丄ΟΖ/δδ/ 九、發明說明： 【發明所屬之技術領域】 本創系關於-種電連接器組件，尤指一盘泰 性連接之電連接器組件。 了〃電路板達成电 【先前技術】 之導包括絕緣本體、複數收容於絕緣本體内 撥=壓:===:—壓板之，通過 第-圖所示爲-種習知電連接器组件励， =====輪子（_)===體 對i 片模組9’之壓板7’，以及槐接於加強片6’相 7fk^ ± σ埜板7之撥桿8’。該壓板7,設有施壓部71，，當壓板 壓部71’直接抵觸並下壓晶片模組9，至絕緣本體5'中。 壓板7,和片，9,係當壓板7,處於開啓狀態時直接組設於 時由，±當撥桿8,旋轉使壓板7,向下壓晶片模組9, 供組9會同時受到端子和壓板7，兩方面之施力，這樣 會出現兩個問題:對於端子(未圖示），由於受力處3 子J未圖示）變形量不同，對於變形量較小區域會有不 對^ 於之區域會有壓損端子（未圖示）現象； 备』Γ，:·0·，备撥桿8,之施力不當時，麼板7,設有之施壓部71， 曰使偶組9_断裂或焊接點裂開造成短路或斷路之威脅。 緣本接器組件2〇〇, ’其包括絕 =it之^模組15，、包覆於絕緣本體⑽外側之金屬加強 樞接於加強片η，一端用於抵壓晶片模組 於加強仙，相對另—端卿扣細2,之撥桿13==2拓曰接 模組14’上端之散熱器15|。散熱器15，具有凸緣二壓 6 1327887 151’對晶片模組14，施力，由此改善晶片模組i4,丄ΟΖ/δδ/ IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to an electrical connector assembly, and more particularly to a Thai-connected electrical connector assembly. The circuit board has reached the power [previous technology] The guide includes the insulating body, and the plurality of materials are housed in the insulating body. The pressure is pressed: ===: - the pressure plate, which is shown in the figure - a conventional electrical connector assembly , ===== Wheel (_) === The pressure plate 7' of the body-to-chip module 9', and the lever 8' connected to the reinforcing piece 6' phase 7fk^± σ field 7. The pressing plate 7 is provided with a pressing portion 71. When the pressing portion 71' directly abuts and presses the wafer module 9 into the insulating body 5'. The pressure plate 7, and the sheet 9, are directly assembled when the pressure plate 7 is in the open state, ± when the lever 8 is rotated, the pressure plate 7 is rotated, and the wafer module 9 is pressed downward, and the group 9 is simultaneously subjected to the terminal. And the pressure plate 7, two kinds of force, so there will be two problems: for the terminal (not shown), due to the force of the 3 sub- J not shown) deformation amount is different, for the small deformation area will be wrong ^ In the area there will be a pressure loss terminal (not shown) phenomenon; preparation Γ,:·0·, the preparation lever 8, the force is not the right time, the board 7, with the pressure part 71, 曰 even Group 9_ breakage or cracking of the solder joint creates a threat of short circuit or open circuit. The edge connector assembly 2〇〇, 'it includes the module 15 of the absolute=it, the metal sheathed on the outer side of the insulative housing (10) is pivotally connected to the reinforcing piece η, and one end is used for pressing the chip module to strengthen the fairy Relative to the other end-end buckle 2, the lever 13==2 is connected to the upper end of the module 14' of the radiator 15|. The heat sink 15 has a flanged voltage 6 1327887 151' to apply force to the wafer module 14, thereby improving the chip module i4,
要之功能在於散熱，所以在其製造選^時二將採用散ί 製作，造成成本很高，並且紅藝較爲複雜在加工I 電連件=要提供一種改進之電連接器組件，以克服上述 【發明内容】 •本創作所解決之技術問題係提供—種電連接器 可與電路板達成電性連接之電連接器組件。 θ種 轉技翻題，本辦涉及―種電連接驗件，I包括 體：複f收容於絕緣本體内之導電端子、裝設於絕緣 壓板及撥桿，壓板和晶片模組之間設有固持片❶、金片上之 模組電連接器組件之一種改進’上述固持片可以與晶片 於晶==之電連接器組件另—種改進’上述固持片還可獨立 與現有技術相比，本創作電連接器組件具有以下 =器=中當壓板下壓封裝晶片模組時，固持片可以提供^ 田:晶片核組與固持片_體封裝時，可以便於裝配和運送；1 ，獨立於晶片模組設置時，固持片可對應 靈活設置不同之結構。 现且之結構 【實施方式】 請參閱第三圖所示，本創作電連接器經件漏包括絕緣 =數收容於絕緣本體咖之導電端子（未圖示）、裝設^ 10上之晶片模組14、框設於絕緣本體10周邊之加強片U、拖 之撥桿12及壓板13 ’以及處於壓板13和晶片模組14之^ 固持片I5與晶片模、组之大小大致相@呈框體結構，固持片設 7 1327887 =載部151和散解152，承載部151紐解152之姆面積可以 ^以適應獨之晶諸崩之受力情狀及組件排設之要求，此 夕卜散熱部I52之設置可以滿足—錄熱魏。該實施方式巾 與晶片模組14封裝成爲一體。 、 壓板13爲一中空框體構造，其中央形成一開口 131，其兩相之 士第-側邊132及第二側邊133’第一側邊132之中部向絕緣本體 10方向鼓起，形成夾持部134。The function is to dissipate heat, so it will be made in the manufacturing process, which will result in high cost, and the red art is more complicated in processing I electrical parts = to provide an improved electrical connector assembly to overcome The above [invention] The technical problem solved by the present invention is to provide an electrical connector assembly in which an electrical connector can be electrically connected to a circuit board. θ kinds of transfer technology, the office involves "electrical connection inspection, I include the body: the complex f is housed in the insulating body of the conductive terminal, installed in the insulating plate and the lever, between the pressure plate and the wafer module An improvement of the module electrical connector assembly on the holding piece and the gold piece. The above-mentioned holding piece can be improved with the wafer-on-electric connector assembly. The above-mentioned holding piece can also be independently compared with the prior art. The creation of the electrical connector assembly has the following = device = when the pressure plate is pressed down the packaged wafer module, the holding piece can provide the field: the wafer core group and the holding piece _ body package can be easily assembled and transported; 1. independent of the wafer When the module is set, the holding piece can flexibly set different structures. Now the structure [embodiment] Please refer to the third figure, the dielectric connector of the present invention includes insulation = several conductive terminals (not shown) housed in the insulating body, and the wafer die mounted on the device 10 The frame 14 is disposed on the periphery of the insulative housing 10, the reinforcing member U, the dragging lever 12 and the pressing plate 13', and the holding plate I5 of the pressing plate 13 and the wafer module 14 are substantially in the same size as the wafer die and the group. Body structure, holding piece set 7 1327887 = carrier part 151 and dispersing 152, the bearing area 151 New 152 mm area can be adapted to the requirements of the unique crystal collapse and component arrangement, this evening heat The setting of the part I52 can satisfy the content of the heat. The embodiment towel is integrally packaged with the wafer module 14. The pressure plate 13 is a hollow frame structure, and an opening 131 is formed in the center thereof, and the middle portion of the two-phase first side 132 and the second side edge 133' of the first side edge 132 bulges toward the insulating body 10 to form Clamping portion 134.
組裝時，可先將加強片11安裝於容設有導電端子（未圖示）之 ^緣本體1〇之周圍，其後將壓板13及撥桿12組設於加強片U上，然 後用緊固件（未圖示）將加強仙及絕緣本體職一步定位於電^ ，（未圖示）上，其後絕緣本體10通過導電端子（未圖示）焊接於 板上（未圖示），然後將覆有固持片15之晶片模組14裝設於絕 、、、體10之上表面（未標號），旋轉壓板13扣持於晶片模組14上之 口1片15，壓板13之爽持部134抵接於晶片模組14之表面，然後旋轉 撥桿12並施加一定壓力擠壓封裝有固持片15之晶片模組14，該時實 現了封裝有固持片15晶片模組14與絕緣本體10導電區（未圖示）之 端子（未圖示）穩固電性導接。 此外本創作電連接器組件還有下文敍述之實施方式，該等實施 方式中固持片與晶片模組及壓板相分離獨立存在。 鲁 請參閱第四圖所示’本創作第二種實施方式之電連接器組件2〇〇 包絕緣本體20、複數收容於絕緣本體20内之導電端子（未圖示）、 裝《又於纟巴緣本體2〇上之晶片模組24、框設於絕緣本體2〇周邊之加強 片21、樞接於加強片21上之撥桿22及壓板23以及處於壓板23和晶片 模組24之間之固持片25。 壓板23爲一中空框體構造，其中央形成一開口231，其兩相對之 =邊爲第一側邊232及第二侧邊233，第一側邊232及第二側邊233之 中部向絕緣本體20方向鼓起，形成夾持部234。 曰曰片模組24s免有上表面241、下表面242，其中上表面241可根據 結構強度劃分爲結構強度最弱之最外緣和内部區域。 