TWI319964B - - Google Patents

Info

Publication number
TWI319964B
TWI319964B TW92118833A TW92118833A TWI319964B TW I319964 B TWI319964 B TW I319964B TW 92118833 A TW92118833 A TW 92118833A TW 92118833 A TW92118833 A TW 92118833A TW I319964 B TWI319964 B TW I319964B
Authority
TW
Taiwan
Application number
TW92118833A
Other languages
Chinese (zh)
Other versions
TW200402256A (en
Inventor
Toru Yuki
Yasushi Ito
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW200402256A publication Critical patent/TW200402256A/en
Application granted granted Critical
Publication of TWI319964B publication Critical patent/TWI319964B/zh

Links

TW92118833A 2002-07-29 2003-07-10 Multi-layered circuit board, detector for measurement, processing apparatus for blind through hole and processing method for blind through hole TW200402256A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002219967A JP4034612B2 (en) 2002-07-29 2002-07-29 Blind hole machining method for multilayer circuit boards

Publications (2)

Publication Number Publication Date
TW200402256A TW200402256A (en) 2004-02-01
TWI319964B true TWI319964B (en) 2010-01-21

Family

ID=31940739

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92118833A TW200402256A (en) 2002-07-29 2003-07-10 Multi-layered circuit board, detector for measurement, processing apparatus for blind through hole and processing method for blind through hole

Country Status (3)

Country Link
JP (1) JP4034612B2 (en)
CN (1) CN100469499C (en)
TW (1) TW200402256A (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4611010B2 (en) 2004-12-10 2011-01-12 日立ビアメカニクス株式会社 Multilayer circuit board manufacturing method
CN101537505B (en) * 2008-12-30 2011-05-25 南京依利安达电子有限公司 Small-aperture high-density drilling method of printed circuit board
CN102069209B (en) * 2010-12-22 2012-11-14 北京控制工程研究所 Micropore drilling machining method of copper alloy and copper alloy parts
CN102319976B (en) * 2011-06-03 2012-12-26 哈尔滨飞机工业集团有限责任公司 Method for processing locating hole of product locating piece in forming mould
DE102013004679B4 (en) * 2013-03-19 2017-11-23 Skybrain Vermögensverwaltung GmbH Apparatus and method for processing printed circuit boards
TW201605315A (en) * 2014-02-21 2016-02-01 維亞機械股份有限公司 Backdrilling method, and backdrilling apparatus
JP7054587B2 (en) * 2016-11-25 2022-04-14 ビアメカニクス株式会社 Drilling equipment and drilling method
CN106932709A (en) * 2017-02-17 2017-07-07 李培培 A kind of multilayer circuit board energization observation debugging apparatus
JP6861581B2 (en) * 2017-06-09 2021-04-21 三菱電機株式会社 Multilayer board signal acquisition structure, signal acquisition device and electronic device

Also Published As

Publication number Publication date
JP4034612B2 (en) 2008-01-16
CN1478626A (en) 2004-03-03
JP2004063771A (en) 2004-02-26
TW200402256A (en) 2004-02-01
CN100469499C (en) 2009-03-18

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