TWI321824B - Adjusting mechanism and adjusting method and semiconductor fabricating method thereof - Google Patents

Description

1321824

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . The gap region between the boat and the furnace tube makes it easy to adjust the adjustment mechanism of the boat in parallel with the furnace tube in the furnace tube, the adjustment method thereof and the wafer manufacturing method. [Prior Art]

In the semiconductor process, the furnace tube system is one of the important process machines. Furnace tubes are used to provide a high temperature environment to provide wafers for various semiconductor processes, such as thermal oxidation, diffusion, diffusion doping, pre-deposi t ion , drive-in, annealing, post-implantation Annealing, alloy heat treatment, reflow or high temperature chemical vapor deposition (CVD). The conventional furnace tube has a receiving groove and an opening for providing a high temperature sealed environment. A plurality of wafer systems are carried in the wafer boat. After the boat enters the receiving slot from the opening, the semiconductor process can be performed. At this point, the inside of the tube will be heated to the temperature required for the process and the boat will be rotated simultaneously to evenly expose the wafer. -<," However, if the boat is tilted relative to the furnace tube, the boat may hit the inner wall of the furnace tube during the rotation and entering and exiting the furnace tube to generate fine particles. In severe cases, it may also cause damage to the boat or the tube. In semiconductor manufacturing 6 1321824

Sanda number: In TW2543PA, because the circuit line width of the wafer is very small, fine particles will contaminate the wafer and cause defects in the wafer. Therefore, how to avoid the improvement of the inclination of the boat relative to the furnace tube to prevent the occurrence of the above various problems is an important issue to be solved. [Summary of the Invention]

In view of the above, an object of the present invention is to provide an adjustment mechanism, an adjustment method thereof, and a wafer manufacturing method, which utilize an adjustment jig to reduce a gap area between a boat and a furnace tube, thereby making it easier to adjust according to The gap area between the jig and the boat is adjusted in parallel with the furnace tube in the furnace tube. In this way, not only can the boat be prevented from touching the furnace tube during the rotation and entering and exiting the furnace tube, but the wafer boat or the furnace tube is damaged. It is also possible to avoid the defects of the wafer caused by the particles generated in the process of contaminating the wafer. According to one aspect of the present invention, an adjustment mechanism is provided for adjusting a boat to be disposed in parallel with a furnace tube in a furnace tube. The furnace tube has a receiving groove and an opening, the receiving groove has a first symmetrical center line, and the boat has a second symmetrical center line. When the boat is inserted into the accommodating groove through the opening, the groove wall of the accommodating groove has a first gap region between the side of the boat and the side of the boat. The adjustment mechanism includes an adjustment jig and an adjustment component. The adjustment jig is insertably inserted into the opening and has a wide portion, a narrow portion and a consistent hole. The through hole penetrates the wide portion and the narrow portion, and the narrow portion is used to plug the opening to expose the wide portion to the outside of the opening. When the boat penetrates the through hole and the opening and enters the accommodating groove, the through hole has a second gap region between the hole wall at the narrow portion and the side of the boat, and the second gap region is smaller than the first gap region. The adjusting component is used to adjust according to the second gap region 7 1321824

Sanda number: TW2543PA The entire first symmetrical center line and the second symmetrical center line are parallel to each other.

