璃基板W的枚數越多，與之成正比發生 之有機物量亦變多’故控制部9〇控制流量調節閥32、42 , 使來自循環通道20的排氣量及供給循環通道2〇之供氣量變 多。若如此，因於流入觸媒單元31中之排氣氣體中包含之 有機物的氣體中濃度大致穩定，故白金觸媒穩定地發揮作 用。此外’當進行燒成處理之玻璃基板w的牧數少時，可 減；供排氣量，降低從基板燒成爐i之循環通道2〇帶走之 熱能，相反地，玻璃基板W之枚數多時，可增加供排氣 量’儘可能於早期排出已產生之有機物。 此外，控制部90控制流量調節閥32、42,使自循環通道 2〇之排氣量比向循環通道20之供氣量多一些。若如此，爐 體10之内部不斷形成對於外部大氣為若干負壓狀態，即使 於搬入搬出玻璃基板W開放百葉窗n時’亦可抑制有機物 向爐外泄漏和熱擴散。 若藉由本實施形態之供排氣系統，有機物幾乎不附著於 熱交換器5G之元件等的内部結構，但是若長期進行連續運 行’仍不可避免地會慢慢發生有機物之附著。當有機物附 著於熱交換器50之内部構造，則形成所謂網眼堵塞狀態， 產生邀力損失。為此，基於入口側壓力計33及出口側壓力 121897.doc •20· 1331671 計34之壓力檢測結果，控制部9〇對自觸媒單元3丨排出並流 入熱交換器5G之熱風的壓力與自熱交換器％排出之熱排氣 壓力之壓力差進行檢測。然後，當其壓力差超過所規定之 間值以上時，控制部90切換三通閥44 ’使新供給之氣體通 過旁通管40b。於此狀態下，新供給之氣體不會通過熱交 換益50於疋，於熱父換器5〇，一方面高溫之排氣氣體持 續流入，另一方面因不再供給低溫氣體，故不再發生熱交On the day f, the decomposition of organic matter and the invitation, the knife solution and the oxidative knife solution occur. As a result, almost all of the organic matter contained in the hot air discharged from the jacket 20 to the exhaust pipe 3 is decomposed into a harmless substance. In the catalyst 7L 31, most of the organic matter is separated and the purified hot air passes through the flow rate adjusting valve 32, and flows into the heat exchanger 5〇β. On the other hand, when the normal baking process is performed on the glass substrate w, the setting is set to three. The valve 44 is opened to allow the new supply gas to pass through the heat exchanger 5〇. #, Close the bypass pipe. Thereby, heat exchange is performed between the high-temperature hot air discharged from the catalyst unit 31 and the low-temperature gas newly supplied to the circulation passage 20, and the temperature of the exhaust gas is lowered while the temperature of the supply gas rises. . At this time, since the organic matter contained in the hot air discharged from the circulation passage 20 to the exhaust pipe 3 is almost completely decomposed, the organic matter such as components in the heat exchanger 50 is extremely small, and the hot parent converter 5 0 can be prevented. The mesh is clogged. The exhaust gas that has passed through the heat exchanger 5 and whose temperature is lowered is discharged to the external heat exhaust pipe or the like via the hot exhaust passage 3〇& There is no doubt that this exhaust gas contains almost no organic matter. On the other hand, the supply air that has passed through the heat exchanger 50 and has an increased rise flows into the air supply pipe 4 through the branch pipe 40a, and flows into the circulation passage 2 through the flow control valve 42 of 121897.doc -18-1331671. Since the newly supplied gas flows into the vicinity of the fan 21 of the circulation passage 2 (i.e., on the upstream side of the heater 22, the temperature of the hot air blown out to the heat treatment space 19 is not lowered, and the heater 22 is heated from the outlet.丨2 is supplied to the heat treatment space 19. On the right, the high-temperature hot air heated by the heater 22 immediately flows into the catalyst unit 31, i efficiently decomposes the organic substance contained in the hot air, so that the organic matter is all decomposed. As a result, since the organic matter adhering to the internal structure of the heat exchanger 5 is controlled to a minimum, the heat exchanger 5 can be stably operated for a long period of time. If the heat exchanger 5 is used, the gas supply and the discharge can be performed. The heat exchange between the gas and the gas improves the energy efficiency of the supply and exhaust system of the substrate firing furnace 1. In addition, in the case of the firing treatment in the air environment, the organic matter simultaneously occurs on the catalyst unit 3 The thermal decomposition and oxidative decomposition show that the population side temperature of the catalyst unit 31 is approximately the temperature of the firing temperature, but the temperature on the outlet side is increased by about 20 (the temperature of rc is increased. Usually, The higher the temperature of the high-temperature side of the heat exchanger, the better the thermal efficiency can be obtained. If the high-temperature exhaust gas of about 400 ° C or higher flows into the heat exchanger 5, better energy efficiency can be obtained. In the case of the substrate firing furnace, the heat of the heat discharged from the exhaust gas itself can be obtained by the supplied air by the additional heat of the catalyst unit 7031. Further, the substrate firing furnace 1 is provided with a count and stored in the furnace body. The counter 91 of the number of the glass substrates W which are subjected to the firing treatment in the first step. The counter 91 may be a hard body counting mechanism for detecting whether the glass substrate W is placed on each scaffold or the like. The software counting mechanism for recognizing the number of the glass substrates w stored in the furnace 121. doc 1331671 body 10 from the processing flow is transmitted to the control unit 90 by an electric signal by the number of the glass substrates w in the process of counting by the counter 91. Then, the control unit 90 controls the flow rate adjusting valve 32 and the flow rate adjusting valve 42 based on the number of the glass substrates W counted by the counter 91, and adjusts the amount of exhaust gas from the circulation passage 20 and the circulation passage 2 Specifically, the larger the number of the glass substrates W subjected to the firing treatment, the larger the amount of organic substances generated in proportion to the amount of the organic material, so that the control unit 9 controls the flow rate adjusting valves 32 and 42 so as to be from the circulation passage 20 The amount of exhaust gas and the amount of gas supplied to the circulation passage 2 are increased. If the concentration of the organic substance contained in the exhaust gas flowing into the catalyst unit 31 is substantially stable, the platinum catalyst stably functions. In addition, when the number of grazing of the glass substrate w subjected to the firing treatment is small, the amount of supply and discharge can be reduced, and the heat energy taken away from the circulation passage 2 of the substrate firing furnace i can be reduced, and conversely, the glass substrate W When the number of the plurality of pieces is increased, the amount of the exhaust gas can be increased as much as possible to discharge the generated organic matter as early as possible. Further, the control unit 90 controls the flow rate adjusting valves 32 and 42 so that the exhaust gas ratio of the self-circulating passage 2〇 is proportional to the circulation passage 20 The amount of gas supplied is more. In this manner, the inside of the furnace body 10 is continuously formed to have a certain negative pressure state for the outside atmosphere, and even when the glass substrate W is opened and carried out to open the louver n, it is possible to suppress leakage of organic matter to the outside of the furnace and heat diffusion. According to the air supply and exhaust system of the present embodiment, the organic substance hardly adheres to the internal structure of the element of the heat exchanger 5G, but if the continuous operation is performed for a long period of time, the adhesion of the organic substance is inevitably caused. When the organic matter is attached to the internal structure of the heat exchanger 50, a so-called mesh clogging state is formed, and an insufficiency loss is generated. For this reason, based on the pressure detection result of the inlet side pressure gauge 33 and the outlet side pressure 121897.doc • 20· 1331671, the pressure of the hot air discharged from the catalyst unit 3丨 and flowing into the heat exchanger 5G by the control unit 9〇 is The pressure difference from the hot exhaust pressure of the heat exchanger % is detected. Then, when the pressure difference exceeds the predetermined value or more, the control unit 90 switches the three-way valve 44' to pass the newly supplied gas through the bypass pipe 40b. In this state, the newly supplied gas will not benefit from heat exchange 50, and the hot parent exchanger will be 5 〇. On the one hand, the high-temperature exhaust gas continuously flows in, and on the other hand, because the low-temperature gas is no longer supplied, it is no longer Hot exchange