固持片25係中空框體結構，設有承載部251和散熱部252，承載 8 1327887 部251设有上表面2511和下表面2512，固持片25之承載部251之下表 面皿僅封餘晶片模組24上表面2彳1之結構紐最弱之最外緣，即 固持片2 5結構爲承載部2 51之框體寬度僅限於晶片模組2 4強度最弱 之區域。 組裝時，可先將加強片21安裝於絕緣本體2〇之周圍，其後將壓 板23及撥桿22組設於加強片21上，然後用緊固件（未圖示）將加強 片21及絕緣本體2〇進一步定位於電路板（未圖示）上，其後將裝有 加強片21、撥桿22以及壓板23之絕緣本體2〇通過導電端子（未圖示） 焊接於電路板（未圖示）上’接著裝人晶片模組24，最後將固持片 25覆於晶片模組24之上表面241，旋轉壓板23使得壓板23之夾持部 234亦抵壓於晶片模組24上表面241之固持片25，最終將壓板23扣持 於加強片21上，晶片模組24與絕緣本體2〇導電區(未圖示）之 現穩固電性導接。 々一本創作電連接器組件以下之實施方式與本創作電連接器組件之 第二^施方式之區別僅在於固持片之結構，故其他組件不予贅述。 請參閱第五圖所示，第三種實施方式之電連接器組件3〇〇，其 中，固持片26設有承載部261和散熱部262，承載部261設有上表面 2611和下表面2612’固持片26承載部261之下表面2612封裝於晶片 組24之上表面241。 、 第四種實施方式和第五種實施方式之電連接器組件係通過於固 持片以及固持片設有之加強裝置以達到支撐加固之效果。 請參閱第六圖所示，第四種實施方式之電連接器組件4〇〇，其中 ，固持片27設有弧形之承載部271和散熱部272，承載部271設有四個 相對緣2710 ’於散熱部272之四周設有四個相對之側壁2720。加強 ^置爲外緣2710設有之第一加強肋2711、側壁272〇向下延伸設有之 ，一^強肋2721。組裝時第一加強肋2711與第二加強肋2721抵觸於 曰=片模組24之上表面241，該實施方式中之加強肋之設置可以採用連 或不連續型不同之結構。承載部261之弧形設置可以促進空氣之 循環，改善晶片模組24之散熱狀況，散熱部272可以避開晶片模組％ 上必要組件之同時還可以兼顧散熱之功能。 9 1327887 躺’第八圖所示，第五種實施方式之電連接器組件 躺’9二ΐ古口 f片28設有承載部28卜散熱部282以及底面283 ’承 ί九：有？個相對外緣，四個外緣中對應接觸於壓板23按壓部 甘緣於散熱部282之四周設有四個相對之側壁， υΐίϋ有特定之連續型或不連續型之⑽或凸點，該實施 方式中加強裳置爲固持片28在第一外緣誦設有之連續型第一凸肋 2811，以及平行於第一凸肋在底面挪設 ’且第二凸職0之位置處於第一側壁厕向底二 2面283 ’惟’第二侧肋在底面挪之設置位置還可視晶片^ 、忠上之組件和散熱需要作必要之調整。組裝時第一凸肋則與第 一凸肋2830抵觸於晶片模組24之上表面241。 —氣然，第_實施方式之電連接驗件4⑻之 貫施方式之電連接器組件鄕之固持片财 之 尸=>!模組24上存在之組件油此便於日日日片模 排，此外逛可達到散熱之效果。 干女 基於不同電連接器組件中不同之組件之特 之排設以及散熱等其他原因考慮，在上面 ^式之電連接n組件中晴片之承载部與散熱部之相對面積可以調 Η 述，由於本創作各種實施方式之電連接器組种，固持 〃 S曰片杈組之接觸面積大於現有技術電連接器中壓板夾 曰 之接觸面積’同時畴片本身具有之承載能力，由此可^ ^片板組和端子党力之均衡性，提高晶片模組之承載特性，改盖 =子之變形量不均之_，避免晶片模組和端子 & =析’本創作各種實施方式之電連接器組件J 仃過程中機械和電性連接之可靠性和穩定性。 八隹建 & =上述’本創作確已符合發明專利之要件顧法提出專利申When assembling, the reinforcing piece 11 can be first installed around the edge body 1 容 which is provided with a conductive terminal (not shown), and then the pressure plate 13 and the lever 12 are assembled on the reinforcing piece U, and then tightened. The firmware (not shown) positions the reinforcing conductor and the insulating body on the electric device (not shown), and then the insulating body 10 is soldered to the board (not shown) through a conductive terminal (not shown), and then The wafer module 14 coated with the holding sheet 15 is mounted on the upper surface (not labeled) of the body 10, and the rotary platen 13 is fastened to the mouth piece 15 of the wafer module 14, and the pressure plate 13 is refreshed. The portion 134 abuts the surface of the wafer module 14, and then rotates the lever 12 and applies a certain pressure to press the wafer module 14 on which the holding sheet 15 is packaged. At this time, the wafer module 14 and the insulating body are packaged with the holding sheet 15 . The terminals (not shown) of the 10 conductive regions (not shown) are stably electrically connected. In addition, the present invention also has embodiments of the present invention in which the retaining tabs are separated from the wafer modules and the press plates independently of each other. Please refer to the fourth figure for the second embodiment of the present invention. The electrical connector assembly 2 includes an insulating body 20, and a plurality of conductive terminals (not shown) housed in the insulating body 20, and The wafer module 24 is disposed on the periphery of the insulating body 2, the reinforcing sheet 21 disposed around the insulating body 2, the lever 22 and the pressing plate 23 pivotally connected to the reinforcing sheet 21, and between the pressing plate 23 and the wafer module 24. Holder 25. The pressure plate 23 is a hollow frame structure, and an opening 231 is formed in the center thereof. The opposite sides are the first side 232 and the second side 233, and the first side 232 and the second side 233 are partially insulated. The body 20 is bulged in the direction to form a clamping portion 234. The cymbal module 24s is free of an upper surface 241 and a lower surface 242, wherein the upper surface 241 can be divided into the outermost edge and the inner region with the weakest structural strength according to the structural strength. The holding piece 25 is a hollow frame structure, and is provided with a bearing portion 251 and a heat dissipating portion 252. The bearing portion 8 1327887 is provided with an upper surface 2511 and a lower surface 2512. The lower surface of the holding portion 251 of the holding piece 25 is only sealed by the wafer mold. The outermost edge of the structure of the upper surface 2彳1 of the group 24 is the weakest outer edge, that is, the structure of the holding piece 25 is such that the frame width of the carrying portion 2 51 is limited to the region where the wafer module 24 is the weakest. When assembling, the reinforcing sheet 21 can be installed around the insulating body 2, and then the pressing plate 23 and the lever 22 are assembled on the reinforcing sheet 21, and then the reinforcing sheet 21 and the insulating layer are insulated by fasteners (not shown). The main body 2 is further positioned on a circuit board (not shown), and then the insulative housing 2, which is provided with the reinforcing piece 21, the lever 22 and the pressing plate 23, is soldered to the circuit board through a conductive terminal (not shown) (not shown) Then, the wafer module 24 is mounted, and finally the holding sheet 25 is overlaid on the upper surface 241 of the wafer module 24, and the pressing plate 23 is rotated so that the clamping portion 234 of the pressing plate 23 is also pressed against the upper surface 241 of the wafer module 24. The holding piece 25 finally holds the pressing plate 23 on the reinforcing piece 21, and the wafer module 24 is electrically connected to the current conductive region (not shown) of the insulating body 2. The following embodiments of the present invention are different from the second embodiment of the present invention in terms of the structure of the holding piece, and therefore other components are not described herein. Referring to the fifth embodiment, the electrical connector assembly 3 of the third embodiment, wherein the holding piece 26 is provided with a bearing portion 261 and a heat dissipating portion 262, and the carrying portion 261 is provided with an upper surface 2611 and a lower surface 2612' The lower surface 2612 of the holder 26 of the holding piece 26 is encapsulated on the upper surface 241 of the wafer set 24. The electrical connector assembly of the fourth embodiment and the fifth embodiment is provided with a reinforcing means provided on the holding piece and the holding piece to achieve the effect of supporting reinforcement. Referring to the sixth embodiment, the electrical connector assembly 4 of the fourth embodiment, wherein the holding piece 27 is provided with an arc-shaped bearing portion 271 and a heat dissipating portion 272, and the supporting portion 271 is provided with four opposite edges 2710. 'There are four opposite side walls 2720 around the heat dissipation portion 272. The first reinforcing rib 2711 provided on the outer edge 2710 is provided with a side wall 272 〇 extending downwardly, and a strong rib 2721. When assembled, the first reinforcing rib 2711 and the second reinforcing rib 2721 are in contact with the upper surface 241 of the 曰=sheet module 24. The reinforcing ribs in this embodiment may be arranged in a different or discontinuous configuration. The arc-shaped arrangement of the carrying portion 261 can promote the circulation of the air and improve the heat dissipation of the wafer module 24. The heat-dissipating portion 272 can avoid the necessary components of the wafer module and can also balance the heat dissipation function. 9 1327887 Lying in the eighth figure, the fifth embodiment of the electrical connector assembly is lying on the '9 two-dimensional port f piece 28 is provided with a bearing portion 28 heat dissipation portion 282 and the bottom surface 283 ' 九 九: Yes? The opposite outer edges, the four outer edges correspondingly contacting the pressing portion of the pressing plate 23 are provided with four opposite side walls around the heat dissipating portion 282, and the specific continuous or discontinuous type (10) or bump, In an embodiment, the reinforcing skirt is disposed as a continuous first rib 2811 provided on the first outer edge of the holding piece 28, and is disposed at a position parallel to the first rib on the bottom surface and the second convex position is at the first position The side wall toilets are two to two sides 283 'only. 'The second side ribs are placed at the bottom of the bottom. The position of the wafers, the components of the loyalty, and the heat dissipation needs to be adjusted as necessary. The first ribs are in contact with the first rib 2830 against the upper surface 241 of the wafer module 24 during assembly. - suffocating, the electrical connector assembly of the electrical connection test piece 4 (8) of the first embodiment is fixed to the corpse of the corpse =>! The component oil present on the module 24 is convenient for the daily film module In addition, you can achieve the effect of heat dissipation. The dry woman is based on the special arrangement of the different components of the different electrical connector components and other reasons, such as the heat sinking of the n-type electrical connection n assembly, the relative area of the bearing portion and the heat dissipating portion can be adjusted. Due to the electrical connector group of the various embodiments of the present invention, the contact area of the holding 〃 曰 杈 杈 group is greater than the contact area of the pressure plate 现有 in the prior art electrical connector, and the bearing capacity of the domain itself can be ^The balance between the chipset and the terminal party force, improve the bearing characteristics of the chip module, change the cover = the uneven amount of deformation of the sub-, avoid the chip module and the terminal & = analysis of the various embodiments of the creation of electricity The reliability and stability of the mechanical and electrical connections during the connector assembly J 仃 process. Gossip Construction &=The above's creation has indeed met the requirements of the invention patent
η以上所述僅為本發明之雛實施例，舉凡熟悉本發明之J 10 士援依本發明之精神所作之等效 專利範_。 域化，皆應涵蓋在以下申請. 【圖式簡單說明】 第一圖係一種習知電連接器組件 # ^ 壯能。 立體不思圖，其中壓板處於開啓 狀態 圖，其中壓板處於開 體示意圖，其中壓板處於開啓狀 第二圖係另:種習知電連接H組件之立體示意 啓狀態。 第三圖係本創作電連接器組件之立 態。 第四圖=1作電連接.件第二種實施方式之 壓板處於開啓狀態。 第五圖，义作電連接器組件第三種實施方式之 壓板處於開啓狀態。 第六圖，=作電連接器纪件第四種實施方式之 壓板處於開啓狀態。 第七圖，本=作電連接器組件第五種實施方式之立體示意圖，其中 愿板處於開啓狀態。 第八圖係第七圖所示電連接器組件中_片另—角度之立體示意圖 【主要組件符號說明】 電連接器組件 100絕緣本體 10 加強片 11撥桿 12 壓板 13開口 131 第一側邊 132第二侧邊 133 失持部 134晶片模組 14 固持片 15承載部 151 散熱部 152電連接器組件 200 11 1327887 絕緣本體 20加強片 21 撥桿 22壓板 23 開口 231第一侧邊 232 第二側邊 233夾持部 234 晶片核組 24上表面 241 下表面 242固持片 25 承載部 251上表面 2511 下表面 2512散熱部 252 電連接器組件 300固持片 26 承載部 261上表面 2611 下表面 2612散熱部 262 電連接器組件 400固持片 27 承載部 271散熱部 272 外緣 2710第一加強肋 2711 側壁 2720第二加強肋 2721 電連接器組件 500固持片 28 承載部 281第一外緣 2810 第一凸肋 2811散熱部 282 第一側壁 2820底面 283 第二凸肋 2830 12The above is only the embodiment of the present invention, and the equivalent of the invention is in accordance with the spirit of the present invention. Domainization should be covered in the following application. [Simple description of the diagram] The first diagram is a conventional electrical connector assembly # ^ 壮能. Stereoscopically, the pressure plate is in an open state diagram, wherein the pressure plate is in an open schematic view, wherein the pressure plate is in an open state. The second figure is another: a stereoscopic schematic state of the conventionally connected electrical component. The third figure is the standpoint of the present electrical connector assembly. The fourth figure is for electrical connection. The second embodiment of the pressure plate is in an open state. Fifth, the pressure plate of the third embodiment of the electrical connector assembly is in an open state. In the sixth figure, the fourth embodiment of the electrical connector is in the open state. In the seventh figure, a perspective view of a fifth embodiment of the electrical connector assembly, wherein the wish board is in an open state. Figure 8 is a perspective view of the electrical connector assembly shown in the seventh figure. [Main component symbol description] Electrical connector assembly 100 Insulating body 10 Reinforcing sheet 11 lever 12 Pressing plate 13 opening 131 First side 132 second side 133 missing portion 134 wafer module 14 holding piece 15 carrying portion 151 heat sink portion 152 electrical connector assembly 200 11 1327887 insulating body 20 reinforcing sheet 21 lever 22 pressing plate 23 opening 231 first side 232 second Side 233 clamping portion 234 wafer core group 24 upper surface 241 lower surface 242 holding sheet 25 bearing portion 251 upper surface 2511 lower surface 2512 heat sink portion 252 electrical connector assembly 300 holding sheet 26 bearing portion 261 upper surface 2611 lower surface 2612 heat dissipation Portion 262 electrical connector assembly 400 retaining tab 27 bearing portion 271 heat sink portion 272 outer edge 2710 first reinforcing rib 2711 side wall 2720 second reinforcing rib 2721 electrical connector assembly 500 retaining tab 28 bearing portion 281 first outer edge 2810 first convex Rib 2811 heat sink 282 first side wall 2820 bottom surface 283 second rib 2830 12