TWI323960B - - Google Patents
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- TWI323960B TWI323960B TW96119626A TW96119626A TWI323960B TW I323960 B TWI323960 B TW I323960B TW 96119626 A TW96119626 A TW 96119626A TW 96119626 A TW96119626 A TW 96119626A TW I323960 B TWI323960 B TW I323960B
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Description
1323960 九、發明說明： 【發明所屬技術領域】 【0001 】 本發明係有關被形成於配線基板側端部的連 接器接續用端子之製造方法，特別是關於可更廉價 地製造被嵌合於ZIF型連接器或壓入式連接器等 的連接器接續用端子之方法。 【先前技術】 【0002】 基於可降低與連接器間之接觸阻力、防止端子 ，體的磨耗、以及防止用以形成端子的金屬材料之 乳化等等的理由’通常大多會在連接器接續 :表：上形成導電性皮膜。而此導電性皮膜係被要 求具有如下之特性，亦即不會自金屬材料剝離、是 =等且厚度薄的皮膜1及不會因氧化而腐 寻·。 【0003】 你古以Ϊ ’從廉價的觀點，大多採用對銅的表面施 :有敍共晶_電錢之方法，但是從現今的環境污 杜““ 導電性皮臈。而有關 了滿足則述特性的導電性皮膜而言， 鑛金或鐘錄之後再施作鑛金作纟^仃在知作 疋在％以鍍鎳之後再進 行鍍金。但是，因為需要不同的2個皮膜而使處理 變煩雜，雖然比起鍍金單體的成本還廉價，但依然 屬高價。雖然也取代鍍金而改以進行純錫或錫系合 金（所謂的無鉛銲料）之電錢，然而在此場合，容 易產生錫的金屬鬚，且有發生漏洩電流或短路之 虞。 【0004】 ▲ 又’在純錫或錫系合金之電鍍部分上預先形成 薄的樹脂皮膜層俾防止金屬鬚之發生的配線基板 為亦習知（例如’參照專利文獻1 )。 【專利文獻1】日本特開2005 — 302575號公報 【發明内容】 【發明欲解決之課題】 【0005】 專利文獻1所記載的發明為’藉由於純錫或錫 系合金之電鑛部分上形成樹脂皮膜層，以防止鉛所 引起環境問題與金屬鬚之發生。而在連接器插入 時’前述樹脂皮膜係因摩擦破損而形成電氣接觸， 具有因樹脂皮膜層柔軟之故而引發位置偏差之 虞。於多次插拔的狀況或長時間的使用上並不適 合’而具有所謂的欠缺穩定性及可靠性的問題。 【0006】 雖然在穩定性及可靠性方面是鍍金較優異，但 1323960 是如同前述，係成本高且在配線基板上需要銲料皮 膜與樹脂皮膜2個不同的皮膜而造成處理煩雜。 【0007】193. In the present invention, the present invention relates to a method of manufacturing a connector connection terminal formed on an end portion of a wiring board, and in particular, it can be manufactured at a lower cost and is fitted to a ZIF. A method of connecting a connector such as a connector or a press-in connector. [Prior Art] [0002] Based on the reason that the contact resistance with the connector can be reduced, the wear of the terminal, the wear of the body, and the emulsification of the metal material for forming the terminal are prevented, etc., most of the connections are usually made at the connector: : A conductive film is formed on the film. Further, the conductive film system is required to have the following characteristics, that is, the film 1 which is not peeled off from the metal material, is thin, and is not etched by oxidation. [0003] You used to be Ϊ ‘from the cheap point of view, most of the use of the surface of copper: there are methods of eutectic _ electricity money, but from today's environment pollution "" conductive skin. In the case of a conductive film that satisfies the characteristics described above, gold or gold is used as gold ore, and then gold is applied as gold. However, since two different films are required to make the treatment troublesome, although it is cheaper than the cost of the gold-plated monomer, it is still expensive. Although it replaces gold plating and converts it into pure tin or tin-based alloy (so-called lead-free solder), in this case, tin whiskers are easily generated, and leakage current or short circuit occurs. [0004] ▲ In addition, a wiring board in which a thin resin film layer is formed in advance on a plated portion of a pure tin or tin-based alloy to prevent the occurrence of whiskers is also known (for example, 'Reference Patent Document 1). [Problem to be Solved by the Invention] [0005] The invention described in Patent Document 1 is formed by the formation of an electric ore portion of a pure tin or tin-based alloy. Resin film layer to prevent environmental problems caused by lead and metal whiskers. On the other hand, when the connector is inserted, the resin film is electrically contacted by frictional damage, and the position of the resin film layer is soft. It has a problem of so-called lack of stability and reliability in the case of multiple insertion and removal or long-term use. Although the gold plating is excellent in terms of stability and reliability, the 1323960 is expensive as described above, and it is required to have two different films of the solder film and the resin film on the wiring substrate, which is troublesome in handling. 【0007】
若是在銅端子的表面印刷無敍的銲料膏以形 成銲料層的方法，則難以產生錫的金屬鬚而且廉 價，但是銲料膏容易因熔化而在厚度上產生不均 一。又’利用銲料膏形成的銲料層係變得比電鍍皮 膜還厚。而從連接器的共用化觀點，有必要成為與 電鍍皮膜的端子厚度相同的方式來形成銲料層，但 是當要將銲料膏的厚度印薄時，在熔化時，因為銲 料會熔化擴散而產生不均，故，以往要形成薄且厚 度均一之銲料層是很困難的。 【0008】 於是，本發明之目的在於提供一種連接器接續 用端子的製造方法，係於連#器接續用$子上印刷If a solder paste is printed on the surface of a copper terminal to form a solder layer, it is difficult to produce tin whisker and it is inexpensive, but the solder paste is liable to be uneven in thickness due to melting. Further, the solder layer formed by the solder paste is thicker than the plating film. From the viewpoint of the sharing of the connector, it is necessary to form the solder layer in the same manner as the thickness of the terminal of the plating film. However, when the thickness of the solder paste is to be thinned, the solder melts and spreads during melting. Therefore, it has been difficult to form a thin and uniform solder layer in the past. Accordingly, it is an object of the present invention to provide a method for manufacturing a connector connection terminal, which is to be printed on a connected device.
無鉛之廉價的銲料膏而形成銲料層時，可使銲料声 的厚度形成薄且均一。 曰 【解決課題之手段】 【0009】 〜本發明係、為達成上述目的而提案者，中請專利 所記載的發明係提供—種配線基板的 子係由端子之製造方法’該連接器接續用端 成且今^垃配線基板上之複數個接觸片所構 成’且該連接"續用料之終端料延長成比既 1323960 • . 定長度還長，且設置將此延長部分相互間予以連 的連結區域，在含有前述連結區域的連接器接續用 端子之表面印刷銲料膏以熔化既印刷的前述銲 膏而形成銲料預塗層，然後，再將含有前述連結區 域的延長部分切斷除去而形成既定長度。 ° 【0010】When a solder layer is formed without a lead-free inexpensive solder paste, the thickness of the solder sound can be made thin and uniform.曰 手段 本 本 【 【 【 【 【 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 0009 A plurality of contact pieces on the wiring substrate are formed and the terminal material of the continuous material is extended to be longer than the length of the 1323960 • and the extension is connected to each other. In the connection region, the solder paste is printed on the surface of the connector connection terminal including the connection region to melt the printed solder paste to form a solder pre-coat layer, and then the extension portion including the connection region is cut off and removed. Form a given length. ° [0010]
若依據此構成，連接器接續用端子之終端部 被延長成比既定長度還長，並將此延長部分相互間 予以連接而設置連結區域。當於連接器接續用端 的表面印刷銲料膏並熔化時，既熔融的銲料係以 中於面積寬廣的連結區域之方式流出，使得在^ 區域之銲料層的厚纟變厚’而在連接器接續 = 的部分，肖料層料㈣成為薄且肖一的厚产端缺 η述延長部分切斷除去而將連接器接續-用二 子形成為既定長度。 ^ 【發明效果】 【ooli】 、二贫叨係為，將連接器接續用端子的终端部延 長並設置面積寬廣的連結區域，並在印刷銲料膏 使之熔化時’使融化擴散的銲料集中於延長 ίίϊί，藉此可將端子部分之銲料層的厚度：成 :的】：：：此’可將無㈣銲料層形成與電鍍皮 膜的端子厚度相同且為均一厚度，而可防止環 8 1323960 * . 染和金屬鬚之發生 於降低成本。 ’且藉由使用廉價的材料而有助 【實施方式】 【發明最佳實施形態】 【0012】 以下，針對本發明所涉及的配線基板的連接器 接續用端子之製造方法，舉出適當的實施例來作說 明。為了達成所謂提供一種可在對連接器接續用端 子上印刷無鉛之廉價的銲料膏而形成銲料層之 際，將銲料層的厚度形成薄且均一的連接器接^ 端I之製造方法的目的’本發明係採用如下的方式 來實現，亦即，由設置在配線基板上之複數個接觸 片所構成之連接器接續用端子的終端部係延長比 既定長度還要長，並設置用以將此延長部分相互間 予以連接的連結區域，於含有前述連結區域的連接 f接續用端子之表面上印刷銲料膏，再將既印刷的 f述銲料膏熔化以形成銲料預塗層，然後，將含有 前述連_區域的延長部分切斷除去而形成既定長 度。 【實施例1】 【0013】 圖1顯示印刷配線基板1 〇，係於絕緣底材】！ 的表面設置銅箔等之導電體’接著利用蝕刻將導電 9 1323960 體不要的部分除去而形成配線圖案12，再以保護 層（cover layer) 13遮蔽著。而由複數個接觸片 14所構成的連接器接續用端子2〇係從保護層之開 口部15的一端露出並形成由鏈線所示的既定長度 L。.連接器接續用端子2〇係形成比其他配線圖案 12還寬廣。 【0014】According to this configuration, the terminal portion of the connector for the connector is extended to be longer than the predetermined length, and the extension portions are connected to each other to provide the connection region. When the solder paste is printed on the surface of the connector end and melted, the molten solder flows out in a wide area of the joint region, so that the thickness of the solder layer in the region becomes thicker and the connector is connected. In the part of =, the material layer (4) becomes thin and the thick end of the material is smeared. The extension is cut off and the connector is connected - the two are formed into a predetermined length. ^ [Effect of the Invention] [ooli] and the second barren are used to extend the terminal portion of the terminal for connector connection and to provide a wide connection area, and to melt the molten solder when the solder paste is melted. By extending the thickness of the solder layer of the terminal portion to: :::: This can form the (four) solder layer with the same thickness as the terminal of the plating film and has a uniform thickness, and can prevent the ring 8 1323960 * Dyeing and metal whiskers occur to reduce costs. [Embodiment of the Invention] [Embodiment of the Invention] [0012] Hereinafter, a method for manufacturing a connector connection terminal of a wiring board according to the present invention will be appropriately described. For example, let me explain. In order to achieve the purpose of providing a solder layer which is capable of printing a lead-free solder paste on a connector connection terminal, the thickness of the solder layer is formed into a thin and uniform connector terminal I. The present invention is achieved in such a manner that the terminal portion of the connector connecting terminal formed by the plurality of contact pieces provided on the wiring substrate is extended longer than a predetermined length, and is provided to be used for a connection region in which the extension portions are connected to each other, a solder paste is printed on the surface of the connection terminal for the connection f including the connection region, and the solder paste which is printed is melted to form a solder pre-coat layer, and then the foregoing The extended portion of the continuous region is cut and removed to form a predetermined length. [Embodiment 1] [0013] Fig. 1 shows a printed wiring board 1 〇, which is attached to an insulating substrate]! The surface of the conductor is provided with a conductor such as copper foil. Then, a portion of the conductor 9 1323 960 is removed by etching to form a wiring pattern 12, which is shielded by a cover layer 13. On the other hand, the connector connecting terminal 2 composed of a plurality of contact pieces 14 is exposed from one end of the opening portion 15 of the protective layer to form a predetermined length L indicated by a chain line. The connector connection terminal 2 is formed to be wider than the other wiring patterns 12. [0014]
連接器接續用端子2〇之終端部被延長超過前 述既定長度L，此延長部分2】也可被收納於保護 層之開口部15内，圖示例中，延長部分2】係超過 開口部15的他端而被形成在保護層13的下面。此 外，設置有將此延長部分2丨彼此間予以接續用的 連結區域22。 【0015】 圖2顯示既於前述印刷配線基板1 〇之保護層 的開口部15印刷銲料膏16之後的狀態，銲料^ 16·不僅是對連接器接續用端子2〇之既定長度[的 部分，而是對接觸片】4之相互間以及包含有連結 區域22.的延長部分21全體一起進行印刷。 【0016】 圖3顯示熔化後的狀態，導電體以外的部分之 銲料膏16被加熱熔融而流入導電體的表面〔二 冷卻硬化之後形成銲料預塗層17。通常， 塗層〗7係於導電趙的表面全體上形成均一的= 10 1323960 • . 度’如同圖示般’含有前述連結區域22的延長部 分21之面積因為比連接器接續用端子2〇的接觸^ 14之面積還大，所以既形成於含有連結區域22的 延長部分21上的銲料預塗層17之厚度變厚，而連 接器接續用端子20的接觸片14上形成厚度薄且為 均一厚度之銲料預塗層17。 【00]7】The terminal portion of the connector connection terminal 2 is extended beyond the predetermined length L, and the extension portion 2 can be housed in the opening 15 of the protective layer. In the illustrated example, the extension portion 2 exceeds the opening portion 15 The other end is formed under the protective layer 13. Further, a connecting region 22 for connecting the extended portions 2 to each other is provided. [0015] FIG. 2 shows a state after the solder paste 16 is printed on the opening 15 of the protective layer of the printed wiring board 1A, and the solder is not only a predetermined length of the connector terminal 2; Instead, the contact sheets 4 are printed together with each other and the entire extension 21 including the connection region 22. Fig. 3 shows a state after melting, in which a portion of the solder paste 16 other than the conductor is heated and melted to flow into the surface of the conductor (two types of solder precoat layer 17 are formed after cooling hardening). In general, the coating layer 7 forms a uniform on the entire surface of the conductive film = 10 1323960. The degree 'as shown in the figure' contains the area of the extension portion 21 of the aforementioned joint region 22 because it is larger than the terminal 2 of the connector. Since the area of the contact 14 is large, the thickness of the solder precoat layer 17 formed on the extended portion 21 including the connection region 22 is thickened, and the contact piece 14 of the connector connection terminal 20 is formed to be thin and uniform. A solder pre-coating of thickness 17. [00] 7]
在以往，就算是想薄薄地印刷銲料膏以形成薄 的銲料預塗層，也會因為銲料熔化擴散而產生不 均，無法形成均一厚度之銲料預塗層，但是如同上 述那樣，藉由事先形成包含有大面積的連結區域 22之延長部分2卜可在連接器接續用端子20的接 觸片14上形成薄且均一厚度的預塗層17。 【0018】In the past, even if it is intended to print a solder paste thinly to form a thin solder pre-coat layer, unevenness may occur due to melting and diffusion of the solder, and a solder precoat layer having a uniform thickness cannot be formed, but as described above, by forming in advance The extension portion 2 including the large-area connection region 22 can form a thin and uniform thickness of the precoat layer 17 on the contact piece 14 of the connector connection terminal 20. [0018]
八接著，切斷圖4的鏈線所示之既定長度]l的部 刀再除去包含連結區域22的延長部分21。如此 來’如圖5所示般，係在印刷配線基板】〇上形 成由複數個接觸片14所構之 【0019】 如此’在前述連接器接續用端子20之表面 ，無乱的轉料膏】6進行印刷及熔化而形 厚度溥且為均—厘痒# # ^ .Ε 与度的鋅料預塗層】7，所以防止 金屬鬚之發生戎提ρ、_ .九 ^ $ 4i兄5染’且能廉價地製造連接器 11 1323960 • « 接續用端子20。 【0020】 又’相較於施作純錫或錫系合金的電鑛之方 法’本發明在印刷配線基板10並不需要銲料皮膜 與樹脂皮膜之不同的2個皮膜，處理係被簡化。實 驗的結果，前述銲料預塗層17之厚度為5〜6/zm， 且成為與在施作錢鎳之後再施作錢金時的皮膜之 合計厚度（3〜5ym)略近似的厚度。因此，本發 明之連接器接續用端子20係可實現與在施作鑛錄 之後再施作鍍金的皮膜之連接器接續用端子同等 的特性。 【0021 】 此外’本發明可在未逸脫本發明精神之情況下 進行各種改變，而且’本發明理所當然可及於該改 變者。 【圖式簡單說明】 【0022】 【圖1】·係表示本發明所涉及的連接器接續用端子 之製造過程的說明圖。 【圖2】係表示本發明所涉及的連接器接續用端子 之製造過程的說明圖。 【圖3】係表示本發明所涉及的連接器接續用端子 之製造過程的說明圖。 12 1323960 « · . 【圖4】係表示本發明 之製造過程的說明圖。 所涉及的連接器接續 用蠕子 【圖5】係表示本發明所涉及的連接器接續用端子 之製造過程的說明圖。Eighth, the cutter having the predetermined length]1 shown by the chain line of Fig. 4 is cut to remove the extended portion 21 including the joint region 22. Thus, as shown in FIG. 5, a plurality of contact pieces 14 are formed on the printed wiring board 〇 [0019] so that the surface of the connector terminal 20 is not chaotic. 】 6 printing and melting and the thickness of the shape is 均- 痒 # # # ^ ^ Ε 度 的 锌 锌 】 】 】 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 金属 金属Dyeing and manufacturing connectors 11 1323960 at a low cost • « Terminal 20 for connection. Further, in the present invention, the two films which are different from the resin film are not required in the printed wiring board 10, and the processing system is simplified. As a result of the experiment, the thickness of the solder precoat layer 17 was 5 to 6 / zm, and it was a thickness slightly similar to the total thickness (3 to 5 μm) of the film when gold was applied as a nickel. Therefore, the connector connecting terminal 20 of the present invention can achieve the same characteristics as the connector connecting terminal for applying the gold plating film after the mineral recording. [0021] Further, the present invention can be variously modified without departing from the spirit of the invention, and the present invention is of course applicable to the modification. [Brief Description of the Drawings] [0022] Fig. 1 is an explanatory view showing a manufacturing process of a connector connection terminal according to the present invention. Fig. 2 is an explanatory view showing a manufacturing process of the connector connecting terminal according to the present invention. Fig. 3 is an explanatory view showing a manufacturing process of the connector connection terminal according to the present invention. 12 1323960 « Figure 4] is an explanatory view showing a manufacturing process of the present invention. CONNECTION OF CONNECTION CONNECTION RELATED TO THE CONNECTOR OF THE CONNECTOR FOR THE CONNECTION OF THE CONNECTOR FOR THE CONNECTION OF THE CONNECTOR RELATED TO THE CONNECTION.
【主要元件符號說明】 【0023】[Main component symbol description] [0023]
10 11 12 13 14 15 16 17 20 21 22 L.. 印刷配線基板 絕緣底材 配線圖案 保護層 接觸片 開口部 銲料膏 銲料預塗層 連接器接續用端子 延長部分 連結區域 既定長度 1310 11 12 13 14 15 16 17 20 21 22 L.. Printed wiring board Insulation substrate Wiring pattern Protective layer Contact piece Opening part Solder paste Solder pre-coat Connector connection terminal Extension part Connection area Setting length 13
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006223496A JP4786461B2 (en) | 2006-08-18 | 2006-08-18 | Method for manufacturing terminal for connecting connector of wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200812162A TW200812162A (en) | 2008-03-01 |
| TWI323960B true TWI323960B (en) | 2010-04-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96119626A TW200812162A (en) | 2006-08-18 | 2007-06-01 | Manufacturing method of connector connecting terminal of wiring board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4786461B2 (en) |
| CN (1) | CN101128089B (en) |
| TW (1) | TW200812162A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5624392B2 (en) * | 2010-07-13 | 2014-11-12 | 株式会社東芝 | Induction heating cooker |
| JP2013094836A (en) * | 2011-11-02 | 2013-05-20 | Mitsubishi Materials Corp | Solder paste for precoat and method of manufacturing the same |
| JP5968514B1 (en) * | 2015-11-05 | 2016-08-10 | 株式会社フジクラ | Printed wiring board |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5446247A (en) * | 1993-11-19 | 1995-08-29 | Motorola, Inc. | Electrical contact and method for making an electrical contact |
| JP2705675B2 (en) * | 1995-11-07 | 1998-01-28 | 日本電気株式会社 | Manufacturing method of printed wiring board |
| JPH10242629A (en) * | 1997-02-26 | 1998-09-11 | Oki Electric Ind Co Ltd | Printed circuit board and its manufacture |
| US6047637A (en) * | 1999-06-17 | 2000-04-11 | Fujitsu Limited | Method of paste printing using stencil and masking layer |
| JP2002184546A (en) * | 2000-12-13 | 2002-06-28 | Japan Aviation Electronics Industry Ltd | Manufacturing method of electric connection member and electric connection member |
| CN1148849C (en) * | 2000-12-23 | 2004-05-05 | 富士康(昆山)电脑接插件有限公司 | Manufacture of electric connector |
-
2006
- 2006-08-18 JP JP2006223496A patent/JP4786461B2/en not_active Expired - Fee Related
-
2007
- 2007-06-01 TW TW96119626A patent/TW200812162A/en not_active IP Right Cessation
- 2007-06-22 CN CN2007101067884A patent/CN101128089B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP4786461B2 (en) | 2011-10-05 |
| CN101128089B (en) | 2011-04-20 |
| JP2008047471A (en) | 2008-02-28 |
| CN101128089A (en) | 2008-02-20 |
| TW200812162A (en) | 2008-03-01 |
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| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |