TWI320348B - Combination method for multiple etching areas and article irradiated by processing machine - Google Patents

Combination method for multiple etching areas and article irradiated by processing machine

Info

Publication number
TWI320348B
TWI320348B TW096117669A TW96117669A TWI320348B TW I320348 B TWI320348 B TW I320348B TW 096117669 A TW096117669 A TW 096117669A TW 96117669 A TW96117669 A TW 96117669A TW I320348 B TWI320348 B TW I320348B
Authority
TW
Taiwan
Prior art keywords
processing machine
combination method
multiple etching
etching areas
article irradiated
Prior art date
Application number
TW096117669A
Other languages
English (en)
Other versions
TW200846120A (en
Inventor
Yung Fu Chen
Yu Lin Lee
Hsien Neng Chou
Bo Yi Jiang
Tai Wei Wu
Shi Wei Ye
Gong Qian Wang
Yuan Ming Yen
Shun Han Yang
Yung Hsiang Huang
Chi Wei Chen
Guang Wen Chen
Qi Hong Chen
Original Assignee
Hortek Crystal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hortek Crystal Co Ltd filed Critical Hortek Crystal Co Ltd
Priority to TW096117669A priority Critical patent/TWI320348B/zh
Priority to JP2007290574A priority patent/JP2008284605A/ja
Priority to KR1020070128247A priority patent/KR100904725B1/ko
Publication of TW200846120A publication Critical patent/TW200846120A/zh
Application granted granted Critical
Publication of TWI320348B publication Critical patent/TWI320348B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133524—Light-guides, e.g. fibre-optic bundles, louvered or jalousie light-guides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/0203—Making porous regions on the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Liquid Crystal (AREA)
TW096117669A 2007-05-17 2007-05-17 Combination method for multiple etching areas and article irradiated by processing machine TWI320348B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW096117669A TWI320348B (en) 2007-05-17 2007-05-17 Combination method for multiple etching areas and article irradiated by processing machine
JP2007290574A JP2008284605A (ja) 2007-05-17 2007-11-08 多重加工区域の組合方法
KR1020070128247A KR100904725B1 (ko) 2007-05-17 2007-12-11 다중가공구역의 조합방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096117669A TWI320348B (en) 2007-05-17 2007-05-17 Combination method for multiple etching areas and article irradiated by processing machine

Publications (2)

Publication Number Publication Date
TW200846120A TW200846120A (en) 2008-12-01
TWI320348B true TWI320348B (en) 2010-02-11

Family

ID=40144823

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096117669A TWI320348B (en) 2007-05-17 2007-05-17 Combination method for multiple etching areas and article irradiated by processing machine

Country Status (3)

Country Link
JP (1) JP2008284605A (zh)
KR (1) KR100904725B1 (zh)
TW (1) TWI320348B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5221734B2 (ja) * 2011-10-21 2013-06-26 株式会社片岡製作所 加工機
WO2015069032A1 (ko) * 2013-11-08 2015-05-14 김인석 불연속 분할 가공 방식의 도광판 패턴 형성 방법
TWI666081B (zh) * 2017-12-15 2019-07-21 新代科技股份有限公司 雷射打標分區接合裝置及其方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2636984B2 (ja) * 1991-07-09 1997-08-06 大日本スクリーン製造株式会社 画像接続方法および装置
JP2001088346A (ja) 1999-09-21 2001-04-03 Fuji Photo Film Co Ltd 露光記録方法
JP2003053560A (ja) 2001-08-09 2003-02-26 Ngk Spark Plug Co Ltd レーザ加工方法及びプリント配線基板の製造方法
JP2004148600A (ja) * 2002-10-29 2004-05-27 Kyocera Mita Corp レーザ露光システム及びそれを備えた画像形成装置
JP2004152720A (ja) * 2002-11-01 2004-05-27 Optoquest Co Ltd 面状光源
US7271822B2 (en) * 2004-07-28 2007-09-18 Hewlett-Packard Development Company, L.P. Seamless stitching of multiple image fields in a wide-format laser printer
JP4653503B2 (ja) * 2005-01-24 2011-03-16 株式会社リコー 光走査装置及び画像形成装置等

Also Published As

Publication number Publication date
TW200846120A (en) 2008-12-01
JP2008284605A (ja) 2008-11-27
KR20080101637A (ko) 2008-11-21
KR100904725B1 (ko) 2009-06-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees