1322737 九、發明說明： 【發明所屬之技術領域】 本發明係有關—種可於A氣環境下接合喊/金屬之低溫 軟銲填料’其兼具可在A氣環境下直接進行接合，以及可對陶 ... 瓷/難潤濕金屬進行接合等優點。 【先前技術】 陶兗結構，乡是崎子鍵、聽鍵_者並存的鍵 • 結’由於其通常具有穩定的電子配位，因此-般的金屬填料很 難在陶絲面上顧。縣要接合多採關接的硬鲜接 合方式，在此簡稱為「間接硬焊法」。亦即陶£在接合之前， 其表面需預先施以金屬化處理，然後再以傳統金屬硬鐸方式接 .· 合’常用以陶竟金屬化的方法有翻-猛法、物理氣相沉積 ⑽）、化學氣相沉積(_、熱噴塗、無電電鍍或離子注入等 方式。 » 因此’習知的「間接硬焊法」之缺點為：其表面需預先施 Μ錢化處理，紐私舰金屬硬銲方錢合，過程十分麻 煩，且成本高。 近來開發ϋί㈣性金屬填料直接進行喊硬銲接合此種 直接硬銲接合法或稱活性硬銲，在此簡稱為「直接硬焊法」。 由於此直接硬銲法是_填充金射所財騎性元素可促 使陶兗與其產生反應，因此陶竞表面可不需先經金屬化處理直 接進行接。，使陶竟接合得以如同金屬以單一製程完成。大多 5 I • 1322737 數被廣泛應用的陶瓷活性硬銲填料多是以銀、鎳、銅、金、鉑、 鈀等合金中添加約2至4%的鈦(Ti)、錯(Zr)、鈮(Nb)或姶(Hf) 等活性金屬配製而成。 然而，習用的「直接硬焊法」仍會產生以下問題： [1]無法在大氣環境下進行接合。習用接合法固然開發出 以活性金屬填料直接進行陶£硬銲接合，但是，這些填料炼點 都在7GG°C以上，製程不僅需要高溫，同時要避免填料的氧化， 接合使用時需要在“真空”或“賴氣氛”下才得以進行，並 無法在大氣環境下進行接合。 [2]使用範圍有限且成本高。習用填料炫點都在·t以 上使知製私所需之设備、時間等之成本增加。無法使用於需 低溫接合的光電產品，使用範圍有限。 因此，有必要研發新技術，以解決上述缺點。 【發明内容】 本毛明之主要目的’在於提供—種可於大氣環境下接合陶 兗/金屬之低溫軟銲鋪，其可在錢環境下直接進行接合。 本發明之-欠-目的，姐提供—種可敎氣魏下接合陶 变/金屬之低溫軟銲補，其可對難麵金屬進行接合。 種可於大氣環境下接合陶瓷/金屬之低溫 本發明係提供一 軟銲填料，其包括： 一活性物’係為鎂，其重量百分比係介於Q. _至㈣; 一金屬基材，係選自錫、銦其中之至少一項； 6 藉此’該低溫軟銲填料之熔化溫度係介於叨它至232=， 且可在大氣環境下進行接合。 本發明之上述目的與優點，不難從下述所選用實施例之詳 細說明與附圖中，獲得深入瞭解。 茲以下列實施例並配合圖式詳細說明本發明於後·· 【實施方式】 本發明係為—種『可於域環境下接合喊/金屬之低溫 軟鲜填料』’其係可於大氣環境下直接接合H或其他難潤濕 金屬之軟銲填料。 如第一、第二及第三圖所示，該低溫軟銲填料1〇之第一 實施例係包括： 一活性物，係為鎮，其重量百分比係介於O.lw戲5wt%; -金屬基材’係選自錫、銦其中之至少一項；藉此，該低 溫軟鮮填料1G之熔化溫㈣介於阶至2耽，且可在大氣 環境下進行接合。 如此為本發明之可於錢環境下接合魄/金屬之低溫軟 銲填料。 另外，該低溫軟銲填料10又包括一添加物，其係選自銀、 銅、辞、錯、Μ之至少一項。 進一步來講，當該活性物（即錤）之重量百分比介於〇lwt% 至5wt% ;且該金屬基材為錫的條件下： 該添加物至少具有下列數種比例組合： 1322737 [1 ]銀 0. 5wt%至 5wt%。 [2] 銀 0. 5wt%至 5wt% ;以及銅 〇. lwt%至 2wt%。 [3] 鉍 10wt%至 60wt%。 [4] 銅 〇. lwt%至 2wt%。 [5] 錯 10wt%至 50wt%。 [6] 鋅 lwt%至 15wt%。 而當該活性物（即鎂）之重量百分比介於〇. lwt%至5wt% ; 且該金屬基材為銦： 該添加物可再有至少下列數種比例組合： [7] 銀 0. 5wt%至 5wt%。 [8] 銀 0. 5wt%至 5wt% ;以及銅 〇. lwt%至 2wt%。 [9] 銅 0. lwt%至 2wt%。 [10] 鋅 lwt%至 15wt%。 另外’該低溫軟銲填料10之第二實施例係包括：錫3〇wt% 至60wt%、鎂0· lwt%至5wt%，其餘為銦。 而該低溫軟銲填料10之第三實施例則包括：錫l〇wt%至 30wt%、鉍 l〇wt% 至 4〇wt%、鎂 〇.lwt% 至 5wt%，其餘為銦。 本發明之低溫軟焊填料10之所以可於大氣環境下，直接 將第被接合物20及一第二被接合物3〇接合，原理是於錫 或銦金屬（脚金屬基材）中添加適當比例的鎂元素使其與活 化之第-、第二被接合物2〇與3Q表面反應而建立鍵結。 8 該第一接合物20具有一第一被接合面21，而該第二接合 物30具有一第二被接合面31，該低溫軟銲填料10係位於該 第一、第二接合面21與31之間。 該第一被接合物20係選自陶瓷、金屬其中之一種； 該第二被接合物30係選自陶瓷、金屬其中之一種。 又’本發明之低溫軟銲填料1〇是利用真空熔煉方式，將 各種合金元素依預定之重量百分比配製而成。 實務上，可用例如AZ31、AZ61或AZ91等型號之錢合金取 代純鎂材質；可提升熔煉之安全性並能增進合金強度使接合使 用性提高。 而本發明之軟銲接合溫度以合姐化溫度以上約2〇 3〇t>c 為最佳’至於本發明之合金填料炼點係介於6()。〇至2腕之 間並可依實際作業溫度範圍自訂調整。 由於活性的鎂元素添加於銲錫合金（即低溫軟悍填料）内 可增進鮮錫與接合基材的反應性，使得陶究或其它難潤濕金 屬材料能於低溫錢環境下達成有效接合。接合過程可以完全 不使用助銲劑。 如第四騎7F ’级本剌之低财料料 接合陶竞/金屬之方法，係如下述步驟： ^兄下 ⑴預備轉4!:细真空職枝 性物及金屬基材依敢之重量 料備之活 炼煉成低溫軟焊填料 1322737 10(參閱第一及第三圖）。 [2] 活化步驟42 :利用“機械活化，，方式促使低溫軟焊 填料10於第一、第二被接合物2〇與3〇的表面潤濕；而得以 去除該低溫軟焊填料10表面氧化層，並促進該低溫軟焊填料 10和該第一、第二被接合物2〇與30間產生反應。 [3] 接合步驟43 :完成以低溫軟焊填料1〇接合該第一、 第二被接合物20與30。 實務上，於該預備步驟41中，該低溫軟焊填料之熔煉溫 度，係以合金熔化溫度以上約為最佳（例如介於6(rc 至230°C之間）。 於該活化步驟42中，係利用刮刀/電烙鐵攪動熔融之低溫 軟銲填料10使其活化；亦可以超音波震盪/接合材料相互摩擦 使其活化。 參閱附件一之第A圖，係本發明於實際實驗過程中之s系 列（如第一圖）銲錫合金接合氧化鋁，其接合剪應力強度可達1 MPa’又如附件一之第B圖所示，係本發明之ISB系列（參閱第 一圖）辉踢合金接合氧化鋁/銅，其接合剪應力強度可達 5. IMPa，再如附件一之第c圖所示，則為本發明於實際實驗過 程中之ί系列（參閱第一圖）銲錫合金接合氧化銦（Indium Tin Oxide ’間稱IT〇)對銅之具體實施例，其接合剪應力強度可達 3· 4MPa。 综上所述’本發明之優點及功效可歸納為·· [1] 可在大氣環境下直接進行接合。本發明之低溫軟焊填 料之炫化溫度係介於60°c至232°C ’可直接在大氣環境下用以 進行接合，相當方便。 [2] 可對陶究/難潤濕金屬進行接合。本發明之低溫軟焊 填料係於錫或姻金屬中添加適當比例的鎖元素，使其與活化之 陶瓷/難潤濕金屬的表面反應而建立鍵結，使得陶瓷或難潤濕 金屬材料能於低溫大氣環境下達成有效接合；且接合過程可以 完全不使用助銲劑。 [3] 應用範圍廣泛。本發明之低溫軟焊填料之熔化溫度介 於60 C至232°C，且接合過程完全不使用助銲劑，故可廣泛應 用於陶究、難以潤濕之金屬，以及光電材料等之接*，不會傷 及成品。 以上僅疋藉由較佳實施例詳細說明本發明，對於該實施例 所做的任何鮮修改與變化，料脫離本發明之精神與範圍。 由以上詳細說明，可使熟知本項技藝者明瞭本發明的確可 達成刖述目的’實已符合專觀之規定，紐出發料利申請。