TW200622040A - A liquid delivery system for an electroplating apparatus and an electroplating apparatus with such a liquid delivery system - Google Patents
A liquid delivery system for an electroplating apparatus and an electroplating apparatus with such a liquid delivery systemInfo
- Publication number
- TW200622040A TW200622040A TW095105071A TW95105071A TW200622040A TW 200622040 A TW200622040 A TW 200622040A TW 095105071 A TW095105071 A TW 095105071A TW 95105071 A TW95105071 A TW 95105071A TW 200622040 A TW200622040 A TW 200622040A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrolyte
- electroplating apparatus
- delivery system
- pipe
- disclosed
- Prior art date
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
A liquid delivery system for an electroplating apparatus is disclosed as including a number of nozzles which are fixedly spaced apart from each other for delivering a liquid electrolyte into the apparatus, and each of the nozzle is adapted to deliver the electrolyte into the apparatus generally along a respective path, and the nozzles are movable on a plane, substantially perpendicular to the path. There is also disclosed a current distributor for controlling the electric current density directed towards different parts of a substrate, e.g. PCB, to be plated. A system for delivering an electrolyte into a container of an electroplating apparatus is also disclosed as including a pipe for receiving the electrolyte from a liquid source, a number of outlets for receiving the electrolyte from the pipe and via which the electrolyte from the pipe is deliverable into the container, and means allowing, during operation, the electrolyte in the container to enter the outlet otherwise than from the pipe. A method of operating an electroplating apparatus is also disclosed as including the steps of (a) operating the electroplating apparatus at a first lower current density for a first period of time; and (b) operating the electroplating apparatus at a higher second current density for a second period of time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95105071A TWI329141B (en) | 2003-09-02 | 2003-09-02 | A liquid delivery system for an electroplating apparatus and an electroplating apparatus with such a liquid delivery system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95105071A TWI329141B (en) | 2003-09-02 | 2003-09-02 | A liquid delivery system for an electroplating apparatus and an electroplating apparatus with such a liquid delivery system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200622040A true TW200622040A (en) | 2006-07-01 |
| TWI329141B TWI329141B (en) | 2010-08-21 |
Family
ID=45074462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95105071A TWI329141B (en) | 2003-09-02 | 2003-09-02 | A liquid delivery system for an electroplating apparatus and an electroplating apparatus with such a liquid delivery system |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI329141B (en) |
-
2003
- 2003-09-02 TW TW95105071A patent/TWI329141B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI329141B (en) | 2010-08-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |