TWI330711B - - Google Patents

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TWI330711B
TWI330711B TW095122783A TW95122783A TWI330711B TW I330711 B TWI330711 B TW I330711B TW 095122783 A TW095122783 A TW 095122783A TW 95122783 A TW95122783 A TW 95122783A TW I330711 B TWI330711 B TW I330711B
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Taiwan
Prior art keywords
substrate
detecting
light
detection
detecting device
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TW095122783A
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Chinese (zh)
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TW200706857A (en
Inventor
Kang Il Cho
Ji Seong Noh
Seong Kwon
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K C Tech Co Ltd
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306Details
    • G02F1/1309Repairing; Testing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/58Arrangements comprising a monitoring photodetector
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2203/00Function characteristic
    • G02F2203/69Arrangements or methods for testing or calibrating a device

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Description

UJU711 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種雜質檢測裝 月 j发罝及檢測方法,尤其係關 於為可在基板上穩定地塗敷并 至双且而用於檢測位於基板上表 面或底面之雜質的檢測裝置及其方法。 【先前技術】 在當前的資訊化社會中,顯示器件作為視覺資訊之傳遞 媒體其重要性比任何時候都受到人們關注。形成當前主流 之陰極射線管(Cathode Ray Tube,又稱布朗管)在重量及體 積方面均存在較大問題’目前正在不斷發展可克服 陰極射線管之此限制的許多平板顯示器件(FUt panei Display) ° 平板顯示器件包含液晶顯示器(LCD : Liquid Crystal DisPlay)、场發射顯示器(Field Emission Display)、電漿顯 示面板(Plasma Display Panel)及電致發光(Electr〇luminescence) 等器件’此等器件中之大部分已被製成產品而在市場上進 行銷售。 液ΒΘ顯示面板可滿足電子產品輕薄短小之趨勢,而且最 近批量生產能力得到提高’因而正在很多應用領域中迅速 替代陰極射線管。 尤其’利用薄膜電晶體(Thin Film Transistor,下面簡稱 "TFT”)驅動液晶單元之液晶顯示面板具有晝質優秀、電消 耗低之優勢’而且最近隨著批量生產技術之有效提高及研 究發展之新成果液晶顯示面板正迅速朝著大型化及高解析 112066.doc 1330711 度之方向發展。 藉由此種液晶顯示面板顯示影像之液晶顯示裝置係利用 電場調節液晶之透光率來顯示影像。為此,液晶顯示裝置 包含按矩陣形態排列液晶單元之液晶顯示面板及用於驅動 該液晶顯示面板之驅動電路。 圖1為表示一般的液晶顯示面板之示意圖。 如圖1所示,在一般的液晶顯示面板1中濾色片陣列基板 20與TFT陣列基板30中間夹著液晶層10而貼合。圖j中展示 之液晶顯示面板1為全部有效畫面之一部分。 在渡色片陣列基板20中上部玻璃基板22之背面形成濾色 片24及共同電極26。上部玻璃基板22之前面貼附偏光板 28。滤色片24中佈置紅色(R)、綠色、藍色(B)之濾色片, 措由透出特疋波長區域之光來顯示色彩。相鄰色彩之遽色 片24之間形成未圖示之黑色矩陣(mack Matrix)。黑色矩睁 δ免置在紅色(R)、綠色(g)、藍色(b)之濾色片24之間用於分 離紅色(R)、綠色(G)、藍色(Β)之濾色片24,並藉由吸收自 相鄰單元入射之光來防止對比度之降低。 TFT陣列基板30中在下部玻璃基板32之前表面上有多條 資料線34及閘極線40相互交又而設置,在其交又部上形成 TFT(38)。且,在下部玻璃基板32前表面上資料線“與閘極 線40之間的單元區域形成像素電極36。 丁卩丁(3 8)由連接於閘極線4〇之閘極、連接於資料線34之源 極、隔著通道與源極相對之汲極構成。TFT(38)藉由貫通汲 極之接觸孔連接於像素電極36。此種TFT(38)藉由響庳由閘 112066.doc 1330711 極線4〇傳送之閘極訊號向像素電極36選擇性地供應由資料 線34傳送之資料訊號eTFT(38)藉由響應纟間極線4〇傳送之 掃描訊號而切換資料線34與像素電極36之間的資料傳送路 . 徑,從而縣像素電極WTFT陣㈣㈣之背面貼附偏光 板42。 • 像素電極36位於由資料線34與閘極線40劃分之單元區 . $ ’並由透光率較高之透明導電性物質構成。該像素電極 • 36根據經過汲極供應之資料訊號與形成在上部玻璃基板22 之共同電極26發生電位差。液晶層1〇響應施加至自身之電 場而調節經過TFT陣列基板30入射之光的透光量。當像素電 極36與共同電極26之間發生電位差時,位於下部玻璃基板 32與上部玻璃基板22之間的液晶層1〇之液晶根據介電異向 性而旋轉。據此,自光源經過像素電極36而供給之光將入 射至上部玻璃基板22。 貼附於濾色片陣列基板20及TFT陣列基板30上之偏光板 | 28、42只能透過向某一方向偏振之光,當液晶層1〇之液晶 為90度的扭曲向列(TN)模式時其偏振方向相互垂直。滤色 片陣列基板20及TFT陣列基板30之朝向液晶的表面形成未 圖示之配向膜。 為在濾色片陣列基板20及TFT陣列基板30上形成圖案, 在形成電極及線物質之上部玻璃基板22及下部玻璃基板32 上塗敷光阻(PR : photoresist),然後藉由進行利用光遮罩向 光阻選擇性地照射紫外線光之曝光製程及顯影曝光之光阻 的顯影製程形成光阻圖案。然後,藉由利用該光阻圖案作 Π 2066.doc 1330711 為遮罩之蝕刻製程蝕刻電極及線物質而形成圖案。 圖2為表示安裝現有之表面檢測裝置的光阻層塗層裝置 之不意圖。 圖2所示之光阻層塗層裝置包含用於放置上部玻璃基板 22及下部玻璃基板32之支撐台5〇、在該玻璃基板上塗敷光 • 阻物質之狹縫噴嘴52、安裝在狹缝噴嘴52上用於檢測雜質 ^ 之表面檢測裝置54 » φ 狹縫噴嘴52距該玻璃基板具有150 μπι以下之間距,並在 向該玻璃基板之長度方向移動的過程中在基板之表面上塗 敷光阻物質而形成光阻層56。在此種狹縫喷嘴52移動方向 之前端貼附表面檢測裝置54。 若在支撐台50或上部玻璃基板22、下部玻璃基板32上存 在雜質之狀態下塗敷光阻層56,則該雜質不僅會損壞狹縫 喷嘴52’而且會損壞該玻璃基板,導致液晶顯示面板上發 生缺陷。 φ 為防止產生此問題,表面檢測裝置54安裝在狭縫噴嘴52 移動方向之前端’從而當狹縫喷嘴52移動時產生雷射光束 60 ’以檢測支撐台5〇、上部玻璃基板22及下部玻璃基板 上之雜質,如圖2所示。 一般的光阻層塗層裝置如圖2所示,自表面檢測裝置54 產生之雷射光束60利用光接觸點掃描上部玻璃基板22及下 部玻璃基板32之表面。 但’如上所述之現有的塗層裝置由於自表面檢測裝置54 產生之雷射光束60之掃描區域非常窄,因而不能檢測位於 112066.doc 1330711 掃摇區域之外的雜質,因此不能完全檢測支撐台5〇或上部 玻璃基板22、下部玻璃基板32上之雜質。 若要解決之問題需要設置多個表面檢測裝置54,以用於 掃描支撐台50或上部玻璃基板22、下部玻璃基板32之整個 表面’但設置多個表面檢測裝置54不僅會提高生產成本, 而且亦使結構變得非常複雜。 【發明内容】 本發明係為解決如上所述之問題而提出,其目的在於提 供一種可藉由更為簡單之結構正確地檢測支撐台或基板上 之所有雜質的表面檢測裝置及利用該檢測裝置之表面檢測 方法。 為了實現上述目的依據本發明所提供之表面檢測裝置包 含:具有發光部及收光部之光感應器,以用於在與檢測對 象之檢測表面相隔預定間距之上方按照與檢測對象的檢測 表面平行之方向收發光線;驅動部,以用於沿著與檢測對 象之檢測表面平行但與光感應器之發光方向相交又之方向 相對於檢測對象移送光感應器。 並且’光感應器之發光部及收光部設在被檢測表面之兩 側端外側’並朝著與移送方向相垂直之方向發光,以使光 線橫跨該檢測對象之檢測表面。 並且,依據本發明所提供之表面檢測裝置亦包含:位置 調卽器’以用於調卽檢測對象之檢測表面與該光感應器發 光路徑之間的高度,·與檢測對象之檢測表面隔離而設置之 移送桿,並在其兩端結合發光部及收光部。此時,位置調 112066.doc -10- 1330711 節器構成為料移送桿之結構,Μ 送桿之間的間^並且,該移送變檢料面與移 敷爭 、捽及用於向該檢測對象塗 敷塗層液之狹縫噴嘴可形成為一體。 並且,依據本發明所提供之表 -.^ ± 衣囱檢測裝置包含··與檢測 俨s 直之移廷桿,一端結合於移送 :、另—端朝檢測對象之檢測表面延長之條帶,以用於在 被施加外力時發生擾曲;檢UJU711 IX. Description of the Invention: [Technical Field] The present invention relates to an impurity detection and detection method, and more particularly to a method for stably applying and smearing on a substrate A device for detecting impurities on an upper surface or a bottom surface of a substrate and a method therefor. [Prior Art] In the current information society, the importance of display devices as visual media is more important than ever. The current mainstream cathode ray tube (Cathode Ray Tube, also known as the Brown tube) has a large problem in terms of weight and volume. Currently, many flat panel display devices (FUt panei Display) that can overcome this limitation of cathode ray tubes are being developed. ° Flat panel display devices include liquid crystal display (LCD: Liquid Crystal DisPlay), field emission display (Field Emission Display), plasma display panel (Plasma Display Panel) and electroluminescence (Electr〇luminescence) devices. Most of them have been made into products and sold on the market. The liquid helium display panel can meet the trend of thin and light electronic products, and the recent mass production capacity has been improved, which has rapidly replaced cathode ray tubes in many applications. In particular, a liquid crystal display panel that uses a thin film transistor (hereinafter referred to as "TFT") to drive a liquid crystal cell has the advantages of excellent quality and low power consumption, and has recently been effectively improved and developed with mass production technology. New results Liquid crystal display panels are rapidly moving toward large-scale and high-resolution 112066.doc 1330711 degrees. Liquid crystal display devices that display images by such liquid crystal display panels use an electric field to adjust the transmittance of liquid crystals to display images. Therefore, the liquid crystal display device includes a liquid crystal display panel in which liquid crystal cells are arranged in a matrix form and a driving circuit for driving the liquid crystal display panel. Fig. 1 is a schematic view showing a general liquid crystal display panel. In the display panel 1, the color filter array substrate 20 and the TFT array substrate 30 are bonded to each other with the liquid crystal layer 10 interposed therebetween. The liquid crystal display panel 1 shown in Fig. j is a part of all effective screens. In the upper portion of the color filter array substrate 20 The color filter 24 and the common electrode 26 are formed on the back surface of the glass substrate 22. The upper glass substrate 22 is attached to the front surface. Light plate 28. A color filter of red (R), green, and blue (B) is disposed in the color filter 24, and the color is displayed by light passing through a special wavelength region. Between the color patches 24 of adjacent colors A black matrix (mack matrix) is formed. The black matrix 睁δ is not disposed between the red (R), green (g), and blue (b) color filters 24 for separating red (R), green (G), blue (Β) color filter 24, and preventing the decrease in contrast by absorbing light incident from an adjacent unit. The TFT array substrate 30 has a plurality of data lines on the front surface of the lower glass substrate 32. 34 and the gate lines 40 are disposed to overlap each other, and a TFT (38) is formed on the intersection portion thereof. Further, a pixel electrode is formed on the front surface of the lower glass substrate 32 on the front surface of the data line "with the gate line 40". 36. Ding Ding (38) is composed of a gate connected to the gate line 4, a source connected to the data line 34, and a drain opposite to the source via the channel. The TFT (38) is connected to the pixel electrode 36 through a contact hole penetrating through the drain. The TFT (38) selectively supplies the data signal eTFT (38) transmitted by the data line 34 to the pixel electrode 36 by means of a gate signal transmitted from the gate 112066.doc 1330711 pole line 4〇 by responding to the daytime The scanning signal transmitted by the polar line 4 switches the data transmission path between the data line 34 and the pixel electrode 36, so that the polarizing plate 42 is attached to the back surface of the county pixel electrode WTFT array (4) (4). • The pixel electrode 36 is located in a cell region divided by the data line 34 and the gate line 40. It is composed of a transparent conductive material having a high light transmittance. The pixel electrode 36 has a potential difference from the common electrode 26 formed on the upper glass substrate 22 based on the data signal supplied through the drain. The liquid crystal layer 1 调节 adjusts the amount of light transmitted through the light incident on the TFT array substrate 30 in response to an electric field applied to itself. When a potential difference occurs between the pixel electrode 36 and the common electrode 26, the liquid crystal of the liquid crystal layer 1 located between the lower glass substrate 32 and the upper glass substrate 22 rotates in accordance with the dielectric anisotropy. Accordingly, light supplied from the light source through the pixel electrode 36 is incident on the upper glass substrate 22. The polarizing plates | 28, 42 attached to the color filter array substrate 20 and the TFT array substrate 30 can only transmit light polarized in a certain direction, and the liquid crystal of the liquid crystal layer 1 is 90 degrees twisted nematic (TN) In the mode, the polarization directions are perpendicular to each other. An alignment film (not shown) is formed on the surface of the color filter array substrate 20 and the TFT array substrate 30 facing the liquid crystal. In order to form a pattern on the color filter array substrate 20 and the TFT array substrate 30, a photoresist (PR: photoresist) is applied on the glass substrate 22 and the lower glass substrate 32 on which the electrode and the wire material are formed, and then light is used. The resist process is formed by a development process in which the cover selectively irradiates the exposure process of the ultraviolet light and the photoresist of the development exposure. Then, a pattern is formed by etching the electrode and the line material by using the photoresist pattern as etch 2066.doc 1330711 for the etching process of the mask. Fig. 2 is a schematic view showing a photoresist layer coating apparatus for mounting a conventional surface detecting apparatus. The photoresist layer coating apparatus shown in FIG. 2 includes a support table 5 for placing the upper glass substrate 22 and the lower glass substrate 32, a slit nozzle 52 for applying a light-resistance substance on the glass substrate, and a slit nozzle 52. Surface detecting means 54 for detecting impurities ^ on the nozzle 52. φ The slit nozzle 52 has a distance