換’熱交換器50之元件等的溫度上升。其結果，附著於熱 交換器5G之内部構造的有機物藉由熱量而再度昇華並被排 出。即，藉由使新供給之氣體流入旁通管4〇b，從熱交換 器50之内部構造去除有機物，實施清潔處理。但是，因進 行此清潔處理時不完全進行熱交換而能源效率降低，故控 制部90切換三通閥44，以使人口㈣力計33與出口側廢力 計34之壓力差達到不^狀值時，新供給之氣體再次通過 熱交換器50。The temperature of the element or the like of the heat exchanger 50 is increased. As a result, the organic matter attached to the internal structure of the heat exchanger 5G is sublimated by heat and discharged. That is, by newly flowing the gas into the bypass pipe 4〇b, the organic matter is removed from the internal structure of the heat exchanger 50, and the cleaning process is performed. However, since the energy efficiency is lowered due to incomplete heat exchange during the cleaning process, the control unit 90 switches the three-way valve 44 so that the pressure difference between the population (four) force meter 33 and the outlet side waste meter 34 reaches a value. At this time, the newly supplied gas passes through the heat exchanger 50 again.
以上，就本發明之實施形態進行了說明，但是本發明只 要不脫離其宗旨’除上述以外，可進行種種之變更。例 如，與本發明相關之供排氣系統亦可係圖3所示者。於圖3 中，就與圖1相同之要素標註相同符號。圖3中之供排氣系 統與圖1不同者係於觸媒單元31中設置供給空氣(或氧氣 空氣供給管6〇。线供給管6G通過熱交換器5G，與排氣管 之觸媒單元31之人口側附近連通連接。再者，為實現此 構成’於圖3之系統中’於排氣管3〇中自加熱後熱風通過 Q域2〇a稍距離之位置配置觸媒單元31。，於排氣管％ 121897.doc 21 與循環通道2G連接之分歧連接點與觸媒單心之間連通連 接空氣供氣管60。 於圖3之系統中，自供氣管4〇供給氮氣等惰性氣體，循 環通道20及爐體Π)之内部為惰性氣體環境。自與之不同通 道之空氣供氣管6G向排氣管3G之觸媒單元31人口側附近供 、。於…父換器5G升溫之空氣（或氧氣）。再者，因係於排氣 管30之最上游位置供給空氣，所以，可防止該空氣倒流， 流入惰性氣體環境之循環通道2{)。#高溫空氣被供給至觸 媒單元31之入口側附近時，與於空氣環境下進行燒成處理 之情形相同’於觸媒單元31同時發生有機物之熱分解與氧 化分解，觸媒單元3 i之出口側溫度變得比入口側溫度還 高。其結果，可提高熱交換器5〇之熱交換效率，使能源效 率更佳。再者，毫無疑問地，圖3之系統係亦可適用於從 供氣管40供給空氣並進行玻璃基板w之大氣燒成處理者。 此外，循環通道2 〇之構成並非限定於如圖2所示之形熊 者，而係連通爐體10之排氣口14和吹出口12之氣體可通過 之流路，於其上游側設置風扇2 i，於下游側設置加熱器之 構成即可。因此，例如為使基板燒成爐丨之外壁面板易於 開放，亦可於爐體10之底部配置加熱器22。 此外，使用旁通管40b之熱交換器50的清潔處理亦可與 入口側壓力計33與出口側壓力計34之壓力差無關地隔一定 間隔實行。 此外’於熱交換器5〇之清潔處理中，亦可藉由使用旁通 官4 0b ’進而一起使用於排氣入口另行設置之例如喷出高 121897.doc •22- 1331671 溫、高壓之過熱蒸氣的過熱蒸氣喷嘴，以較短時間提高清 潔程度。 此外，熱交換器50並非限定於蓄熱式熱交換器者，亦可 係帶有供排氣交替通過之通道的板式熱交換器等。 此外，可收容於基板燒成爐丨之爐體10内之玻璃基板W 的枚數並非限定於40故者，可為任意數量。 此外，藉由具備本發明相關之供排氣系統之基板燒成爐 之燒成處理對象之基板，並非限定於玻璃基板…者，亦可 是半導體晶圓。此外，被燒成物之墨水亦可係跑道用、 ITO電極（麵錫氧化物之透明電極）用等。 【圖式簡單說明】 圖1係顯示本發明相關之基板燒成爐供排氣系統之重要 部份結構的概略圖。 圖2係從上方所見基板燒成爐之斷面圖。 圖3係顯不本發明相關之基板燒成爐之供排氣系統之其 他例之概要圖。 【主要元件符號之說明】 1 基板燒成爐 10 爐體 12 吹出D 13 耐熱HEPA過濾器 14 排氣口 20 循環通道 20a 加熱後熱風通過區域 121897.doc -23- 1331671 21 風扇 22 加熱器 30 排氣管 31 觸媒單元 32、42 流量調節閥 33 入口側壓力計 34 出口側壓力計 40 供氣管 40b 旁通管 50 熱交換器 90 控制部 91 計數器 W 玻璃基板 121897.doc -24-Although the embodiments of the present invention have been described above, the present invention can be variously modified without departing from the scope of the invention. For example, the air supply and exhaust system associated with the present invention may also be as shown in FIG. In FIG. 3, the same elements as those in FIG. 1 are denoted by the same reference numerals. The air supply and exhaust system of Fig. 3 differs from that of Fig. 1 in that a supply air (or an oxygen air supply pipe 6 is provided in the catalyst unit 31. The wire supply pipe 6G passes through the heat exchanger 5G, and the catalyst unit of the exhaust pipe Further, in order to realize this configuration, in the system of Fig. 3, the catalyst unit 31 is disposed at a position slightly longer than the hot air passing through the Q domain 2〇a in the exhaust pipe 3〇. , in the exhaust pipe % 121897.doc 21 and the circulation passage 2G connected to the divergent connection point and the catalyst single core between the air supply pipe 60. In the system of Figure 3, the supply of inert gas such as nitrogen gas from the gas supply pipe 4, The inside of the circulation passage 20 and the furnace body is an inert gas atmosphere. The air supply pipe 6G, which is different from the passage, is supplied to the vicinity of the population side of the catalyst unit 31 of the exhaust pipe 3G. The air (or oxygen) of the 5G warming up by the parent. Further, since the air is supplied to the most upstream position of the exhaust pipe 30, the air can be prevented from flowing backward and flow into the circulation passage 2 of the inert gas atmosphere. When the high-temperature air is supplied to the vicinity of the inlet side of the catalyst unit 31, the same as in the case of the firing treatment in the air environment, the thermal decomposition and oxidative decomposition of the organic substance occur simultaneously at the catalyst unit 31, and the catalyst unit 3 i The outlet side temperature becomes higher than the inlet side temperature. As a result, the heat exchange efficiency of the heat exchanger 5 can be improved, and the energy efficiency can be improved. Further, the system of Fig. 3 is also applicable to a person who supplies air from the air supply pipe 40 and performs atmospheric firing of the glass substrate w. Further, the configuration of the circulation passage 2 is not limited to the bears as shown in FIG. 2, but is a flow passage through which the gas passing through the exhaust port 14 and the air outlet 12 of the furnace body 10 can pass, and a fan is provided on the upstream side thereof. 2 i, the heater can be configured on the downstream side. Therefore, for example, in order to make the wall panel of the substrate firing furnace easy to open, the heater 22 may be disposed at the bottom of the furnace body 10. Further, the cleaning process using the heat exchanger 50 of the bypass pipe 40b may be performed at regular intervals regardless of the pressure difference between the inlet side pressure gauge 33 and the outlet side pressure gauge 34. In addition, in the cleaning process of the heat exchanger 5, it can also be separately used by the use of the bypass officer 40b', and is separately set to the exhaust inlet, for example, the high discharge temperature 121897.doc • 22-1331671 overheating of the temperature and the high pressure The superheated steam nozzle of the steam improves the degree of cleanliness in a shorter period of time. Further, the heat exchanger 50 is not limited to the regenerative heat exchanger, and may be a plate heat exchanger or the like having a passage through which exhaust gas is alternately passed. Further, the number of the glass substrates W that can be accommodated in the furnace body 10 of the substrate firing furnace is not limited to 40, and may be any number. In addition, the substrate to be subjected to the firing processing of the substrate firing furnace having the supply and exhaust system according to the present invention is not limited to the glass substrate, and may be a semiconductor wafer. Further, the ink of the burned material may be used for a racetrack, an ITO electrode (a transparent electrode of a tin oxide), or the like. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the configuration of an important part of a substrate firing furnace supply and exhaust system according to the present invention. Fig. 2 is a cross-sectional view of the substrate firing furnace seen from above. Fig. 3 is a schematic view showing another example of the supply and exhaust system of the substrate firing furnace according to the present invention. [Description of main component symbols] 1 Substrate firing furnace 10 Furnace body 12 Blowing out D 13 Heat-resistant HEPA filter 14 Exhaust port 20 Circulation passage 20a After heating, hot air passage area 121897.doc -23- 1331671 21 Fan 22 Heater 30 Row Trachea 31 Catalyst unit 32, 42 Flow regulating valve 33 Inlet side pressure gauge 34 Outlet side pressure gauge 40 Air supply pipe 40b Bypass pipe 50 Heat exchanger 90 Control part 91 Counter W Glass substrate 121897.doc -24-