According to still another object of the present invention, an adjustment method for adjusting a boat in a furnace tube in parallel with the furnace tube is proposed. The furnace tube has an opening and a first symmetrical centerline, and the boat has a second symmetrical centerline. When the boat is inserted into the opening, the wall of the opening is separated from the side of the boat by a first gap region. First, an adjustment jig is provided. The adjustment jig has a wide portion, a narrow portion and a continuous hole, and the through hole penetrates the wide portion and the narrow portion. Next, the narrow portion is plugged into the opening to expose the wide portion to the outside of the opening. The boat is inserted into the accommodating groove through the through hole and the opening. The hole wall of the through hole at the narrow portion is separated from the side of the boat by a second gap region, and the second gap region is smaller than the first gap region. Then, according to the second gap region, the first symmetrical center line and the second symmetrical center line are adjusted to be parallel to each other. According to another object of the present invention, an adjustment jig is proposed. The adjustment tool includes a wide portion and a narrow portion. The narrow portion is connected to the wide portion, and the wide portion and the narrow portion have a constant hole, and the through hole penetrates the wide portion and the narrow portion. Among them, the width of the adjustment jig is gradually reduced from the wide part to the narrow part. According to still another object of the present invention, a wafer manufacturing method is proposed. First, a tube and a boat are provided. The furnace tube has an opening, a receiving groove and a first symmetrical center line, and the boat has a second symmetrical center line, and the boat is disposed in the tube. When the boat is inserted into the opening and enters the accommodating groove, the groove wall of the accommodating groove is separated from the side of the boat by a first gap region. Next, an adjustment jig is provided, the adjustment jig having a wide portion, a narrow portion and a continuous hole, the through hole penetrating the wide portion and the narrow portion. Then, the narrow portion is plugged into the opening so that the wide portion is exposed outside the opening. Then, the boat is inserted into the through hole and the opening to enter the accommodation 8

One Γ Γ flat: TW2543PA two 'two holes in the card. The wall of the hole is separated from the side of the boat - the second gap area pU - the gap area is smaller than the first gap area. Then, according to the second 区域 region, the symmetry center line and the second symmetry center line are flattened together, and the wafer is placed in the wafer boat. Next, the boat is placed in the furnace tube to perform one of the wafer semiconductor processes. The above-mentioned objects, features, and advantages of the present invention will become more apparent. The preferred embodiments are described below, and the drawings are described in detail as follows: [Embodiment] Embodiment 1 is the same as that of the first day. 1 is a perspective view of an adjustment mechanism, a tube and a boat in accordance with a preferred embodiment of the present invention. The first ιβ diagram shows a side view of the adjustment mechanism, the tube and the boat of the first drawing. The adjusting mechanism 30 is used for adjusting - the boat 2 is disposed in the furnace tube 1Q in parallel with the furnace tube 1〇. The furnace tube 1 has a receiving groove 13 and an opening n. The receiving groove 13 has a first symmetrical center line L13, and the boat 2 has a second symmetrical center line L20. The adjustment mechanism 30 includes an adjustment jig 31 and an adjustment member 32. The adjustment jig 31 is detachably disposed at the opening u, and has an I 311, a narrow portion 312, and a continuous hole 313. The through hole 313 passes through the gingival portion 311 and the narrow portion 312. The adjustment jig 31 of Fig. 1B is located outside the opening 11, and the narrow portion 312 can be used to plug the opening 11 so that the wide portion 311 is exposed outside the opening 11. The jig 31 can be adjusted and the gap area between the boat 2 〇 and the accommodating groove 13 can be narrowed, thereby making it easier to adjust the adjustment component % 1321824

Ida number: TW2543PA Stereoscopic view of the state in which the σ is fixed. The second β shows the side view of the second adjustment mechanism, the tube and the boat. When the adjustment is made and the opening 11 is removed, the narrow portion 312 is located inside the accommodating groove 13 and the wide portion is located outside the opening 11.

Please refer to the 3rd to 3D drawings at the same time. The 3rd drawing shows a perspective view of the state in which the boat passes through the opening and the through hole in the second drawing. The 3rd figure shows the first. Side view of the Zhou Zheng organization, the furnace officer and the boat. Fig. 3 is a schematic plan view showing the hole wall disk boat in a state where the boat is inclined with respect to the furnace tube in Fig. 3A. The 3D ride shows a schematic view of the hole wall and the boat in the 3C figure after the adjustment of the boat and the tube. When the boat 2 passes through the through hole 313 and the opening U enters the receiving groove, the through hole 313 has a second gap region D2 between the hole wall 313a at the narrow portion 3 and the side surface 22 of the boat 20, The second gap region D2 is smaller than the first gap region (1). As shown in the % diagram, when the wafer boat 20 is tilted within the furnace tube 1 , the width of the gap region D2 is not the same every direction. The user can adjust the boat 2 by the adjusting member 32 according to the second gap region D2. The adjustment member 32 includes a moving portion and a positioning portion. In the present embodiment, the moving portion is a milk' positioning portion is a positioning screw and a wire 322. The user can rotate the micro; ^ = to adjust the inclination of the boat 2 〇 relative to the tube i ,, so that the first % map;; brother: the width of the gap area D2 is the same in either direction, such as the P 苐 two gap area When D2 is equal in the width direction of the arbitrary direction, the first L L middle L line L13 and the second symmetrical center line L20 are parallel to each other. The positioning screw is used to fix the boat 20 to avoid the adjustment of the wafer boat 20 after the adjustment. Please refer to the 4A to 4B drawings, and the 4A_ to the 3A.曰 11 1321824 0 ,

Sanda number: TW2543PA A perspective view of the boat and furnace tube after adjustment. Fig. 4B is a side view showing the adjusting member, the tube and the boat of Fig. 4A. After the adjustment is completed, the user removes the adjustment jig 31 of Fig. 3A. At this time, the adjusted wafer boat 20 is inserted into the accommodating groove 13 of the furnace tube 10. Since the first symmetry center line L13 and the second symmetry center line L20 are parallel to each other, the boat 20 does not rub against the groove wall 12 of the furnace tube 10 when rotated. According to the above embodiment, although the furnace tube is exemplified by a vertical furnace tube, the furnace tube of the present invention may also be a horizontal furnace tube. As long as the φ adjustment jig is used to reduce the gap area between the boat and the furnace tube, the purpose of easily adjusting the wafer boat in parallel with the furnace tube in the furnace tube is not deviated from the technical scope of the present invention. Embodiment 2 Referring to Figure 5, there is shown a flow chart of a method for adjusting according to Embodiment 2 of the present invention. Here, the adjustment mechanism may be the adjustment mechanism of the above embodiment and its deformation. In the present embodiment, the adjustment mechanism # of the first embodiment is taken as an example for illustration. The structure of the furnace tube 10 and the crystal boat 20 is the same as that of the first embodiment, and the same reference numerals will be used and will not be described again. Please also refer to Figures 1A to 1B. First, in step S1, an adjustment jig 31 is provided. The adjustment jig 31 has a wide portion 311, a narrow portion 312, and a constant hole 313. The through hole 313 penetrates the wide portion 311 and the narrow portion 312. Next, proceeding to step S2, the narrow portion 312 is closed to the opening 11, and the wide portion 311 is exposed outside the opening 11, as shown in Figs. 2A to 2B. Please also refer to Figures 3A to 3B. In step S3, the boat 20 1321824

-- The Sanda number: TW2543PA ...- penetrates through the through hole 313 and the opening 11 and enters the accommodating groove 13. The through hole 313 is spaced apart from the side surface 22 of the boat 20 by a second gap region D2 at the hole wall 313a of the narrow portion 312, and the second gap region D2 is smaller than the first gap region D1. Next, proceeding to step S4, the first symmetry center line L13 and the second symmetry center line L20 are adjusted to be parallel to each other according to the second gap region D2. In step S4, the furnace tube 10 is further fixed and the boat 20 is adjusted so that the width of the second gap region D2 in the 3C drawing is equal in either direction, as shown in Fig. 3D. When the width of the second gap region D2 is equal in either direction, when the first symmetry center line L13 and the second symmetry center line L20 are parallel to each other, the first symmetry center line and the second symmetry center line are parallel to each other. And after the adjustment of the boat 20, the boat 20 is fixed, and the adjustment and treatment are removed.

Please refer to FIG. 6. FIG. 6 is a flow chart showing a wafer manufacturing method according to Embodiment 3 of the present invention. In the present embodiment, the wafer manufacturing method uses the adjustment method of the second embodiment, and the same reference numerals are used in the same portions, and the description thereof will not be repeated. Please also refer to Figures 1A to 4B. First, in steps S61 to S65 of Fig. 6, the wafer boat 20 is adjusted to be disposed in parallel with the furnace tube 10 in the furnace tube 10. Please refer to FIG. 7 , which shows a schematic diagram of placing a wafer on a wafer boat. Next, proceeding to step S66 of Fig. 6, a wafer 40 is placed in the wafer boat 20. Please refer to Fig. 8, which shows a schematic diagram of a state in which a semiconductor process is performed. Then, the process proceeds to step S67 of Fig. 6. Place the boat 20 in the furnace tube 13 1321824

Sanda number: TW2543PA 10, to perform one semiconductor process of wafer 40. The adjusting mechanism and the adjusting method thereof and the wafer manufacturing method disclosed in the above embodiments of the present invention use an adjusting jig to reduce a gap region between the boat and the tube, thereby more easily adjusting the jig and the crystal The gap area between the boats adjusts the boat to be placed in parallel with the furnace tube in the furnace tube. In this way, not only can the boat be prevented from touching the furnace tube during the rotation and entering and exiting the furnace tube, but the wafer boat or the furnace tube is damaged. It can avoid the contamination of the wafer by the particles generated during the touch, which will cause defects in the wafer.

In the above, the present invention has been disclosed in the above preferred embodiments, but it is not intended to limit the present invention. Any changes and modifications may be made without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention is defined by the scope of the appended claims.

14 1321824

Sanda number: TW2543PA [Simplified illustration of the drawings] FIG. 1A is a perspective view of an adjustment mechanism, a furnace tube and a boat according to a preferred embodiment of the present invention; FIG. 1B is a diagram showing an adjustment mechanism and a furnace of FIG. Side view of the tube and the boat; FIG. 1C is a side view of the adjustment jig along the section line 1C-1C' in FIG. 1A;

1D is a cross-sectional view of the adjusting jig along the section line 1D-1D' in FIG. 1A; FIG. 2A is a perspective view showing a state in which the adjusting jig is plugged in the opening in FIG. 1A; FIG. 2B is a view 2A is a perspective view of the state of the adjustment mechanism, the tube and the boat, and FIG. 3A is a perspective view showing the state of the boat through opening and the through hole in FIG. 2A; FIG. 3B is a diagram showing the adjustment mechanism and the furnace of FIG. The side view of the tube and the boat; FIG. 3C is a plan view of the hole wall and the boat in a state where the boat is inclined with respect to the tube in FIG. 3A, and FIG. 3D shows the boat in the 3C. The view of the hole wall and the boat in the state after the adjustment of the furnace tube is not intended, and FIG. 4A is a perspective view showing the state in which the wafer boat and the furnace tube are adjusted in FIG. 3A; FIG. 4B is a diagram showing FIG. Adjustment element, furnace tube and side surface of the boat 15 1321824 Three-dimensional number: TW2543PA schematic diagram; FIG. 5 is a flow chart showing an adjustment method according to the second embodiment of the present invention; FIG. 6 is a diagram showing the implementation according to the present invention Example 3: Flow chart of the wafer manufacturing method; Figure 7 depicts the non-wafer placement in the boat. And FIG. 8 illustrates a state in a semiconductor process of FIG. [Main component symbol description]

10 : Furnace tube 11 : Opening 12 : Groove wall 13 : accommodating groove 20 : Boat 22 : Side 30 : Adjustment mechanism 31 : Adjustment jig 31 a : Adjusting the side 311 of the jig : Wide part 312 : Narrow part 313 :孑L 313a : Hole wall 32 : Adjustment element 321 : Fine adjustment screw 322 : Set screw 16 1321824

Sanda number: TW2543PA 40: wafer C311: first annular section C312: second annular section D1: first gap area D2: second gap area D311: thickness of first annular section D312: second annular section Thickness L13: first symmetrical centerline

L20: second symmetrical center line W11: size of the opening W311: width of the wide part W312: width of the narrow part

17

Claims (1)

1321824 j \ Sanda number: TW2543PA X. Patent application scope: 1. An adjustment mechanism for adjusting a wafer boat to be arranged in parallel with the furnace tube in a furnace tube, the furnace tube having a receiving groove and an opening, The accommodating groove has a first symmetrical center line, and the boat has a second symmetrical center line. When the boat is inserted into the accommodating groove through the opening, the groove wall of the accommodating groove and the side of the boat Between the first and second gap regions, the adjusting mechanism comprises: an adjusting jig disposed at the opening in a pluggable manner, and having a wide portion, a narrow portion and a consistent hole, the through hole penetrating the width And the narrow portion, the narrow portion is configured to plug the opening to expose the wide portion to the outside of the opening, and when the boat enters the receiving groove through the through hole and the opening, the through hole is a second gap region is formed between the hole wall at the narrow portion and the side of the boat, the second gap region is smaller than the first gap region; and an adjusting component is configured to adjust the first gap region according to the second gap region a symmetric centerline and the second symmetric centerline are mutually parallel. 2. The adjustment mechanism of claim 1, wherein the wide portion and the narrow portion are integrally formed. 3. The adjustment mechanism of claim 1, wherein the adjustment fixture is a hollow funnel-shaped structure, the width of the adjustment fixture is gradually reduced from the wide portion to the narrow portion, and the narrow portion is The width is smaller than the size of the opening, and the width of the wide portion is larger than the size of the opening. 4. The adjustment mechanism of claim 3, wherein the hole wall of the through hole is parallel to the side of the adjustment jig, and the contour of the hole wall of the through hole corresponds to the profile of the side of the adjustment jig . - 达2 PA : TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW TW The second annular section has a thickness substantially equal to the thickness of the two annular sections. The adjustment mechanism of claim 5, wherein the cross section is qualitatively identical in the direction perpendicular to the second symmetry center line. The adjustment mechanism of claim 5, wherein the accommodation in the direction perpendicular to the second symmetry center line is qualitatively the same. The invention is the adjustment mechanism described in claim 5, wherein the cross section is a first circular cross section, and the first garment cross section is a second circular cross section. Adjustment 1 piece: The adjustment mechanism described in the first aspect of the patent, wherein the first part is a moving part for moving the boat; and a positioning part is used for positioning the boat; when the moving part moves the crystal The boat is in the first symmetrical middle 〇: after the positions of the eyes are parallel to each other, the wafer boat is absent. The adjustment mechanism described in item 9 of the patent scope, wherein the movement: V糸 is a fine adjustment screw, and the positioning portion is a positioning screw.燐; kind of adjustment method for adjusting - the boat is arranged in parallel in the furnace tube, the 官 煻瞢 H H # # # # Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Β Line, the boat has a 笸-乐对/,有弟-symmetric centerline, when the boat is inserted 19 1321824 达达号: TW2543PA The opening enters the accommodating groove, the groove wall of the accommodating groove The adjustment method comprises: providing a adjustment jig having a wide portion, a narrow portion and a consistent hole, the through hole penetrating the wide portion and the narrow The narrow portion is plugged into the opening to expose the wide portion to the outside of the opening; the boat is inserted through the through hole and the opening into the receiving groove, and the hole wall at the narrow portion Separating a side of the boat from a second gap region, the second gap region being smaller than the first gap region; According to the second gap region, the first symmetrical center line and the second symmetry center line are adjusted to be parallel to each other. 12. The adjustment method of claim 11, wherein the wide portion and the narrow portion may be an integrally formed structure. 13. The adjustment method according to claim 11, wherein the adjustment jig is a hollow funnel-shaped structure, the width of the adjustment jig is gradually reduced from the wide portion to the narrow portion, and the narrow portion is The width is smaller than the size of the opening, and the width of the wide portion is larger than the size of the opening. 14. The adjustment method of claim 13, wherein the hole wall of the through hole is parallel to the side of the adjustment jig, and the contour of the hole wall of the through hole corresponds to the profile of the side of the adjustment jig . 15. The adjustment method of claim 11, wherein the wide portion has a first annular cross section perpendicular to the second symmetrical center line, and the narrow portion has a first perpendicular to the second symmetrical center line a second annular section having a thickness substantially equal to the thickness of the second annular section. 16. The method of adjustment as described in claim 15 wherein 20 丄丄 - number: TW2543PA the first annular section is substantially the same as the thickness perpendicular to the upper one. ^ The direction of the center line. The adjustment method described in claim 15 of the patent application, wherein the thickness is substantially the same. The direction of the symmetry center line 18. As in the fifteenth item of the patent application, the opening is a circular opening, the first round method, wherein the surface, the 竽篦-Lu π-cloth cross section is a first ring paraplegia χ The garment cross section is a second circular cross section. The adjustment method according to the Uth aspect of the patent scope, wherein the symmetry center line and the second symmetry center line are parallel to each other and adjust the boat to make the first symmetry center and the pair of private center lines mutually parallel. The method for transferring the patent of the fine 19, wherein Fix the boat. 21· As described in the second paragraph of the patent application, the fixing of the boat includes: a method in which the adjustment jig is removed. 22. A jig 'comprising a wide portion; and a narrow portion connecting the wide portion, the through hole penetrating the wide portion and the narrow portion, seeing the money portion has a consistent hole, ', L The width of the hole is gradually reduced from the wide portion to the narrow portion. 21 1321824 Sanda number: TW2543PA The boat is inserted through the through hole and the opening into the receiving groove, and the through hole is at the hole wall of the narrow portion The side of the boat is separated by a second gap region, the second gap region is smaller than the first gap region; according to the second gap region, the first symmetric center line and the second symmetric center line are adjusted to be parallel to each other; a wafer in the wafer boat; and placing the wafer boat in the furnace tube to perform a semiconductor process of the wafer. The wafer manufacturing method according to claim 28, wherein The wide portion and the narrow portion are integrally formed. The wafer manufacturing method according to claim 28, wherein the adjustment fixture is a hollow funnel-shaped structure, and the width of the adjustment fixture From the wide portion to the narrow portion gradually shrinking, and The width of the narrow portion is smaller than the size of the opening, and the width of the wide portion is larger than the size of the opening. The wafer manufacturing method according to claim 30, wherein the hole wall of the through hole is parallel to the adjustment The method of manufacturing the wafer according to claim 28, wherein the width portion has a vertical portion a first annular section of the second symmetrical centerline, and the narrow portion has a second annular section perpendicular to the second symmetrical centerline, the thickness of the first annular section being substantially equal to the thickness of the second annular section. 33. The wafer manufacturing method according to claim 32, wherein the first annular cross section is substantially the same in thickness in any direction perpendicular to the second symmetric center line: two in the direction of D2: W2543PA Wherein the method for manufacturing the crystal 81 described in Item 32 of the 4^ is in the same direction, the thickness of the second-coating surface is substantially the same in any direction perpendicular to the second symmetry center line. 32 items The wafer manufacturing method is cut into two: a circular opening 'the first annular section is a -th ring, and the second ring section is a second ring section. See, for example, the patent application scope 帛 28 items In the wafer manufacturing method, the step of aligning the first symmetry center line and the second symmetry center line with each other further comprises: fixing the tube and fixing the boat, so that the symmetry medium and the line The second symmetric centerline of S Xuan is parallel to each other. 37: The wafer manufacturing method described in claim 36 of the patent application, ', the adjustment step includes: fixing the boat. ^8. The method for manufacturing a wafer according to item 37, wherein the fixing of the wafer boat comprises: removing the adjustment jig. twenty four