TWI320340B - Apparatus and method for measuring widthwise ejection uniformity of slit nozzle - Google Patents

Apparatus and method for measuring widthwise ejection uniformity of slit nozzle

Info

Publication number
TWI320340B
TWI320340B TW96118397A TW96118397A TWI320340B TW I320340 B TWI320340 B TW I320340B TW 96118397 A TW96118397 A TW 96118397A TW 96118397 A TW96118397 A TW 96118397A TW I320340 B TWI320340 B TW I320340B
Authority
TW
Taiwan
Prior art keywords
slit nozzle
measuring widthwise
ejection uniformity
ejection
uniformity
Prior art date
Application number
TW96118397A
Other languages
English (en)
Other versions
TW200743527A (en
Inventor
Kang Il Cho
Original Assignee
K C Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by K C Tech Co Ltd filed Critical K C Tech Co Ltd
Publication of TW200743527A publication Critical patent/TW200743527A/zh
Application granted granted Critical
Publication of TWI320340B publication Critical patent/TWI320340B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254—Coating heads with slot-shaped outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Nozzles (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
TW96118397A 2006-05-23 2007-05-23 Apparatus and method for measuring widthwise ejection uniformity of slit nozzle TWI320340B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20060046139A KR100766444B1 (ko) 2006-05-23 2006-05-23 슬릿 노즐의 폭방향 토출 균일도 측정 장치 및 방법

Publications (2)

Publication Number Publication Date
TW200743527A TW200743527A (en) 2007-12-01
TWI320340B true TWI320340B (en) 2010-02-11

Family

ID=38748339

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96118397A TWI320340B (en) 2006-05-23 2007-05-23 Apparatus and method for measuring widthwise ejection uniformity of slit nozzle

Country Status (5)

Country Link
US (1) US20070272146A1 (zh)
JP (1) JP4592726B2 (zh)
KR (1) KR100766444B1 (zh)
CN (1) CN101078881B (zh)
TW (1) TWI320340B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100766443B1 (ko) * 2006-05-23 2007-10-11 주식회사 케이씨텍 슬릿 노즐의 폭방향 토출 균일도 측정 장치 및 방법
WO2009151514A1 (en) 2008-06-11 2009-12-17 Millipore Corporation Stirred tank bioreactor
JP5303232B2 (ja) * 2008-09-30 2013-10-02 東京応化工業株式会社 ノズル、塗布装置及びノズルのメンテナンス方法
JP4983890B2 (ja) * 2009-10-28 2012-07-25 住友化学株式会社 有機ｅｌ素子の製造方法
CN106940248A (zh) * 2016-01-05 2017-07-11 中国航空工业集团公司北京航空精密机械研究所 测量扁平扇形喷嘴横向喷射不均匀度的装置及方法
CN108267881B (zh) * 2018-01-22 2021-07-23 精电(河源)显示技术有限公司 一种减少彩虹现象发生的lcd生产工艺方法
JP7450844B2 (ja) * 2018-07-06 2024-03-18 シェルバック セミコンダクター テクノロジー リミテッド ライアビリティ カンパニー スプレー測定機器のためのシステム及び方法
KR102264453B1 (ko) * 2020-11-30 2021-06-14 주식회사제이에스텍 필름 클리너

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3937769A (en) * 1973-12-27 1976-02-10 Norton Company Liquid distributor
US4307822A (en) 1979-06-28 1981-12-29 Robert Hardesty Metered dispenser
JPS61102258A (ja) 1984-10-25 1986-05-20 Fuji Xerox Co Ltd インクジエツト記録装置用液滴検出装置
JPH04114598U (ja) * 1991-03-15 1992-10-08 石川島播磨重工業株式会社 カーテンコータの幅方向流量計測装置
US5358007A (en) * 1993-11-15 1994-10-25 Carlberg Stanley B Downspout with swivel and flow diverter
ES2112504T3 (es) * 1994-09-28 1998-04-01 Sulzer Chemtech Ag Dispositivo de distribucion de liquido para columna.
KR0173889B1 (ko) * 1996-09-02 1999-05-15 현대자동차주식회사 실란트 토출량 계측기
US6168687B1 (en) * 1998-04-24 2001-01-02 Honeywell-Measurex Corporation System and method for sheet measurement and control in papermaking machine
DE19844602A1 (de) * 1998-09-29 2000-03-30 Bosch Gmbh Robert Verfahren und Vorrichtung zum Messen der Winkelverteilung eines Flüssigkeitsstrahls
US6376013B1 (en) * 1999-10-06 2002-04-23 Advanced Micro Devices, Inc. Multiple nozzles for dispensing resist
US6406851B1 (en) * 2000-01-28 2002-06-18 Agilent Technologies, Inc. Method for coating a substrate quickly and uniformly with a small volume of fluid
JP2002373843A (ja) * 2001-06-14 2002-12-26 Nec Corp 塗布装置及び塗布膜厚制御方法
JP2004321913A (ja) * 2003-04-23 2004-11-18 Mitsubishi Materials Corp 塗布システム
JP2005013787A (ja) * 2003-06-23 2005-01-20 Tokyo Electron Ltd 塗布成膜装置及び塗布成膜方法
JP2006015693A (ja) 2004-07-05 2006-01-19 Seiko Epson Corp 液滴吐出特性測定方法、液滴吐出特性測定装置、液滴吐出装置、および電気光学装置の製造方法
KR100643494B1 (ko) * 2004-10-13 2006-11-10 삼성전자주식회사 반도체 제조용 포토레지스트의 디스펜싱장치

Also Published As

Publication number Publication date
US20070272146A1 (en) 2007-11-29
JP2007318128A (ja) 2007-12-06
CN101078881A (zh) 2007-11-28
JP4592726B2 (ja) 2010-12-08
KR100766444B1 (ko) 2007-10-11
TW200743527A (en) 2007-12-01
CN101078881B (zh) 2010-12-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees