CN1478626A - Multilayer circuit board, detector for measuring, location hole processing device and its method - Google Patents
Multilayer circuit board, detector for measuring, location hole processing device and its method Download PDFInfo
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- CN1478626A CN1478626A CNA031503357A CN03150335A CN1478626A CN 1478626 A CN1478626 A CN 1478626A CN A031503357 A CNA031503357 A CN A031503357A CN 03150335 A CN03150335 A CN 03150335A CN 1478626 A CN1478626 A CN 1478626A
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Abstract
To allow easy confirmation of the location of an inner layer and can increase the processing accuracy. Conductor layers 31 of the multilayer circuit board 30 are insulated from each other with insulation layers 32. To each conductor section for a circuit which is to be used as a circuit when the multilayer circuit board 30 becomes a product, a measurement region 31b which is only used for processing is connected. The measurement regions 31b of various layers are aligned horizontally and are so located as to overlap each other in the up and down direction. Prior to processing holes, a V-shaped hole 70 is processed in a place where the measurement regions 31b are located, and the probes 50 for measurement are located in the measurement regions 31b exposed on an inner surface of the hole 70. By measuring the voltages between the probe needles 51 and a rotor shaft, the position of a drill end is controlled.
Description
Technical field
The present invention relates to the location hole processing unit (plant), location hole processing method of multilayer circuit board and as the multilayer circuit board of the object of these location hole processing unit (plant)s, location hole processing method and the measurement detector that in these location hole processing unit (plant)s, location hole processing method, uses, the instrument that this location hole processing unit (plant) utilization remains on the armature spindle is measured the shaft voltage that is created on the high armature spindle of earth resistance, and comes the front position of control tool with this.
Background technology
Multilayer circuit board is by a plurality of conductor layers that use in circuit and makes the insulating barrier of conductor layer and additional conductors layer insulation and a integral body that the pressing that interlocks forms.The position of each conductor layer of multilayer circuit board is uneven along thickness direction, has nothing in common with each other.
Therefore, in TOHKEMY 2001-341052 communique, make multilayer circuit board and the earth insulation in advance as workpiece, being configured in lip-deep conductor layer by utilization measures the shaft voltage that produces on the armature spindle that keeps instrument, detect the surface location of the multilayer circuit board of working position, the location positioning that makes detection on the normal place of depth direction, machining hole then.
According to this technology, even on the multilayer circuit board of concave-convex surface, also can carry out high-precision deep processing from hole surface.
In addition, in Japanese kokai publication sho 61-131804 communique, the side to multilayer circuit board processes in advance, makes the conductor inside layer expose (hereinafter referred to as " internal layer ") to the open air, in the internal layer of a side of exposure detection circuit, other sides are connected respectively with drill bit.Then, Yi Bian monitor the state of testing circuit, Yi Bian make drill bit be cut into multilayer circuit board, the position when closing with testing circuit is as the position of the internal layer of target.
According to this technology, Yi Bian, can promptly learn the position of internal layer Yi Bian learn that with carrying out spot-facing processing repeatedly the situation of the position of internal layer compares.
But as the former occasion in the above-mentioned conventional art, the distance between surface and the internal layer is the size of design, promptly processes under the state of short transverse invariant position for every layer.Therefore, when processing connected superficial layer and the hole as the internal layer of target, can have following situation: the bottom surface of machining hole did not arrive the internal layer as target, or has penetrated the internal layer as target.And, do not dispose from the teeth outwards on the surface of multilayer circuit board of conductor layer must the configuration conduction plate.
In addition, the thickness of multilayer circuit board central portion in the horizontal direction and periphery is mostly different.Therefore, under the situation of central portion being processed in position according to the internal layer of measuring along periphery, also can be identical with the former of above-mentioned conventional art, the bottom surface that machining hole can occur does not arrive the internal layer as target, or has penetrated the internal layer as target.And, because the measuring point is the side, so must process the side by other operations in advance.Also cause difficulty to configuration detector.
Summary of the invention
The object of the present invention is to provide a kind of the affirmation work of the position of internal layer to be become easily, improve machining accuracy multilayer circuit board location hole processing method and multilayer circuit board and detect and use detector, it can solve the problem in the above-mentioned conventional art.
In order to finish above-mentioned purpose, first scheme has following feature: on the multilayer circuit board that forms interlocking pressing conductor layer and insulating barrier, above-mentioned conductor layer is made up of following, that is, the circuit that is used as circuit is with conductor portion and the measurement section that detects the direction position vertical with aforesaid substrate in machining hole that is connected with conductor portion that this circuit is used; With the vertical direction of aforesaid substrate on repeat the designated field of above-mentioned measurement section.
In this case, the designated field of above-mentioned measurement section is preferably disposed on the position of the internal layer that can infer pressing, also has, and can not interfere when being preferably disposed on machining hole on the position of the conductor portion that foregoing circuit uses.
Being characterized as of alternative plan: the measurement of the above-mentioned portion of terminal output of forming in the support portion of the portion of terminal that is formed by a plurality of electric conducting materials and this portion of terminal of support of detection is with in the detector, under the state that all is in insulation between each terminal, along the circumferential direction dispose above-mentioned portion of terminal, this portion of terminal is supported in the above-mentioned support portion, and can axially move freely.
In this case, above-mentioned portion of terminal is preferably formed as cylindric.In addition, also can replace along above-mentioned circumferencial direction be configured to radially dispose, in configuration radially, preferably the terminal of the needle-like shape that is arranged in a straight line.
Third party's case is a kind of processing unit (plant), it is used for processing location hole on the multilayer circuit board of first scheme, this third party's case is characterised in that to possess: platform, above-mentioned multilayer circuit board is set on this platform, this multilayer circuit board is for above-mentioned designated field, and extremely the predefined degree of depth is pre-formed measuring inclined plane from the surface; Measure and use detector, the leading section of its terminal is supported in the bracing or strutting arrangement, and can contact with above-mentioned conductor layer; Armature spindle, the instrument that it has installed machining hole is driven in rotation by motor; Support, it supports above-mentioned armature spindle, make above-mentioned instrument for above-mentioned platform carry out near with separate; Control device, the above-mentioned measurement that its selection contacts with the conductive part of wishing the degree of depth is controlled the position of above-mentioned instrument front end with the terminal of detector, detection from the value of the voltage of the above-mentioned armature spindle induction of above-mentioned terminal output according to this detected value.
Cubic case is a kind of processing unit (plant), it is used for processing location hole on the multilayer circuit board of first scheme, this cubic case is characterised in that to possess: platform, above-mentioned multilayer circuit board is set on this platform, this multilayer circuit board is for above-mentioned designated field, and extremely the predefined degree of depth is pre-formed measuring inclined plane from the surface; Measure and use detector, the leading section of its terminal is supported in the bracing or strutting arrangement, and can contact with above-mentioned conductor layer; Armature spindle, the instrument that it has installed machining hole is driven in rotation by motor; Support, it supports above-mentioned armature spindle, make above-mentioned instrument for above-mentioned platform carry out near with separate; Control device, the above-mentioned measurement that its selection contacts with the conductive part of wishing the degree of depth terminal of detector, detection is from the value of the voltage of the above-mentioned armature spindle induction of above-mentioned terminal output, according to this detected value, obtain height from the platform that is provided with above-mentioned multilayer circuit board to the anomaly platform surface of each conductor layer of above-mentioned designated field, the above-mentioned average height that utilization is obtained is inferred the height of each conductor layer, controls the front position of above-mentioned instrument according to the height of inferring.
In these cases, above-mentioned inclined plane is the inclined-plane in the hole of V font by the cross section, in other words is exactly to be formed by the side in conical hole or the inclined plane on the plane.In addition, the terminal of an above-mentioned measurement with detector is set, and possesses drive unit, its move above-mentioned bracing or strutting arrangement so that the portion that exposes to the open air of the above-mentioned conductor layer on above-mentioned inclined plane by crosscut, also can on above-mentioned bracing or strutting arrangement, set a plurality of Support Positions even scan a terminal, change the Support Position of above-mentioned terminal and make it and the contact of different conductor layer.Also having, also can use the measurement of alternative plan to use detector as above-mentioned measurement detector, owing to do not need moving and replacing of terminal, also is feasible in operation.
Being characterized as of the 5th scheme: in the above-mentioned designated field of the multilayer circuit board of first scheme, processing cross sectional shape is the hole of V font, measure induced voltage (shaft voltage) by exposing to the open air in the lip-deep above-mentioned measurement section in above-mentioned hole, and this induced voltage produces on the armature spindle of the instrument that machining hole has been installed, control the front position of above-mentioned instrument according to the measured value of above-mentioned induced voltage, the processing location hole.
Being characterized as of the 6th scheme: in the above-mentioned designated field of the multilayer circuit board of first scheme, carry out inclined-plane processing, measure induced voltage by exposing to the open air in the lip-deep above-mentioned measurement section on above-mentioned inclined-plane, and this induced voltage produces on the armature spindle of the instrument that machining hole has been installed, control the front position of above-mentioned instrument according to the measured value of above-mentioned induced voltage, the processing location hole.
Being characterized as of the 7th scheme: in the above-mentioned designated field of the multilayer circuit board of first scheme, process the hole that cross sectional shape is the V font, measure induced voltage (shaft voltage) by exposing to the open air in the lip-deep above-mentioned measurement section in above-mentioned hole, and this induced voltage produces on the armature spindle of the instrument that machining hole has been installed, measured value according to above-mentioned induced voltage, obtain height from the platform that is provided with above-mentioned multilayer circuit board to the anomaly platform surface of each conductor layer of above-mentioned designated field, the above-mentioned average height that utilization is obtained is inferred the height of each conductor layer, control the front position of above-mentioned instrument according to the height of inferring, and process location hole.
The being characterized as of case from all directions: in the above-mentioned designated field of the multilayer circuit board of first scheme, carry out inclined-plane processing, measure induced voltage (shaft voltage) by exposing to the open air in the lip-deep above-mentioned measurement section on above-mentioned inclined-plane, and this induced voltage produces on the armature spindle of the instrument that machining hole has been installed, measured value according to above-mentioned induced voltage, obtain height from the platform that is provided with above-mentioned multilayer circuit board to the anomaly platform surface of each conductor layer of above-mentioned designated field, the above-mentioned average height that utilization is obtained is inferred the height of each conductor layer, control the front position of above-mentioned instrument according to the height of inferring, and process location hole.
Being characterized as of the 9th scheme: the 7th or the from all directions in the case, the height of each conductor layer in the above-mentioned fields of measurement that storage is obtained is obtained above-mentioned average height according to the height of above-mentioned each conductor layer of storage.
According to the present invention, because fields of measurement aligned in position in the horizontal direction in the conduction by making connecting conductor, in hole along processing V font on the multilayer circuit board of the overlapping pressing of short transverse, internal layer is exposed to the open air, so can in an operation, a plurality of internal layers be exposed to the open air, and also can confirm the position of internal layer easily.In addition, configuration is used to measure the measurement detector of shaft voltage in the field of exposing to the open air on hole surface, because the shaft voltage that produces on the high armature spindle of one side measurement of Grounding Resistance, Yi Bian process, so can be at machining hole under the high accuracy.In addition, by using the measurement detector that radially disposes a plurality of portion of terminal, can make procedure operation become easy.The result can make the affirmation work of internal layer position become easily, and improves machining accuracy.
Description of drawings
Fig. 1 is the front elevation of pith of the printed substrate positional punch machine of embodiment of the present invention;
Fig. 2 is the in-built ideograph of the multilayer circuit board of expression embodiment of the present invention;
Fig. 3 is the sectional view of the general structure of the detector for measuring of expression embodiment of the present invention;
Fig. 4 is the circuit diagram of the control structure of the processing unit (plant) of expression embodiment of the present invention.
Embodiment
Below with reference to accompanying drawing embodiments of the present invention are described.
Front elevation as the pith of the printed substrate positional punch machine of Fig. 1 is represented, and support 1 is omitted illustrated mobile scheme and supports, and can be along about the figure (Y) and up and down (Z) direction move freely.Fixed main shaft 2 in support 1.Armature spindle 3 is supported on the main shaft 2 by air journal bearing 4a～4d, and can rotate freely, and is supported and be positioned on the direction of principal axis by air thrust bearing 5 simultaneously.On armature spindle 3, dispose the rotor 6 of the end ring shape that forms by copper product.This rotor 6 is coils that formed the ladder shape by copper product (thin plate of Copper Foil, copper).On the position relative, dispose coil (stator) 7 with the rotor 6 of main shaft 2.Coil 7 is connected with conversion electric power 8.It is high-frequency alternating voltage that conversion electric power 8 changes from the commercial ac voltage of three phase mains 9 inputs.Front end at armature spindle 3 supports drill bit 10.
The front end of main shaft 2 is embedded in the presser feet 20.Presser feet 20 is supported on the piston rod 21 of a pair of cylinder, and this piston rod 21 is supported on the support 1, and this presser feet 20 moves freely along the Z direction with respect to main shaft 2.Fixed the lining 22 that forms by insulating material in the lower end of presser feet 20.Platform 25 moves freely along the direction vertical with paper (directions X).Fixing multilayer circuit board 30 on platform 25, and to make conductor layer be a side on surface.Make support 1, presser feet 20 and platform 25 ground connection.
Shown in the ideograph of the multilayer circuit board of Fig. 2, multilayer circuit board 30 is formed by conductor layer 31 and insulating barrier 32 staggered pressings, and conductor layer 31 passes through insulating barrier 32 by mutually insulated.Each conductor layer 31 is all by forming with the lower part: when multilayer circuit board 30 becomes product, the part (hereinafter referred to as " circuit conductor portion 31a ") that is used as circuit be connected and the part of in machining hole, only using (hereinafter referred to as " measurement section 31b ") for the position of measuring height direction with conductor portion 31a with circuit with one deck.Each independently circuit measurement section 31b is set on conductor portion 31a, dispose every layer measurement section 31b in the horizontal direction, and make it overlapping along thickness direction.The public part of this lap is exactly a so-called designated field in above-mentioned first scheme.Have, in illustrated multilayer circuit board 30, uppermost conductor layer 31 does not form circuit conductor portion 31a, is conductor layer 31 all again.
Shown in the general structure chart of the detector for measuring of Fig. 3, the measuring component 51a～51c of the ring-type in the detector for measuring 50 (cylindric) is along at the guide rail 52 inner walls that form, and easy on and off moves.Measuring component 51a～51c is formed by electric conducting material, by guide rail 52 mutually insulateds that formed by insulating material, presses the linearly arrangement of appointed interval.Power spring 53 pushes each measuring component 51a～51c to the below of figure.Stube cable 54a～54c on spring 53.If measuring component 51a～51c is according to such formation ring-type, because precision is not high, and is circular any one part that exposes the conductive layer on the inclined-plane to the open air and all contacts, so control becomes simple with the measuring component of ring-type (cylindric).
Shown in the control circuit figure of the processing unit (plant) of Fig. 4, cable 54a～54c, promptly measuring component 51a～51c is connected with the terminal a1～a3 of switch 60 respectively.The public terminal c of switch 60 is connected by the input terminal 62a of cable 61 with filter (being band pass filter here) 62.The lead-out terminal 62b of filter 62 is connected with the input terminal 63a of contrast device 63, and earth terminal 62e is connected with the earth.The lead-out terminal 63b of contrast device 63 is connected with NC device 64.Switch by NC device 64 control switchs 60.
Measure and move freely along the XYZ direction by omitting the illustrated scheme that is loaded on the platform 25 with detector 50.
Next, on one side with reference to figure 4 order of explanation processing location holes (hereinafter referred to as " hole ") on one side, this location hole connects the conductor layer 31 on surface and the 3rd conductor layer 31 that begins from the side on surface.
In first being processed, by the drill bit of front end formation V font, machining hole 70 makes fields of measurement 31b be concentric circles and exposes to the open air up to the fields of measurement 31b of designated depth.Next, detector for measuring 50 is docked with the fields of measurement 31b that exposes to the open air.Machining hole and make it arrive the 3rd conductor layer here is so NC device 64 makes public terminal c be connected with measurement terminal 51c.
Next, the illustrated cylinder of omission is operated, make piston rod 21 be in the most outstanding state in advance.In addition, conversion electric power 8 is operated, provide electric current to coil 7, the magnetic field that produces by coil 7 makes armature spindle 3 rotations.Because armature spindle 3 by air journal bearing 4a～4d and air thrust bearing 5 (promptly, pass through air layer) be supported on the main shaft 2, if so connect the switch of three-dimensional power supply 9 or conversion electric power 8 (omitting diagram), magnetic field by producing in the above-mentioned coil 7 can produce induced voltage in the higher armature spindle 3 of earth resistance so.Here the induced voltage that produces in this armature spindle 3 is known as shaft voltage V0.
The waveform of shaft voltage V0 and following waveform are about equally, promptly, the waveform of the voltage Vi2 of the frequency of three times of the control frequencys of the voltage Vi1 of the control frequency of overlapping conversion electric power 8 and conversion electric power 8 in the voltage Vs of the frequency of three phase mains 9, for example, electric voltage frequency at three phase mains 9 is 50Hz, and in addition, the voltage control frequency of conversion electric power 8 is under the situation of 1kHz, the amplitude of shaft voltage V0 is before and after the 1V, and the amplitude of Vi2 is before and after the 300mV.
If support 1 is descended, at first lining 22 docks with surperficial conductor layer 31, multilayer circuit board 30 by being pressed on the platform 25.Then, multilayer circuit board 30 by the state that is pressed on the platform 25 under, presser feet 20 stops to descend, and resists air pressure later on, relatively rises for support 1.
Support 1 is descended,, by measuring component 51c the shaft voltage V0 of generation in the armature spindle 3 is input in the filter 62 so if the front end of drill bit 10 docks with the 3rd fields of measurement 31b (conductor layer 31) as target.Filter 62 from shaft voltage V0 to contrast device 63 output voltage V i2.Contrast device 63 offset of sinusoidal wave voltage Vi2 and predefined voltage (for example ,+100mV) compare, if voltage Vi2 surpasses+100mV, so just to NC device 64 output detection signals.If NC device 64 is received the detection signal of contrast device 63, so just finish drill bit 10, i.e. the decline of support 1 makes its rising afterwards at once.
Next, describe about machining accuracy.
For example, if the maximum of voltage Vi2 is 150mV, the front end of drill bit 10 is with after the 3rd fields of measurement 31b docks so, from contrast device 63 to output detection signal, the maximum of needed time the chances are 0.25ms.On the other hand, the decrease speed of support 1 is that drill bit 10 is 12.5 μ m the 0.25ms dropping distance under the situation of 3m/ branch.That is, even detect the decline that shaft voltage V0 controls drill bit 10 afterwards again, the machining tolerance that also can control hole depth is in 15 μ m.
In the present embodiment, because measuring with keeping a plurality of measuring component 51a～51c in the detector 50, so can reduce the kind of measuring with detector 50.
Have again, in the present embodiment, though cooperate conductor layer as target, the contact c of switch 60 is connected with the 3rd fields of measurement 31b as target in advance, but the front end of preferably confirming drill bit 10 has arrived after the conductor layer of upper strata one side, and the contact that has connected next conductor layer is connected with common junction c.
In addition, in the present embodiment because superficial layer is a conductor layer 31, so that be connected the measuring component 51a of superficial layer 31 in advance and be connected with public terminal c in advance, be preferably in when having confirmed that drill bit 10 contacts with superficial layer 31, measuring component 51b is connected with public terminal c.If do like this, just can in machining hole, the concave-convex surface of multilayer circuit board 30 be saved as data.
Here, can't under the situation of all circuit, preferably carry out following disposal with setting measurement field 31b on the conductor portion 31.That is, earlier the hole to the place that is provided with fields of measurement 31b processes, and at this moment, obtains and store in advance the height from this fields of measurement 31b (that is, conductor layer 31) to platform 25 surfaces.Then, utilize the average height of the conductor layer 31 of storage, the local machining hole of fields of measurement 31b can't be set.
Have again, in the present embodiment, though in measuring, maintain a plurality of measuring components 51 of ring-type with detector 50, but the most handy measuring component 51 is one by one replaced the measuring component 51 of each conductor layer special use, such with the conductor layer 31 that crosscut exposes to the open air, a measuring component 51 is scanned, the front end of measuring component 51 is contacted with the position of the conductor layer of wishing the degree of depth.
In addition, also can use the measuring component 51 of measuring component 51 substituted cyclics of needle-like, in this case, if odd number, also can be supported on a plurality of positions of the guide rail 52 that plays the support portion effect, perhaps, also can make guide rail 52 along the hole 70 move radially, it is contacted with the conductive layer that exposes to the open air.Perhaps, also can be the measuring component 51 of a plurality of needle-likes of a plurality of linearities ground configuration, and its any one conductive layer that exposes from the inclined-plane in the top in hole 70 and hole 70 is contacted.In a word, the width of the interval setting terminal of corresponding conductive layer.
Also have,, confirm that preferably measurement is with producing broken string on each measuring component 51 of detector 50 and the cable 54 that is connected with measuring component in first being processed.
Claims (18)
1. staggered pressing conductor layer and insulating barrier and the multilayer circuit board that forms is characterized by:
Above-mentioned conductor layer is made up of following, that is, the circuit that is used as circuit is with conductor portion and the measurement section that detects the direction position vertical with aforesaid substrate in machining hole that is connected with conductor portion that this circuit is used;
With the vertical direction of aforesaid substrate on repeat the designated field of above-mentioned measurement section.
2. multilayer circuit board according to claim 1 is characterized in that the designated field of above-mentioned measurement section is set on the position of the internal layer position that can infer superimposed pressing.
3. multilayer circuit board according to claim 1 and 2 can not interfered when the designated field that it is characterized in that above-mentioned measurement section is set at machining hole on the position of the conductor portion that foregoing circuit uses.
4. measurement detector, portion of terminal that it is formed by a plurality of electric conducting materials and the support portion of supporting this portion of terminal are formed, and detect the output of above-mentioned portion of terminal, being characterized as of this detector:
Along the circumferential direction dispose above-mentioned portion of terminal under the state that all is in insulation between each terminal, this portion of terminal is supported in the above-mentioned support portion, and can axially move freely.
5. measurement detector according to claim 4, it is cylindric to it is characterized in that above-mentioned portion of terminal forms.
6. measurement detector, portion of terminal that it is formed by a plurality of electric conducting materials and the support portion of supporting this portion of terminal are formed, and detect the output of above-mentioned portion of terminal, being characterized as of this detector:
All be in the above-mentioned portion of terminal of state lower edge radial arrangement of insulation between each portion of terminal, this portion of terminal is supported in the above-mentioned support portion, and can axially move freely.
7. measurement detector according to claim 6 is characterized in that the linearly configuration of above-mentioned portion of terminal.
8. location hole processing unit (plant), it processes location hole on the described multilayer circuit board of claim 1, and being characterized as of this processing unit (plant) possesses:
Platform is provided with above-mentioned multilayer circuit board on this platform, this multilayer circuit board is for above-mentioned designated field, and extremely the predefined degree of depth is pre-formed measuring inclined plane from the surface;
Measure and use detector, the leading section of its terminal is supported in the bracing or strutting arrangement, and can contact with above-mentioned conductor layer;
Armature spindle, the instrument that it has installed machining hole is driven in rotation by motor;
Support, it supports above-mentioned armature spindle, make above-mentioned instrument for above-mentioned platform carry out near with separate;
Control device, the above-mentioned measurement that its selection contacts with the conductive part of wishing the degree of depth is controlled the position of above-mentioned instrument front end with the terminal of detector, detection from the value of the voltage of the above-mentioned armature spindle induction of above-mentioned terminal output according to this detected value.
9. location hole processing unit (plant), it processes location hole on the described multilayer circuit board of claim 1, and being characterized as of this processing unit (plant) possesses:
Platform is provided with above-mentioned multilayer circuit board on this platform, this multilayer circuit board is for above-mentioned designated field, and extremely the predefined degree of depth is pre-formed measuring inclined plane from the surface;
Measure and use detector, the leading section of its terminal is supported in the bracing or strutting arrangement, and can contact with above-mentioned conductor layer;
Armature spindle, the instrument that it has installed machining hole is driven in rotation by motor;
Support, it supports above-mentioned armature spindle, make above-mentioned instrument for above-mentioned platform carry out near with separate;
Control device, the above-mentioned measurement that its selection contacts with the conductive part of wishing the degree of depth terminal of detector, detection is from the value of the voltage of the above-mentioned armature spindle induction of above-mentioned terminal output, according to this detected value, obtain height from the platform that is provided with above-mentioned multilayer circuit board to the anomaly platform surface of each conductor layer of above-mentioned designated field, the above-mentioned average height that utilization is obtained is inferred the height of each conductor layer, controls the front position of above-mentioned instrument according to the height of inferring.
10. according to Claim 8 or 9 described location hole processing unit (plant)s, it is characterized in that above-mentioned inclined plane is that the cross section is the inclined-plane in the hole of V font.
11. according to Claim 8 or 9 described location hole processing unit (plant)s, it is characterized in that possessing drive unit, this drive unit move above-mentioned bracing or strutting arrangement so that the portion that exposes to the open air of the above-mentioned conductor layer on above-mentioned inclined plane by crosscut, and above-mentioned measurement is an odd number with the terminal of detector.
12. according to Claim 8 or 9 described location hole processing unit (plant)s, it is characterized in that on above-mentioned bracing or strutting arrangement, setting a plurality of Support Positions, change the Support Position of above-mentioned terminal, make itself and the contact of different conductor layer, and above-mentioned measurement is an odd number with the terminal of detector.
13. according to Claim 8 or 9 described location hole processing unit (plant)s, it is characterized in that above-mentioned measurement is made up of with detector any one the described measurement in the claim 4～7 with detector.
14. the location hole processing method of a multilayer circuit board is characterized by:
In the above-mentioned designated field of the described multilayer circuit board of claim 1, processing cross sectional shape is the hole of V font,
Measure induced voltage by exposing to the open air, and this induced voltage produces on the armature spindle of the instrument that machining hole has been installed in the lip-deep above-mentioned measurement section in above-mentioned hole,
Control the front position of above-mentioned instrument according to the measured value of above-mentioned induced voltage.
15. the location hole processing method of a multilayer circuit board is characterized by:
In the above-mentioned designated field of the described multilayer circuit board of claim 1, carry out inclined-plane processing,
Measure induced voltage by exposing to the open air, and this induced voltage produces on the armature spindle of the instrument that machining hole has been installed in the lip-deep above-mentioned measurement section on above-mentioned inclined-plane,
Control the front position of above-mentioned instrument according to the measured value of above-mentioned induced voltage.
16. the location hole processing method of a multilayer circuit board is characterized by:
In the above-mentioned designated field of the described multilayer circuit board of claim 1, processing cross sectional shape is the hole of V font,
Measure induced voltage by exposing to the open air, and this induced voltage produces on the armature spindle of the instrument that machining hole has been installed in the lip-deep above-mentioned measurement section on above-mentioned inclined-plane,
According to the measured value of above-mentioned induced voltage, obtain height from the platform that is provided with above-mentioned multilayer circuit board to the anomaly platform surface of each conductor layer of above-mentioned designated field,
The above-mentioned average height that utilization is obtained is inferred the height of each conductor layer,
Control the front position of above-mentioned instrument according to the height of inferring.
17. the location hole processing method of a multilayer circuit board is characterized by:
In the above-mentioned designated field of the described multilayer circuit board of claim 1, carry out inclined-plane processing,
Measure induced voltage by exposing to the open air, and this induced voltage produces on the armature spindle of the instrument that machining hole has been installed in the lip-deep above-mentioned measurement section on above-mentioned inclined-plane,
According to the measured value of above-mentioned induced voltage, obtain height from the platform that is provided with above-mentioned multilayer circuit board to the anomaly platform surface of each conductor layer of above-mentioned designated field,
The above-mentioned average height that utilization is obtained is inferred the height of each conductor layer,
Control the front position of above-mentioned instrument according to the height of inferring.
18. according to claim 16 or 17 described location hole processing methods, it is characterized in that storing the height of each conductor layer in the above-mentioned designated field of obtaining,, obtain above-mentioned average height according to the height of above-mentioned each conductor layer of storing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002219967 | 2002-07-29 | ||
| JP2002219967A JP4034612B2 (en) | 2002-07-29 | 2002-07-29 | Blind hole machining method for multilayer circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1478626A true CN1478626A (en) | 2004-03-03 |
| CN100469499C CN100469499C (en) | 2009-03-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031503357A Expired - Lifetime CN100469499C (en) | 2002-07-29 | 2003-07-24 | Multilayer circuit board, detector for measuring, location hole processing device and its method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4034612B2 (en) |
| CN (1) | CN100469499C (en) |
| TW (1) | TW200402256A (en) |
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| CN102069209A (en) * | 2010-12-22 | 2011-05-25 | 北京控制工程研究所 | Micropore drilling machining method of copper alloy and copper alloy parts |
| CN101537505B (en) * | 2008-12-30 | 2011-05-25 | 南京依利安达电子有限公司 | Small-aperture high-density drilling method of printed circuit board |
| CN1791300B (en) * | 2004-12-10 | 2011-06-01 | 日立比亚机械股份有限公司 | Multi-layered circuit board and manufacturing method of multi-layered circuit board |
| CN102319976A (en) * | 2011-06-03 | 2012-01-18 | 哈尔滨飞机工业集团有限责任公司 | Method for processing locating hole of product locating piece in forming mould |
| CN104057124A (en) * | 2013-03-19 | 2014-09-24 | 斯盖布莱恩财产管理有限公司 | Device And Method For Machining Printed Circuit Boards |
| CN104858465A (en) * | 2014-02-21 | 2015-08-26 | 维亚机械株式会社 | Backdrilling method, and backdrilling apparatus |
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| JP7054587B2 (en) * | 2016-11-25 | 2022-04-14 | ビアメカニクス株式会社 | Drilling equipment and drilling method |
| CN106932709A (en) * | 2017-02-17 | 2017-07-07 | 李培培 | A kind of multilayer circuit board energization observation debugging apparatus |
| JP6861581B2 (en) * | 2017-06-09 | 2021-04-21 | 三菱電機株式会社 | Multilayer board signal acquisition structure, signal acquisition device and electronic device |
-
2002
- 2002-07-29 JP JP2002219967A patent/JP4034612B2/en not_active Expired - Lifetime
-
2003
- 2003-07-10 TW TW92118833A patent/TW200402256A/en not_active IP Right Cessation
- 2003-07-24 CN CNB031503357A patent/CN100469499C/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1791300B (en) * | 2004-12-10 | 2011-06-01 | 日立比亚机械股份有限公司 | Multi-layered circuit board and manufacturing method of multi-layered circuit board |
| CN101537505B (en) * | 2008-12-30 | 2011-05-25 | 南京依利安达电子有限公司 | Small-aperture high-density drilling method of printed circuit board |
| CN102069209A (en) * | 2010-12-22 | 2011-05-25 | 北京控制工程研究所 | Micropore drilling machining method of copper alloy and copper alloy parts |
| CN102069209B (en) * | 2010-12-22 | 2012-11-14 | 北京控制工程研究所 | Micropore drilling machining method of copper alloy and copper alloy parts |
| CN102319976A (en) * | 2011-06-03 | 2012-01-18 | 哈尔滨飞机工业集团有限责任公司 | Method for processing locating hole of product locating piece in forming mould |
| CN102319976B (en) * | 2011-06-03 | 2012-12-26 | 哈尔滨飞机工业集团有限责任公司 | Method for processing locating hole of product locating piece in forming mould |
| CN104057124A (en) * | 2013-03-19 | 2014-09-24 | 斯盖布莱恩财产管理有限公司 | Device And Method For Machining Printed Circuit Boards |
| CN104057124B (en) * | 2013-03-19 | 2019-03-08 | 斯盖布莱恩财产管理有限公司 | For processing the device and method of printed circuit board |
| CN104858465A (en) * | 2014-02-21 | 2015-08-26 | 维亚机械株式会社 | Backdrilling method, and backdrilling apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200402256A (en) | 2004-02-01 |
| JP4034612B2 (en) | 2008-01-16 |
| TWI319964B (en) | 2010-01-21 |
| CN100469499C (en) | 2009-03-18 |
| JP2004063771A (en) | 2004-02-26 |
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