1329141 (1) 玖、發明說明 【發明所屬之技術領域】 本發明關於一種電鍍設備的液體輸送系統（例如用來 輸送液態電解液者）、具此液體輸送系統之電鍍設備、及 電鍍設備的操作方法。 【先前技術】 在傳統電鍍程序中，要電鍍的基板，例如一印刷電路 板（PCB )，可有要利用電鍍塡滿容納藉由數噴嘴輸送到 電鍍設備的一處理槽中的電解液中的金屬（例如銅）的數 個小槽（稱爲“微徑”），微徑典型尺寸直徑約5 0 // m -200仁 m，深度約 50# m - 125# m。 圖1爲被一層金屬（例如銅）部分塡滿的一印刷電路 板1.2微徑，塡滿率a/A總是小於1，其中a爲微徑10底 部與未被銅塡滿的一槽16底部之間距離，而A爲微徑10 底部與銅層14表面之間距離，業界總是試著要將PCB 12 電鍍到塡滿率儘可能接近1 00%。 在電鍍期間，且如圖2所示，輸送電解液20的一噴 嘴18位置在一陽極22與PCB 12(其作用如同一陰極） 之間，實務上發現令人滿意的微徑塡滿效果在PCB 12微 徑孔口需要大量電解液沖擊流，在此方面，圖3A到3F 示出在表1所示狀態下對微孔進行塡滿之實驗結果。 (2)1329141 表11329141 (1) Field of the Invention The present invention relates to a liquid transport system for an electroplating apparatus (for example, for transporting a liquid electrolyte), an electroplating apparatus having the liquid transport system, and an operation of an electroplating apparatus method. [Prior Art] In a conventional electroplating process, a substrate to be plated, such as a printed circuit board (PCB), may be filled with electroplating to accommodate an electrolyte that is transported by a number of nozzles into a processing tank of the electroplating apparatus. A small number of small grooves (called "micro-diameters") of metal (such as copper), the typical diameter of the micro-diameter is about 50 // m -200 lm, and the depth is about 50 # m - 125 # m. Figure 1 is a printed circuit board 1.2 micro-hole filled with a layer of metal (such as copper), the fullness rate a / A is always less than 1, where a is the bottom of the micro-diameter 10 and a slot 16 that is not full of copper The distance between the bottoms, and A is the distance between the bottom of the micro-diameter 10 and the surface of the copper layer 14, the industry always tries to plate the PCB 12 to a fullness ratio as close as possible to 100%. During electroplating, and as shown in FIG. 2, a nozzle 18 that transports the electrolyte 20 is positioned between an anode 22 and a PCB 12 (which functions as the same cathode), and a satisfactory micro-path full effect is found in practice. The PCB 12 micro-diameter orifice requires a large amount of electrolyte impingement flow. In this regard, Figs. 3A to 3F show the results of the experiment of filling the micropore in the state shown in Table 1. (2) 13291141 Table 1
微徑位置 電流密度 圖3A V 20 ASF 圖3B V 25 ASF 圖3C V 30 ASF 圖3D E 20 ASF 圖3E E 25 ASF 圖3F E 30ASFMicro-path position Current density Figure 3A V 20 ASF Figure 3B V 25 ASF Figure 3C V 30 ASF Figure 3D E 20 ASF Figure 3E E 25 ASF Figure 3F E 30ASF
上述表1及後面討論中’，，ASF”係指，，每平方英尺之安 培”，而1ASF等於每平方公尺有1〇·76安培。 如圖2所示，位置記號”V”係指在PCB 12上最靠近 噴嘴18之嘴且在噴嘴18軸線上的部分，因此是被電解液 噴射流覆蓋之區域，而位置記號”E”係指在PCB 12上最遠 離噴嘴18之嘴的部分。上述實驗結果見圖4，其中Y軸 爲塡滿率（％ )，而X軸爲電流密度（以ASF爲單位）^ 圖4中上面的曲線爲圖3A-3C微徑塡滿結果，圖4中下 面的曲線爲圖3D-3F微徑塡滿結果，而中間的曲線爲爲上 、下曲線的算術平均。 其可看出： (a) 在相同電流密度下，微徑在位置V和在位置E 之塡滿率不同： (b) 在位置V之微徑，電流密度愈高時之塡滿率愈 局； -6 - (3) (3)1329141 (c) 在位置E之微徑’電流密度愈低時之塡滿率愈 高。 亦對塡滿率和由噴嘴輸送的電解液流率相對關係在固 定電流密度下進行實驗’圖5A-5C爲設置在相對於噴嘴 之相同位置的三個微徑在不同電解液流率下且在25ASF 電流密度下進行實驗之結果’如圖6所槪示’ γ軸爲塡滿 率（％ )，而X軸爲電解液流率（每分鐘多少升，L/min )，結果顯示流率愈高時塡滿率愈高° 爲了得到PCB均勻塡滿率和電流分布，已有人建議 以”刀緣”方式將PCB攪動’藉由”刀緣”攪動（亦即噴嘴 18與PCB 12之距離b (圖7)保持一定），PCB12左右 (見圖7中之雙向箭頭）或上下往復移動。然而此法有以 下缺點： 這種PCB”刀緣”攪動僅適用於微徑塡滿，但PCB並 非只有微徑，也有通孔，其需要不同方式之移動’例如距 離b (圖7)會有所變化之前後移動》 b. 由於邊緣效應，PCB邊緣總是有較厚之電鍍’ 其避免之方法係調整陽極和PCB邊緣位置，但是當陰極 (亦即PCB )相對於電鏟機移動，其很難調整其屏蔽位置 和陽極位置，因而亦難以得到良好PCB電鍍均勻性。 此外，不同尺寸的微徑需要不同電流密度來達到良好 微徑塡滿結果，一般而言，高電流密度適合較大微徑；但 是高電流密度易在較小微徑內產生空隙，反之，雖然低電 流密度適合較小微徑，但一般會造成較大微徑有下切’因 (4) (4)1329141 此在電鍍具不同尺寸微徑基板時難以得到令人滿意的結果 〇 由是本發明的一目的在於提供一種電鍍設備之液體輸 送系統、具此液體輸送系統之電鍍設備、具電流分配器之 電鍍設備、及電鍍設備的操作方法，以減輕上述缺點，或 至少爲大眾提供另一種替代方案。 本發明的此一目的以及其他目的在下面討論中將很可 清楚。 【發明內容】 依據本發明的第一觀點，其提供一種電鍍設備之液體 輸送系統，該系統包括至少二液體出口，該至少二液體出 口係彼此間隔地固定設置以利同時動作且可將液體送入該 設備內，其中至少第一個液體出口沿著一路徑將該液體送 入該設備內，且其中該等液體出口可在大致上垂直於該路 徑的一平面上移動。 依據本發明的第二觀點，其提供一種設有液體輸送系 統之電鍍設備，該系統包括至少二液體出口，該至少二液 體出口係彼此間隔地固定設置以利同時動作且可將液體送 入該設備內，其中至少第一個液體出口沿著一路徑將該液 體送入該設備內，且其中該等液體出口可在大致上垂直於 該路徑的一平面上移動。 依據本發明的第三觀點，其提供一種將至少一基板電 鍍之電鍍設備’包括陽極裝置 '容納一電解液之容器裝置 -8 - (5) 1329141 、將該解液輸送進入該容器之裝置、以及控制 不同部位的電流密度之裝置> 依據本發明的第四觀點，其提供一種將一 一電鍍設備的一容器內之系統，該系統包括容 源來的該液體之管裝置、容納從該管裝置來的 從該管裝置來的該液體得以經過而送入該容器 口、以及在作業期間允許該容器內的該液體經 以外之路徑進入該出口之裝置。 依據本發明的第五觀點，其提供一種設有 送到一電鍍設備的一容器內之系統之電鍍設備 括容納從一液體源來的該液體之管裝置、容納 來的該液體且讓從該管裝置來的該液體得以經 容器之至少一出口、以及在作業期間允許該容 體經由該管裝置以外之路徑進入該出口之裝置 依據本發明的第六觀點，其提供一種電鍍 法，包括以下步驟：（a)在第一電流密度下 設備第一段時間；以及（b )接著在較高的一 度下操作該電鍍設備第二段時間。 【實施方式】 現在請參閱圖8，其揭示本發明之電鍍設 送系統，特別是將電解液輸送到電鍍設備的一 。液體輸送系統包括將電解液輸送到槽102內 1〇4a, 10 4b，噴嘴104a係彼此固定間隔設置以 導向該基向 液體輸送到 納從一液體 該液體且讓 之至少一出 由該管裝置 將一液體輸 ，該系統包 從該管裝置 過而送入該 器內的該液 〇 設備操作方 操作該電鍍 第二電流密 備之液體輸 槽102內者 的兩排噴嘴 利同時移動 (6) (6)1329141 ，類似於此，噴嘴1 〇4b彼此固定間隔設置以利同時移動 ，特別言之，噴嘴l〇4a, 104b與一管105a, 105b結合以 接受從它來的電解液，請了解噴嘴之排數可一排或多於兩 排，視特定需求及設計而定。 如圖8所示，基板，例如數個印刷電路板（PCB )( 圖8僅示出其中一個PCB 106 )可被例如一PCB承載器（ 例如飛桿，未示出）下降到槽102內位於數排噴嘴104a， l〇4b之間，在電鍍期間，PCB 106大致上相對於電鍍機之 槽102保持不動，接著使數排噴嘴104 a，104b沿著與箭號 SA, SB所指方向的垂直的平面上的個別直線往復移動，箭 號SA，SB噴嘴104a，104b將電解液輸送到槽102內的方 向。因此，數排噴嘴104a，104b可例如左右往復移動如圖 8中雙箭號RA，RB所示，或是上下往復移動，亦即進出紙 面。 由於管子與噴嘴104a，104b重量遠小於PCB 106和 飛桿（未示出）重量，可動部分之重量大幅降低，因此使 其作動所需動力較少。 在噴嘴104a，104b遠離PCB 106移動路徑的一側有 —個別排陽極l〇8a，108b，在運作期間，陽極108a，l〇8b 係電子連結到一電源，而槽102中的PCB 106作用如同一 陰極，在槽內102於PCB 106與陽極108a，108b之間得 以存在一電場，因而將電解液中的金屬（例如銅）電鍍在 PCB 106內和PCB 106上的適當位置，電場強度可視需要 調整。 -10- (7) (7)1329141 請參閱圖9A和9B ’其分別示出一對相鄰噴嘴i〇4B 移動的最左端位置和最右端位置，實際上發現，爲了達到 最適當電解液噴射流涵蓋範圍，d/D比値好爲1/2-3/5，其 中d爲二相鄰噴嘴l〇4a之間距離，而D爲個別噴嘴l〇4a 最左端位置與最右端位置之距離。 在此安排下’陰極（亦即 PCB 106)與陽極108a, l〇8b之距離保持不變，使其易於在PCB 106上得到均勻 電鍍效果。 此種電解液輸送系統亦可與其他系統結合，例如PCB 106必要時可前後移動，例如如圖8中朝向和遠離PCB 106之雙箭號T所示者，使通孔得以電鍍到令人滿意。 上述安排最適合用於升降式電鍍機，在輸送帶式電鍍 機（其中基板係利用輸送帶移動經過一處理槽）中不一定 要，如上所述且如圖2-4所示，微徑最佳塡充之組合係使 位置V有較高電流密度，在位置E則有較低電流密度。 達成此一效果之電鍍設備（以標號200標示）槪示於 圖10中，設備2〇〇包括至少一處理槽202，電解液可經 由數噴嘴204a，204b導入處理槽202。基板，例如PCB ( 圖10僅示出其中一個PCB 206 )可被例如輸送帶（未示 出）在箭號F方向移動穿過到槽202內。在數排噴嘴 204a, 204b遠離PCB 206在槽202內移動路徑的一個別側 有一個別排陽極208a, 208b。 設在陽極排208a與噴嘴排2(Ha之間者爲一第一電流 分配器210a;設在噴嘴排204a與PCB 206在槽202內移 -11 - (8) (8)1329141 動路徑之間者爲一第二電流分配器210b;設在噴嘴排 204b與PCB 206在槽202內移動路徑之間者爲一第三電 流分配器210c;設在噴嘴排204b與陽極排208b之間者 爲一第四電流分配器21 0d。請了解若電流分配器210a和 210b中僅有一者且電流分配器210c和210d中僅有一者 ，可得到令人滿意之結果。圖10中四個電流分配器210a, 210b, 210c，21 0d爲任意選擇且可達到較佳結果。 如圖11所示，在安裝電流分配器210a之下，陽極 208a與PCB 206 (其作用如同陰極）之間的電場改變或重 新分布使得較高電流密度導向最靠近個別噴嘴204a的位 置V,, V2，V3，V4，而較低電流密度導向位置E2, E3 ( PCB 206上與二相鄰噴嘴204a等距離的區域）》 如圖12更清楚地所不’電流分配器210a爲由電絕緣 材料例如聚丙烯（PP)或聚氯乙烯（PVC )製成之多孔板 ，在電流分配器210a上設有數組通孔212a, 212b，其中 通孔212a尺寸比通孔212b大，由於電流分配器210a之 絕緣本質，電場僅能經由通孔212a，212b存在於陽極 208a與PCB 206之間，通過通孔212a的電流密度較大， 而通過通孔2 1 2b的電流密度較小。請了解雖然所示通孔 212a，212b形狀爲圓形，其可爲其他形狀，例如細長槽孔 及間隙，只要能讓電通過即可。 圖13A和13B示出電鍍設備另一種傳統電解液輸送 系統300，在此安排中，一供應管3〇2之壁306設有至少 —孔304，讓電解液308能離開管302進入電鍍設備的一 -12- 1329141 Ο) 槽內’電解液通過孔3〇4進入槽的流率Q (公升/分鐘） 等於電解液從管302進入孔3 04的流率q。圖14A和14B 示出電鍍設備又一種傳統電解液輸送系統310，在此安排 中設有孔314附近且經由一供應管318 —壁316與孔314 連通的一溝道312，供應管318中的電解液3 20先進入孔 314，接著在進入電鍍設備的一槽內之前通過溝道312, 如同圖13A和13B所示以及如上所述例子，電解液通過 溝道312進入槽的流率Q等於電解液從管318進入孔314 的流率q。 如上所述，電解液流率愈高則塡滿率愈高，所以上述 安排係設計來增加電解液流入槽內之流率，但不一定要增 加電解液流入供應管之流率，因此不一定要增加電解液從 供應管到供應管上個別孔之流率，其特別有利，因爲PCB 與陽極之間隔非常小而且不能允許大型管路工作。 依據本發明的第一種安排見圖15A和15B，在此安排 中，一供應管402設有數孔，其中一孔4〇4見圖15 A和 15B，孔404與一溝道406連接且呈液體連通關係’溝道 406通到具一漏斗狀嘴410的一加寬空間408，實際上發 現在運作期間，當電解液通過溝道406進入空間41〇並進 入電鍍設備的一槽內，在漏斗狀嘴410附近的電解液被進 入嘴410的通過的電解液拉到與電解液出口方向相反的方 向，並與離開的電解液混合。從空間40 8進入槽內的電解 液流率Q等於從管4 02進入孔4 04之電解液流率qi與從 槽被拉入空間408嘴的電解液流率q2之和。可看出—部 -13- (10) (10)1329141 分電解液是從槽直接進入空間408而非從管402 ’亦可看 出溝道406比管402內徑窄且比空間408窄。 依據本發明的第二種安排見圖16厶至17B’在此安排 中’一供應管502設有數孔，其中一孔5〇4見圖16A和 16B，孔504與通到一通孔508的一溝道506連通，其縱 軸P-P —般垂直於電解液從溝道506進入通孔508的流動 方向。在通過通孔508之後，電解液508在進入電鍍設備 的一槽內之前進入一加寬孔510。實際上發現，在此安排 中，在通孔5 08二孔口 512附近的槽內的電解液被拉入通 孔508且與通孔508內的電解液混合，並在再度進入槽之 前進入孔510，因此，電解液從槽進入通孔5 08之方向一 般垂直於電解液從溝道506到孔510之流動方向，並隨後 流入槽內。電解液從槽進入孔510到槽內之總流率Q等 於電解液從管502進入孔5 04之流率qi#及電解液從槽 經由孔口 512進入通孔512的流率q2，q3之總和。可看出 一部分電解液是從槽直接進入孔5 10而非從管5 02，亦可 看出溝道506比管502內徑窄且比孔510窄。 可看出上述使用排放效應來增加電解液從噴嘴到PCB 之流率，排放器或液體噴射器爲允許慢速移動甚至靜止的 流體（例如液體）的區域加入流體高速噴射流之設備，其 方式係得後者大部分動能，結果爲流率比原始高動能噴射 流快數倍之結合流體噴射流。然而，傳統排放器之尺寸相 當大，因而不方便或不適用於此處。反之，依據本發明且 如上所述之本發明之安排節省空間、易於製造、且成本相 -14- (11) (11)1329141 當低。 如上所述，一般而言，高電流密度適合較大之微徑塡 充，然而，高電流密度易在較小的微徑內形成空隙。另一 方面，雖然低電流密度適合較小之微徑塡充，但一般會造 成較大微徑形成下切，這些係經過實驗。圖18A爲深度 皆爲75 /im的一排三個微徑600，602，604之塡充結果， 微徑600直徑約75 v m，微徑602直徑約100// m，微徑 604直徑約125 μ m，施加電流密度爲25ASF的電場約55 分鐘，其塡充結果見圖18A，可看出僅有微徑600有良好 結果，微徑602和604皆出現下切。 接著的實驗也是對深度爲75//m的三個微徑60 6(直 徑約爲75"m)，608 (直徑約爲100/zm) , 610(直徑約 爲125 m )進行，施加電流密度爲30ASF的電場約46 分鐘，因而如同上述第一個實驗得到相同的安培-小時大 小，其塡充結果見圖18B，可看出雖然微徑608和610有 良好和可接受結果，微徑60 6出現空隙。 第三個實驗也是對深度爲75/zm的三個微徑612(直 徑約爲75#m)，614(直徑約爲10〇#m) , 616(直徑約 爲125 a m )進行，施加電流密度爲30ASF的電場約27·5 分鐘，接著施加電流密度爲20ASF的電場約27.5分鐘， 因而如同上述第一和第二個實驗得到相同的安培-小時大 小，其塡充結果見圖18C，可看出雖然微徑616有可接受 結果，微徑612, 614出現空隙。 實際上發現先施加低電流密度的電場第一段時間，再 -15- (12) (12)1329141 施加高電流密度的電場第二段時間，可得到更多的可接受 結果，二段時間最好相同。第四個實驗也是對深度爲75 m的三個微徑618 (直徑約爲75 m )，620 (直徑約爲 100/zm) , 6 22 (直徑約爲125/zm)進行，施加電流密度 爲 20ASF的電場約 27.5分鐘，接著施加電流密度爲 30ASF的電場約27.5分鐘，因而如同上述第一、第二和 第三個實驗得到相同的安培-小時大小，其塡充結果見圖 18D，可看出雖然微徑618，620，和622不是良好就是至 少可接受。 實際上發現對具有多於一種尺寸的微徑之PCB而言 很難以單一步驟電流密度程序將這些微徑塡滿，本發明程 序採用逐漸式應用可防止較小微徑產生空隙之較高電流密 度，同時將足夠的銅電鍍在較大的微徑內。實際上發現連 續較高電流密度之步驟數目可多於二個，例如三個甚至四 個，視使用者特定需求而定。 實際上亦發現基板電鏡的連續較筒電流密度逐漸式應 用在相同的令人滿意的電鍍結果下可減少總電鍍時間，例 如要避免空隙的最大單步驟電流密度爲25 ASF，而電鍍時 間爲30分鐘，總電流爲每平方英尺爲25 X 30/60安培_小 時，亦即1 2.5安培-小時/平方英尺。爲達到相同結果，亦 即沒有空隙，可採用以下逐漸式方法： 25 ASF X 20 分鐘 30 ASF X 8.33 分鐘 總電流爲每平方英尺爲25 X 2 0/60 + 30 X 8.33/60安 -16- (13) (13)1329141 培-小時’亦即12.5安培·小時/平方英尺，但電鍍時間只 需28.33分鐘。 請了解上述僅爲可實施本發明之例子而已，在不偏離 本發明的精神之下仍可有許多修改及/或變化。 亦請了解爲求清晰之故而揭示於個別實施例的本發明 特定特徵可在單一實施例中結合，反之，爲求簡潔之故而 揭示於單一實施例的本發明不同特徵亦可分開地提供或適 當地次組合。 【圖式簡單說明】 以下將以舉例方式參閱所附圖式說明本發明之例子， 其中： 圖1爲被一層銅部分塡滿的PCB微徑； 圖 2顯不一電鑛設備中的一陽極、一噴嘴、以及一 PCB之位置： 圖3 A-3F爲在相對於噴嘴的不同位置且在不同電流密 度下的六個微徑塡滿結果； 圖4爲圖3A-3F結果槪示圖； 圖5A-5C爲在相同電流密度下但噴嘴流出的電解液 流率不同下的三個微徑塡滿結果·· 圖6爲圖5A-5C結果槪示圖； 圖7爲電鍍設備第一種傳統電解液輸送系統； 圖8爲本發明第一實施例之電解液輸送系統； 圖9A和9B顯示圖8中電解液輸送系統中的噴嘴移 -17- (14) 1329141 動方式： 圖10爲本發明第二實施例之賃 圖11爲圖10中電解液_送系 圖12示出圖10中電解液輸送 圖13A和13B爲電鍍設備桌 統； 圖14A和14B爲電鑛設備第 統： 圖15A和15B爲本發明第三 統； 圖16A和16B爲本發明第四 統； 圖17A和17B示出圖16A和 細部圖，其中圖17A爲沿圖17B[ 以及 圖18A-18D爲在不同電流密 作模式下對不同尺寸微徑進行的實 元件對照表 10 :微徑 1 2 :印刷電路板 U :層 16 :槽 1 8 :噴嘴 i解液輸送系統； 統部分放大圖； 系統的電流分配器： 二種傳統電解液輸送系 三種傳統電解液輸送系 實施例之電解液輸送系 實施例之電解液輸送系 16B中電解液輸送系統 句Z - Z線所取剖面圖； 荽大小下以及在不同操 險結果。 -18- (15) 1329141 20 :電解液 2 2 :陽極 102 ：槽 104a :噴嘴 . 104b ：噴嘴 105a ：管 105b :管 ® 106 :印刷電路板 108a :陽極 108b ：陽極 200 :電鍍設備 202 :處理槽 204a :噴嘴 204b ：噴嘴 2 0 6 :印刷電路板 2 0 8 a .陽極 208b:陽極 210a:第一電流分配器 - 210b:第二電流分配器 _ 210c:第三電流分配器 210d:第四電流分配器 2 1 2 a :通孔 2 1 2 b :通孔 300:電解液輸送系統 (16)1329141 302 ： 304 ： 306 ： 308 ： 3 10： 3 12： 3 14：In the above Table 1 and discussed later, 'ASF' means, ampere per square foot, and 1 ASF is equal to 1 〇 76 amps per square meter. As shown in FIG. 2, the position mark "V" refers to the portion of the PCB 12 that is closest to the nozzle of the nozzle 18 and is on the axis of the nozzle 18, and thus is the area covered by the electrolyte jet flow, and the position mark "E" is Refers to the portion of the PCB 12 that is furthest from the nozzle of the nozzle 18. The above experimental results are shown in Figure 4, where the Y-axis is the fullness rate (%) and the X-axis is the current density (in ASF). The upper curve in Figure 4 is the micro-path full result of Figure 3A-3C, Figure 4 The lower middle curve is the micro-path full result of Fig. 3D-3F, and the middle curve is the arithmetic average of the upper and lower curves. It can be seen that: (a) At the same current density, the micro-path has different expiration rates at position V and at position E: (b) at the position V, the higher the current density, the better the fullness rate ; -6 - (3) (3) 13291141 (c) The lower the fullness of the micro-path at the position E, the lower the current density. The experiment was also conducted at a fixed current density for the relative full rate and the relative flow rate of the electrolyte delivered by the nozzle. Figures 5A-5C show three micro-diameters at the same position relative to the nozzle at different electrolyte flow rates and The results of the experiment at 25ASF current density 'shown in Figure 6' γ axis is the fullness rate (%), while the X axis is the electrolyte flow rate (how many liters per minute, L / min), the results show the flow rate The higher the fullness, the higher the fullness rate. In order to obtain the uniformity of the PCB and the current distribution, it has been suggested to stir the PCB by the "knife edge" method by the "edge" agitation (that is, the distance between the nozzle 18 and the PCB 12). b (Fig. 7) keeps a certain), PCB 12 left and right (see the double-headed arrow in Figure 7) or reciprocating up and down. However, this method has the following disadvantages: This PCB "knife edge" agitation is only suitable for micro-path full, but the PCB is not only micro-diameter, but also has through-holes, which require different ways of movement 'eg distance b (Figure 7) will be Move before and after the change. b. Due to the edge effect, the edge of the PCB always has a thicker plating. The way to avoid it is to adjust the anode and PCB edge position, but when the cathode (ie PCB) moves relative to the electric shovel, its It is difficult to adjust the shielding position and the anode position, and thus it is difficult to obtain good PCB plating uniformity. In addition, different sizes of micro-paths require different current densities to achieve good micro-path full results. In general, high current densities are suitable for larger micro-diameters; however, high current densities tend to create voids in smaller micro-paths, whereas The low current density is suitable for smaller micro-diameters, but generally results in a larger micro-diameter with undercuts. (4) (4) 13291141 This is difficult to obtain satisfactory results when electroplating different diameter micro-diameter substrates. One object of the present invention is to provide a liquid delivery system for an electroplating apparatus, an electroplating apparatus having the same, a plating apparatus with a current distributor, and an operation method of the electroplating apparatus to alleviate the above disadvantages, or at least provide another alternative to the public. Program. This and other objects of the present invention will be apparent from the following discussion. SUMMARY OF THE INVENTION According to a first aspect of the present invention, there is provided a liquid delivery system for an electroplating apparatus, the system comprising at least two liquid outlets that are fixedly spaced apart from each other for simultaneous action and for delivering liquid Into the apparatus, wherein at least a first liquid outlet carries the liquid into the apparatus along a path, and wherein the liquid outlets are movable in a plane substantially perpendicular to the path. According to a second aspect of the present invention, there is provided an electroplating apparatus provided with a liquid delivery system, the system comprising at least two liquid outlets fixedly spaced apart from each other for simultaneous action and for feeding liquid into the Within the apparatus, at least a first liquid outlet carries the liquid into the apparatus along a path, and wherein the liquid outlets are movable in a plane substantially perpendicular to the path. According to a third aspect of the present invention, there is provided a device for arranging at least one substrate electroplating apparatus 'including an anode device' for accommodating an electrolyte -8 - (5) 1329141, a device for conveying the lysate into the container, And a device for controlling the current density of different portions> according to a fourth aspect of the present invention, there is provided a system in a container of a plating apparatus, the system comprising a tube device for receiving the liquid, from which The liquid from the tube means from which the tube means passes is fed into the mouth of the container, and means for allowing the liquid in the container to enter the outlet through a different path during operation. According to a fifth aspect of the present invention, there is provided an electroplating apparatus provided with a system for feeding into a container of an electroplating apparatus, comprising a tube device for accommodating the liquid from a liquid source, containing the liquid and allowing the liquid Apparatus for passing the liquid from the tube device through at least one outlet of the container and allowing the container to enter the outlet via a path other than the tube device during operation. According to a sixth aspect of the present invention, there is provided an electroplating method comprising the following Step: (a) the device is at a first current density for a first period of time; and (b) then operating the plating device for a second period of time at a higher degree. [Embodiment] Referring now to Figure 8, there is disclosed an electroplating system of the present invention, particularly one in which an electrolyte is delivered to an electroplating apparatus. The liquid delivery system includes transporting the electrolyte into the tank 102 1 〇 4a, 10 4b, the nozzles 104a being fixedly spaced from one another to direct the liquid to the liquid and to at least one out of the liquid. Receiving a liquid, the system packs the liquid helium device from the tube device and feeds into the device to operate the two rows of nozzles in the second current sealed liquid transfer tank 102 to move simultaneously (6) (6) 13291141, similarly, the nozzles 1 〇 4b are fixedly spaced from each other to facilitate simultaneous movement, in particular, the nozzles 10a, 104b are combined with a tube 105a, 105b to receive the electrolyte from it, please Knowing the number of rows of nozzles can be in one row or more than two rows, depending on specific needs and design. As shown in FIG. 8, a substrate, such as a plurality of printed circuit boards (PCBs) (only one of which is shown in FIG. 8) can be lowered into the slot 102 by, for example, a PCB carrier (eg, a flying rod, not shown). Between the rows of nozzles 104a, 104b, during electroplating, the PCB 106 remains substantially stationary relative to the slot 102 of the electroplating machine, and then the rows of nozzles 104a, 104b are oriented along the direction indicated by the arrows SA, SB. The individual straight lines on the vertical plane reciprocate, and the arrows SA, SB nozzles 104a, 104b transport the electrolyte into the direction of the grooves 102. Therefore, the rows of nozzles 104a, 104b can be reciprocated, for example, left and right as shown by the double arrows RA, RB in Fig. 8, or reciprocated up and down, that is, in and out of the paper. Since the weight of the tube and nozzles 104a, 104b is much smaller than the weight of the PCB 106 and the flying rod (not shown), the weight of the movable portion is greatly reduced, so that less power is required to operate it. On the side of the nozzles 104a, 104b remote from the path of movement of the PCB 106, there are individual rows of anodes 8a, 108b. During operation, the anodes 108a, 10b are electronically coupled to a power source, and the PCB 106 in the slot 102 acts as if A cathode, an electric field is present between the PCB 106 and the anodes 108a, 108b in the trench 102, thereby plating a metal (e.g., copper) in the electrolyte into the PCB 106 and the appropriate position on the PCB 106. The electric field strength can be as needed. Adjustment. -10- (7) (7) 13291141 Please refer to FIGS. 9A and 9B' which show the leftmost position and the rightmost position of the movement of a pair of adjacent nozzles i 〇 4B, respectively, and actually found that in order to achieve the most appropriate electrolyte injection The flow coverage range, the d/D ratio is preferably 1/2-3/5, where d is the distance between two adjacent nozzles l〇4a, and D is the distance between the leftmost end position and the rightmost end position of the individual nozzles l〇4a . Under this arrangement, the distance between the cathode (i.e., PCB 106) and the anodes 108a, l8b remains constant, making it easy to obtain a uniform plating effect on the PCB 106. Such an electrolyte delivery system can also be combined with other systems, such as the PCB 106, which can be moved back and forth as necessary, for example as shown by the double arrow T in FIG. 8 facing away from and away from the PCB 106, allowing the through holes to be plated satisfactorily. . The above arrangement is most suitable for use in a lift-type electroplating machine, which is not necessarily required in a conveyor belt type electroplating machine in which the substrate is moved through a processing tank by a conveyor belt, as described above and as shown in Figures 2-4, the micro-path is optimal. The combination of charge has a higher current density at position V and a lower current density at position E. An electroplating apparatus (indicated by reference numeral 200) which achieves this effect is shown in Fig. 10, and the apparatus 2A includes at least one processing tank 202 through which the electrolyte can be introduced into the processing tank 202 via the number of nozzles 204a, 204b. A substrate, such as a PCB (only one of which is shown in Fig. 10), can be moved through the slot 202 in the direction of arrow F, for example, by a conveyor belt (not shown). In the rows of nozzles 204a, 204b away from the PCB 206, there is an additional row of anodes 208a, 208b on one side of the path of movement within the slot 202. It is disposed between the anode row 208a and the nozzle row 2 (Ha is a first current distributor 210a; and is disposed between the nozzle row 204a and the PCB 206 in the slot 202 -11 - (8) (8) 13291141 moving path The second current distributor 210b is disposed between the nozzle row 204b and the PCB 206 in the groove 202; the third current distributor 210c is disposed between the nozzle row 204b and the anode row 208b. The fourth current distributor 21 0d. Please understand that if only one of the current distributors 210a and 210b and only one of the current distributors 210c and 210d, a satisfactory result can be obtained. Four current distributors 210a in FIG. , 210b, 210c, 21 0d are optional and can achieve better results. As shown in Figure 11, under the mounting current distributor 210a, the electric field between the anode 208a and the PCB 206 (which acts like a cathode) changes or re-energizes. The distribution causes the higher current density to be directed to the position V, V2, V3, V4 closest to the individual nozzles 204a, while the lower current density is directed to the positions E2, E3 (the areas on the PCB 206 that are equidistant from the adjacent nozzles 204a). Figure 12 more clearly does not 'the current distributor 210a is made of an electrically insulating material such as poly A porous plate made of propylene (PP) or polyvinyl chloride (PVC) is provided with array through holes 212a, 212b in the current distributor 210a, wherein the through hole 212a is larger in size than the through hole 212b, and is insulated by the current distributor 210a. In essence, the electric field can only exist between the anode 208a and the PCB 206 via the through holes 212a, 212b, the current density through the through hole 212a is large, and the current density through the through hole 2 1 2b is small. The holes 212a, 212b are circular in shape, and may be other shapes, such as elongated slots and gaps, as long as electricity can pass. Figures 13A and 13B illustrate another conventional electrolyte delivery system 300 of an electroplating apparatus, arranged herein. The wall 306 of a supply pipe 3〇2 is provided with at least a hole 304 for allowing the electrolyte 308 to leave the tube 302 and enter a slot of the electroplating apparatus in a -12- 1329141 Ο) electrolyte entering the tank through the hole 3〇4. The flow rate Q (liters per minute) is equal to the flow rate q of the electrolyte from the tube 302 into the orifice 3 04. 14A and 14B illustrate another conventional electrolyte delivery system 310 in which an arrangement is provided with a channel 312 adjacent the aperture 314 and communicating with the aperture 314 via a supply tube 318 - wall 316, in the supply tube 318 The electrolyte 3 20 first enters the aperture 314 and then passes through the channel 312 prior to entering a slot in the plating apparatus. As shown in Figures 13A and 13B and as described above, the flow rate Q of the electrolyte entering the slot through the channel 312 is equal to The flow rate q of electrolyte from tube 318 into port 314. As described above, the higher the electrolyte flow rate, the higher the fullness rate, so the above arrangement is designed to increase the flow rate of the electrolyte into the tank, but it is not necessary to increase the flow rate of the electrolyte into the supply tube, so it is not necessarily It is particularly advantageous to increase the flow rate of electrolyte from the supply tube to the individual orifices in the supply tube because the distance between the PCB and the anode is very small and does not allow large lines to operate. The first arrangement in accordance with the present invention is illustrated in Figures 15A and 15B. In this arrangement, a supply tube 402 is provided with a plurality of apertures, one of which is shown in Figures 15A and 15B, and the aperture 404 is coupled to a channel 406 and The liquid communication relationship 'channel 406 leads to a widened space 408 having a funnel-shaped nozzle 410, and it is actually found that during operation, as the electrolyte enters the space 41 through the channel 406 and enters a slot in the plating apparatus, The electrolyte in the vicinity of the funnel-shaped nozzle 410 is pulled by the electrolyte passing through the nozzle 410 to a direction opposite to the direction of the electrolyte outlet, and is mixed with the leaving electrolyte. The flow rate Q of the electrolyte entering the tank from the space 40 8 is equal to the sum of the electrolyte flow rate qi from the tube 04 into the orifice 04 and the electrolyte flow rate q2 from the nozzle being drawn into the space 408. It can be seen that the portion -13-(10)(10)1329141 electrolyte is directed from the tank directly into the space 408 rather than from the tube 402'. The channel 406 is also narrower than the inner diameter of the tube 402 and narrower than the space 408. A second arrangement according to the present invention is shown in Figures 16A through 17B'. In this arrangement, a supply tube 502 is provided with a plurality of holes, one of which is shown in Figs. 16A and 16B, and a hole 504 is connected to a through hole 508. The channel 506 is in communication with its longitudinal axis PP being generally perpendicular to the flow direction of the electrolyte from the channel 506 into the via 508. After passing through the via 508, the electrolyte 508 enters a widened aperture 510 before entering a slot in the plating apparatus. In fact, it has been found that in this arrangement, the electrolyte in the groove near the orifice 512 of the through hole 508 is drawn into the through hole 508 and mixed with the electrolyte in the through hole 508, and enters the hole before reentering the groove. 510, therefore, the direction of the electrolyte from the slot into the through hole 508 is generally perpendicular to the flow direction of the electrolyte from the channel 506 to the hole 510 and then flows into the groove. The total flow rate Q of the electrolyte from the tank inlet hole 510 into the tank is equal to the flow rate q# of the electrolyte from the tube 502 into the orifice 504 and the flow rate q2 of the electrolyte entering the through hole 512 from the tank via the orifice 512, q3 sum. It can be seen that a portion of the electrolyte enters the aperture 5 10 directly from the slot rather than from the tube 502. It can also be seen that the channel 506 is narrower than the inner diameter of the tube 502 and narrower than the aperture 510. It can be seen that the above-described emission effect is used to increase the flow rate of the electrolyte from the nozzle to the PCB, and the ejector or liquid ejector is added to the device of the fluid high-speed jet stream in a region that allows a slow moving or even stationary fluid (eg, liquid). The latter is mobilized for most of the kinetic energy, resulting in a combined fluid jet flow that is several times faster than the original high kinetic energy jet. However, conventional dischargers are relatively large in size and thus inconvenient or unsuitable for use herein. On the contrary, the arrangement of the present invention according to the present invention and as described above saves space, is easy to manufacture, and has a low cost of -14-(11)(11)1329141. As mentioned above, in general, high current densities are suitable for larger micro-diameter charging, however, high current densities tend to form voids in smaller micro-paths. On the other hand, although the low current density is suitable for smaller micro-path charge, it generally results in a larger micro-path to form an undercut, and these systems are experimental. Figure 18A shows the results of a row of three micro-diameters 600, 602, 604 with a depth of 75 / im. The diameter of the diameter 600 is about 75 vm, the diameter of the diameter 602 is about 100 / / m, and the diameter of the diameter 604 is about 125. μ m, an electric field with a current density of 25 ASF is applied for about 55 minutes, and the results of the charging are shown in Fig. 18A. It can be seen that only the micro-diameter 600 has good results, and the micro-diameters 602 and 604 all have undercuts. The next experiment was also carried out on three micro-paths 60 6 (diameter of about 75 " m), 608 (about 100/zm in diameter) and 610 (about 125 m in diameter) with a depth of 75/m. The electric field of 30 ASF is about 46 minutes, so that the same ampere-hour size is obtained as in the first experiment described above, and the results of the charging are shown in Fig. 18B. It can be seen that although the micro-paths 608 and 610 have good and acceptable results, the micro-path 60 6 There is a gap. The third experiment was also performed on three micro-diameters 612 (diameter approximately 75 #m), 614 (diameter approximately 10 〇 #m), and 616 (diameter approximately 125 am) with a depth of 75/zm. The electric field of 30 ASF is about 27.5 minutes, and then the electric field with a current density of 20 ASF is applied for about 27.5 minutes, so that the same ampere-hour size is obtained as in the first and second experiments described above, and the results of the charging are shown in Fig. 18C. Although the micro-path 616 has acceptable results, the micro-paths 612, 614 have voids. In fact, it is found that the electric field of low current density is applied for the first time, and then the electric field of high current density is applied for a second period of time of -15-(12) (12)1329141, and more acceptable results can be obtained. The same is true. The fourth experiment was also performed on three micro-diameters 618 (diameter of approximately 75 m), 620 (diameter approximately 100/zm), and 6 22 (diameter approximately 125/zm) with a depth of 75 m. The electric field of 20ASF is about 27.5 minutes, and then the electric field with a current density of 30 ASF is applied for about 27.5 minutes, so that the same ampere-hour size is obtained as in the first, second and third experiments described above, and the results of the charging are shown in Fig. 18D. Although the micropaths 618, 620, and 622 are not good or at least acceptable. In fact, it has been found that it is difficult for a PCB having a micro-path having more than one size to fill these micro-paths with a single-step current density program. The procedure of the present invention uses a gradual application to prevent higher current densities of small micro-cavities. At the same time, enough copper is plated in the larger micro-path. In fact, the number of steps for successively higher current densities can be found to be more than two, for example three or even four, depending on the particular needs of the user. In fact, it has also been found that the continuous tube current density of the substrate electron microscope is gradually applied to the same satisfactory plating result to reduce the total plating time, for example, to avoid the maximum single-step current density of the gap is 25 ASF, and the plating time is 30 In minutes, the total current is 25 X 30/60 amps per hour, or 1 2.5 amp-hours per square foot. To achieve the same result, ie without voids, the following gradual method can be used: 25 ASF X 20 minutes 30 ASF X 8.33 minutes Total current is 25 X 2/60 + 30 X 8.33/60 amps - 16- per square foot (13) (13) 13291141 Peine-hours, which is 12.5 amps per hour per square foot, but the plating time is only 28.33 minutes. It is to be understood that the foregoing is only illustrative of the embodiments of the invention, and many modifications and/or changes may be made without departing from the spirit of the invention. It is also understood that the particular features of the present invention disclosed in the embodiments of the invention may be combined in a single embodiment for the sake of clarity, and the different features of the present invention disclosed in the single embodiment may be separately provided or appropriate for the sake of brevity. Land combination. BRIEF DESCRIPTION OF THE DRAWINGS In the following, an example of the invention will be described by way of example with reference to the accompanying drawings, wherein: FIG. 1 is a PCB micro-path full of a layer of copper; FIG. 2 shows an anode in an electro-mineralizing apparatus , a nozzle, and the position of a PCB: Figure 3 A-3F is the result of six micro-paths at different positions relative to the nozzle and at different current densities; Figure 4 is a graphical representation of the results of Figures 3A-3F; 5A-5C are three micro-path full results at different current densities but different nozzle flow rates of the nozzles. FIG. 6 is a diagram showing the results of FIGS. 5A-5C; FIG. 7 is a first type of electroplating apparatus. Conventional Electrolyte Delivery System; Figure 8 is an electrolyte delivery system according to a first embodiment of the present invention; Figures 9A and 9B show nozzle movements in the electrolyte delivery system of Figure 8 -17-(14) 1329141 Motion Mode: Figure 10 Figure 11 of the present invention is the electrolyte solution of Figure 10, Figure 12 shows the electrolyte delivery of Figure 10, Figures 13A and 13B are the plating equipment table; Figures 14A and 14B are the electro-chemical equipment system: 15A and 15B are the third embodiment of the present invention; Figs. 16A and 16B are the fourth embodiment of the present invention; Figs. 17A and 17B show 16A and a detailed view, wherein FIG. 17A is a comparison of real components of different size micropaths in different current density modes along FIG. 17B [and FIGS. 18A-18D: Micropath 1 2: Printed circuit board U: Layer 16: Tank 1 8: Nozzle i solution delivery system; System partial enlargement; System current distributor: Two conventional electrolyte delivery systems Three conventional electrolyte delivery systems Example electrolyte delivery system Example electrolyte Section 7 of the Z-Z line of the electrolyte delivery system in the transport system 16B; 荽 size and results in different operations. -18- (15) 1329141 20 : Electrolyte 2 2 : Anode 102 : Slot 104a : Nozzle. 104b : Nozzle 105a : Tube 105b : Tube ® 106 : Printed circuit board 108a : Anode 108b : Anode 200 : Electroplating apparatus 202 : Treatment Slot 204a: Nozzle 204b: Nozzle 2 0 6 : Printed circuit board 2 0 8 a. Anode 208b: Anode 210a: First current distributor - 210b: Second current distributor _ 210c: Third current distributor 210d: Fourth Current distributor 2 1 2 a : through hole 2 1 2 b : through hole 300: electrolyte delivery system (16) 13291141 302 : 304 : 306 : 308 : 3 10: 3 12: 3 14:
3 16： 3 18： 320 ： 402 ： 404 ： 406 ： 408 ： 410 ：3 16: 3 18: 320 : 402 : 404 : 406 : 408 : 410 :
502 ： 504 ： 506 ： 508 ： 5 10： 5 12： 600 ： 602 ： 604 ： 供應管 孔 壁 電解液 電解液輸送系統 溝道 孔 壁 供應管 電解液 供應管 孔 溝道 空間 漏斗狀嘴 供應管 孔 溝道 穿孔 孔 孔口 微徑 微徑 微徑 (17) 1329141 6 Ο 6 :微徑 6 Ο 8 :微徑 6 1 Ο :微徑 6 1 2 :微徑 6 1 4 :微徑 6 1 6 :微徑 6 1 8 :微徑502 : 504 : 506 : 508 : 5 10: 5 12: 600 : 602 : 604 : Supply tube hole wall electrolyte solution delivery system channel hole wall supply tube electrolyte supply tube hole channel space funnel nozzle supply tube hole Channel perforation hole orifice micro-diameter micro-diameter (17) 1329141 6 Ο 6 : micro-path 6 Ο 8 : micro-path 6 1 Ο : micro-path 6 1 2 : micro-path 6 1 4 : micro-path 6 1 6 : Micropath 6 1 8 : micro path
6 2 0 :微徑 622 :微徑6 2 0 : micro path 622 : micro path