(1) 1281517 玖、發明說明 【發明所屬之技術領域】 本發明關於一種電鍍設備的液體輸送系統（例如用來 輸送液態電解液者）、具此液體輸送系統之電鍍設備、及 電鍍設備的操作方法。 【先前技術】 在傳統電鍍程序中，要電鍍的基板，例如一印刷電路 板（PCB )，可有要利用電鍍塡滿容納藉由數噴嘴輸送到 電鍍設備的一處理槽中的電解液中的金屬（例如銅）的數 個小槽（稱爲“微徑”），微徑典型尺寸直徑約5 0 // m -200 β m 5 深度約 50// m— 125// m。 圖1爲被一層金屬（例如銅）部分塡滿的一印刷電路 板12微徑，塡滿率a/A總是小於1，其中a爲微徑1 0底 部與未被銅塡滿的一槽1 6底部之間距離，而A爲微徑1 0 底部與銅層14表面之間距離，業界總是試著要將PCB 12 電鍍到塡滿率儘可能接近1 〇〇%。 在電鍍期間，且如圖2所示’輸送電解液2 0的一噴 嘴18位置在一陽極22與PCB 12(其作用如同一陰極） 之間，實務上發現令人滿意的微徑塡滿效果在P C B 1 2微 徑孔口需要大量電解液沖擊流，在此方面，圖3 A到3 F 示出在表1所示狀態下對微孔進行塡滿之實驗結果。 1281517(1) 1281517 玖, the invention relates to the technical field of the invention. The present invention relates to a liquid transport system for an electroplating apparatus (for example, for transporting a liquid electrolyte), an electroplating apparatus having the liquid transport system, and an operation of an electroplating apparatus method. [Prior Art] In a conventional electroplating process, a substrate to be plated, such as a printed circuit board (PCB), may be filled with electroplating to accommodate an electrolyte that is transported by a number of nozzles into a processing tank of the electroplating apparatus. Several small grooves of metal (such as copper) (referred to as "micro-paths"), typical diameters of micro-diameters of about 50 // m -200 β m 5 depths of about 50 / / m - 125 / / m. Figure 1 shows the micro-path of a printed circuit board 12 that is partially filled with a layer of metal (e.g., copper). The fullness a/A is always less than 1, where a is the bottom of the micro-path 10 and a slot that is not full of copper. 1 6 The distance between the bottom, and A is the distance between the bottom of the micro-diameter 10 and the surface of the copper layer 14. The industry always tries to plate the PCB 12 to a fullness ratio as close as 1%. During the electroplating, and as shown in Fig. 2, a nozzle 18 for transporting the electrolyte 20 is placed between the anode 22 and the PCB 12 (which acts as the same cathode), and a satisfactory micro-diameter effect is found in practice. In the PCB 1 2 micro-diameter orifice, a large amount of electrolyte impingement flow is required. In this respect, Figs. 3A to 3F show the results of the experiment of filling the micropore in the state shown in Table 1. 1281517
表1Table 1
微徑位置 電流密度 圖3 A V 20 ASF 圖3B V 25 ASF 圖3C V 30ASF 圖3D E 20ASF 圖3E E 25 ASF 圖3F E 30ASF 上述表1及後面討論中，”ASF”係指，，每平方英尺之安 培”，而1ASF等於每平方公尺有10.76安培。 如圖2所示，位置記號” V”係指在PCB 12上最靠近 噴嘴1 8之嘴且在噴嘴1 8軸線上的部分，因此是被電解液 噴射流覆蓋之區域，而位置記號”E”係指在PCB 12上最遠 離噴嘴1 8之嘴的部分。上述實驗結果見圖4，其中Y軸 爲塡滿率（％ )，而X軸爲電流密度（以A S F爲單位）。 圖4中上面的曲線爲圖3 A - 3 C微徑塡滿結果，圖4中下 面的曲線爲圖3 D - 3 F微徑塡滿結果，而中間的曲線爲爲上 、下曲線的算術平均。 其可看出'· (a) 在相同電流岔度下，微徑在位置V和在位置E 之塡滿率不同； (b) 在位置V之微徑，電流密度愈高時之塡滿率愈 尚； -6 - (3) !281517 (c) 在位置E之微徑，電流密度愈低時之塡滿率愈 高。 亦對塡滿率和由噴嘴輸送的電解液流率相對關係在固 定電流密度下進行實驗，圖5 A - 5 C爲設置在相對於噴嘴 之相同位置的三個微徑在不同電解液流率下且在2 5 A s F 電流密度下進行實驗之結果，如圖6所槪示’ Y軸爲塡滿 率（％ )，而X軸爲電解液流率（每分鐘多少升’ L/min )，結果顯示流率愈高時塡滿率愈高。 爲了得到 PCB均勻塡滿率和電流分布，已有人建議 以”刀緣，，方式將PCB攪動，藉由”刀緣”攪動（亦即噴嘴 以與PCB12之距離b (圖7)保持一定），PCB12左右 (見圖7中之雙向箭頭）或上下往復移動。然而此法有以 下缺點： 這種PCB”刀緣”攪動僅適用於微徑塡滿，但PCB並 非只有微徑，也有通孔，其需要不同方式之移動，例如距 離b (圖7 )會有所變化之前後移動。 b. 由於邊緣效應，PCB邊緣總是有較厚之電鍍， 其避免之方法係調整陽極和PCB邊緣位置，但是當陰極 (亦即PCB )相對於電鍍機移動，其很難調整其屏蔽位置 和陽極位置，因而亦難以得到良好P C B電鍍均勻性。 此外，不同尺寸的微徑需要不同電流密度來達到良好 微徑塡滿結果，一般而言，高電流密度適合較大微徑；但 是高電流密度易在較小微徑內產生空隙，反之，雖然低電 流密度適合較小微徑，但一般會造成較大微徑有下切，因 -7- (4) 1281517 此在電鍍具不同尺寸微徑基板時難以得到令人滿意的結果 〇 由是本發明的一目的在於提供一種電鍍設備之液體輸 送系統、具此液體輸送系統之電鍍設備、具電流分配器之 電鍍設備、及電鍍設備的操作方法，以減輕上述缺點，或 至少爲大眾提供另一種替代方案。 本發明的此一目的以及其他目的在下面討論中將很可 淸楚。 【發明內容】 依據本發明的第一觀點，其提供一種電鍍設備之液體 輸送系統，該系統包括至少二液體出□，該至少二液體出 口係彼此間隔地固定設置以利同時動作且可將液體送入該 設備內，其中至少第一個液體出口沿著一路徑將該液體送 入該設備內，且其中該等液體出口可在大致上垂直於該路 徑的一平面上移動。 依據本發明的第二觀點，其提供一種設有液體輸送系 統之電鍍設備，該系統包括至少二液體出口，該至少二液 體出口係彼此間隔地固定設置以利同時動作且可將液體送 入該設備內，其中至少第一個液體出口沿著一路徑將該液 體送入該設備內，且其中該等液體出口可在大致上垂直於 該路徑的一平面上移動。 依據本發明的第三觀點，其提供一種將至少一基板電 鍍之電鍍設備，包括陽極裝置、容納一電解液之容器裝置 -8- (5) 1281517 、將該解液輸送進入該容器之裝置、以及控制 不同部位的電流密度之裝置。 依據本發明的第四觀點，其提供一種將一 一電鍍設備的一容器內之系統，該系統包括容 源來的該液體之管裝置、容納從該管裝置來的 從該管裝置來的該液體得以經過而送入該容器 口、以及在作業期間允許該容器內的該液體經 以外之路徑進入該出口之裝置。 依據本發明的第五觀點，其提供一種設有 送到一電鍍設備的一容器內之系統之電鍍設備 括容納從一液體源來的該液體之管裝置、容納 來的該液體且讓從該管裝置來的該液體得以經 容器之至少一出口、以及在作業期間允許該容 體經由該管裝置以外之路徑進入該出口之裝置 依據本發明的第六觀點，其提供一種電鍍 法’包括以下步驟：（a )在第一電流密度下 設備第一段時間；以及（b )接著在較高的一 度下操作該電鍍設備第二段時間。 【實施方式】 現在請參閱圖8，其揭示本發明之電鍍設 送系統’特別是將電解液輸送到電鍍設備的一 。液體輸送系統包括將電解液輸送到槽1 0 2內 l〇4a，10 4b，噴嘴104a係彼此固定間隔設置以 導向該基向 液體輸送到 納從一液體 該液體且讓 之至少一出 由該管裝置 將一液體輸 ，該系統包 從該管裝置 過而送入該 器內的該液 〇 設備操作方 操作該電鍍 第二電流密 備之液體輸 槽102內者 的兩排噴嘴 利同時移動 (6) 1281517 ，類似於此，噴嘴1 〇4b彼此固定間隔設置以利同時移動 ，特別言之，噴嘴104a，l〇4b與一管105a，105b結合以 接受從它來的電解液’請了解噴嘴之排數可一排或多於兩 排，視特定需求及設計而定。 如圖8所示，基板，例如數個印刷電路板（PCB )( 圖8僅示出其中一個pCB 106)可被例如一 PCB承載器（ 例如飛桿，未示出）下降到槽102內位於數排噴嘴104 a, 104b之間，在電鍍期間，PCB 106大致上相對於電鍍機之 槽102保持不動，接著使數排噴嘴l〇4a，104b沿著與箭號 SA, SB所指方向的垂直的平面上的個別直線往復移動’箭 號SA，SB噴嘴104a，104b將電解液輸送到槽102內的方 向。因此，數排噴嘴l〇4a，104b可例如左右往復移動如圖 8中雙箭號Ra，Rb所示，或是上下往復移動，亦即進出紙 面。 由於管子與噴嘴l〇4a，104b重量遠小於PCB 106和 飛桿（未示出）重量，可動部分之重量大幅降低，因此使 其作動所需動力較少。 在噴嘴l〇4a，104b遠離PCB 106移動路徑的一側有 一個別排陽極108a，108b，在運作期間，陽極108a，108b 係電子連結到一電源，而槽102中的PCB 106作用如同一 陰極，在槽內102於PCB 106與陽極108a，108b之間得 以存在一電場，因而將電解液中的金屬（例如銅）電鍍在 PCB 106內和PCB 106上的適當位置，電場強度可視需要 調整。 •10- (7) 1281517 請參閱圖9A和9B，其分別示出一對相鄰噴嘴1〇4Β 移動的最左端位置和最右端位置，實際上發現，爲了達到 最適當電解液噴射流涵蓋範圍，d/D比値好爲1/2-3/5，其 中d爲二相鄰噴嘴l〇4a之間距離，而D爲個別噴嘴l〇4a 最左端位置與最右端位置之距離。 在此安排下，陰極（亦即 PCB 1 06 )與陽極 1 〇8a， l〇8b之距離保持不變，使其易於在PCB 1〇6上得到均勻 電鍍效果。Micro-path position current density Figure 3 AV 20 ASF Figure 3B V 25 ASF Figure 3C V 30ASF Figure 3D E 20ASF Figure 3E E 25 ASF Figure 3F E 30ASF In the above table 1 and discussed later, “ASF” means, per square foot Amps, and 1ASF is equal to 10.76 amps per square meter. As shown in Figure 2, the position mark "V" refers to the portion of the PCB 12 that is closest to the nozzle of the nozzle 18 and is on the axis of the nozzle 18, thus Is the area covered by the electrolyte jet, and the position mark "E" refers to the portion of the PCB 12 that is farthest from the nozzle of the nozzle 18. The above experimental results are shown in Figure 4, where the Y-axis is the fullness rate (%), The X-axis is the current density (in ASF). The upper curve in Figure 4 is the result of Figure 3 A - 3 C micro-path full, and the lower curve in Figure 4 is Figure 3 D - 3 F micro-path full result And the middle curve is the arithmetic mean of the upper and lower curves. It can be seen that '· (a) at the same current, the micro-path has different expiration rates at position V and at position E; (b) The micro-path of position V, the higher the current density, the higher the fullness rate; -6 - (3) !281517 (c) The micro-path at the position E, the current is dense The lower the fullness, the higher the fullness rate. The experiment also shows the relationship between the fullness rate and the electrolyte flow rate delivered by the nozzle at a fixed current density. Figure 5 A - 5 C is placed at the same position relative to the nozzle. The results of the three micro-paths at different electrolyte flow rates and at a current density of 25 A s F, as shown in Figure 6, indicate that the Y-axis is the fullness (%) and the X-axis is the electrolyte flow. The rate (how many liters per minute 'L/min), the result shows that the higher the flow rate, the higher the fullness rate. In order to get the uniformity of the PCB and the current distribution, it has been suggested to stir the PCB by "knife edge," By "knife edge" agitation (ie, the nozzle is kept constant at a distance b from the PCB 12 (Fig. 7)), the PCB 12 is moved left and right (see the double-headed arrow in Fig. 7) or reciprocated up and down. However, this method has the following disadvantages: This PCB "knife edge" agitation is only suitable for micro-path full, but the PCB is not only micro-diameter, but also has through-holes, which require different ways of movement, such as distance b (Fig. 7). Move before and after the change. b. Due to edge effects, there is always a thicker plating on the edge of the PCB. The way to avoid it is to adjust the anode and PCB edge position, but when the cathode (ie PCB) moves relative to the plating machine, it is difficult to adjust its shielding position and The anode position makes it difficult to obtain good PCB plating uniformity. In addition, different sizes of micro-paths require different current densities to achieve good micro-path full results. In general, high current densities are suitable for larger micro-diameters; however, high current densities tend to create voids in smaller micro-paths, whereas The low current density is suitable for smaller micro-diameters, but generally results in a larger micro-diameter undercut, because -7-(4) 1281517 is difficult to obtain satisfactory results when electroplating different diameter micro-diameter substrates. One object of the present invention is to provide a liquid delivery system for an electroplating apparatus, an electroplating apparatus having the same, a plating apparatus with a current distributor, and an operation method of the electroplating apparatus to alleviate the above disadvantages, or at least provide another alternative to the public. Program. This and other objects of the present invention will be apparent from the following discussion. SUMMARY OF THE INVENTION According to a first aspect of the present invention, there is provided a liquid delivery system for an electroplating apparatus, the system comprising at least two liquid