1322737 IX. Description of the invention: [Technical field of the invention] The present invention relates to a low-temperature soldering filler capable of joining shouting/metal in an A gas environment, which can be directly bonded in an A gas environment, and The advantages of ceramics/hard to wet metals. [Prior Art] The structure of the pottery is the key to the coexistence of the scorpion and the key. The knot is difficult to be seen on the ceramic tile because it usually has a stable electronic coordination. The county is required to engage in a combination of hard and fresh joints, which is referred to herein as the “indirect brazing method”. That is to say, before the jointing, the surface of the pottery should be pre-applied with metallization, and then it can be connected by a traditional metal hard raft. The method used in the metallization of the pottery has the method of turning-bursting, physical vapor deposition (10) ), chemical vapor deposition (_, thermal spraying, electroless plating or ion implantation). Therefore, the shortcomings of the 'indirect brazing method' are: the surface needs to be pre-treated, the new private ship metal The process of hard soldering is very cumbersome, and the cost is high. Recently, the development of ϋί (4) metal fillers is directly carried out by shouting hard soldering and direct hard soldering or active brazing, which is referred to herein as "direct brazing method". This direct brazing method is a chemical-energy element that can cause the pottery to react with it. Therefore, the surface of the pottery can be directly connected by metallization, so that the joint can be completed in a single process like metal. Most of the 5 I • 1322737 ceramics are widely used in ceramic active brazing fillers, such as silver, nickel, copper, gold, platinum, palladium and other alloys add about 2 to 4% of titanium (Ti), wrong (Zr),铌(Nb) or 姶(Hf), etc. However, the conventional "direct brazing method" still has the following problems: [1] It is impossible to join in the atmosphere. The conventional joining method is developed to directly perform the hard soldering with the active metal filler. However, these fillers are all above 7GG °C. The process not only requires high temperature, but also avoids the oxidation of the filler. The bonding needs to be carried out under the "vacuum" or "lying atmosphere" and cannot be carried out under atmospheric conditions. [2] The scope of use is limited and the cost is high. The cost of the conventional fillers is increased above the cost of equipment, time, etc., which cannot be used for low-temperature bonding. Therefore, it is necessary to develop new technologies to solve the above disadvantages. [Summary of the Invention] The main purpose of the present invention is to provide a low-temperature soldering station that can bond ceramics/metals in an atmospheric environment, which can be used in a money environment. Direct bonding. The invention----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- The present invention provides a solder filler comprising: an active material is magnesium, and the weight percentage thereof is between Q. _ to (4); a metal substrate Is selected from at least one of tin and indium; 6 whereby the melting temperature of the low-temperature solder filler is between 叨 and 232 =, and can be joined under atmospheric conditions. The above objects and advantages of the present invention The present invention will be described in detail in the following detailed description of the embodiments of the invention and the accompanying drawings. It can be combined with shouting/metal low temperature soft fresh filler in a regional environment. 'It can directly bond H or other hard-wetting metal soft soldering filler in the atmosphere. As shown in the first, second and third figures, The first embodiment of the low-temperature soldering filler 1 includes: an active material, which is a town, and the weight percentage thereof is 5% by weight of O.lw; - the metal substrate is selected from at least tin and indium. One; thereby, the melting temperature of the low temperature soft fresh filler 1G (4) 2 in order to delay, and the joining may be carried out under atmospheric conditions. Thus, the low-temperature solder filler of the present invention can be joined to a niobium/metal in a money environment. In addition, the low-temperature solder filler 10 further includes an additive selected from at least one of silver, copper, sine, sham, and samarium. Further, when the weight percentage of the active material (ie, cerium) is between 〇lwt% and 5% by weight; and the metal substrate is tin: the additive has at least the following ratio combinations: 1322737 [1] Silver 0. 5wt% to 5wt%. [2] Silver 0. 5wt% to 5wt%; and copper 〇. lwt% to 2wt%. [3] 铋 10wt% to 60wt%. [4] Copper 〇. lwt% to 2wt%. [5] Wrong 10wt% to 50wt%. [6] Zinc lwt% to 15wt%. 5wt。 The weight of the active material (ie, magnesium) is between 〇. lwt% to 5wt%; and the metal substrate is indium: the additive may be combined with at least the following ratios: [7] silver 0. 5wt % to 5wt%. [8] Silver 0. 5wt% to 5wt%; and copper 〇. lwt% to 2wt%. [9] Copper 0. lwt% to 2wt%. [10] Zinc lwt% to 15wt%. Further, the second embodiment of the low-temperature solder filler 10 includes: tin 3 wt% to 60 wt%, magnesium 0 wtwt to 5 wt%, and the balance being indium. The third embodiment of the low-temperature solder filler 10 includes: tin 〇 wt% to 30 wt%, 铋 l〇 wt% to 4 〇 wt%, magnesium 〇.1 wt% to 5 wt%, and the balance being indium. The low-temperature solder filler 10 of the present invention can directly bond the first object to be joined 20 and the second object to be joined 3 in an atmosphere, and the principle is to add appropriate tin or indium metal (foot metal substrate). The proportion of magnesium element causes it to react with the activated first and second adherends 2〇 and 3Q to establish a bond. 8 The first joint 20 has a first joined surface 21, and the second joint 30 has a second joined surface 31. The low temperature solder filler 10 is located on the first and second joint surfaces 21 and Between 31. The first adherend 20 is selected from one of ceramics and metal; and the second adherend 30 is selected from one of ceramics and metals. Further, the low-temperature soldering filler 1 of the present invention is prepared by vacuum melting, and various alloying elements are prepared in accordance with a predetermined weight percentage. In practice, a pure magnesium material such as AZ31, AZ61 or AZ91 can be used to replace the pure magnesium material; the safety of the smelting can be improved and the strength of the alloy can be improved to improve the joint use. The soft soldering temperature of the present invention is preferably about 2 〇 3 〇 t > c above the combined temperature of the present invention. The alloy filler of the present invention has a refining system of 6 (). 〇 Between 2 wrists and can be customized according to the actual operating temperature range. Since the active magnesium element is added to the solder alloy (i.e., the low temperature soft enamel filler), the reactivity of the fresh tin and the bonded substrate can be improved, so that the ceramic or other difficult-to-wet metal materials can be effectively joined in a low-temperature money environment. The bonding process can be completely free of flux. For example, the fourth riding 7F 'class of the low-cost materials to join the pottery / metal method, is as follows: ^ brother (1) ready to turn 4!: fine vacuum branches and metal substrates to the weight of the dare The material is prepared and refined into low temperature soldering filler 1322737 10 (see the first and third figures). [2] Activation step 42: using "mechanical activation, the method causes the low-temperature solder filler 10 to wet on the surfaces of the first and second adherends 2〇 and 3〇; and the surface oxidation of the low-temperature solder filler 10 is removed. a layer, and promotes the reaction between the low-temperature solder filler 10 and the first and second objects 2 and 30. [3] Bonding step 43: completion of bonding the first and second portions with a low-temperature solder filler The bonded objects 20 and 30. In practice, in the preliminary step 41, the melting temperature of the low-temperature solder filler is preferably about the melting temperature of the alloy (for example, between 6 (rc and 230 ° C). In the activation step 42, the molten low-temperature solder filler 10 is agitated by a doctor blade/electric soldering iron to activate it; or the ultrasonic vibration/bonding material may be rubbed against each other to activate it. See Figure A of Annex I, Invented in the actual experimental process of the s series (as shown in the first figure) solder alloy bonded alumina, the joint shear stress strength up to 1 MPa' and as shown in Figure B of Annex I, is the ISB series of the present invention (see The first picture) Hui kick alloy bonding alumina / copper, which is connected The shear stress strength can reach 5. IMPa, as shown in the figure c of Annex I, is the series of solder alloy bonding indium oxide (Indium Tin Oxide ' between the actual experimental process of the invention (see the first figure) In the specific example of copper, the joint shear stress intensity can reach 3.4 MPa. In summary, the advantages and effects of the present invention can be summarized as follows. [1] It can be directly bonded in the atmosphere. The tempering temperature of the low-temperature soldering filler of the present invention is between 60 ° C and 232 ° C. It can be directly used in the atmosphere for bonding, and is quite convenient. [2] The ceramic/hard-to-wet metal can be joined The low temperature soldering filler of the present invention is formed by adding an appropriate proportion of a lock element to a tin or a metal to react with the surface of the activated ceramic/diffusible metal to establish a bond, so that the ceramic or the hardly wettable metal material can Effective bonding is achieved in a low-temperature atmosphere; and the bonding process can be completely free of flux. [3] The application range is wide. The melting temperature of the low-temperature soldering filler of the present invention is between 60 C and 232 ° C, and the bonding process is completely absent. Using flux, so Widely used in ceramics, metals that are difficult to wet, and optoelectronic materials, etc., without damaging the finished product. The invention has been described in detail above by way of preferred embodiments, and any modifications made to this embodiment are made. The spirit and scope of the present invention will be apparent from the above description. It will be apparent to those skilled in the art that the present invention may be made in accordance with the provisions of the present invention.