1J2J148 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種高瓦數細線路載板之製法及其結 構，尤其係指一種可供LED封裝使用並具有優異散熱 之高瓦數細線路載板之製法及其結構。 【先前技術】 發光二極體（LED)因具有體積小、高亮度、低耗電以 及低發熱之優點，因此大量被應用在目前朝向小體積精 緻化發展的電子產品上，然而雖然LED具有上述之優點， 但疋LED卻存在不耐高溫的缺點，原因在於LED的封裝材 多係塑化材質，-纟LED的溫度升高，很容^對基板線路 及封裝材造成不良影響，嚴重時甚至會導致LED的損壞。 目前既有之LED封裝用載板多係使用BT載板，即雙 貭丁稀一@义醯亞胺樹脂（Bismaieimide Triazine Resir〇 載板，其玻璃轉移溫度（1^)在18〇π 〜19〇<>c之間，但是目 刖BT載板用作LED封裝載板時，其多不具有任何的散熱 結構，故為了避免LED在配合其他電子元件運作時，因為 八他電子元件所產生之溫度轉移導致蓄熱效應造成[ED之 扣壞，多需要搭配體積較大的散熱裝置，但如此一來，LED 體積小的優點便受到侷限而無法充分的發揮，故如果⑽ 的載板本身可具有優異的散熱結構，便可以讓之優點 發揮到淋漓盡致》 【發明内容】 本發明人有鑑於上述既有LED封裝載板之問題，乃積 5 ⑽148 _著手從事研究開發’以期可改進上述既 經過不斷的試驗及努力， 有結構之問題， 方力，终於開發出本發明。 ▲，月之主要目的在於提供一種 南瓦數細線路載板之製法及其結構。 優"政熱效果的 為了達到上述發明目的，本發 段予以達成，1中太袼.. ’、木取以下之技術手 違成，、中本發明之製法係包括下述 于 銅基材鍍鎳步驟，係於一銅基 载體的鎳載體層； 一側電鍍有作為 乾膜設置步驟，存立柏A u β 冗係在銅基材異於鎳載 一層乾膜； «〈力則β又置 第一次曝光顯影步驟，係在上述乾膜上進行影像轉 膜. 又置後述導熱絕緣膠的位置留下乾 保護錫層電鍍步驟，係在銅基材 ?膜間電鍍作為保 S隻銅基材之保護錫層； 蝕刻及剝錫步驟，利用蚀刻方法將具有乾膜之部位連 同銅基材去除以形成穿孔，之後再將保護錫層去除，僅留 下形成有穿孔的銅基材； 導熱絕緣膠填充設置步驟，於銅基材異於鎳載體層之 另側設置導熱絕緣膠以形成導熱絕緣膠層，該導熱絕緣膠 並會填充至鋼基材之穿孔中； 銅層壓合及開孔步驟，在上述導熱絕緣膠層上壓合一 銅層’利用雷射鑽孔方法在銅基材上方之銅層及導熱絕緣 膠層上開設窗孔，· 6 金屬線路層及乾膜兮署牛g取 . 鋼層上設置一，金二= 銅基材及其上方之 膜； 屬線路層’並於金屬線路層上設置乾 :欠曝光顯影步驟，係在金屬線路層的乾膜 _ 4像轉移，僅在金屬線 、進仃 乾膜. 母I硌層上仅形成線路間距的位置留下 保護錫層電鐘步驟，係在金屬線路層之乾膜間電鑛作 马保護金屬線路層之保護錫層； 餘刻及剥錫步驟，利用钱刻方法將具有乾膜之部位連 :金屬線路層及銅層去除以形成間距’之後再將保護錫層 除，僅留下形成有間距的金屬線路層，· 錄載肢層去除步驟，將作為載體之錦载體層剝除即為 成品。 藉由上述的製程，本發明可使得作為LED載板之銅基 2上具有導熱效果極佳的導熱絕緣膠，故可避免LED載板 與其他電子元件使用時’因為蓄熱效應無法散熱而導致LED 元件的損壞。 【貫施方式】 清參看第一圖所示，此為本發明之流程圖，本發明主 要係於銅基材上形成穿1’並於穿孔中設置耐高溫、耐酸 〃同導熱效果之導熱絕緣膠，再於銅基材上形成線路 層0 本發明之詳細流程步驟係包括有： 銅基材鍍鎳步驟，係於一銅基材板（1 0 )之一側電 丄切148 錢有作為載體的鎳載體層（11); 乾膜設置步驟，係在銅基材（i◦)異於鎳裁體層（1 1 )之另側設置一層乾膜（i 2 ); 互第一次曝光顯影步驟，係在上述乾膜（工2)上進行 -像轉移，僅在銅基材（1 〇)上欲設置後述導熱絕緣滕 (1 5 )的位置留下乾膜（工2 );1J2J148 IX. Description of the Invention: [Technical Field] The present invention relates to a method for fabricating a high-wattage fine-line carrier and its structure, and more particularly to a high-wattage fine line for use in an LED package and having excellent heat dissipation The method of making the carrier and its structure. [Prior Art] Since the light-emitting diode (LED) has the advantages of small size, high brightness, low power consumption, and low heat generation, it is widely used in electronic products that are currently moving toward small-volume refinement, although LEDs have the above-mentioned The advantages, but the LED has the disadvantage of not being able to withstand high temperature. The reason is that the LED packaging material is mostly plasticized material, and the temperature of the LED is increased, which is very difficult to cause adverse effects on the substrate circuit and the packaging material. Will cause damage to the LED. At present, the existing LED package carrier board uses BT carrier board, that is, Bismuthimide Triazine Resir〇, its glass transition temperature (1^) is 18〇π~19 Between <>c, but when the BT carrier is used as an LED package carrier, it does not have any heat dissipation structure, so in order to avoid the LED in cooperation with other electronic components, because of the eight electronic components The resulting temperature transfer causes the heat storage effect to be [defective to the ED, and more needs to be combined with a larger heat sink. However, the advantage of the small size of the LED is limited and cannot be fully utilized, so if the carrier of the (10) itself The invention has the advantages of excellent heat dissipation structure, and the advantages thereof can be fully realized. [Inventors] In view of the above problems of the existing LED package carrier board, the present inventors have accumulated 5 (10) 148 _ proceeding in research and development to improve the above After continuous trials and efforts, structural problems, Fang Li, finally developed the invention. ▲, the main purpose of the month is to provide a Nanwa number fine line carrier plate and its structure In order to achieve the above-mentioned inventions, the present invention is achieved in the first paragraph, and the following technical methods are violated. The nickel plating step is carried out on a nickel-based carrier layer of a copper-based carrier; one side is plated with a dry film setting step, and the deposited cypress A u β is a dry film on the copper substrate different from the nickel substrate; And a first exposure and development step is performed on the dry film to perform image transfer film. The position of the thermal conductive adhesive is further described as leaving a dry protective tin layer plating step, and plating is performed between the copper substrate and the film. a protective tin layer of the copper substrate; an etching and stripping step, the portion having the dry film is removed together with the copper substrate by an etching method to form a perforation, and then the protective tin layer is removed, leaving only the copper substrate having the perforated surface a thermally conductive insulating filler filling step of disposing a thermally conductive insulating adhesive on the other side of the copper substrate different from the nickel carrier layer to form a thermally conductive insulating layer which is filled into the perforations of the steel substrate; And the opening step, in the above guide Pressing a copper layer on the insulating layer to create a window hole on the copper layer and the thermal conductive insulating layer above the copper substrate by laser drilling method, 6 metal circuit layer and dry film 牛 牛 取. Set one, gold two = copper substrate and the film above it; belong to the circuit layer 'and set the dry on the metal circuit layer: underexposure development step, the dry film in the metal circuit layer _ 4 image transfer, only in the metal Line, 仃 dry film. The position of the line spacing on the mother I 硌 layer leaves the step of protecting the tin layer electric clock, which is the protective tin layer of the protective metal layer of the horse in the dry film of the metal circuit layer; Engraving and stripping steps, using the money engraving method to connect the parts with dry film: the metal circuit layer and the copper layer are removed to form the pitch', and then the protective tin layer is removed, leaving only the metal circuit layer with the spacing formed. In the step of removing the limb layer, the stripped carrier layer as a carrier is removed into a finished product. According to the above process, the invention can make the copper base 2 as the LED carrier plate have the thermal conductive adhesive with excellent heat conduction effect, so that the LED carrier board and other electronic components can be avoided when the LED is not used due to the heat storage effect. Damage to components. [Comprehensive method] As shown in the first figure, this is a flow chart of the present invention. The present invention mainly relates to forming a heat-insulating insulating layer which is formed on a copper substrate and which is provided with a high temperature resistance, acid resistance and heat conduction effect. The glue and the circuit layer are formed on the copper substrate. The detailed process steps of the present invention include: a copper substrate nickel plating step, which is performed on one side of a copper substrate board (10). a nickel carrier layer (11) of the carrier; a dry film setting step of disposing a dry film (i 2 ) on the other side of the copper substrate (I 1 ) different from the nickel layer (1 1 ); The step of performing the image transfer on the dry film (Work 2), leaving a dry film only on the copper substrate (1 〇) where the thermal conductive insulation (1 5 ) to be described later is left;
保護錫層電鍍步驟，係在銅基材（i 〇 )之乾膜（1 2 )間電鍍作為保護銅基材（i 〇 )之保護錫層（1 3 ); 蝕刻及剝錫步驟，利用蝕刻方法將具有乾膜（1 2 ) 之部位連同銅基材（1〇)去除以形成穿孔（1、4)，之 後再將保護錫層（1 3 )去除，僅留下形成有穿孔（i 4 ) 的銅基材（1 〇 ); 導熱絕緣膠填充設置步驟，於銅基材（1 〇 )異於錄 載體層（1 之另側設置導熱絕緣膠以形成導熱絕緣膠 層（1 5)忒導熱絕緣膠並會填充至銅基材（1 〇)之 穿孔（1 4 )中； ’在上述導熱絕緣膠層（1 5 ) 利用雷射鑽孔方法在銅基材（1 銅層壓合及開孔步驟 上壓合一鋼層（16)， 〇 )上 銅層（1 6 )及導熱絕緣膠層（1 5 )上開設 窗孔（1 7 ); 金屬線路層及乾膜 其上方之銅層 銅金屬層之金屬線路層 上設置乾膜（1 9 ); 設置步驟，係於銅基材（1 0 )及 及窗孔（1 7 )上設置一層較佳為 (18) ’並於金屬線路層（18) 8 1323148The protective tin layer plating step is performed by plating a protective tin layer (1 3 ) between the dry film (1 2 ) of the copper substrate (i 〇) as a protective copper substrate (i 〇); etching and stripping steps, using etching The method removes the portion having the dry film (1 2 ) together with the copper substrate (1〇) to form the perforations (1, 4), and then removes the protective tin layer (13), leaving only the perforations formed (i 4 Copper substrate (1 〇); thermal insulation rubber filling setting step, the copper substrate (1 〇) is different from the recording carrier layer (the other side of the 1 is provided with thermal conductive adhesive to form a thermal conductive adhesive layer (1 5)忒The thermal conductive adhesive is filled into the perforation (1 4 ) of the copper substrate (1 ;); 'The above thermal conductive adhesive layer (15) is laser-drilled in a copper substrate (1 copper laminate and Opening a steel layer (16), 〇) a copper layer (16) and a thermal insulating layer (15) to open a window hole (17); a metal circuit layer and a copper film above the dry film a dry film (1 9 ) is disposed on the metal circuit layer of the copper metal layer; and the setting step is to set a layer (18) on the copper substrate (10) and the window hole (17) Metal wiring layer (18) 81323148
第二次曝光顯影步羯，係在金制路 膜（19)上進行影像轉移，僅在金屬線（ 欲形成線路間距（2 0)的位置留下乾膜 保護錫層錢步驟，係在金I線路層 9 8 ) 之保 (1 9 )間電鑛作為保護金屬線路層（1 (21); 蚀刻及剝❹驟，利耗刻方法將具 之部位連同金屬線路層（丄8 )及鋼層 6獏（ 成間距（2 〇 )，之後再將保護錫層（2 1 )去 下形成有間距（2 〇 )的金屬線路層（丄8 )去除 鎳載體層去除步驟，將作為 ， 剝除即為成品。 載體之錄裁體層（ )的乾 8 )上 » 之乾犋 護鎮層 除以形 ’僅留 本發明高瓦數細線路載板之結構主要 (1 0 )及設置於銅基材（i 〇 )上之 ’、匕括有鋼基材 其中銅基材（i ◦)上形成有穿孔（：路層（1 8 ) ’ 、丄 4)，穿ri/、 中及銅基材（1 〇)與金屬線路層The second exposure development step is performed on the gold road film (19) for image transfer, leaving only the metal wire (the step of forming a line gap (20) to leave the dry film protection tin layer, in gold I line layer 9 8 ) (1 9 ) between the electric ore as a protective metal circuit layer (1 (21); etching and stripping, the method of profit and loss will be combined with the metal circuit layer (丄8) and steel Layer 6貘 (separated by (2 〇), then the protective tin layer (2 1 ) is removed to form a metal wiring layer (丄8) with a pitch (2 〇) to remove the nickel carrier layer removal step, which will be stripped That is, the finished product. The carrier of the carrier layer ( ) is dry 8) on the » dry 犋 镇 除 除 除 除 ' ' ' ' ' ' ' ' ' 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高 高On the material (i 〇), a steel substrate is included, in which a copper substrate (i ◦) is formed with perforations (: road layer (1 8 ) ', 丄 4), through ri/, medium and copper substrate (1 〇) with metal circuit layer
士策私紹β 8 )之間填充設置 有導熱絕緣層（膠）（1 5 ) » 【圖式簡單說明】 第一圖係本發明之製法流程示意圖。 【主要元件符號說明】 (1 〇)銅基材 (12) 乾膜 (13) 保護錫層 9 1323148 (1 4 )穿孔 (1 5 )導熱絕緣膠層 (16)銅層 (1 7 )窗孔 _ ( 1 8 )金屬線路層 (1 9 )乾膜 (2 0 )間距 (21)保護錫層 • 10The filling between the stipulations of β 8 ) is provided with a thermal insulating layer (glue) (1 5 ) » [Simplified description of the drawings] The first figure is a schematic diagram of the process of the invention. [Main component symbol description] (1 〇) copper substrate (12) dry film (13) protective tin layer 9 1323148 (1 4) perforated (1 5) thermal conductive adhesive layer (16) copper layer (1 7) window hole _ ( 1 8 ) metal circuit layer (1 9 ) dry film (20) pitch (21) protective tin layer • 10