outlets, the at least two liquid outlets being fixedly spaced apart from each other for simultaneous action and liquid Feed into the apparatus, wherein at least a first liquid outlet delivers the liquid into the apparatus along a path, and wherein the liquid outlets are movable in a plane substantially perpendicular to the path. According to a second aspect of the present invention, there is provided an electroplating apparatus provided with a liquid delivery system, the system comprising at least two liquid outlets fixedly spaced apart from each other for simultaneous action and for feeding liquid into the Within the apparatus, at least a first liquid outlet carries the liquid into the apparatus along a path, and wherein the liquid outlets are movable in a plane substantially perpendicular to the path. According to a third aspect of the present invention, there is provided an electroplating apparatus for electroplating at least one substrate, comprising an anode device, a container device -8-(5) 1281517 accommodating an electrolyte, and a device for conveying the lysate into the container, And means for controlling the current density of different parts. According to a fourth aspect of the present invention, there is provided a system in a container for an electroplating apparatus, the system comprising a tube device for receiving the liquid, the device for receiving the tube device from the tube device The liquid is passed through to the mouth of the container, and the means for allowing the liquid in the container to enter the outlet through a different path during operation. According to a fifth aspect of the present invention, there is provided an electroplating apparatus provided with a system for feeding into a container of an electroplating apparatus, comprising a tube device for accommodating the liquid from a liquid source, containing the liquid and allowing the liquid Apparatus for passing the liquid from the tube device through at least one outlet of the container, and allowing the container to enter the outlet via a path other than the tube device during operation, in accordance with a sixth aspect of the present invention, which provides an electroplating method 'including the following Step: (a) the device is at a first current density for a first period of time; and (b) then operating the plating device for a second period of time at a higher degree. [Embodiment] Reference is now made to Fig. 8, which discloses an electroplating system of the present invention, particularly one in which an electrolyte is delivered to an electroplating apparatus. The liquid delivery system includes transporting the electrolyte into the tank 10a, 4a, 104b, and the nozzles 104a are fixedly spaced from each other to direct the liquid to the liquid to be discharged from a liquid and at least one out The tube device transports a liquid, and the system packs the liquid helium device from the tube device and feeds into the device to operate the two rows of nozzles in the second current-tight liquid transfer tank 102 to simultaneously move (6) 1281517, similarly, the nozzles 1 〇 4b are fixedly spaced from each other to facilitate simultaneous movement, in particular, the nozzles 104a, 104b are combined with a tube 105a, 105b to receive the electrolyte from it 'please understand The number of rows of nozzles can be in one row or more than two rows, depending on specific needs and design. As shown in FIG. 8, a substrate, such as a plurality of printed circuit boards (PCBs) (only one of the pCBs 106 is shown in FIG. 8), can be lowered into the slot 102 by, for example, a PCB carrier (eg, a flying rod, not shown). Between the rows of nozzles 104a, 104b, during electroplating, the PCB 106 remains substantially stationary relative to the slot 102 of the electroplating machine, and then the rows of nozzles 104a, 104b are oriented along the direction indicated by the arrows SA, SB. Individual straight lines reciprocating on the vertical plane 'arrows SA, SB nozzles 104a, 104b convey the electrolyte into the direction of the grooves 102. Therefore, the plurality of rows of nozzles 104a, 104b can be reciprocated, for example, left and right as shown by the double arrows Ra, Rb in Fig. 8, or reciprocated up and down, that is, in and out of the paper. Since the weight of the tube and the nozzles 104a, 104b is much smaller than the weight of the PCB 106 and the flying rod (not shown), the weight of the movable portion is greatly reduced, so that less power is required to operate it. On the side of the nozzles 104a, 104b remote from the path of movement of the PCB 106, there are a plurality of rows of anodes 108a, 108b. During operation, the anodes 108a, 108b are electronically coupled to a power source, and the PCB 106 in the slot 102 acts as the same cathode. An electric field is present between the PCB 106 and the anodes 108a, 108b in the trench 102, thereby plating metal (e.g., copper) in the electrolyte into the PCB 106 and in place on the PCB 106, and the electric field strength can be adjusted as needed. • 10-(7) 1281517 Referring to Figures 9A and 9B, which show the leftmost and rightmost positions of a pair of adjacent nozzles 1〇4Β, respectively, it was found that in order to achieve the most appropriate electrolyte jet flow coverage , d / D is better than 1/2 - 3/5, where d is the distance between two adjacent nozzles l 〇 4a, and D is the distance between the leftmost end position and the rightmost end position of the individual nozzles 〇 4a. Under this arrangement, the distance between the cathode (i.e., PCB 106) and the anodes 1 〇 8a, l 〇 8b remains unchanged, making it easy to obtain a uniform plating effect on the PCB 1 〇 6.
此種電解液輸送系統亦可與其他系統結合，例如PCB 1 0 6必要時可前後移動，例如如圖8中朝向和遠離P C B 1 06之雙箭號T所示者，使通孔得以電鍍到令人滿意。 上述安排最適合用於升降式電鍍機，在輸送帶式電鍍 機（其中基板係利用輸送帶移動經過一處理槽）中不一定 要，如上所述且如圖2-4所示，微徑最佳塡充之組合係使 位置V有較高電流密度，在位置E則有較低電流密度。 達成此一效果之電鍍設備（以標號2 0 0標示）槪示於 圖10中，設備200包括至少一處理槽202，電解液可經 由數噴嘴204a，204b導入處理槽202。基板，例如PCB ( 圖10僅示出其中一個PCB 206 )可被例如輸送帶（未示 出）在箭號F方向移動穿過到槽202內。在數排噴嘴 2 04a，2 04b遠離PCB 206在槽202內移動路徑的一個別側 有一個別排陽極208a，208b。 設在陽極排2 0 8 a與噴嘴排2 0 4 a之間者爲一第一電流 分配器210a;設在噴嘴排204a與PCB 206在槽202內移 -11 - (8) 1281517 動路徑之間者爲一第二電流分配器2 1 0 b ;設在噴嘴排 2 04b與PCB 2 06在槽202內移動路徑之間者爲一第三電 流分配器210c;設在噴嘴排204b與陽極排208b之間者 爲一第四電流分配器2 1 Od。請了解若電流分配器2 1 0 a和 21〇b中僅有一者且電流分配器210c和210d中僅有一者 ，可得到令人滿意之結果。圖1 0中四個電流分配器2 1 0a, 2 1 0 b，2 1 0 c，2 1 0 d爲任意選擇且可達到較佳結果。 如圖11所示，在安裝電流分配器210a之下，陽極 208a與PCB 206 (其作用如同陰極）之間的電場改變或重 新分布使得較高電流密度導向最靠近個別噴嘴204a的位 置Vi，V2，V3，V4，而較低電流密度導向位置El5 E2，E3 ( PCB 206上與二相鄰噴嘴204a等距離的區域）。 如圖1 2更淸楚地所示，電流分配器2 1 0a爲由電絕緣 材料例如聚丙烯（PP )或聚氯乙烯（PVC )製成之多孔板 ，在電流分配器210a上設有數組通孔212a，212b，其中 通孔212a尺寸比通孔212b大，由於電流分配器210a之 絕緣本質，電場僅能經由通孔212a，212b存在於陽極 208a與PCB 2 06之間，通過通孔212a的電流密度較大， 而通過通孔2 1 2b的電流密度較小。請了解雖然所示通孔 2 12a, 2 12b形狀爲圓形，其可爲其他形狀，例如細長槽孔 及間隙，只要能讓電通過即可。 圖13A和13B示出電鍍設備另一種傳統電解液輸送 系統3 00，在此安排中，一供應管3 02之壁3 06設有至少 一孔3 04，讓電解液3 0 8能離開管3 02進入電鍍設備的一 •12- 1281517Such an electrolyte delivery system can also be combined with other systems, such as PCB 106, which can be moved back and forth if necessary, for example, as shown by the double arrow T in FIG. 8 facing and away from the PCB 106, the through hole can be electroplated to Satisfactory. The above arrangement is most suitable for use in a lift-type electroplating machine, which is not necessarily required in a conveyor belt type electroplating machine in which the substrate is moved through a processing tank by a conveyor belt, as described above and as shown in Figures 2-4, the micro-path is optimal. The combination of charge has a higher current density at position V and a lower current density at position E. An electroplating apparatus (indicated by the numeral 2000) which achieves this effect is shown in Fig. 10, and the apparatus 200 includes at least one processing tank 202 through which the electrolyte can be introduced into the processing tank 202 via the number of nozzles 204a, 204b. A substrate, such as a PCB (only one of which is shown in Fig. 10), can be moved through the slot 202 in the direction of arrow F, for example, by a conveyor belt (not shown). In the rows of nozzles 2 04a, 2 04b away from the PCB 206, there is a separate anode 208a, 208b on one side of the path of movement within the slot 202. Between the anode row 2 0 8 a and the nozzle row 2 0 4 a is a first current distributor 210a; the nozzle row 204a and the PCB 206 are moved within the slot 202 -11 - (8) 1281517 moving path The second current distributor 2 1 0 b is disposed between the nozzle row 2 04b and the PCB 206 in the movement path of the slot 202. The third current distributor 210c is disposed in the nozzle row 204b and the anode row. Between 208b is a fourth current distributor 2 1 Od. Please understand that if only one of the current distributors 2 1 0 a and 21 〇 b and only one of the current distributors 210c and 210d, a satisfactory result can be obtained. The four current dividers 2 1 0a, 2 1 0 b, 2 1 0 c, 2 1 0 d in Figure 10 are arbitrarily chosen and achieve better results. As shown in Figure 11, under the mounting current distributor 210a, the electric field change or redistribution between the anode 208a and the PCB 206 (which acts like a cathode) causes the higher current density to be directed to the position Vi, V2 closest to the