TWI319964B - - Google Patents

Info

Publication number
TWI319964B
TWI319964B TW92118833A TW92118833A TWI319964B TW I319964 B TWI319964 B TW I319964B TW 92118833 A TW92118833 A TW 92118833A TW 92118833 A TW92118833 A TW 92118833A TW I319964 B TWI319964 B TW I319964B
Authority
TW
Taiwan
Application number
TW92118833A
Other languages
Chinese (zh)
Other versions
TW200402256A (en
Inventor
Toru Yuki
Yasushi Ito
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW200402256A publication Critical patent/TW200402256A/zh
Application granted granted Critical
Publication of TWI319964B publication Critical patent/TWI319964B/zh

Links

TW92118833A 2002-07-29 2003-07-10 Multi-layered circuit board, detector for measurement, processing apparatus for blind through hole and processing method for blind through hole TW200402256A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002219967A JP4034612B2 (ja) 2002-07-29 2002-07-29 多層回路基板の止まり穴加工方法

Publications (2)

Publication Number Publication Date
TW200402256A TW200402256A (en) 2004-02-01
TWI319964B true TWI319964B (ja) 2010-01-21

Family

ID=31940739

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92118833A TW200402256A (en) 2002-07-29 2003-07-10 Multi-layered circuit board, detector for measurement, processing apparatus for blind through hole and processing method for blind through hole

Country Status (3)

Country Link
JP (1) JP4034612B2 (ja)
CN (1) CN100469499C (ja)
TW (1) TW200402256A (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4611010B2 (ja) * 2004-12-10 2011-01-12 日立ビアメカニクス株式会社 多層回路基板の製造方法
CN101537505B (zh) * 2008-12-30 2011-05-25 南京依利安达电子有限公司 印刷电路板的小孔径高密度钻孔方法
CN102069209B (zh) * 2010-12-22 2012-11-14 北京控制工程研究所 一种铝合金、铜合金零件的微孔钻削加工方法
CN102319976B (zh) * 2011-06-03 2012-12-26 哈尔滨飞机工业集团有限责任公司 一种成型模中产品定位件定位孔的加工方法
DE102013004679B4 (de) * 2013-03-19 2017-11-23 Skybrain Vermögensverwaltung GmbH Vorrichtung und Verfahren zum Bearbeiten von Leiterplatten
TW201605315A (zh) * 2014-02-21 2016-02-01 維亞機械股份有限公司 背鑽加工方法以及背鑽加工裝置
JP7054587B2 (ja) * 2016-11-25 2022-04-14 ビアメカニクス株式会社 ドリル加工装置及びドリル加工方法
CN106932709A (zh) * 2017-02-17 2017-07-07 李培培 一种多层线路板通电观测用调试装置
JP6861581B2 (ja) * 2017-06-09 2021-04-21 三菱電機株式会社 多層基板の信号取得構造、信号取得装置および電子装置

Also Published As

Publication number Publication date
JP2004063771A (ja) 2004-02-26
CN1478626A (zh) 2004-03-03
CN100469499C (zh) 2009-03-18
TW200402256A (en) 2004-02-01
JP4034612B2 (ja) 2008-01-16

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