of 150 μm or less from the glass substrate, and applies light on the surface of the substrate during the movement to the length of the glass substrate. The photoresist layer 56 is formed by a resist material. The surface detecting means 54 is attached to the front end of the slit nozzle 52 in the moving direction. If the photoresist layer 56 is applied in the state where impurities are present on the support table 50 or the upper glass substrate 22 and the lower glass substrate 32, the impurities not only damage the slit nozzle 52' but also damage the glass substrate, resulting in a liquid crystal display panel. A defect has occurred. φ To prevent this problem, the surface detecting device 54 is mounted at the front end of the slit nozzle 52 in the moving direction so that the laser beam 60' is generated when the slit nozzle 52 moves to detect the support table 5, the upper glass substrate 22, and the lower glass. Impurities on the substrate, as shown in Figure 2. A general photoresist layer coating apparatus is shown in Fig. 2. The laser beam 60 generated from the surface detecting device 54 scans the surfaces of the upper glass substrate 22 and the lower glass substrate 32 by light contact points. However, the existing coating apparatus as described above has a very narrow scanning area of the laser beam 60 generated from the surface detecting device 54, and thus cannot detect impurities located outside the swept area of 112066.doc 1330711, so that the support cannot be completely detected. The impurities on the top 5 or the upper glass substrate 22 and the lower glass substrate 32. To solve the problem, it is necessary to provide a plurality of surface detecting devices 54 for scanning the entire surface of the support table 50 or the upper glass substrate 22 and the lower glass substrate 32. However, providing a plurality of surface detecting devices 54 not only increases the production cost, but also increases the production cost. It also makes the structure very complicated. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a surface detecting device capable of accurately detecting all impurities on a support table or a substrate by a simpler structure and using the same Surface detection method. In order to achieve the above object, a surface detecting apparatus according to the present invention includes: a light sensor having a light emitting portion and a light receiving portion for being parallel to a detecting surface of a detecting object at a predetermined interval from a detecting surface of the detecting object The light is transmitted and received in a direction; the driving portion is configured to transfer the light sensor relative to the detection object in a direction parallel to the detection surface of the detection object but intersecting the light emission direction of the light sensor. Further, the light-emitting portion and the light-receiving portion of the light sensor are disposed outside the both side ends of the surface to be detected and emit light in a direction perpendicular to the transfer direction so that the light traverses the detection surface of the detection target. Moreover, the surface detecting device according to the present invention further includes: a position adjuster 'for adjusting the height between the detecting surface of the detecting object and the light emitting path of the light sensor, and is isolated from the detecting surface of the detecting object. The transfer rod is provided, and the light-emitting portion and the light-receiving portion are combined at both ends thereof. At this time, the position adjustment 112066.doc -10- 1330711 is configured as the structure of the material transfer rod, and the space between the rods is sent, and the transfer of the inspection surface and the movement is used for the detection. The slit nozzle of the object coating liquid can be formed in one body. Moreover, the watch---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Used to cause disturbance when an external force is applied;

ώ此能. 巧早兀,以用於檢測條帶之擾 狀態’驅動部’以用於朝著與檢測對象之檢測表面平行 之方向相對於該檢測對象移送該移送桿。 並且’條帶之另-端具有長度方向與檢測對象之檢測表 面相平行之檢測桿,此時檢測桿延長而形成為橫跨檢測對 象之檢測表面兩端的形狀。 此時,檢測單元可使用結合於條帶之應變儀,亦可使用 隨著條帶之擾曲而接觸之接觸感應器。 並且,依據本發明所提供之表面檢測裝置亦包含位置調 節器’以用於調節檢測對象之檢測表面與條帶另_端之間 的距離。且,該移送桿及用於向該檢測對象塗敷塗層液之 狹縫喷嘴可形成為一體。 依據本發明所提供之表面檢測方法,包含步驟:利用具 有發光部及收光部之光感應器在與檢測對象之檢測表面相 隔預定間距之上方按照與檢測對象的檢測表面相平行之方 向進行發光及收光;按照平行於檢測對象之檢測表面但與 光感應器之發光方向相交又的方向相對於檢測對象移送光 感應器;當光感應器之收光部不能接收光線時,停止用於 112066.doc 向檢測對象塗敷塗層液之狹縫噴嘴的操作。 並且,依據本發明所提供之表面檢測方法亦包含在停止 該狹縫喷嘴的操作之後將該狹縫喷嘴移送至塗敷初始位置 • _終止位置之步驟。將該狹縫噴嘴移送至塗敷終止位 置時,提昇狹縫喷嘴並移送至前方。 ’ 並且’依據本發明所提供之表面檢測方法,亦可包含步 冑.在與檢測對象之檢測表面相隔預定間距的上方按照與 • ⑯測對象之檢測表面平行的方向相對於檢測對象移送受外 力時發生擾曲之條帶;檢測條帶之擾曲狀態;當檢測到條 帶之擾曲狀態時,停止用於向該檢測對象塗敷塗層液之狹 縫噴嘴的操作。 並且,依據本發明所提供之表面檢測方法亦包含在停止 該狹縫噴嘴的操作之後將該條帶及該狹縫喷嘴移送至塗敷 初始位置或塗敷終止位置之步驟。將該條帶及該狹縫噴嘴 移送至塗敷終止位置時,提昇該條帶及該狹縫喷嘴並移送 • 至前方。 【實施方式】 • 以下,參照附隨圖式詳細說明依據本發明所提供之表面 . 檢測裂置之實施例。 圖3為依據本發明第一實施例所提供之表面檢測裝置之 不忍圖,圖4為依據本發明第一實施例所提供之表面檢測裝 置之正視圖,圖5為沿著圖4之A-A線截取的本發明第一實施 例所提供之表面檢測裝置之部分剖視圖。 圓3及圖4中展示的本發明第一實施例所提供之表面檢測 H2066.doc 1330711 裝置100位於狹缝喷嘴400移動方向之前方,該狹縫喷嘴4〇〇 用於向安裝在支樓台200之基板300上面塗敷光阻層4ΐ〇»此 種表面檢測裝置100包含:比基板3 00寬度長且與基板3〇〇 之上表面向上隔離一定間隔之移送桿11〇,具有分別結合於 移送桿110兩端之發光部132及收光部134之光感應器13〇, 以用於在與基板3〇〇之上表面相隔預定間距之上方按照與 基板300之上表面平行的方向收發光線;具有連接於移送桿 110兩端之移動支架120之驅動部(未圖示),以用於向著與基 板300之上表面平行但與光感應器13〇之發光方向不同之方 向移送移送桿11 〇。 並且’在移送桿110及移動支架120之結合部分設有用於 調節移送桿110高度之位置調節器122,因而可調節基板3〇〇 上表面與光感應器130發光路徑之間的間距。因此,用戶藉 由調節基板300上表面與光感應器13〇發光路徑之間的間 距,從而可將檢測裝置設定為只檢測超過一定大小之雜 質。即’右雜質非常小亦會給基板3 〇 〇帶來較大影響,則藉 由縮短基板300上表面與光感應器13〇發光路徑之間的間距 而使雜質發光裝置亦可檢測微細之雜質;若比參考值小之 雜質不影響基板300,則藉由將基板3〇〇上表面與光感應器 13 0發光路徑之間的間距設定為參考值,使雜質發光裝置只 檢測參考值以上之雜質。 如圖4及圖5所示,當基板300之上表面或底面沒有雜質 時,自發光部U2入射之光正常地傳遞至收光部134❶但, 當基板300之上表面有雜質時,自發光部132傳遞之光被雜 112066.doc -13· 1330711 質遮擋,從而不能傳遞至收光部134。當基板300之底面有 雜質時,由於基板300以與雜質相同之高度突出,因而自發 光部132傳遞之光被基板3〇〇遮擋而不能傳遞至收光部134。 如上所述’當起動光感應器13〇使發光部132與收光部134 之間進行發光與收光,則朝著與光感應器13〇之發光方向相 垂直之方向移送移送桿11〇,同時掃描整個基板3〇〇。 若光感應器130正常進行發光與收光,則移送桿11〇繼續 被移送,而安裝在移送桿11〇後面之狹縫噴嘴向基板3〇〇的 上表面塗敷光阻層410〇此時,若光感應器π〇之收光部Π4 不能正常進行收光,則表面檢測裝置1〇〇判斷基板3〇〇上有 雜質,因而驅動部停止移送桿丨丨〇之移送動作,狹縫喷嘴亦 停止塗層工作。當停止移送桿110之移送及狹縫喷嘴的塗層 動作時,將狹縫喷嘴移送至前方或後方。將狹縫喷嘴移送 至前方時,為防止雜質損壞該狹縫喷嘴之端部而將該狹縫 噴嘴提昇之後移送至前方。然後,自支撐台200取回未完成 塗層製程之基板3 0 0而進行洗滌過程。經過洗滌過程而恢復 至初始狀態之基板300再次進行塗層製程。當基板底面有雜 質時,若在沒有提昇狭縫喷嘴之狀態下朝前方移送狹縫喷 嘴’則狹縫喷嘴及基板接觸而可能在基板上產生劃痕,而 且亦可能使高價之狹縫喷嘴端部因雜質而損壞。而當基板 上表面有雜質時,若在沒有提昇狭縫喷嘴之狀態下朝前方 移送狭縫噴嘴,則狭縫喷嘴使雜質向前方移動而可能在基 板上產生劃痕,*且狭縫喷嘴自身亦可能因雜質而受損。 由於此劃痕可能導致基板不能再次使用,而且狹缝喷嘴價 M2066.doc -14· 1330711 格較南’因而為保護基板及狭縫喷嘴需要經過將狹縫噴嘴 提昇之後移送至前方的作業。 若移送桿110藉由整個基板3〇〇上表面時光感應器130之 收光部134皆能正常進行收光,則認為基板3〇〇上表面或底 面無雜質’因而狹縫噴嘴一次完成基板3〇〇上表面之塗層工 作。 如上所述’由於依據本發明所提供之表面檢測裝置1 〇〇 利用一光感應器1 30亦能檢測基板3〇〇之整個上表面及底 面’因而不僅可節省生產成本,亦可使結構變得簡單。此 外’依據本發明所提供之表面檢測裝置100不僅可檢測出基 板300上表面及底面之雜質,而且亦可檢測表面形成凸起之 不合格基板300。 本實施例中為能夠在移送一次移送桿1丨〇時掃描整個基 板300 ’使發光部132與收光部134之間距大於基板300寬 度,但發光部132與收光部134之間距可根據需要進行掃描 之範圍大小來進行調節。 此外,本實施例中移送桿11〇之移送方向垂直於光感應器 130之發光路徑,但是移送桿11〇之移送方向亦可設定為按 一定角度傾斜於光感應器13〇之發光路徑。 圖6為依據本發明第二實施例所提供之表面檢測裝置之 不思圖,圖7為依據本發明第二實施例所提供之表面檢測裝 置之正視圖。 如圖6及圖7所示,本發明之第二實施例所提供之表面檢 測裝置1GG利用上端結合於移送桿11() '下端朝基板则上表 112066.doc -15· 1330711 面延長之條帶140來替代第一實施例之光感應器13〇,以用 於檢測是否存在雜質。 移送彳干110上結合多個條帶140,各條帶14〇之下端連接於 . 檢測桿150,該檢測桿15〇形狀較長而橫跨基板3〇〇之上表 • 面,並與基板300之上表面間隔預定距離。由於檢測桿! 50 • ㈣較長而橫跨基板3〇〇之上表面,因而不管雜質在基板 • I00之任何位置皆能與雜質發生干涉’而條帶140由於檢測 # ? 150與雜質之間發生干涉將被擾曲。因此,依據本發明所 提供之表面檢測裝置可藉由移送一次移送桿11〇來測定整 個基板300上是否存在雜質。 此時,檢測桿150之長度可根據需要測定是否有雜質之範 圍而進行增減,而且若條帶Μ0寬度被製作為可橫跨基板 300時,可省略檢測桿150。 並且’可藉由操作設在移送桿11〇與移動支架12〇之間的 位置調節器m來改變移送桿110之高度,從而調節基板3〇〇 籲與檢測桿15g之間的間距。由於調節基板3⑽與檢測桿15〇 間距之目的及效果與第一實施例之調節基板期與感應器 發光路經之間的間距之目的及效果相同,因而在此省略且 說明。 ’、 圖8為沿著圖7之B _ B線截取的本發日月第:實施例所提供 之表面檢縣置之部分剖視圖,圖9為#基板上表面有雜質 時條帶因雜質發生擾曲的本發明第二實施例所提供之表面 檢測裝置之部分剖視圖。 由於條帶140受报小之外力亦會被擾曲因而在貼附於基 H2066.doc •16- 丄頂711 板300上表面之雜質5〇〇與檢測桿15〇相干涉之狀態下若繼 續移送桿110之移送動作,條帶14〇將被擾曲如圖9所示。 此時,條帶140被擾曲之程度藉由貼附於條帶14〇上之應 . 變儀16G來測定,當條帶14G被擾曲之程度超過—定參考時 , 驅動。卩停止移送桿110之移送動作,狭縫喷嘴之塗層製程亦 被中斷w停止移送桿110之移送動作及狹縫喷嘴之塗層動 作時,將移送桿110及狹縫喷嘴移送至前方或後方。其後之 Φ 過程與本發明的第一實施例所描述之過程相同》 圖10為本發明第三實施例所提供之表面檢測裝置之部分 視圖,圖11為當基板上表面有雜質時條帶因雜質發生擾 曲的本發明第三實施例所提供之表面檢測裝置之部分剖視 圖。 如圖所示’本發明所提供之表面檢測裝置1 〇〇可利用藉由 條帶140之擾曲而接觸之毯I感應器J70來構成用於檢測條 帶140擾曲程度之檢測單元。 _ 接觸感應器17〇之端子分別設在移送桿110與條帶140相 互對應之位置,當條帶14〇由貼附於基板3〇〇上表面之雜質 • 500擾曲時相互接觸,如圖11所示。如上所述,當接觸感應 益1 70之兩個端子相互接觸時,表面檢測裝置100檢測出基 板300上有雜質而停止移送桿11〇之移送動作,狹縫噴嘴亦 停止塗層工作。當停止移送桿11〇之移送動作及狭缝喷嘴之 塗層動作時,將移送桿110及狭縫噴嘴移送至前方或後方。 其後之過程與本發明的第一實施例所描述之過程相同。 圖3至圖11中展示狹縫喷嘴400及檢測裝置1〇〇分別由不 U2066.doc -17- 1330711 同之驅動單元驅動的實施例,但若參照作為圖3中展示之本 發明第一實施例所提供之表面檢測裝置變形例之圖12,可 獲知狭縫喷嘴400及檢測裝置1〇〇可由連接桿600形成為一 體。因此’與圖3至圖11中展示之實施例相比可由單個驅動 單元控制狹縫噴嘴400及檢測裝置1〇〇 ’因而可利用較簡單 之結構檢測雜質。並且’利用連接桿6〇〇實現之單一結構亦 可適用於圖8至圖11中展示之第二實施例及第三實施例。In this case, the disturbing state 'drive portion' for detecting the strip is used to transfer the transfer lever relative to the detection target in a direction parallel to the detection surface of the detection object. Further, the other end of the strip has a detecting rod whose longitudinal direction is parallel to the detecting surface of the detecting object, and at this time, the detecting rod is elongated to form a shape across the both ends of the detecting surface of the detecting object. At this time, the detecting unit may use a strain gauge coupled to the strip, or may use a contact sensor that contacts with the strip. Further, the surface detecting device provided in accordance with the present invention also includes a position adjuster 'for adjusting the distance between the detecting surface of the detecting object and the other end of the strip. Further, the transfer lever and the slit nozzle for applying a coating liquid to the detection target may be integrally formed. According to the surface detecting method of the present invention, there is provided a step of illuminating in a direction parallel to the detecting surface of the detecting object by using a light sensor having a light emitting portion and a light receiving portion at a predetermined interval from the detecting surface of the detecting object. And receiving light; moving the light sensor relative to the detecting object in a direction parallel to the detecting surface of the detecting object but intersecting the light emitting direction of the light sensor; when the light receiving portion of the light sensor cannot receive the light, stopping for 112066 .doc The operation of applying a slit nozzle to the test object to the test object. Further, the surface detecting method according to the present invention also includes the step of transferring the slit nozzle to the application initial position • _ termination position after the operation of stopping the slit nozzle. When the slit nozzle is transferred to the coating end position, the slit nozzle is lifted and transferred to the front. And the surface detecting method according to the present invention may further include a step of transferring an external force with respect to the detecting object in a direction parallel to the detecting surface of the measuring object at a predetermined interval from the detecting surface of the detecting object. A strip of disturbed band occurs; the disturbed state of the strip is detected; and when the disturbed state of the strip is detected, the operation of the slit nozzle for applying the coating liquid to the detecting object is stopped. Further, the surface detecting method according to the present invention also includes the step of transferring the strip and the slit nozzle to a coating initial position or a coating end position after the operation of stopping the slit nozzle. When the strip and the slit nozzle are transferred to the application end position, the strip and the slit nozzle are lifted and transferred to the front. [Embodiment] Hereinafter, an embodiment of a surface to be detected according to the present invention will be described in detail with reference to the accompanying drawings. 3 is a front view of a surface detecting device according to a first embodiment of the present invention, FIG. 4 is a front view of a surface detecting device according to a first embodiment of the present invention, and FIG. 5 is a line along line AA of FIG. A partial cross-sectional view of the surface detecting device provided by the first embodiment of the present invention is taken. The surface detection H2066.doc 1330711 device 100 provided in the circle 3 and the first embodiment of the present invention shown in FIG. 4 is located in front of the moving direction of the slit nozzle 400, and the slit nozzle 4 is used for mounting on the branch station 200. The substrate 300 is coated with a photoresist layer 4 ΐ〇» such a surface detecting device 100 includes: a transfer rod 11 长 which is longer than the substrate 300 and spaced upward from the upper surface of the substrate 3 一定, and has a separate transfer to the transfer a light-emitting portion 132 at both ends of the rod 110 and a light sensor 13B of the light-receiving portion 134 for transmitting and receiving light in a direction parallel to the upper surface of the substrate 300 at a predetermined interval from the upper surface of the substrate 3A; A driving portion (not shown) having a moving bracket 120 connected to both ends of the transfer lever 110 for transferring the transfer lever 11 in a direction parallel to the upper surface of the substrate 300 but different from the light emitting direction of the light sensor 13? . And, a position adjuster 122 for adjusting the height of the transfer lever 110 is provided at a joint portion of the transfer lever 110 and the moving bracket 120, so that the interval between the upper surface of the substrate 3〇〇 and the light-emitting path of the light sensor 130 can be adjusted. Therefore, by adjusting the distance between the upper surface of the substrate 300 and the light-emitting path of the light sensor 13, the detecting means can be set to detect only impurities exceeding a certain size. That is, the 'right impurity is too small, which will greatly affect the substrate 3 ,, and the impurity light-emitting device can also detect fine impurities by shortening the distance between the upper surface of the substrate 300 and the light-emitting path of the light sensor 13 . If the impurity smaller than the reference value does not affect the substrate 300, the impurity light-emitting device detects only the reference value by setting the pitch between the upper surface of the substrate 3 and the light-emitting path of the light sensor 130 as a reference value. Impurities. As shown in FIG. 4 and FIG. 5, when there is no impurity on the upper surface or the bottom surface of the substrate 300, the light incident from the light-emitting portion U2 is normally transmitted to the light-receiving portion 134. However, when there is an impurity on the upper surface of the substrate 300, self-luminous light is emitted. The light transmitted by the portion 132 is blocked by the impurity 112066.doc -13· 1330711 and cannot be transmitted to the light collecting portion 134. When there is an impurity on the bottom surface of the substrate 300, since the substrate 300 protrudes at the same height as the impurity, the light transmitted from the light-emitting portion 132 is blocked by the substrate 3 and cannot be transmitted to the light-receiving portion 134. As described above, when the light-emitting unit 132 is caused to emit light and receive light between the light-emitting portion 132 and the light-receiving portion 134, the transfer rod 11 is transferred in a direction perpendicular to the light-emitting direction of the light sensor 13A. Simultaneously scan the entire substrate 3〇〇. If the light sensor 130 normally emits light and receives light, the transfer rod 11〇 continues to be transferred, and the slit nozzle mounted behind the transfer rod 11〇 applies a photoresist layer 410 to the upper surface of the substrate 3〇〇. When the light receiving unit 〇4 of the light sensor π〇 cannot normally receive light, the surface detecting device 1 determines that there is an impurity on the substrate 3, so that the driving unit stops the transfer operation of the transfer rod, and the slit nozzle The coating work was also stopped. When the transfer of the transfer lever 110 and the coating operation of the slit nozzle are stopped, the slit nozzle is transferred to the front or the rear. When the slit nozzle is moved to the front, the slit nozzle is lifted and then moved forward to prevent the impurities from damaging the end of the slit nozzle. Then, the substrate 300 of the unfinished coating process is taken back from the support table 200 to perform a washing process. The substrate 300 which has been restored to the initial state by the washing process is again subjected to the coating process. When there is an impurity on the bottom surface of the substrate, if the slit nozzle is transferred toward the front without lifting the slit nozzle, the slit nozzle and the substrate may be in contact with each other to cause scratches on the substrate, and the slit nozzle end of the high price may be The part is damaged by impurities. When there is an impurity on the upper surface of the substrate, if the slit nozzle is transferred toward the front without lifting the slit nozzle, the slit nozzle moves the impurities forward and may cause scratches on the substrate, and the slit nozzle itself It may also be damaged by impurities. Since the scratches may cause the substrate to be unusable, and the slit nozzle price is M2066.doc -14·1330711 is relatively south, thus the protective substrate and the slit nozzle need to be moved to the front after lifting the slit nozzle. If the transfer rod 110 can receive light normally when the light receiving portion 134 of the light sensor 130 is normally received by the upper surface of the substrate 3, it is considered that the upper surface or the bottom surface of the substrate 3 has no impurities. The coating on the upper surface works. As described above, the surface detecting device 1 according to the present invention can detect the entire upper surface and the bottom surface of the substrate 3 by using a light sensor 130. Thus, not only the production cost but also the structure can be changed. It's simple. Further, the surface detecting apparatus 100 according to the present invention can detect not only the impurities on the upper surface and the bottom surface of the substrate 300 but also the defective substrate 300 on which the surface is formed to be convex. In this embodiment, the entire substrate 300 ′ can be scanned when the transfer rod 1 移 is transferred once, so that the distance between the light-emitting portion 132 and the light-receiving portion 134 is greater than the width of the substrate 300, but the distance between the light-emitting portion 132 and the light-receiving portion 134 can be as needed. The size of the scan is adjusted to adjust the size. In addition, in this embodiment, the transfer direction of the transfer rod 11 is perpendicular to the light-emitting path of the light sensor 130, but the transfer direction of the transfer rod 11 can also be set to be inclined at a certain angle to the light-emitting path of the light sensor 13A. Figure 6 is a perspective view of a surface detecting apparatus according to a second embodiment of the present invention, and Figure 7 is a front elevational view of a surface detecting apparatus according to a second embodiment of the present invention. As shown in FIG. 6 and FIG. 7, the surface detecting device 1GG according to the second embodiment of the present invention is extended by the upper end to the lower end of the transfer rod 11()' toward the substrate, and the upper surface of the table 112066.doc -15· 1330711 is extended. A belt 140 is provided in place of the light sensor 13A of the first embodiment for detecting the presence or absence of impurities. The transfer tray 110 is combined with a plurality of strips 140, and the lower ends of the strips 14 are connected to the detecting rod 150. The detecting rod 15 is long in shape and spans the surface of the substrate 3, and the substrate The upper surface of 300 is spaced apart by a predetermined distance. Thanks to the detector! 50 • (4) Longer and across the upper surface of the substrate 3〇〇, so that the impurity can interfere with the impurity at any position of the substrate • I00', and the strip 140 will be interfered by the interference between the detection # 150 and the impurity Disturbed. Therefore, the surface detecting apparatus provided in accordance with the present invention can measure the presence or absence of impurities on the entire substrate 300 by transferring the transfer rod 11 一次 once. At this time, the length of the detecting lever 150 can be increased or decreased as needed to determine whether or not there is a range of impurities, and if the width of the strip Μ0 is made to span the substrate 300, the detecting lever 150 can be omitted. And the height of the transfer lever 110 can be changed by operating the position adjuster m provided between the transfer lever 11A and the moving holder 12A, thereby adjusting the distance between the substrate 3 and the detecting lever 15g. Since the purpose and effect of adjusting the pitch of the substrate 3 (10) and the detecting lever 15 are the same as those of the first embodiment for adjusting the pitch between the substrate period and the light-emitting path of the inductor, they are omitted and described herein. ', FIG. 8 is a cross-sectional view of the surface of the present invention taken along the line B-B of FIG. 7 : the surface of the surface inspection provided by the embodiment, and FIG. 9 is a section of the substrate when impurities are present on the surface of the substrate due to impurities. A partial cross-sectional view of a surface detecting device provided by a second embodiment of the present invention. Since the strip 140 is subjected to a small amount of force, the force is also disturbed, and if the impurity 5 〇〇 attached to the upper surface of the base H2066.doc •16- dome 711 plate 300 interferes with the detecting rod 15〇, the continuation is continued. The transfer action of the transfer lever 110, the strip 14〇 will be disturbed as shown in FIG. At this time, the extent to which the strip 140 is disturbed is measured by the damper 16G attached to the strip 14 ,, and is driven when the strip 14G is disturbed to a greater extent than the reference.卩The transfer operation of the transfer lever 110 is stopped, and the coating process of the slit nozzle is also interrupted. When the transfer operation of the transfer lever 110 and the coating operation of the slit nozzle are stopped, the transfer lever 110 and the slit nozzle are transferred to the front or the rear. . The subsequent Φ process is the same as that described in the first embodiment of the present invention. FIG. 10 is a partial view of a surface detecting apparatus according to a third embodiment of the present invention, and FIG. 11 is a strip when the upper surface of the substrate has impurities. A partial cross-sectional view of a surface detecting apparatus according to a third embodiment of the present invention which is disturbed by impurities. As shown in the figure, the surface detecting apparatus 1 provided by the present invention can constitute a detecting unit for detecting the degree of disturbance of the strip 140 by using the blanket I sensor J70 which is contacted by the strip 140. The terminals of the contact sensor 17 are respectively disposed at positions corresponding to the transfer rods 110 and the strips 140, and are in contact with each other when the strips 14 are intertwined by the impurities 500 attached to the upper surface of the substrate 3, as shown in the figure. 11 is shown. As described above, when the two terminals of the contact sensor 1 70 are in contact with each other, the surface detecting device 100 detects that there is an impurity on the substrate 300 and stops the transfer operation of the transfer lever 11, and the slit nozzle also stops the coating operation. When the transfer operation of the transfer lever 11 and the coating operation of the slit nozzle are stopped, the transfer lever 110 and the slit nozzle are transferred to the front or the rear. The subsequent process is the same as that described in the first embodiment of the present invention. 3 to 11 show an embodiment in which the slit nozzle 400 and the detecting device 1 are respectively driven by a driving unit not U2066.doc -17-1330711, but referring to the first embodiment of the present invention shown in FIG. As shown in Fig. 12 of a modification of the surface detecting device provided in the example, it is known that the slit nozzle 400 and the detecting device 1 can be integrally formed by the connecting rod 600. Therefore, the slit nozzle 400 and the detecting means 1' can be controlled by a single driving unit as compared with the embodiment shown in Figs. 3 to 11 so that impurities can be detected with a simpler structure. And the single structure realized by the connecting rod 6〇〇 can also be applied to the second embodiment and the third embodiment shown in Figs. 8 to 11 .

知上所述,雖然利用最佳實施例詳細描述本發明,但本 發明之保護範圍並非限定於特定實施例,而是要根據申請 專利範圍來進行解釋。 尤其,雖然本實施例中表面檢測裝置主要用於在基板之 塗層製程之前檢測基板上是否有雜質,但本發明所提供之 表面檢測裝置亦可用於檢測基板以外之各種產品上是否有 雜質’或者測定產品之粗糙程度。 此外,熟習此項技術者應知道,在不脫離本發明保護範 圍之情況下可進行各種修改及變更。 依據本發明所提供之表面檢測裝£不僅可正確地檢測出 基板上表面或底面之雜質,亦可檢測出表面上形成凸起之 不合格基板,而且由於内部結構變得簡單而可降低生產成 本0 並且,依據本發明所提供之表面檢;則裝置藉由與用於向 ,測對象塗敷塗層液之狹缝喷嘴形成為—體,因而可更簡 單地檢測雜質。 並且,依據本發明所提供之表面檢測方法具有可利用一 112066.doc 光感應器來檢測整個基板上是否有雜質之優點。 【圖式簡單說明】 圖1為表示一般的液晶顯示面板之示意圖; 圖2為表示安裝現有的表面檢測裝置之光阻層塗層裝置 之示意圖; 圖3為依據本發明第一實施例所提供之表面檢測裝置之 示意圖; 圖4為依據本發明第一實施例所提供之表面檢測裝置之 正視圖; 圖5為沿著圖4之A-A線截取的本發明第一實施例所提供 之表面檢測裝置之部分剖視圖; 圖6為依據本發明第二實施例所提供之表面檢測裝置之 示意圖; 圖7為依據本發明第二實施例所提供之表面檢測裝置之 正視圖; 圖8為沿著圖7之B_B線截取的本發明第二實施例所提供 之表面檢測裝置之部分剖視圖; 圖9為當基板上表面有雜質時條帶因雜質發生擾曲的本 發明第二實施例所提供之表面檢測裝置之部分剖視圖; 圖10為本發明第三實施例所提供之表面檢測裝置之部分 剖視圖; 圖11為當基板上表面有雜質時條帶因雜質發生擾曲的本 發月第—實施例所提供之表面檢測裝置之部分剖視圖; 圖12為表示圖3中展示的|發明第一實施例所提供之表 112066.docThe present invention has been described in detail with reference to the preferred embodiments thereof, but the scope of the present invention is not limited to the specific embodiments, but is construed in accordance with the scope of the claims. In particular, although the surface detecting device in this embodiment is mainly used to detect whether there is impurity on the substrate before the coating process of the substrate, the surface detecting device provided by the present invention can also be used to detect whether there are impurities on various products other than the substrate. Or determine the roughness of the product. In addition, those skilled in the art will appreciate that various modifications and changes can be made without departing from the scope of the invention. According to the surface inspection apparatus provided by the present invention, not only the impurities on the upper surface or the bottom surface of the substrate can be accurately detected, but also the defective substrate on which the protrusion is formed on the surface can be detected, and the production cost can be reduced due to the simple internal structure. Further, according to the surface inspection provided by the present invention, the apparatus is formed into a body by a slit nozzle for applying a coating liquid to the measuring object, whereby the impurities can be detected more simply. Moreover, the surface inspection method provided in accordance with the present invention has the advantage that a 112066.doc light sensor can be utilized to detect the presence or absence of impurities on the entire substrate. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a general liquid crystal display panel; FIG. 2 is a schematic view showing a photoresist layer coating device for mounting an existing surface detecting device; FIG. 3 is a view showing a first embodiment of the present invention. 4 is a front view of a surface detecting device according to a first embodiment of the present invention; FIG. 5 is a front view of the first embodiment of the present invention taken along line AA of FIG. Figure 6 is a schematic view of a surface detecting device according to a second embodiment of the present invention; Figure 7 is a front elevational view of a surface detecting device according to a second embodiment of the present invention; A partial cross-sectional view of a surface detecting apparatus according to a second embodiment of the present invention taken along line B_B of FIG. 7; FIG. 9 is a surface of the second embodiment of the present invention in which the strip is disturbed by impurities when there is an impurity on the upper surface of the substrate. FIG. 10 is a partial cross-sectional view of a surface detecting device according to a third embodiment of the present invention; FIG. 11 is a view showing a state when an upper surface of the substrate has impurities. Months because of flexing occurring impurities present - the cross-sectional view of a portion of a surface detection apparatus provided by embodiments of the embodiment; FIG. 12 is a diagram shown in FIG. 3 | table 112066.doc embodiment a first embodiment of the invention provided

Claims (1)

,文申請双多fm私日修正替换-頁丨· :十,申請專利範圍·· - 種表面檢測裝置,用以檢測一基板之一檢測表面上之 一雜質’其包含: 移送知’其較該基板之一寬度長、且與該基板之該 ·. 檢測表面相隔; 一感應器單元,以用於檢測沿著一寬度方向橫跨該基, the application for double multi-fm private day correction replacement - page 丨 · : ten, the scope of patent application · · a kind of surface detection device to detect one of the impurities on one of the detection surfaces of a substrate 'its contain: transfer to know' One of the substrates has a long width and is spaced apart from the detection surface of the substrate; an inductor unit for detecting across the base along a width direction 板之该檢測表面之—預定部分之全部,該感應器單元與 該移送桿耦接; -位置調節單元’以用於調節該感應器單元與該基板 之間之一間距,該位置調節單元與移送桿耦接;及 一驅動單元’以用於沿著與該寬度方向相交又的一方 向相對於該基板移送該感應器單元與該位置調節單元。 2·如請求们之表面檢測裝置,其中該感應器翠元包含一光 感應器,以用於與該基板之該檢測表面平行之一方向傳 輸/接收光線’並且於與該移送方向垂直之—方向發光, 使得光線橫跨該基板之該檢測表面。 x 3.如請求項2之表面檢測裝置,其中該光感應器包含 部與一收光部於該基板之該檢測表面之兩端之一外側' 4_如請求項3之表面檢測裝 接於[“曰 ,、中《光錢該收光部耦 筏於移廷桿之兩端。 5. 如請求項4之表面檢測裝置,其中該移送桿與用於向職 ^該檢測表面上塗敷-塗層液之—狹縫㈣形成為二 6. 如請求項1之表面檢測裝置, 其中該感應器單元包含. I12066-990426.doc 丄,/11 傻莳條▼,被形成長形以於一寬度方向橫跨該基 I— 、 * 奴,以及藉由該基板之全部寬度之一雜質與一干擾而擾 曲;以及 一檢測單元,以用於檢測該擾曲條帶之一擾曲狀態。 如切求項6之表面檢測裝置,其中該擾曲條帶之一上端與 該基板之該檢測表面相隔並且與該移送桿㈣;該擾曲 8 條帶之-下端朝向該基板之該檢測表面延展;以及當施 加一外力時該擾曲條帶被擾曲。 如。月求項7之表面檢測裝置,進一牛白人 ϋ 衣置進步包含一檢測桿,該檢 測桿破形成於該擾曲條帶之下端,該檢測桿被形成長形 於^订4基板之該檢測表面之—方向橫跨該檢測表 9, 社 ’、以基板之該檢测表面相隔。 s月求項8之表面檢測裝置 1 ㈣其^ & 我置其中该檢測桿延長而形成橫 跨忒基板之檢測表面兩端。 1〇·如請求項6至9中任一瑙夕主二认 元w ❺之表面檢測裝置’其中該檢測單 匕3耦接至該擾曲條帶之一應變儀。 U.如請求項7至9中任一項之表面檢測裝置 元包含一接觸感應器·該 八〇欢湏丨早 點;該等接觸端1¾ & y ^ 3夕個接觸端 之處.及送桿與該擾曲條帶互相面對 之處,及虽该擾曲條帶擾曲 12.如請求項7之表面檢測裝置,其中:二接觸:點接觸。 板之該檢測表面上塗敷_塗層料與用於向該基 體。 θ之一狹鏠喷嘴形成為一 J12066-990426.doc 2.a plurality of predetermined portions of the detecting surface of the board, the sensor unit being coupled to the transfer rod; a position adjusting unit for adjusting a distance between the sensor unit and the substrate, the position adjusting unit and The transfer rod is coupled; and a drive unit 'for transferring the sensor unit and the position adjustment unit relative to the substrate in a direction intersecting the width direction. 2. The surface detecting device of the requester, wherein the sensor celite comprises a light sensor for transmitting/receiving light in one direction parallel to the detecting surface of the substrate and perpendicular to the moving direction - The direction of illumination causes light to traverse the detection surface of the substrate. The surface detecting device of claim 2, wherein the light sensor including portion and a light receiving portion are outside the one end of the detecting surface of the substrate. 4_ As the surface of the request item 3 is detected and attached ["曰,, 中中" The light-receiving portion is coupled to the ends of the shifting rod. 5. The surface detecting device of claim 4, wherein the transfer rod is used for coating the surface of the inspection surface - The coating liquid-slit (four) is formed as two 6. The surface detecting device of claim 1, wherein the sensor unit comprises: I12066-990426.doc 丄, /11 silly strips ▼, formed into a long shape for one The width direction spans the base I-, * slave, and is disturbed by an interference of one of the full widths of the substrate; and a detecting unit for detecting a disturbing state of the one of the disturbing strips. The surface detecting device of claim 6, wherein an upper end of the disturbing strip is spaced apart from the detecting surface of the substrate and with the transfer rod (4); the lower end of the strip 8 faces the detecting surface of the substrate Extending; and the disturbing strip is disturbed when an external force is applied. The surface detecting device of the item 7 of the month, the white ϋ 衣 进步 进步 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 包含 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣 衣The direction of the detection surface traverses the detection table 9, and the surface of the substrate is separated by the detection surface of the substrate. (4) The surface detection device 1 of the item 8 (4) is placed with the detection rod extended to form a span.两端 两端 忒 忒 忒 忒 忒 忒 忒 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面U. The surface detecting device element according to any one of claims 7 to 9 includes a contact sensor, the gossip, and the contact end of the contact end 13⁄4 & y ^ 3 . And the surface of the sending rod and the disturbing strip facing each other, and the disturbing strip is disturbed. 12. The surface detecting device of claim 7, wherein: two contacts: point contact. _ coating material and used to the substrate. θ a narrow nozzle formed as a J12066-990426 .doc 2.
TW095122783A 2005-06-29 2006-06-23 Apparatus for inspecting surface and method thereof TW200706857A (en)

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