individual nozzle 204a. , V3, V4, and the lower current density is directed to the position El5 E2, E3 (the area on the PCB 206 that is equidistant from the two adjacent nozzles 204a). As shown more clearly in Fig. 12, the current distributor 210a is a perforated plate made of an electrically insulating material such as polypropylene (PP) or polyvinyl chloride (PVC), and an array is provided on the current distributor 210a. The through holes 212a, 212b, wherein the through holes 212a are larger in size than the through holes 212b. Due to the insulating nature of the current distributor 210a, the electric field can only exist between the anode 208a and the PCB 206 via the through holes 212a, 212b through the through holes 212a. The current density is large, and the current density through the through holes 2 1 2b is small. It is understood that although the through holes 2 12a, 2 12b are circular in shape, they may be of other shapes, such as elongated slots and gaps, as long as electricity is allowed to pass. 13A and 13B show another conventional electrolyte delivery system 300 of an electroplating apparatus. In this arrangement, a wall 306 of a supply tube 322 is provided with at least one hole 3 04 to allow the electrolyte 3 0 8 to leave the tube 3 02 into the electroplating equipment of a •12-1281517
槽內，電解液通過孔3 04進入槽的流率 等於電解液從管3 02進入孔3 04的流率 示出電鍍設備又一種傳統電解液輸送系統 中設有孔3 1 4附近且經由一供應管3 1 8 — 連通的一溝道3 1 2，供應管3 1 8中的電解 3 1 4，接著在進入電鍍設備的一槽內之前 如同圖1 3 A和1 3 B所示以及如上所述例 溝道3 1 2進入槽的流率Q等於電解液從f 的流率q。 如上所述，電解液流率愈高則塡滿率 安排係設計來增加電解液流入槽內之流率 加電解液流入供應管之流率，因此不一定 供應管到供應管上個別孔之流率，其特別 與陽極之間隔非常小而且不能允許大型管 依據本發明的第一種安排見圖1 5 A禾[ 中，一供應管402設有數孔，其中一孔 15B，孔404與一溝道406連接且呈液體 4 〇 6通到具一漏斗狀嘴4 1 0的一加寬空間 現在運作期間，當電解液通過溝道406進 入電鍍設備的一槽內，在漏斗狀嘴4 1 0附 入嘴4 1 0的通過的電解液拉到與電解液出 向’並與離開的電解液混合。從空間4 0 8 液流率Q等於從管402進入孔404之電 槽被拉入空間4 0 8嘴的電解液流率q2之 Q (公升/分鐘） t。圖 14A 和 14B 3 1 0，在此安排 -壁3 1 6與孔3 1 4 液3 2 0先進入孔 通過溝道3 1 2， 丨子，電解液通過 f 3 1 8進入孔3 1 4 :愈高，所以上述 :，但不一定要增 :要增加電解液從 有利，因爲PCB 路工作。 ]1 5 B，在此安排 4 0 4見圖1 5 A和 〖連通關係，溝道 3 40 8，實際上發 丨入空間4 1 0並進 [近的電解液被進 方向相反的方 進入槽內的電解 解液流率qi與從 •和。可看出一部 -13- (10) 1281517 分電解液是從槽直接進入空間408而非從管402 ’ 出溝道406比管402內徑窄且比空間408窄。 依據本發明的第二種安排見圖1 6 A至1 7B ’在 中，一供應管5 02設有數孔，其中一孔504見圖 16B，孔504與通到一通孔508的一溝道506連通 軸P-P —般垂直於電解液從溝道506進入通孔508 方向。在通過通孔508之後，電解液508在進入電 的一槽內之前進入一加寬孔5 1 0。實際上發現，在 中，在通孔5 0 8二孔口 5 1 2附近的槽內的電解液被 孔5 0 8且與通孔5 0 8內的電解液混合，並在再度進 前進入孔510，因此，電解液從槽進入通孔5 08之 般垂直於電解液從溝道5 06到孔5 1 0之流動方向， 流入槽內。電解液從槽進入孔5 1 0到槽內之總流孝 於電解液從管5 02進入孔5 04之流率qi以及電解 經由孔口 5 1 2進入通孔5 1 2的流率q2，q3之總和。 一部分電解液是從槽直接進入孔5 1 0而非從管5 02 看出溝道5 06比管5 02內徑窄且比孔510窄。 可看出上述使用排放效應來增加電解液從噴嘴 之流率，排放器或液體噴射器爲允許慢速移動甚至 流體（例如液體）的區域加入流體高速噴射流之設 方式係得後者大部分動能，結果爲流率比原始高動 流快數倍之結合流體噴射流。然而，傳統排放器之 當大，因而不方便或不適用於此處。反之，依據本 如上所述之本發明之安排節省空間、易於製造、且 亦可看 此安排 16A和 ，其縱 的流動 鍍設備 此安排 拉入通 入槽之 方向一 並隨後 【Q等 液從槽 可看出 ，亦可 到PCB 靜止的 備，其 能噴射 尺寸相 發明且 成本相 -14- 1281517In the tank, the flow rate of the electrolyte into the tank through the hole 304 is equal to the flow rate of the electrolyte from the tube 302 into the hole 307. The plating apparatus is further provided with a hole 3 1 4 in the vicinity of the conventional electrolyte delivery system and via a Supply tube 3 1 8 - a channel 3 1 2 in communication, electrolysis 3 14 in supply tube 3 1 8 , then before entering a slot in the electroplating apparatus as shown in Figures 13 A and 1 3 B and as above The flow rate Q of the example channel 3 12 entering the groove is equal to the flow rate q of the electrolyte from f. As described above, the higher the electrolyte flow rate, the better the full-rate rate is designed to increase the flow rate of the electrolyte into the tank and the flow rate of the electrolyte into the supply tube, so it is not necessary to supply the individual tubes to the supply tube. The ratio, which is particularly small to the anode, and which does not allow the large tube to be in accordance with the first arrangement of the present invention, is shown in Fig. 15. 5 A. [A supply tube 402 is provided with a plurality of holes, one of which is 15B, the hole 404 is a groove The channel 406 is connected and is in a liquid 4 〇6 to a widened space having a funnel-shaped nozzle 4 1 0. During operation, when the electrolyte passes through the channel 406 into a slot of the plating apparatus, the funnel-shaped nozzle 4 1 0 The electrolyte that has passed through the nozzle 410 is pulled to the electrolyte and is mixed with the leaving electrolyte. From the space 4 0 8 the flow rate Q is equal to Q (liters per minute) t of the electrolyte flow rate q2 of the nozzle from the tube 402 entering the hole 404 being pulled into the space 4 0 8 . Figure 14A and 14B 3 10 , where the arrangement - wall 3 16 and the hole 3 1 4 liquid 3 2 0 first enters the hole through the channel 3 1 2, the dice, the electrolyte passes through the f 3 1 8 into the hole 3 1 4 : The higher the above, so the above:, but not necessarily to increase: to increase the electrolyte from the favorable, because the PCB road works. ]1 5 B, here arranged 4 0 4 see Figure 1 5 A and 〖connected relationship, channel 3 40 8, actually smash into the space 4 1 0 into the [near electrolyte into the opposite direction into the slot The internal electrolytic solution has a flow rate of qi and from and. It can be seen that a portion of -13-(10) 1281517 electrolyte is directed from the tank directly into space 408 rather than from tube 402'. Channel 406 is narrower than tube 402 and narrower than space 408. A second arrangement in accordance with the present invention is illustrated in FIGS. 16A through 17B', wherein a supply tube 502 is provided with a plurality of apertures, one aperture 504 of which is shown in FIG. 16B, and a aperture 504 and a channel 506 leading to a via 508. The communication axis PP is generally perpendicular to the direction of the electrolyte from the channel 506 into the via 508. After passing through the via 508, the electrolyte 508 enters a widened hole 510 before entering a tank of electricity. It has been found that, in the middle, the electrolyte in the groove near the opening 5 of the through hole 5 0 8 is mixed with the electrolyte in the through hole 5 0 8 and enters before entering again. The hole 510, therefore, the electrolyte flows from the groove into the through hole 508 perpendicular to the flow direction of the electrolyte from the channel 506 to the hole 510, and flows into the groove. The total flow of the electrolyte from the tank into the hole 5 10 to the tank is filial to the flow rate q2 of the electrolyte from the tube 52 into the hole 504 and the flow rate q2 of the electrolysis through the orifice 5 1 2 into the through hole 5 1 2, The sum of q3. A portion of the electrolyte is directed from the tank directly into the orifice 5 1 0 rather than from the tube 52. The channel 506 is narrower than the inner diameter of the tube 052 and narrower than the orifice 510. It can be seen that the above-mentioned emission effect is used to increase the flow rate of the electrolyte from the nozzle, and the manner in which the discharger or the liquid ejector is added to the high-speed jet of the fluid to allow slow movement or even fluid (for example, liquid) is the majority of the kinetic energy of the latter. The result is a combined fluid jet flow rate that is several times faster than the original high dynamic flow. However, conventional dischargers are large and therefore inconvenient or unsuitable for use herein. Conversely, the arrangement of the present invention as described above saves space, is easy to manufacture, and can also be seen in this arrangement 16A and its longitudinal flow plating apparatus is arranged to pull into the direction of the access slot and then [Q et al. The trough can be seen, it can also go to the PCB static preparation, it can spray the size of the invention and cost phase -14 - 1281517
當低。 如上所述，一般而言，高電流密度適合較大之微徑塡 充’然而’高電流密度易在較小的微徑內形成空隙。另一 方面’雖然低電流密度適合較小之微徑塡充，但一般會造 成較大微徑形成下切，這些係經過實驗。圖i 8 a爲深度 皆爲75//m的—排三個微徑6〇〇，602，604之塡充結果， 微徑6 0 0直徑約7 5 // m，微徑6 0 2直徑約1 0 0 // m，微徑 604直徑約125 # m，施加電流密度爲25ASF的電場約55 分鐘’其塡充結果見圖18A，可看出僅有微徑600有良好 結果，微徑602和604皆出現下切。 接著的實驗也是對深度爲75 # m的三個微徑606 (直 徑約爲7 5 // m ) , 6 0 8 (直徑約爲1 0 0 // m ) , 6 1 0 (直徑約 爲125#m)進行，施加電流密度爲30ASF的電場約46 分鐘’因而如同上述第一個實驗得到相同的安培-小時大 小，其塡充結果見圖18B，可看出雖然微徑608和610有 良好和可接受結果，微徑6 0 6出現空隙。 第三個實驗也是對深度爲75 的三個微徑612(直 徑約爲7 5 // m )，6 1 4 (直徑約爲1 〇〇 // m )，6 1 6 (直徑約 爲1 2 5 // m )進行，施加電流密度爲3 0 A S F的電場約2 7 · 5 分鐘，接著施加電流密度爲20ASF的電場約27.5分鐘， 因而如同上述第一和第二個實驗得到相同的安培-小時大 小，其塡充結果見圖18C，可看出雖然微徑616有可接受 結果’微徑6 1 2，6 1 4出現空隙。 實際上發現先施加低電流密度的電場第一段時間，再 -15- (12) 1281517 施加高電流密度的電場第二段時間，可得到更多的可接受 結果，二段時間最好相同。第四個實驗也是對深度爲.75 // m的三個微徑6 1 8 (直徑約爲7 5 // m )，6 2 0 (直徑約爲 1 0 0 // m )，6 2 2 (直徑約爲1 2 5 // m )進行，施加電流密度 爲20ASF的電場約27.5分鐘，接著施加電流密度爲 3 OASF的電場約27.5分鐘，因而如同上述第一、第二和 第三個實驗得到相同的安培·小時大小，其塡充結果見圖 18D，可看出雖然微徑618，620，和622不是良好就是至 少可接受。 實際上發現對具有多於一種尺寸的微徑之PCB而言 很難以單一步驟電流密度程序將這些微徑塡滿，本發明程 序採用逐漸式應用可防止較小微徑產生空隙之較高電流密 度，同時將足夠的銅電鍍在較大的微徑內。實際上發現連 續較高電流密度之步驟數目可多於二個’例如三個甚至四 個，視使用者特定需求而定。 實際上亦發現基板電鍍的連續較高電流密度逐漸式應 用在相同的令人滿意的電鍍結果下可減少總電鍍時間’例 如要避免空隙的最大單步驟電流密度爲25ASF ’而電鍍時 間爲30分鐘，總電流爲每平方英尺爲2 5 X 3 0/60安培-小 時，亦即1 2.5安培-小時/平方英尺。爲達到相同結果’亦 即沒有空隙，可採用以下逐漸式方法： 25 ASF X 20 分鐘 30ASFx8.33 分鐘 總電流爲每平方英尺爲25 X 2 0/60 + 3 0 X 8.3 3/60安 -16 - (13) 1281517 培-小時’亦即12.5安培-小時/平方英尺，但電鍍時間只 需2 8 · 3 3分鐘。 請了解上述僅爲可實施本發明之例子而已，在不偏雛 本發明的精神之下仍可有許多修改及/或變化。 亦請了解爲求淸晰之故而揭示於個別實施例的本發明 特定特徵可在單一實施例中結合，反之，爲求簡潔之故而 揭示於單一實施例的本發明不同特徵亦可分開地提供或適 當地次組合。 【圖式簡單說明】 以下將以舉例方式參閱所附圖式說明本發明之例子， 其中： 圖1爲被一層銅部分塡滿的PCB微徑； 圖2顯示一電鍍設備中的一陽極、一噴嘴、以及一 PCB之位置； 圖3 A-3F爲在相對於噴嘴的不同位置且在不同電流密 度下的六個微徑塡滿結果； 圖4爲圖3 A · 3 F結果槪示圖； 圖5A-5C爲在相同電流密度下但噴嘴流出的電解液 流率不同下的三個微徑塡滿結果； 圖6爲圖5A-5C結果槪示圖； 圖7爲電鍍設備第一種傳統電解液輸送系統； 圖8爲本發明第一實施例之電解液輸送系統； 圖9 A和9 B顯示圖8中電解液輸送系統中的噴嘴移 -17- (14) 1281517 動方式； 圖1 G爲本發明第二實施例之1 圖1 1爲圖1 〇中電解液輸送系 圖12示出圖10中電解液輸送 圖1 3 A和1 3 B爲電鍍設備第 統； 圖14A和14B爲電鍍設備第 統； 圖15A和15B爲本發明第三 統； 圖16A和16B爲本發明第四 統； 圖 17A和 17B示出圖 16A和 細部圖，其中圖17A爲沿圖17B 以及 圖18A-18D爲在不同電流密 作模式下對不同尺寸微徑進行的實 元件對照表 1 0 :微徑 1 2 :印刷電路板 14 :層 16 :槽 1 8 :噴嘴 I解液輸送系統； 統部分放大圖； 系統的電流分配器； 二種傳統電解液輸送系 三種傳統電解液輸送系 實施例之電解液輸送系 實施例之電解液輸送系 16B中電解液輸送系統 的Z-Z線所取剖面圖； 度大小下以及在不同操 驗結果。 -18- (15) (15)1281517 2 Ο :電解液 2 2 :陽極 102 ：槽 1 0 4 a :噴嘴 104b ：噴嘴 105a：管 105b :管 106 :印刷電路板 1 0 8 a :陽極 10 8b:陽極 2 0 0 :電鍍設備 202 :處理槽 204a ：噴嘴 204b ：噴嘴 206 :印刷電路板 2 0 8 a :陽極 2 0 8b:陽極 2 10a :第一電流分配器 2 10b :第二電流分配器 2 10c :第三電流分配器 2 10d :第四電流分配器 2 1 2 a :通孔 2 12b :通孔 3 〇 〇 :電解液輸送系統 (16) (16)1281517 3 02 :供應管 3 04 ··孔 3 06 ：壁 3 0 8 :電解液 3 1 0 :電解液輸送系統 3 1 2 :溝道 3 1 4 :孔 3 1 6 :壁 3 1 8 :供應管When low. As noted above, in general, high current densities are suitable for larger micro-diameters. However, high current densities tend to form voids in smaller micro-paths. On the other hand, although the low current density is suitable for smaller micro-diameter filling, it generally results in a larger micro-path forming undercut, and these systems are experimental. Figure i 8 a is the depth of 75 / / m - three micro-diameters 6 〇〇, 602, 604 塡 结果 results, micro-diameter 6,000 diameter about 7 5 / 4 m, micro-diameter 602 diameter About 10 0 // m, the diameter 604 is about 125 # m in diameter, and the electric field with a current density of 25 ASF is about 55 minutes. The result of the charging is shown in Fig. 18A. It can be seen that only the micro-diameter 600 has good results, and the micro-path Both 602 and 604 appear undercut. The next experiment is also for three micropaths 606 (diameter about 7 5 // m) with a depth of 75 # m, 6 0 8 (diameter is about 1 0 0 // m), 6 1 0 (diameter is about 125) #m) Carrying out, applying an electric field with a current density of 30 ASF for about 46 minutes' thus obtaining the same ampere-hour size as the first experiment described above, and the results of the charging are shown in Fig. 18B, and it can be seen that although the micro-diameters 608 and 610 are good. And acceptable results, there is a gap in the micro-path 6 6 6 . The third experiment is also for three micro-paths 612 with a depth of 75 (approximately 7 5 // m in diameter), 6 1 4 (diameter is approximately 1 〇〇// m), and 6 1 6 (diameter approximately 1 2) 5 // m ), an electric field with a current density of 30 ASF was applied for about 27.5 minutes, and then an electric field with a current density of 20 ASF was applied for about 27.5 minutes, so that the same ampere was obtained as in the first and second experiments described above - The size of the hour, the result of which is shown in Fig. 18C, can be seen that although the micro-path 616 has an acceptable result 'the micro-path 6 1 2, the gap appears in the 61. In fact, it is found that the electric field of low current density is applied for a first time, and then the electric field of high current density is applied for a second time period of -15-(12) 1281517, and more acceptable results are obtained, and the two periods are preferably the same. The fourth experiment is also for three micropaths with a depth of .75 // m, 6 1 8 (diameter is about 7 5 // m ), 6 2 0 (diameter is about 1 0 0 // m ), 6 2 2 (diameter is about 1 2 5 // m), an electric field with a current density of 20 ASF is applied for about 27.5 minutes, and then an electric field with a current density of 3 OASF is applied for about 27.5 minutes, thus the first, second and third experiments described above. The same ampere-hour size is obtained, the results of which are shown in Figure 18D, it can be seen that although the micro-paths 618, 620, and 622 are not good or at least acceptable. In fact, it has been found that it is difficult for a PCB having a micro-path having more than one size to fill these micro-paths with a single-step current density program. The procedure of the present invention uses a gradual application to prevent higher current densities of small micro-cavities. At the same time, enough copper is plated in the larger micro-path. In fact, the number of steps for successively higher current densities can be found to be more than two 'e.g. three or even four, depending on the particular needs of the user. In fact, it has also been found that the continuous higher current density of substrate plating is gradually applied to the same satisfactory plating results to reduce the total plating time 'for example, to avoid voids, the maximum single-step current density is 25 ASF' and the plating time is 30 minutes. The total current is 2 5 X 3 0/60 amp-hours per square foot, or 1 2.5 amp-hours per square foot. To achieve the same result', ie no gaps, the following gradual method can be used: 25 ASF X 20 minutes 30ASFx8.33 minutes Total current is 25 X 2/60 + 3 0 X 8.3 3/60 amps per square foot - (13) 1281517 Pei-hours, or 12.5 amp-hours per square foot, but plating time is only 2 8 · 3 3 minutes. It is to be understood that the foregoing is only illustrative of the embodiments of the invention, and many modifications and/or changes may be made without departing from the spirit of the invention. It is also understood that the specific features of the present invention disclosed in the embodiments of the present invention may be combined in a single embodiment, and the different features of the present invention disclosed in a single embodiment may be provided separately or for the sake of brevity. Properly combined. BRIEF DESCRIPTION OF THE DRAWINGS In the following, an example of the invention will be described by way of example with reference to the accompanying drawings in which: FIG. 1 is a PCB micro-diameter which is partially filled with a layer of copper; FIG. 2 shows an anode and a cathode in an electroplating apparatus. The position of the nozzle and a PCB; Fig. 3 A-3F are the results of six micropaths at different positions relative to the nozzle and at different current densities; Fig. 4 is a diagram showing the results of Fig. 3 A · 3 F; 5A-5C are three micro-path full results at different current densities but different electrolyte flow rates from nozzles; Figure 6 is a diagram showing the results of Figures 5A-5C; Figure 7 is the first tradition of electroplating equipment. Electrolyte delivery system; Fig. 8 is an electrolyte delivery system according to a first embodiment of the present invention; Figs. 9A and 9B show nozzle movement -17-(14) 1281517 in the electrolyte delivery system of Fig. 8; Fig. 1 G is the second embodiment of the present invention. FIG. 1 is the electrolyte delivery system of FIG. 1. FIG. 12 shows the electrolyte delivery of FIG. 10. FIG. 1 3 A and 1 3 B are the electroplating equipments; FIG. 14A and FIG. 14B. 15A and 15B are the third system of the present invention; FIGS. 16A and 16B are the fourth system of the present invention; 17A and 17B show FIG. 16A and a detailed view, wherein FIG. 17A shows a real component comparison table 10 for different size micropaths in different current-tight mode along FIG. 17B and FIGS. 18A-18D: micropath 1 2 : Printed circuit board 14: layer 16: slot 1 8: nozzle I solution delivery system; part of the enlarged view; system current distributor; two traditional electrolyte delivery system three traditional electrolyte delivery system embodiment of the electrolyte delivery system A cross-sectional view of the ZZ line of the electrolyte delivery system in the electrolyte delivery system 16B of the embodiment; the degree of magnitude and the results of the different tests. -18- (15) (15) 1281517 2 Ο : electrolyte 2 2 : anode 102 : tank 1 0 4 a : nozzle 104b : nozzle 105a : tube 105b : tube 106 : printed circuit board 1 0 8 a : anode 10 8b : anode 2 0 0 : electroplating apparatus 202 : treatment tank 204a : nozzle 204b : nozzle 206 : printed circuit board 2 0 8 a : anode 2 0 8b: anode 2 10a : first current distributor 2 10b : second current distributor 2 10c : third current distributor 2 10d : fourth current distributor 2 1 2 a : through hole 2 12b : through hole 3 〇〇: electrolyte delivery system (16) (16) 1281517 3 02 : supply tube 3 04 ·· hole 3 06 : wall 3 0 8 : electrolyte 3 1 0 : electrolyte delivery system 3 1 2 : channel 3 1 4 : hole 3 1 6 : wall 3 1 8 : supply tube
3 2 0 :電解液 402 :供應管 404 ：孑L 406 :溝道 4 0 8 :空間 4 1 0 :漏斗狀嘴 5 02 :供應管 5 04 :孔 5 06 :溝道 5 0 8 :穿孔 5 10 :孑L 5 1 2 ··孔口 600 :微徑 602 :微徑 604 :微徑 (17) 1281517 606 :微徑 608 :微徑 6 1 0 :微徑 6 1 2 :微徑 6 1 4 :微徑 6 1 6 :微徑 6 1 8 :微徑 620 :微徑 622 :微徑3 2 0 : electrolyte 402 : supply tube 404 : 孑 L 406 : channel 4 0 8 : space 4 1 0 : funnel-shaped nozzle 5 02 : supply tube 5 04 : hole 5 06 : channel 5 0 8 : perforation 5 10 : 孑 L 5 1 2 · · orifice 600 : micro-path 602 : micro-path 604 : micro-diameter (17) 1281517 606 : micro-path 608 : micro-path 6 1 0 : micro-path 6 1 2 : micro-path 6 1 4 : micro path 6 1 6 : micro path 6 1 8 : micro path 620 : micro path 622 : micro path